A leak-proof module to prevent internal chassis wiring from affecting liquid cooling performance

Abstract

This utility model discloses a leak-proof module to prevent internal wiring from affecting liquid cooling performance. It includes a panel, a mounting plate, a first I / O interface assembly, a second I / O interface assembly, a switch assembly, and a power interface assembly. The first I / O interface assembly has a first cable. The switch assembly is sealed to the panel and exposed on the outer surface of the panel, and has a second cable. The power interface assembly is sealed to the panel and exposed on the outer surface of the panel, and has a third cable. By using the mounting plate to fix the cables, and by placing the mounting plate and cables between the PCB motherboard and the side wall of the chassis, the module effectively prevents the cables from being haphazardly distributed inside the liquid-cooled chassis, reducing their impact on coolant flow and ensuring normal coolant flow near the heat source on the PCB motherboard, thereby contributing to effective cooling.

Description

Technical Field

[0001] This utility model relates to the field of chassis technology, and in particular to a leak-proof module that prevents internal chassis wiring from affecting liquid cooling performance. Background Technology

[0002] A liquid-cooled chassis is a computer case that utilizes liquid cooling technology. Compared to traditional air cooling, liquid cooling offers higher heat dissipation efficiency and lower noise levels, making it widely used in high-performance computers, gaming PCs, and workstations. The core of a liquid-cooled chassis is the liquid cooling system, which typically consists of a radiator, tubing, a pump, a reservoir, and coolant. The coolant circulates between the radiator and water block within the chassis via the pump, absorbing and carrying away heat from components such as the CPU and GPU, before dissipating the heat into the air through the radiator.

[0003] Current liquid-cooled chassis mainly consist of a chassis shell, a PCB motherboard, and a front panel. The PCB motherboard is housed inside the chassis shell, and the front panel seals over any openings in the shell. This front panel houses components such as a first I / O interface assembly, a second I / O interface assembly, a switching assembly, and a power interface assembly. These components typically require cables for connection to the PCB motherboard. However, in existing technology, these cables are haphazardly distributed inside the liquid-cooled chassis, negatively impacting the flow of coolant near the heat sources on the PCB motherboard, thus significantly reducing cooling efficiency. Therefore, it is necessary to research a solution to address these issues. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a leak-proof module that prevents internal wiring from affecting the liquid cooling effect. It can effectively solve the problem that the messy distribution of cables inside the existing liquid cooling chassis has an adverse effect on the flow of coolant near the heat source of the PCB motherboard.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A leak-proof module for preventing internal chassis wiring from affecting liquid cooling performance includes a panel, a mounting plate, a first I / O interface assembly, a second I / O interface assembly, a switch assembly, and a power interface assembly. The mounting plate is fixedly connected to the panel and is located between the PCB motherboard and the side wall of the chassis. The first I / O interface assembly is sealed to the panel and exposed on the outer surface of the panel. The first I / O interface assembly has a first cable, which is fixed to the mounting plate and located between the PCB motherboard and the side wall of the chassis. The second I / O interface assembly is sealed to the panel and exposed on the outer surface of the panel. The switch assembly is sealed to the panel and exposed on the outer surface of the panel. The switch assembly has a second cable, which is fixed to the mounting plate and located between the PCB motherboard and the side wall of the chassis. The power interface assembly is sealed to the panel and exposed on the outer surface of the panel. The power interface assembly has a third cable, which is fixed to the mounting plate and located between the PCB motherboard and the side wall of the chassis.

[0007] As a preferred embodiment, the fixing plate is provided with multiple wire clamps, and the first cable, the second cable and the third cable are fixed to the fixing plate by the corresponding wire clamps. The structure is simple and the installation is stable.

[0008] As a preferred embodiment, the fixing plate has multiple threaded holes, and the multiple wire clamps are respectively connected and fixed by multiple first screws to the corresponding threaded holes, so that the fixing position of the wire clamps can be changed according to the wiring needs.

[0009] As a preferred embodiment, the fixing plate is fixedly connected to the panel by a second screw, which has a simple structure and is easy to assemble.

[0010] As a preferred embodiment, the fixing plate is provided with a plurality of adapter studs, one end of each adapter stud is fixedly connected to the fixing plate, and the other end of each adapter stud abuts against the PCB motherboard. The PCB motherboard is fixedly connected to the other end of the plurality of adapter studs by a plurality of third screws, so as to facilitate installation and connection with the PCB motherboard, while providing accommodating space for cables.

[0011] As a preferred embodiment, the fixing plate has multiple perforations to save materials.

[0012] As a preferred embodiment, the panel is recessed with a first groove, and the first I / O interface component is embedded in the first groove and fixed and sealed by potting adhesive, thus ensuring a stable installation.

[0013] As a preferred embodiment, the panel is recessed with a second groove, and the second I / O interface component is embedded in the second groove and fixed and sealed by potting adhesive, thus ensuring a stable installation.

