A display screen and a mechanical peeling device

Abstract

This invention relates to the field of laser peeling technology, specifically to a display screen and a mechanical peeling device. The display screen includes a substrate and light-emitting chips distributed on the substrate. Each light-emitting chip includes a light-emitting element and a transparent substrate covering the light-emitting surface of the light-emitting element. At least one end of the transparent substrate extends outward to form a protrusion. During mechanical peeling, the transparent substrate is pulled or pushed by the protrusion to separate it from the light-emitting chip. The protrusion facilitates the pushing or pulling operation, thereby simplifying the peeling of the transparent substrate and reducing the difficulty of mechanical peeling. The mechanical peeling device includes a mechanical peeling component, which includes a push rod corresponding to the protrusion of the transparent substrate. An external force is applied to drive the push rod to push or pull the protrusion, thereby separating the transparent substrate from the light-emitting chip. The cooperative arrangement of the push rod and the protrusion improves the convenience of the pulling or pushing operation and further reduces the difficulty of peeling the transparent substrate.

Description

Technical Field

[0001] This utility model relates to the field of display screen technology, and in particular to a display screen and a mechanical peeling device. Background Technology

[0002] In the semiconductor field, laser lift-off is often used in display manufacturing to separate the transparent substrate from the gallium nitride (GaN) epitaxial layer in order to improve the heat dissipation and light emission efficiency of the display. In this laser lift-off process, a laser of a specific wavelength (such as an ultraviolet laser) is selected to penetrate the transparent substrate (such as sapphire) and focus on the functional layer at the interface: the gallium nitride layer. After absorbing the laser energy, the functional layer undergoes instantaneous thermal decomposition or vaporization, thereby destroying the interfacial bonding force.

[0003] After laser irradiation, the transparent substrate needs to be separated from the light-emitting chip by mechanical peeling. The traditional mechanical peeling method involves the operator manually pressing one side of the transparent substrate while simultaneously pushing or pulling it from the other side to separate the transparent substrate from the light-emitting chip. However, in existing displays, the outer edge of the transparent substrate is close to the adjacent light-emitting element, making it difficult to push or pull the transparent substrate, which increases the difficulty of mechanical peeling. Utility Model Content

[0004] In view of the above-mentioned shortcomings in the prior art, one of the technical problems to be solved by this application is: how to design a display screen that facilitates the peeling off of the transparent substrate and reduces the difficulty of mechanical peeling.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] A display screen, characterized in that it comprises:

[0007] Substrate, used to support the light-emitting chip;

[0008] A light-emitting chip includes a light-emitting element and a transparent substrate. The light-emitting surface of the light-emitting element is located on the side away from the substrate. The transparent substrate covers the light-emitting surface of the light-emitting element, and at least one end of the transparent substrate extends outward to form a protrusion.

[0009] Its further feature is that,

[0010] The light-emitting chip is an integrated LED chip, which includes several light-emitting elements distributed in an array.

[0011] Furthermore, the substrate is a driving board, the light-emitting element is flip-chip mounted on the driving board and electrically connected to the driving board, and the driving board is used to control the working state of the light-emitting element.

[0012] Furthermore, at least one side of the light-emitting chip in the driver board is provided with a wire bonding area, which is used for electrical connection to external signals.

[0013] Furthermore, the protrusion includes at least a first protrusion and / or a first upper protrusion and / or a first lower protrusion, the right end of the transparent substrate extends outward to form the first protrusion, the upper end of the transparent substrate extends outward to form the first upper protrusion, and the lower end of the transparent substrate extends outward to form the first lower protrusion.

[0014] Furthermore, the material of the transparent substrate includes, but is not limited to, sapphire.

[0015] A mechanical peeling device, characterized in that it comprises:

[0016] The support plate includes a support plate body and a placement area disposed on the support plate body, the placement area being used to place the aforementioned display screen;

[0017] A mechanical peeling assembly includes a push rod that corresponds to a protrusion in the display screen and is used to push or pull the protrusion to separate the transparent substrate from the light emitter.

[0018] Its further feature is that,

[0019] In the carrier plate body, a through groove is provided on one side of the placement area below the protrusion. The shape of the through groove matches the shape of the push rod and is used to install the push rod.

[0020] Furthermore, the through groove is distributed along the Y direction of the carrier plate body, with both ends penetrating the upper and lower edges of the carrier plate body, respectively. The push rod is slidably installed in the through groove, and the push rod is distributed along the Y direction of the carrier plate body. At least one end of the push rod extends outward and protrudes from the carrier plate body to form a third protrusion, which is used to connect the drive mechanism.

[0021] Furthermore, the through groove is distributed along the Z-direction of the carrier plate body, and its two ends penetrate the top and bottom ends of the carrier plate body; the push rod is slidably installed in the through groove, with one end corresponding to the bottom end of the protrusion and the other end connected to the drive mechanism.

[0022] Furthermore, the drive mechanism includes a base, and the other end of the push rod is vertically fixed to the top of the base. During mechanical peeling, the base, driven by an external force, causes the push rod to rise and fall.

