A heat dissipation structure for a vapor chamber

Abstract

This utility model discloses a heat dissipation structure for a heat exchange plate, relating to the field of heat exchange plate technology. It includes a heat dissipation substrate and a protective cleaning mechanism. The protective cleaning mechanism is fixedly connected to the top of the heat dissipation substrate, and includes a reinforcing frame fixedly connected to the top of the heat dissipation substrate. A groove is formed on the inner surface of the reinforcing frame, and a T-shaped slider is slidably connected inside the groove. A connecting rod is fixedly connected to the bottom of the T-shaped slider, and a cleaning brush is fixedly connected to the bottom of the connecting rod. The reinforcing frame is made of heat dissipation material and wraps around the outer surface of the heat dissipation fins, enhancing the stability of the overall structure. The T-shaped slider drives the cleaning brush at the bottom of the connecting rod. Compared with existing ordinary heat dissipation structures, this heat dissipation structure for a heat exchange plate reduces thermal resistance, rapidly transfers heat, improves the heat exchange efficiency between the heat exchange plate and the outside, ensures uniform heat dissipation, avoids localized overheating, and improves the operational stability of the equipment.

Description

Technical Field

[0001] This utility model relates to the field of heat exchanger technology, specifically a heat dissipation structure for a heat exchanger. Background Technology

[0002] A vapor chamber is a heat dissipation element that utilizes the principle of phase change to achieve rapid heat conduction. Evaporation absorbs heat and condensation releases heat. During operation, the working fluid at the contact point with the chip (evaporation end) absorbs heat and evaporates, turning into vapor that quickly moves to the heat sink (condensation section), where it is pre-cooled, condenses into a liquid, and releases heat. Then, it returns to the evaporation end through the capillary structure, thus repeating the cycle to transfer heat from the evaporation end to the condensation end. As a highly efficient heat conduction element, vapor chambers are widely used in electronic equipment, new energy, and other fields. However, existing vapor chamber heat dissipation structures have many shortcomings.

[0003] A vapor chamber heat sink, as disclosed in application number CN202420165880.7, is used to dissipate heat from chips on a PCB board. It includes a heat sink body and a vapor chamber, with the vapor chamber positioned between the heat sink body and the chip. The vapor chamber comprises a first vapor chamber portion and a second vapor chamber portion, both integrally formed. The first vapor chamber portion is fixedly connected to the heat sink body, and the second vapor chamber portion is connected to the heat sink body via an elastic component. The second vapor chamber portion is in contact with the chip. This vapor chamber heat sink, with its second vapor chamber portion connected to the heat sink body via an elastic component, utilizes the elastic deformation of the vapor chamber and the elastic force of the elastic component to ensure a tight fit between the vapor chamber and the chip without damaging the chip. This eliminates chip height tolerances, thereby improving chip heat dissipation efficiency, reducing energy consumption, and protecting the equipment. However, the heat dissipation structure has low heat conduction efficiency between the heat spreader and external heat dissipation components, resulting in heat not being dissipated in time. In addition, the dustproof and waterproof performance is poor, and dust and moisture can easily enter and affect the performance of the heat spreader. Furthermore, under equipment vibration conditions, the connection between the heat spreader and the heat dissipation structure is unstable, affecting the heat dissipation effect.

[0004] Therefore, in view of this, we studied and improved the existing structure to address its shortcomings, and proposed a heat dissipation structure for a heat exchange plate. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation structure for a heat exchange plate to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation structure for a heat dissipation plate, comprising a heat dissipation substrate and a protective cleaning mechanism, characterized in that the protective cleaning mechanism is fixedly connected to the top of the heat dissipation substrate, and the protective cleaning mechanism includes a reinforcing frame fixedly connected to the top position of the heat dissipation substrate, the inner surface of the reinforcing frame is provided with a groove, and a T-shaped slider is slidably connected inside the groove, the bottom of the T-shaped slider is fixedly connected to a connecting rod, and the bottom of the connecting rod is fixedly connected to a cleaning brush.

[0007] Preferably, heat dissipation fins are fixedly connected to the top of the heat dissipation substrate, and metal heat-conducting pillars are fixedly connected to the bottom of the heat dissipation substrate.

[0008] Preferably, a thermally conductive silicone grease layer is fixedly connected to the bottom of the metal heat-conducting column, and a thermally conductive partition is fixedly connected to the bottom of the thermally conductive silicone grease layer.

[0009] Preferably, the bottom of the heat-conducting partition is fixedly connected to the temperature-equalizing plate body, and a waterproof and breathable membrane is provided on the outside of the reinforcing frame.