[0014] As a preferred embodiment, the panel has holes in which the switch assembly is inserted and secured by tightening nuts, ensuring a stable installation.

[0015] As a preferred embodiment, the panel is recessed with a third groove, in which the power interface assembly is embedded and fixed and sealed with potting compound, ensuring a stable installation.

[0016] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0017] By installing a mounting plate, each cable is fixed to the mounting plate, and the mounting plate and each cable are placed between the PCB motherboard and the side wall of the chassis, the messy distribution of cables in the liquid-cooled chassis is effectively avoided, thereby reducing the impact of cables on the flow of coolant and ensuring the normal flow of coolant near the heat source of the PCB motherboard, which helps to ensure the cooling effect.

[0018] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a three-dimensional assembly diagram of a preferred embodiment of the present invention;

[0020] Figure 2 This is a three-dimensional assembly schematic diagram of a preferred embodiment of the present invention from another angle;

[0021] Figure 3 This is an exploded view of a preferred embodiment of the present invention;

[0022] Figure 4 This is an exploded view from another angle of a preferred embodiment of the present invention;

[0023] Figure 5 This is a three-dimensional schematic diagram of the preferred embodiment of the present invention in its usage state.

[0024] Figure 6 This is an exploded view of the preferred embodiment of this utility model in its usage state;

[0025] Figure 7 This is a cross-sectional view of the preferred embodiment of the present invention in its usage state;

[0026] Figure 8 This is an enlarged schematic diagram of the panel in a preferred embodiment of the present invention;

[0027] Figure 9 This is an enlarged schematic diagram of the fixing plate in a preferred embodiment of the present invention.

[0028] Explanation of reference numerals in the attached diagram:

[0029] 10. Panel 11. First Groove

[0030] 12. Second groove 13. Third groove

[0031] 14. Hole position 20. Fixing plate

[0032] 21. Wire clamp 22. First screw

[0033] 23. Second screw 24. Adapter stud

[0034] 201. Threaded hole; 202. Hole with openwork.

[0035] 30. First I / O interface component; 31. First cable

[0036] 40. Second I / O interface component; 50. Switch component

[0037] 51. Second cable 52. Nut

[0038] 60. Power interface assembly; 61. Third cable

[0039] 71. Sealing ring 72. Chassis shell

[0040] 73. PCB motherboard 74. Connector. Detailed Implementation

[0041] Please refer to Figures 1 to 9 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a panel 10, a fixing plate 20, a first I / O interface component 30, a second I / O interface component 40, a switch component 50, and a power interface component 60.

[0042] The panel 10 is recessed with a first groove 11, a second groove 12 and a third groove 13, and has holes 14. Furthermore, a sealing ring 71 is provided around the periphery of the panel 10 for sealing installation with the chassis shell 72.

[0043] The fixing plate 20 is fixedly connected to the panel 10, and is located between the PCB motherboard 73 and the side wall of the chassis 72. In this embodiment, the fixing plate 20 is provided with multiple wire clips 21, and multiple threaded holes 201 are provided on the fixing plate 20. The multiple wire clips 21 are respectively fixed by multiple first screws 22 to the corresponding threaded holes 201, and the fixing position of the wire clips 21 can be changed according to the wiring needs. The fixing plate 20 is fixedly connected to the panel 10 by second screws 23, and multiple second screws 23 are arranged side by side at intervals. The fixing plate 20 can also be fixed to the panel 10 by other means (such as welding). In addition, the fixing plate 20 is provided with multiple adapter studs 24. One end of each adapter stud 24 is fixedly connected to the fixing plate 20, and the other end of each adapter stud 24 abuts against the PCB motherboard 73. The PCB motherboard 73 is fixedly connected to the other end of the multiple adapter studs 24 by multiple third screws (not shown in the figure). In addition, the fixing plate 20 has multiple hollow holes 202, which are arranged in an array to save materials.

[0044] The first I / O interface assembly 30 is sealed and installed with the panel 10, exposing the outer surface of the panel 10. The first I / O interface assembly 30 has a first cable 31, which is fixed to the mounting plate 20 and located between the PCB motherboard 73 and the side wall of the chassis 72. In this embodiment, the first I / O interface assembly 30 is embedded in the first groove 11 and fixed and sealed by potting compound. The first cable 31 is fixed to the mounting plate 20 by a corresponding wire clip 21, and the first cable 31 is located between the mounting plate 20 and the PCB motherboard 73.

[0045] The second I / O interface assembly 40 is sealed and fitted to the panel 10 and exposed on the outer surface of the panel 10. In this embodiment, the second I / O interface assembly 40 is embedded in the second groove 12 and fixed and sealed by potting adhesive.