[0023] Furthermore, the placement area array is distributed on the bearing plate body, the push rod array is distributed with one end corresponding to the protrusion, and all push rods are spring rods.

[0024] Furthermore, the mechanical peeling device also includes a vacuum adsorption hole located below the placement area. One end of the vacuum adsorption hole penetrates the carrier plate body and corresponds to the bottom end of the micro display screen, while the other end is connected to a vacuum chamber, which is connected to a vacuum generator.

[0025] Furthermore, the mechanical stripping device also includes a mask, which includes a light-transmitting area and a light-blocking area. The light-transmitting area is used for laser transmission, and the light-blocking area is used to block the laser. During laser stripping, the mask is located in the optical path between the light-emitting chip and the laser.

[0026] Furthermore, the photomask is provided with a plurality of light-transmitting areas arranged in an array, and the light-transmitting areas correspond one-to-one with the placement areas.

[0027] The photomask has a first bolt hole on its edge, and the carrier plate has a second bolt hole on its edge. The first bolt hole corresponds to the second bolt hole, and the bolt passes through the first bolt hole and the second bolt hole in sequence to fix the photomask and the carrier plate together.

[0028] A mechanical peeling method, wherein before mechanical peeling, a laser peeling process is used to reduce the adhesion between the transparent substrate and the light emitter in the display screen, wherein the display screen is the aforementioned display screen;

[0029] The mechanical peeling method is characterized by comprising:

[0030] The transparent substrate is peeled off using a mechanical peeling assembly: a drive mechanism drives a push rod to push or pull the protrusions of the transparent substrate, thereby separating the transparent substrate from the light-emitting chip.

[0031] Its further feature is that,

[0032] The laser ablation process includes: providing a display screen;

[0033] The transparent substrate in the display screen is divided into a connection area and a stripping area. The connection area refers to the region of the transparent substrate near the wire bonding area, and the stripping area refers to the region of the transparent substrate outside the connection area.

[0034] The laser irradiates the stripping area, reducing the adhesion between the transparent substrate and the light-emitting chip.

[0035] Furthermore, the laser ablation process also includes: providing a mask, the mask including a light-transmitting area and a light-blocking area, the light-transmitting area being used for laser transmission, and the light-blocking area being used for blocking the laser;

[0036] The photomask is placed in the optical path between the laser and the transparent substrate;

[0037] The laser passes through the light-transmitting area and irradiates the stripping area. The light-shielding area blocks the area outside the stripping area, and the area outside the stripping area includes the connecting area.

[0038] The above-mentioned solution of this utility model can achieve the following beneficial effects: This application provides a display screen in which at least one side of the transparent substrate extends outward to form a protrusion. During mechanical peeling, the transparent substrate is pulled or pushed by the protrusion to separate the transparent substrate from the light-emitting chip. The setting of the protrusion is conducive to the pushing or pulling operation, thereby facilitating the peeling of the transparent substrate and reducing the difficulty of mechanical peeling.

[0039] In addition, the mechanical stripping device is equipped with a mechanical stripping assembly, which includes a push rod that corresponds to the protrusion of the transparent substrate. An external force is applied to drive the push rod to push or pull the protrusion, thereby separating the transparent substrate from the light-emitting chip. The cooperative arrangement of the push rod and the protrusion improves the convenience of the pulling or pushing operation and further reduces the difficulty of stripping the transparent substrate. Attached Figure Description

[0040] Figure 1 This is a top view of the display screen of Embodiment 1 of this application;

[0041] Figure 2 This is a top view of the display screen in Embodiment 2 of this application;

[0042] Figure 3 This is a top view of the display screen in Embodiment 3 of this application;

[0043] Figure 4 This is a top view of another embodiment of the display screen of this application;

[0044] Figure 5 This is a top view of another embodiment of the display screen of this application;

[0045] Figure 6 This is a top view of the mechanical peeling device according to Embodiment 1 of this application;

[0046] Figure 7 This is a front view cross-sectional structural schematic diagram of Embodiment 1 of the mechanical peeling device of this application;

[0047] Figure 8 This is a top view of Embodiment 2 of the mechanical peeling device of this application;

[0048] Figure 9 This is a front view cross-sectional structural schematic diagram of Embodiment 2 of the mechanical peeling device of this application;

[0049] Figure 10 This is a top view schematic diagram of the mask plate used in Embodiment 1 of this application;

[0050] Figure 11 This is a top view schematic diagram of the structure used in Embodiment 2 of this application of the photomask;

[0051] Figure 12 This is a top view schematic diagram of the structure used in Embodiment 3 of this application of the photomask;

[0052] Figure 13 This is a top view schematic diagram of the mask used in Embodiment 4 of this application;

[0053] Figure 14 This is a top view schematic diagram of the mask application in Embodiment 5 of this application;

[0054] Figure 15 This is a schematic cross-sectional view of the main view of the mask used in Embodiment 1 of this application.

[0055] Reference numerals: 1. Light emitter; 2. Driver plate; 3. Transparent substrate; 4. Mask; 5. Support plate; 6. Push rod; 7. Through slot; 8. Base.