[0010] Preferably, a dustproof filter is fixedly connected to the outer surface of the waterproof and breathable membrane, and a rubber shock-absorbing pad is fixedly connected to the bottom of the temperature equalization plate body.

[0011] Preferably, the bottom of the rubber shock-absorbing pad is fixedly connected to an elastic damping column, and the bottom of the elastic damping column is fixedly connected to a mounting base.

[0012] Preferably, the inner surface of the mounting base is provided with mounting holes.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. This utility model, through the design of a protective cleaning mechanism and a reinforced frame made of high thermal conductivity aluminum alloy, not only strengthens the connection between the heat dissipation fins and the substrate through a ring structure, but also quickly conducts heat from the fin edges to the entire structure, enhancing stability and further improving heat dissipation efficiency. The cleaning brush simultaneously sweeps across the fin surface, its soft yet tough bristles penetrating deep into the wavy grooves to effectively remove dust, fibers, and other accumulated debris, preventing a decrease in heat exchange efficiency due to dust buildup. The reinforced frame provides rigid support for the heat dissipation fins during equipment vibration and handling, preventing deformation and damage. The cleaning component allows for quick maintenance during daily use without disassembling structural components, effectively maintaining heat dissipation efficiency. These two components complement each other, extending the service life of the heat dissipation structure and ensuring the long-term stable heat dissipation performance of the heat spreader, greatly improving the reliability and practicality of the equipment.

[0015] 2. This utility model constructs a comprehensive and multi-layered anti-vibration system by setting up rubber shock-absorbing pads and elastic damping columns, providing a solid guarantee for the stable operation of the heat dissipation structure in a vibration environment. The rubber shock-absorbing pads are made of highly elastic special rubber material and are in direct contact with the mounting base. Their unique honeycomb pore structure disperses vibration energy from all directions. The elastic damping columns can weaken severe vibrations and further attenuate vibration intensity. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the overall cross-sectional side view of this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the protective cleaning mechanism 2 of this utility model;

[0019] Figure 4 This is a schematic diagram of the bottom structure of the main body 7 of the temperature distribution plate of this utility model.

[0020] In the diagram: 1. Heat dissipation base plate; 2. Protective cleaning mechanism; 201. Reinforcing frame; 202. Slide groove; 203. T-shaped slider; 204. Connecting rod; 205. Cleaning brush; 3. Heat dissipation fins; 4. Metal heat-conducting pillars; 5. Thermal grease layer; 6. Thermally conductive partition; 7. Heat spreader body; 8. Waterproof and breathable membrane; 9. Dust filter; 10. Rubber shock-absorbing pad; 11. Elastic damping pillar; 12. Mounting base; 13. Mounting hole. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1-3As shown, a heat dissipation structure for a heat exchange plate includes a heat dissipation substrate 1 and a protective cleaning mechanism 2. The protective cleaning mechanism 2 is fixedly connected to the top of the heat dissipation substrate 1, and the protective cleaning mechanism 2 includes a reinforcing frame 201 fixedly connected to the top of the heat dissipation substrate 1. A groove 202 is formed on the inner surface of the reinforcing frame 201, and a T-shaped slider 203 is slidably connected inside the groove 202. A connecting rod 204 is fixedly connected to the bottom of the T-shaped slider 203, and a cleaning brush 205 is fixedly connected to the bottom of the connecting rod 204. The reinforcing frame 201 is made of heat dissipation material and wraps around the outer surface of the heat dissipation fins 3 to enhance the stability of the overall structure. The T-shaped slider 203 drives the cleaning brush 205 at the bottom of the connecting rod 204. The cleaning brush 205 contacts the heat dissipation fins 3 to clean the dust between the fins, keep the heat dissipation fins 3 clean, and maintain their heat dissipation effect.

[0023] like Figure 2 As shown, heat dissipation fins 3 are fixedly connected to the top of the heat dissipation substrate 1, and metal heat-conducting pillars 4 are fixedly connected to the bottom of the heat dissipation substrate 1. Thermal grease layer 5 is fixedly connected to the bottom of the metal heat-conducting pillar 4, and thermally conductive baffle 6 is fixedly connected to the bottom of the thermal grease layer 5. The unique wave shape of the heat dissipation fins 3 increases the heat dissipation area and disrupts the airflow boundary layer to enhance air convection. The heat dissipation substrate 1 is connected to the metal heat-conducting pillar 4 by welding. The thermal grease layer 5 is evenly applied to the surface of the heat spreader body 7, filling the tiny gaps and reducing thermal resistance. Heat is transferred from the heat spreader body 7 to the metal heat-conducting pillar 4 through the thermal grease layer 5, and then quickly conducted to the heat dissipation substrate 1, preparing for subsequent heat dissipation.