[0046] The switch assembly 50 is sealed and installed with the panel 10, exposing the outer surface of the panel 10. The switch assembly 50 has a second cable 51, which is fixed to the mounting plate 20 and located between the PCB motherboard 73 and the side wall of the chassis 72. In this embodiment, the switch assembly 50 has a leakage-proof function. The switch assembly 50 is inserted into the hole 14 and tightened by the nut 52. The second cable 52 is fixed to the mounting plate 20 by a corresponding wire clamp 21, and the second cable 52 is located between the mounting plate 20 and the PCB motherboard 73.

[0047] The power interface assembly 60 is sealed and installed with the panel 10, exposing the outer surface of the panel 10. The power interface assembly 60 has a third cable 61, which is fixed to the mounting plate 20 and located between the PCB motherboard 73 and the side wall of the chassis 72. In this embodiment, the power interface assembly 60 is embedded in the third groove 13 and fixed and sealed by potting compound. The third cable 61 is fixed to the mounting plate 20 by a corresponding wire clip 21, and the third cable 61 is located between the mounting plate 20 and the PCB motherboard 73.

[0048] The assembly process of this embodiment is described in detail below:

[0049] First, the switch assembly 50 is installed into the hole 14 and tightened with the nut 52. Next, the first I / O interface assembly 30 is embedded in the first groove 11 and fixed and sealed with glue. Then, the second I / O interface assembly 40 is embedded in the second groove 12 and fixed and sealed with glue. Next, the power interface assembly 60 is embedded in the third groove 13 and fixed and sealed with glue. Then, the sealing ring 71 is fixed to the periphery of the panel 10. Next, the fixing plate 20 is assembled and fixed to the panel 10, and the first cable 31, the second cable 52 and the third cable 61 are fixed to the fixing plate 20. This completes the assembly of the finished module.

[0050] In use, first connect the plugs of the first I / O interface component 30, the second I / O interface component 40, the switch component 50, and the power interface component 60 to their respective interfaces on the PCB motherboard 73. Then, fix the PCB motherboard 73 to the adapter studs 24 on the mounting plate 20 using the third screw. Next, seal the panel 10 on the chassis 72 to isolate the internal space of the chassis 72 from the outside. Finally, inject coolant into the chassis 72 through the connector 74.

[0051] The key design feature of this invention is that by setting a fixing plate, each cable is fixed to the fixing plate, and the fixing plate and each cable are placed between the PCB motherboard and the side wall of the chassis, which effectively avoids the cables being randomly distributed in the liquid-cooled chassis, reduces the impact of the cables on the flow of coolant, and ensures the normal flow of coolant near the heat source of the PCB motherboard, thereby helping to ensure the cooling effect.

[0052] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A leak-proof module to prevent internal wiring from affecting liquid cooling performance, characterized in that: The system includes a panel, a mounting plate, a first I / O interface assembly, a second I / O interface assembly, a switch assembly, and a power interface assembly. The mounting plate is fixedly connected to the panel and is located between the PCB motherboard and the side wall of the chassis. The first I / O interface assembly is sealed to the panel and exposed on the outer surface of the panel. The first I / O interface assembly has a first cable, which is fixed to the mounting plate and located between the PCB motherboard and the side wall of the chassis. The second I / O interface assembly is sealed to the panel and exposed on the outer surface of the panel. The switch assembly is sealed to the panel and exposed on the outer surface of the panel. The switch assembly has a second cable, which is fixed to the mounting plate and located between the PCB motherboard and the side wall of the chassis. The power interface assembly is sealed to the panel and exposed on the outer surface of the panel. The power interface assembly has a third cable, which is fixed to the mounting plate and located between the PCB motherboard and the side wall of the chassis.

2. The leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The fixing plate is provided with multiple wire clamps, and the first cable, the second cable and the third cable are fixed to the fixing plate by the corresponding wire clamps.

3. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 2, characterized in that: The fixing plate has multiple threaded holes, and the multiple wire clamps are respectively connected and fixed by multiple first screws to the corresponding threaded holes.

4. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The fixing plate is fixedly connected to the panel by the second screw.

5. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The fixing plate is provided with a plurality of adapter studs. One end of each adapter stud is fixedly connected to the fixing plate, and the other end of each adapter stud abuts against the PCB motherboard. The PCB motherboard is fixedly connected to the other end of the plurality of adapter studs by a plurality of third screws.

6. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The fixing plate has multiple hollow holes.

7. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The panel has a first groove, and the first I / O interface component is embedded in the first groove and fixed and sealed by potting glue.

8. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The panel has a second recess, and the second I / O interface component is embedded in the second recess and fixed and sealed by potting.

9. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The panel has holes, and the switch assembly is installed in the holes and tightened with nuts.

10. A leak-proof module for preventing internal wiring from affecting liquid cooling performance as described in claim 1, characterized in that: The panel has a third recess, in which the power interface assembly is embedded and fixed and sealed by potting.

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