[0056] Hitting the line area 203;

[0057] Connection area 301, stripping area 302;

[0058] Light-transmitting area 401, light-blocking area 402;

[0059] First protrusion 3001, first upper protrusion 3002, first lower protrusion 3003;

[0060] Second protrusion 4001, second upper protrusion 4002, second lower protrusion 4003;

[0061] First hitting zone 2031, second hitting zone 2032, third hitting zone 2033;

[0062] Carrier plate body 501, placement area 502, vacuum adsorption hole 503. Detailed Implementation

[0063] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0064] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products or devices.

[0065] In display manufacturing, laser lift-off is often used to separate the transparent substrate from the gallium nitride (GaN) epitaxial layer to improve the display's heat dissipation and luminous efficiency. During laser lift-off, the adhesion between the transparent substrate and the light-emitting element decreases after laser irradiation. Mechanical lift-off is then used to separate the transparent substrate from the light-emitting element. Traditional mechanical lift-off involves an operator manually pressing one side of the transparent substrate while simultaneously pushing or pulling it from the other side to separate it from the light-emitting element. However, current display structure designs are flawed, with the outer edge of the transparent substrate being too close to the adjacent light-emitting element, making it difficult to push or pull the transparent substrate and increasing the difficulty of mechanical lift-off.

[0066] In view of the above-mentioned shortcomings in the prior art, the following discloses several specific embodiments of the display screen.

[0067] A display screen, which is an LED micro display screen, mainly includes a light-emitting element 1 and a substrate. The light-emitting element 1 is an LED integrated chip. The LED integrated chip includes several arrayed light-emitting elements and a transparent substrate. The transparent substrate covers the light-emitting surface of the light-emitting element. Each light-emitting element is mainly composed of an N-type GaN layer, a light-emitting layer, and a P-type GaN layer distributed from bottom to top. The size of a single light-emitting element is usually less than 50 μm.

[0068] The substrate is a driver board 2, with a size ranging from (7mm to 15mm) * (3mm to 10mm). In this embodiment, the driver board size is preferably 9.5mm x 5.9mm. The driver board 2 is flip-chip connected to the light-emitting element and is used to control the on or off of the light-emitting element. In the process of manufacturing the above display screen, the LED integrated chip is first aligned and bonded to the driver board 2. After bonding, the transparent substrate 3 covers the light-emitting element.

[0069] The transparent substrate 3 is horizontally striped and preferably made of sapphire. At least one side of the transparent substrate 3 extends outward to form a protrusion. In this embodiment, the protrusion includes a first protrusion 3001, and the right end of the transparent substrate 3 extends outward to form the first protrusion 3001. (Refer to...) Figure 1 .

[0070] It should be noted that, in another embodiment, the protrusion includes a first upper protrusion 3002, which extends outward from the upper end of the transparent substrate to form the first upper protrusion 3002, as shown in the reference. Figure 4 Alternatively, the protrusion includes a first lower protrusion 3003, where the lower end of the transparent substrate 3 extends outward to form the first lower protrusion 3003, as shown in the reference. Figure 5 .

[0071] A display screen, which is an LED micro display screen, mainly includes a light-emitting element 1 and a substrate. The light-emitting element 1 is an LED integrated chip. The LED integrated chip includes several arrayed light-emitting elements and a transparent substrate. The transparent substrate covers the light-emitting surface of the light-emitting element. Each light-emitting element is mainly composed of an N-type GaN layer, a light-emitting layer, and a P-type GaN layer distributed from bottom to top. The size of a single light-emitting element is usually less than 50 μm.

[0072] The substrate is a driver board 2, with a size ranging from (7mm to 15mm) * (3mm to 10mm). In this embodiment, the driver board size is preferably 9.5mm x 5.9mm. The driver board 2 is flip-chip connected to the light-emitting element and is used to control the on or off of the light-emitting element. In the process of manufacturing the above display screen, the LED integrated chip is first aligned and bonded to the driver board 2. After bonding, the transparent substrate 3 covers the light-emitting element.

[0073] The transparent substrate 3 is horizontally striped and preferably made of sapphire. At least one side of the transparent substrate 3 extends outward to form a protrusion.

[0074] The display screen in this embodiment is as follows: Figure 2 As shown, its light-emitting body and driving plate 2 are the same as those in Embodiment 1. The difference is that the protrusion in the transparent substrate includes: a first protrusion 3001 and a first upper protrusion 3002. The right end of the transparent substrate 3 extends outward to form the first protrusion 3001; the upper end of the transparent substrate 3 extends outward to form the first upper protrusion 3002.

[0075] A display screen, which is an LED micro display screen, mainly includes a light-emitting element 1 and a substrate. The light-emitting element 1 is an LED integrated chip. The LED integrated chip includes several arrayed light-emitting elements and a transparent substrate. The transparent substrate covers the light-emitting surface of the light-emitting element. Each light-emitting element is mainly composed of an N-type GaN layer, a light-emitting layer, and a P-type GaN layer distributed from bottom to top. The size of a single light-emitting element is usually less than 50 μm.