[0024] Furthermore, the bottom of the heat-conducting partition 6 is fixedly connected to the heat-dissipating plate body 7, and a waterproof and breathable membrane 8 is provided on the outside of the reinforcing frame 201. A dust filter 9 is fixedly connected to the outer surface of the waterproof and breathable membrane 8, and a rubber shock-absorbing pad 10 is fixedly connected to the bottom of the heat-dissipating plate body 7. The heat-dissipating plate body 7 is made of high-purity oxygen-free copper material. The waterproof and breathable membrane 8 prevents external moisture from entering while allowing air circulation. The dust filter 9 filters dust and impurities, and the rubber shock-absorbing pad 10 absorbs vibration energy.

[0025] Furthermore, the bottom of the rubber damping pad 10 is fixedly connected to an elastic damping column 11, and the bottom of the elastic damping column 11 is fixedly connected to a mounting base 12. The inner surface of the mounting base 12 is provided with mounting holes 13. The elastic damping column 11 buffers vibration through elastic deformation and is connected to the heating element through the mounting holes 13 inside the mounting base 12.

[0026] Working principle: When using the heat dissipation structure for the heat exchange plate, the heat exchange plate body 7 is first connected to the heating element through the mounting hole 13 of the mounting base 12. Heat is transferred from the heating element to the heat exchange plate body 7, and then quickly conducted to the heat dissipation substrate 1 through the thermally conductive partition 6, the thermally conductive silicone grease layer 5, and the metal thermally conductive pillar 4. Then, the airflow passes evenly through the corrugated heat dissipation fins 3, dissipating the heat into the air. In daily use, the waterproof and breathable membrane 8 and the dust filter 9 prevent moisture and dust from entering. If dust needs to be cleaned, the T-shaped slider 203 inside the reinforced frame 201 of the moving protective cleaning mechanism 2 is moved. The T-shaped slider 203 drives the cleaning brush 205 at the bottom of the connecting rod 204 along the slide groove 202 to clean the heat dissipation fins 3. Finally, when the equipment is in a vibrating environment, the rubber shock-absorbing pad 10, the elastic damping pillar 11, and the reinforced frame 201 absorb the vibration and ensure the stable operation of the heat dissipation structure. This is the working principle of the heat dissipation structure for the heat exchange plate.

Claims

1. A heat dissipation structure for a heat spreader, comprising a heat dissipation substrate (1) and a protective cleaning mechanism (2), characterized in that, A protective cleaning mechanism (2) is fixedly connected to the top of the heat dissipation substrate (1), and the protective cleaning mechanism (2) includes a reinforcing frame (201) fixedly connected to the top of the heat dissipation substrate (1). A groove (202) is provided on the inner surface of the reinforcing frame (201), and a T-shaped slider (203) is slidably connected inside the groove (202). A connecting rod (204) is fixedly connected to the bottom of the T-shaped slider (203), and a cleaning brush (205) is fixedly connected to the bottom of the connecting rod (204).

2. The heat spreading structure for a vapor chamber according to claim 1, wherein The top of the heat dissipation substrate (1) is fixedly connected to heat dissipation fins (3), and the bottom of the heat dissipation substrate (1) is fixedly connected to metal heat-conducting pillars (4).

3. The heat spreading structure for a vapor chamber according to claim 2, wherein The bottom of the metal heat-conducting column (4) is fixedly connected to a thermally conductive silicone grease layer (5), and the bottom of the thermally conductive silicone grease layer (5) is fixedly connected to a thermally conductive partition plate (6).

4. The heat spreading structure for a vapor chamber according to claim 3, wherein The bottom of the heat-conducting partition (6) is fixedly connected to the temperature-equalizing plate body (7), and a waterproof and breathable membrane (8) is provided on the outside of the reinforcing frame (201).

5. The heat spreading structure for a vapor chamber according to claim 4, wherein The outer surface of the waterproof and breathable membrane (8) is fixedly connected to a dust filter (9), and the bottom of the temperature equalization plate body (7) is fixedly connected to a rubber shock-absorbing pad (10).

6. The heat spreading structure for a vapor chamber according to claim 5, wherein The bottom of the rubber shock-absorbing pad (10) is fixedly connected to an elastic damping column (11), and the bottom of the elastic damping column (11) is fixedly connected to a mounting base (12).

7. The heat spreading structure for a vapor chamber according to claim 6, wherein The mounting base (12) has mounting holes (13) on its inner surface.

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