[0076] The substrate is a driver board 2, with a size ranging from (7mm to 15mm) * (3mm to 10mm). In this embodiment, the driver board size is preferably 9.5mm x 5.9mm. The driver board 2 is flip-chip connected to the light-emitting element and is used to control the on or off of the light-emitting element. In the process of manufacturing the above display screen, the LED integrated chip is first aligned and bonded to the driver board 2. After bonding, the transparent substrate 3 covers the light-emitting element.

[0077] The transparent substrate 3 is horizontally striped and preferably made of sapphire. At least one side of the transparent substrate 3 extends outward to form a protrusion.

[0078] The display screen in this embodiment is as follows: Figure 3 As shown, its light-emitting body and driving plate 2 are the same as those in Embodiment 1. The difference is that the protrusion includes: a first protrusion 3001, a first upper protrusion 3002, and a first lower protrusion 3003. The right end of the transparent substrate 3 extends outward to form the first protrusion 3001; the upper end of the transparent substrate 3 extends outward to form the first upper protrusion 3002; and the lower end of the transparent substrate 3 extends outward to form the first lower protrusion 3003. The width of the first protrusion 3001, the first upper protrusion 3002, and the first lower protrusion 3003 is greater than or equal to 0.5 mm.

[0079] During the manufacturing process of the display screen, before laser peeling, the display screen structure is as described in the above-mentioned display screen embodiments one to three. After laser irradiation, the transparent substrate in the above-mentioned display screen embodiments one to three can be peeled off by mechanical peeling. During mechanical peeling, the transparent substrate is pulled or pushed by the first protrusion, the second protrusion or the third protrusion to separate the transparent substrate from the light-emitting chip. The setting of the first protrusion and / or the second protrusion and / or the third protrusion is conducive to pushing or pulling operations, thereby facilitating the peeling of the transparent substrate and reducing the difficulty of mechanical peeling.

[0080] To achieve the above objectives, and to avoid displacement of the display screen during the peeling process that would affect the peeling yield, the following discloses specific embodiments of several mechanical peeling devices for rapidly peeling off the transparent substrate 3 in the above-mentioned display screen.

[0081] refer to Figure 6 , Figure 7 The mechanical peeling device includes: a support plate, a mechanical peeling component, and a vacuum adsorption component. The support plate includes a support plate body 501 and a placement area 502 formed in the support plate body. The placement area 502 is used to place any of the above-mentioned display screens. In this embodiment, the placement area is a groove, which facilitates the placement of the display screen.

[0082] The mechanical peeling assembly includes a push rod 6 located on one side of the placement area, corresponding to the protrusion in the display screen. During mechanical peeling, an external force is applied to drive the push rod to push or pull the protrusion of the transparent substrate 3, thereby separating the transparent substrate 3 from the light emitter 1.

[0083] Taking the transparent substrate peeling in the first embodiment of the display screen as an example, to facilitate the installation of the push rod 6, a through groove 7 is formed on one side of the placement area 502 in the carrier plate body, below the first protrusion 3001. The shape of the through groove 7 matches the shape of the push rod 6. In this embodiment, the through groove 7 is distributed along the Y direction of the carrier plate body 501, and its two ends pass through the upper edge and lower edge of the carrier plate body 501, respectively. The push rod 6 is distributed along the Y direction of the carrier plate body 501, slidably installed in the through groove 7, and its two ends extend outward, protruding from the carrier plate body 501 to form a third protrusion 601. The third protrusion 601 is used to apply pushing or pulling force. For example, when manually applying external force, the setting of the third protrusion 601 facilitates the operator to manually push or pull the push rod 6.

[0084] In addition, in this embodiment, the placement area 502 array is distributed in the carrier body 501, and the displays in the same column share the same push rod. When peeling off the transparent substrate 3, the laser scans the light-transmitting area in each transparent substrate, reducing the adhesion between each transparent substrate and the light emitter, and then mechanically peeling it off. During this process, the third protrusion 601 is manually pushed or pulled to raise the push rod 6. The middle part of the push rod 6 pushes the first protrusion 3001 of the transparent substrate in the same column of displays, that is, pushes one side of the transparent substrate in the same column of displays, thereby separating the transparent substrate 3 in the same column of displays from the light emitter 1, and realizing peeling.

[0085] The vacuum adsorption assembly includes a vacuum adsorption hole 503, which is located below the placement area 502 in the carrier body 501. One end of the vacuum adsorption hole 503 penetrates through the carrier body 501 and corresponds to the bottom of the micro-display screen, while the other end is connected to a vacuum generator. After laser irradiation, during mechanical peeling, the LED micro-display screen is first adsorbed and fixed through the vacuum adsorption hole 503 to prevent damage caused by displacement or impact during peeling, and at the same time, it facilitates the smooth peeling of the transparent substrate 3.

[0086] refer to Figure 8 , Figure 9 The mechanical peeling device includes: a support plate, a mechanical peeling component, and a vacuum adsorption component. The support plate includes a support plate body 501 and a placement area 502 formed in the support plate body 501. The placement area 502 is used to place any of the above-mentioned display screens. In this embodiment, the placement area is a groove, which facilitates the placement of the display screen.

[0087] The mechanical peeling assembly includes a push rod 6 located on one side of the placement area, corresponding to the protrusion in the display screen. During mechanical peeling, an external force is applied to drive the push rod to push or pull the protrusion of the transparent substrate 3, thereby separating the transparent substrate 3 from the light emitter 1.

[0088] Taking the transparent substrate peeling in the first embodiment of the display screen as an example, to facilitate the installation of the push rod 6, a through groove 7 is formed on one side of the placement area 502 in the carrier body 501, below the first protrusion 3001. The shape of the through groove 7 matches the shape of the push rod 6. In this embodiment, the through groove 7 is distributed along the Z direction of the carrier body 501, and the push rod 6 is distributed along the Z direction and slidably installed in the corresponding through groove 7. Both ends of the push rod 6 penetrate the top and bottom ends of the carrier body 501, with one end corresponding to the bottom end of the first protrusion 3001 and the other end connected to the driving mechanism. The driving structure includes a base 8, and the other end of the push rod 6 is vertically fixed to the top end of the base 8. During mechanical peeling, the base 8, under the action of external force, drives the push rod 6 to rise and fall. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate 3, thereby separating the transparent substrate 3 from the light-emitting body 1 and realizing peeling.

[0089] In this embodiment, placement areas 502 are arrayed within the carrier plate body 501, and each placement area 502 has a push rod 6 on one side, arranged in an array structure. When peeling off the transparent substrate 3, a laser scans the light-transmitting area in each transparent substrate, reducing the adhesion between each transparent substrate 3 and the light emitter 1, followed by mechanical peeling. During this process, each push rod 6 is lifted under the action of the driving mechanism. The push rod 6 is a spring rod, ensuring that the first protrusion of each transparent substrate 3 can be subjected to force, thereby ensuring effective separation of each transparent substrate 3 from the light emitter 1, meeting the requirements of batch processing, and improving peeling efficiency.

[0090] The vacuum adsorption assembly includes a vacuum adsorption hole 503, which is located below the placement area 502 in the carrier body. One end of the vacuum adsorption hole 503 penetrates through the carrier body 501 and corresponds to the bottom of the micro-display screen, while the other end is connected to a vacuum generator. After laser irradiation, during mechanical peeling, the LED micro-display screen is first adsorbed and fixed through the vacuum adsorption hole 503 to prevent damage caused by displacement or impact during peeling, and at the same time, it facilitates the smooth peeling of the transparent substrate 3.

[0091] It should be noted that in the above-mentioned mechanical peeling component embodiment one and mechanical peeling component embodiment two, other methods can be used to stabilize the display screen in actual application to prevent the display screen from shifting during the peeling process and affecting the peeling effect. For example, the display screen can be pasted into the placement area 502 by pasting.

[0092] The mechanical peeling device embodiment one or mechanical peeling device embodiment two described above are applied to the laser peeling process to peel off the transparent substrate in the above display screen. The specific steps include:

[0093] S1. A laser peeling process is used to reduce the adhesion between the transparent substrate 3 and the light-emitting body 1 in the display screen. Specifically, S11. A display screen is provided, which is the first embodiment of the display screen, and the display screen is placed in the placement area 502.

[0094] S12. Divide the transparent substrate in the display screen into a connection area and a stripping area. The connection area refers to the area in the transparent substrate near the wire bonding area, and the stripping area refers to the area in the transparent substrate outside the connection area.

[0095] S13, laser irradiation of the stripping area reduces the adhesion between the transparent substrate 3 and the light emitter.

[0096] S2. The transparent substrate 3 is peeled off by mechanical peeling. Specifically, S21. The display screen is fixed by adsorption through vacuum adsorption holes.

[0097] S22. Push or pull the first protrusion 3001 to separate the transparent substrate 3 from the light emitter 1. In embodiment two of the mechanical peeling device, the base of the drive mechanism is raised and lowered, and the base drives the push rod 6 to rise and fall. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate 3, thereby separating the transparent substrate 3 from the light emitter and achieving peeling.

[0098] It should be noted that, in another embodiment, when using the mechanical peeling device in Embodiment 1, the push rod 6 can be manually pulled to raise and lower the push rod 6. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate, thereby separating the transparent substrate 3 from the light-emitting body 1 and achieving peeling.

[0099] The above-described embodiments of the display screen (Issue 1, Issue 2, and Issue 3) are merely several embodiments described in this application. In another embodiment of the display screen, the display screen further includes a bonding area, that is, based on the display screen structure of Embodiments 1, 2, and 3, a bonding area is added. The bonding area is distributed in the substrate and located on at least one side of the light-emitting chip, used for electrical connection to external signals. The bonding area is provided with circuitry and / or second pads. However, when using the above laser lift-off method to peel off the transparent substrate 3, due to certain errors in the laser irradiation area, the placement position of the display screen, and the cutting position, the laser beam / spot may irradiate the bonding area, causing the circuitry or second pads of the bonding area to be burned and damaged.

[0100] To address the above issues, several specific embodiments of photomasks are provided below.

[0101] The mask is designed based on the position and structure of the bonding area 2031 and the transparent substrate 3 in the display screen. The display screen adds a first bonding area 2031 on the basis of the structure of the first embodiment of the display screen. The first bonding area 2031 is located on the left side of the light-emitting chip. During laser stripping, the laser spot / light should be avoided from shining on the first bonding area 2031.

[0102] Before designing the photomask, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area includes a first connection area 3011, which refers to the region in the transparent substrate near the first bonding area 2031. The stripping area 302 refers to the region in the transparent substrate outside the first connection area. The first connection area 301 is vertically shaped and located on the left edge of the transparent substrate, at the left end of the stripping area 302, that is, between the first bonding area 2031 and the stripping area 302. To reduce the influence of overall error, the width of the first connection area is greater than the overall error, which includes laser irradiation position error, cutting position error, and placement position error when placing the display screen in the placement area. In this embodiment, the overall error range is 3μm~10μm, so the width of the first connection area is 5μm~20μm, preferably 15μm.

[0103] Based on the above structure, the mask 4 in this embodiment is designed as follows: The mask 4 includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 is structurally matched with the stripping area 302 for laser transmission, and the light-shielding area 402 is structurally matched with the area outside the stripping area for blocking the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3, and the mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area, which includes the first connecting area 3011. The width of the first connecting area is greater than the overall error. During laser stripping, even if there is a certain error, the adjacent first bonding area 2031 will not be burned, thereby preventing the electrical performance of the display screen from being affected and ensuring the yield of laser stripping.

[0104] In this embodiment, a first protrusion 3001 is provided on one side of the transparent substrate 3, and the right end of the peeling area 302 extends outward, that is, the right end of the peeling area 302 extends away from the first connection area to form the first protrusion 3001.

[0105] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001. The upper and lower ends of the light-transmitting area 401 are flush with the upper and lower edges of the stripping area 302, respectively. (Refer to...) Figure 10 , Figure 15 .

[0106] It should be noted that in another embodiment (i.e., mask embodiment two), the left end of the peeling area 302 is the first connecting area 301, the right end is the first protrusion 3001, and the upper and lower ends extend outward to form the first upper protrusion 3002 and the first lower protrusion 3003, respectively.

[0107] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001. The upper and lower ends of the light-transmitting area 401 protrude beyond the edges of the first upper protrusion and the first lower protrusion of the stripping area 302, respectively, to form a second upper protrusion 4002 and a second lower protrusion 4003. (Refer to...) Figure 11 .

[0108] The mask is designed based on the position and structure of the bonding area 2031 and the transparent substrate 3 in the display screen. The display screen adds a first bonding area 2031 and a second bonding area 2032 on the basis of the structure of the display screen embodiment 2. The first bonding area 2031 is located on the left side of the light-emitting chip, and the second bonding area is located on the upper side of the light-emitting chip. During laser stripping, the laser spot / light should be avoided from irradiating the first bonding area 2031 and the second bonding area 2032.

[0109] Before designing the photomask, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area includes a first connection area 3011 and a second connection area 3012. The first connection area 3011 refers to the area in the transparent substrate near the first bonding area 2031, and the second connection area 3012 refers to the area in the transparent substrate near the second bonding area 2032. The stripping area 302 refers to the area in the transparent substrate outside the first and second connection areas. The first connection area 3011 is a vertical strip located on the left edge of the transparent substrate, at the left end of the stripping area 302, that is, between the first bonding area 2031 and the stripping area 302. The second connection area 3012 is a horizontal strip located on the upper edge of the transparent substrate, at the upper end of the stripping area 302, that is, between the second bonding area 2032 and the stripping area 302. To reduce the impact of overall error, the width of both the first and second connection areas is greater than the overall error. The overall error includes laser irradiation position error, cutting position error, and placement position error when placing the display screen in the placement area. In this embodiment, the overall error range is 3μm~10μm, so the width of the first connection area and the width of the second connection area range from 5μm to 20μm, preferably 15μm.

[0110] Based on the above structure, the mask in this embodiment is designed as follows: The mask includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 matches the structure of the stripping area 302 for laser transmission, and the light-shielding area 402 matches the structure of the area outside the stripping area 302 for blocking the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3, and the mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area. The area outside the stripping area includes a first connecting area 3011 and a second connecting area 3012. The width of the first connecting area and the width of the second connecting area are greater than the overall error. During laser stripping, even if there is a certain error, the adjacent first bonding area 2031 and second bonding area 2032 will not be burned, thereby preventing the electrical performance of the display screen from being affected and ensuring the yield of laser stripping.

[0111] In this embodiment, a first protrusion 3001 is provided on one side of the transparent substrate 3, and the right end of the peeling area 302 extends outward, that is, the right end of the peeling area 302 extends away from the first connection area 3011 to form the first protrusion 3001.

[0112] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001. The lower end of the light-transmitting area 401 is flush with the lower edge of the stripping area 302. (Refer to...) Figure 12 .

[0113] It should be noted that in another embodiment (i.e., mask embodiment four), the left end of the peeling area 302 is the first connecting area 3011, the right end is the first protrusion 3001, and the lower end of the peeling area 302 protrudes outward to form the first lower protrusion 3003.

[0114] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001, and the lower end of the light-transmitting area 401 protrudes beyond the edge of the first lower protrusion of the stripping area 302 to form a second lower protrusion 4003. (Refer to...) Figure 13 .

[0115] The mask is designed based on the position and structure of the bonding area 2031 and the transparent substrate 3 in the display screen. The display screen, based on the structure of the third embodiment, includes a first bonding area 2031, a second bonding area 2032, and a third bonding area 2033. The first bonding area 2031 is located to the left of the light-emitting chip, the second bonding area is located above the light-emitting chip, and the third bonding area 2033 is located below the light-emitting chip. During laser stripping, laser spot / light should be avoided from irradiating the first bonding area 2031, the second bonding area 2032, and the third bonding area 2033.

[0116] Before designing the mask, the transparent substrate 3 is divided into a connection region 301 and a release region 302. The connection region includes a first connection region 3011, a second connection region 3012, and a third connection region 3013. The first connection region 3011 refers to the area in the transparent substrate that is close to the first bonding region 2031, the second connection region 3012 refers to the area in the transparent substrate that is close to the second bonding region 2032, and the third connection region 3013 refers to the area in the transparent substrate that is close to the third bonding region 2033. The release region 302 refers to the area in the transparent substrate other than the first connection region, the second connection region, and the third connection region. The first connection area 3011 is vertically shaped and located at the left edge of the transparent substrate and the left end of the stripping area 302, i.e., between the first bonding area 2031 and the stripping area 302. The second connection area 3012 is horizontally shaped and located at the upper edge of the transparent substrate and the upper end of the stripping area 302, i.e., between the second bonding area 2032 and the stripping area 302. The third connection area 3013 is horizontally shaped and located at the lower edge of the transparent substrate and the lower end of the stripping area, i.e., between the third bonding area 2033 and the stripping area 302. To reduce the impact of overall error, the widths of the first, second, and third connection areas are all greater than the overall error, which includes laser irradiation position error, cutting position error, and placement position error when placing the display screen in the placement area. In this embodiment, the overall error range is 3μm~10μm, so the widths of the first, second, and third connection areas range from 5μm to 20μm, preferably 15μm.

[0117] Based on the above structure, the mask in this embodiment is designed as follows: The mask includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 matches the structure of the stripping area 302 for laser transmission, and the light-shielding area matches the structure of the area outside the stripping area 302 for blocking the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3, and the mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area 302. The area outside the stripping area includes a first connecting area 3011, a second connecting area 3012, and a third connecting area 3013. The widths of the first connecting area, the second connecting area, and the third connecting area are greater than the overall error. During laser stripping, even if there is a certain error, the adjacent first wire bonding area 2031, the second wire bonding area 2032, and the third wire bonding area 2033 will not be burned.

[0118] In this embodiment, a first protrusion 3001 is provided in the transparent substrate 3, and the right end of the peeling area 302 extends outward, that is, the right end of the peeling area 302 extends away from the first connection area 3011 to form the first protrusion 3001.

[0119] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001. The lower end of the light-transmitting area 401 is flush with the lower edge of the stripping area 302. (Refer to...) Figure 14 .

[0120] The above-described mask embodiment one or mask embodiments two to five are applied to the laser lift-off process, and the above-described mechanical lift-off device embodiment one or mechanical lift-off device embodiment two are used to lift off the transparent substrate in the above-described display embodiment one, display embodiment two, or display embodiment three. In this embodiment, mask embodiment one is used to lift off the transparent substrate of display embodiment one. The specific steps include:

[0121] S1. Provide a mask as an example.

[0122] S2. A laser peeling process is used to reduce the adhesion between the transparent substrate and the light-emitting chip in the first embodiment of the display screen. Specifically, S21. A display screen is provided, which is the first embodiment of the display screen.

[0123] S22. Divide the transparent substrate in the display screen into a connection area and a stripping area. The connection area refers to the area in the transparent substrate that is close to the wire bonding area, and the stripping area refers to the area in the transparent substrate that is outside the connection area.

[0124] S23. The photomask of embodiment one is placed in the optical path between the laser and the mechanical stripping device. The light-transmitting area in the photomask of embodiment one corresponds to the stripping area in the transparent substrate. The light-shielding area blocks the area outside the stripping area. The area outside the stripping area includes the first connection area.

[0125] S24. The laser passes through the light-transmitting area and irradiates the stripping area, reducing the adhesion between the transparent substrate 3 and the light-emitting body 1. The laser can only irradiate the stripping area through the light-transmitting area. The first connecting area 3011 is located in the region between the stripping area and the first bonding area 2031. The first connecting area 3011 and the adjacent first bonding area 2031 are blocked by the shielding area, preventing the laser from passing through. This effectively avoids the problem of the laser spot / ray irradiating the bonding area and causing the bonding area to be burned and damaged, thereby avoiding the impact on the electrical performance of the display screen and ensuring the laser stripping yield.

[0126] S3. The transparent substrate 3 is peeled off by mechanical peeling. Specifically, S31. The LED micro display screen is fixed by adsorption through vacuum adsorption holes.

[0127] S32. Push or pull the first protrusion 3001 to separate the transparent substrate 3 from the light emitter 1. When using the mechanical peeling device in Embodiment 2, the base of the drive mechanism is raised and lowered, and the base drives the push rod 6 to rise and fall. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate, thereby separating the transparent substrate 3 from the light emitter 1 and achieving peeling.

[0128] It should be noted that, in another embodiment, when using the mechanical peeling device in Embodiment 1, the push rod 6 can be manually pulled to raise and lower the push rod 6. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate, thereby separating the transparent substrate 3 from the light-emitting body 1 and achieving peeling.

[0129] The removal of the transparent substrate 3 in the display screen of this application helps to reduce light crosstalk, improve the light output efficiency and display brightness of the display screen. In addition, in some embodiments, removing the transparent substrate 3 facilitates the subsequent application of color film to meet the color display requirements of LED micro display screen.

[0130] It is understood that the above detailed description of this utility model is for illustrative purposes only and is not intended to limit the technical solutions described in the embodiments of this utility model. Those skilled in the art should understand that modifications or equivalent substitutions can still be made to this utility model to achieve the same technical effects; as long as the usage requirements are met, they are all within the protection scope of this utility model.

Claims

1. A display screen, characterized in that, The display screen includes: Substrate, used to support the light-emitting chip; A light-emitting chip includes a light-emitting element (1) and a transparent substrate (3). The light-emitting element (1) is mounted on the substrate, and the light-emitting surface of the light-emitting element (1) faces away from the substrate. The transparent substrate (3) covers the light-emitting surface of the light-emitting element (1), and at least one end of the transparent substrate (3) extends outward to form a protrusion.

2. The display screen according to claim 1, characterized in that, The protrusion includes at least a first protrusion (3001) and / or a first upper protrusion (3002) and / or a first lower protrusion (3003). The right end of the transparent substrate (3) extends outward to form the first protrusion (3001), the upper end of the transparent substrate (3) extends outward to form the first upper protrusion (3002), and the lower end of the transparent substrate (3) extends outward to form the first lower protrusion (3003).

3. The display screen according to claim 1 or 2, characterized in that, The light-emitting chip is an LED integrated chip, and the substrate is a driver board (2), which is electrically connected to the light-emitting body (1) and is used to control the working state of the light-emitting body (1).

4. A mechanical peeling device, characterized in that, It includes: The support plate (5) includes a support plate body (501) and a placement area (502) disposed on the support plate body (501). The placement area (502) is used to place the display screen, which is the display screen as described in claim 1. A mechanical stripping assembly includes a push rod (6) that corresponds to a protrusion in the display screen and is used to push or pull the protrusion to separate the transparent substrate (3) from the light emitter (1).

5. The mechanical peeling device according to claim 4, characterized in that, In the carrier plate body (501), a through groove (7) is provided on one side of the placement area (502) below the protrusion. The shape of the through groove (7) matches the shape of the push rod (6) and is used to install the push rod (6).

6. The mechanical peeling device according to claim 5, characterized in that, The through groove (7) is distributed along the Y direction of the carrier plate body (501), and its two ends pass through the upper end and lower end of the carrier plate body (501) respectively. The push rod (6) is slidably installed in the through groove (7) and distributed along the Y direction of the carrier plate body (501). At least one end of the push rod (6) extends outward and protrudes from the carrier plate body (501) to form a third protrusion. The third protrusion is used to connect to the drive mechanism, and the drive mechanism is used to drive the push rod to move.

7. The mechanical peeling device according to claim 5, characterized in that, The through groove is distributed along the Z direction of the carrier plate body (501), and its two ends penetrate the top and bottom ends of the carrier plate body (501). The push rod (6) is slidably installed in the through groove, with one end corresponding to the bottom end of the protrusion and the other end used to connect to the drive mechanism. The drive mechanism is used to drive the push rod to move.

8. The mechanical peeling device according to claim 7, characterized in that, The placement area (502) is arrayed on the bearing plate body (501), the push rods (6) are arrayed and one end corresponds to the protrusion, and all push rods (6) are spring rods.

9. The mechanical peeling device according to any one of claims 4 to 8, characterized in that, The mechanical stripping device also includes a mask, which includes a light-transmitting area and a light-shielding area. The light-transmitting area is used for laser transmission, and the light-shielding area is used for blocking the laser. The transparent substrate includes a connecting area and a stripping area. During laser stripping, the mask is located in the optical path between the light-emitting chip and the laser. The light-transmitting area corresponds to the stripping area, and the light-shielding area blocks the area outside the stripping area in the transparent substrate. The area outside the stripping area includes the connecting area.

10. The mechanical peeling device according to claim 9, characterized in that, The mechanical peeling device also includes a vacuum adsorption hole (503), which is located below the placement area (502) inside the carrier plate body (501). One end of the vacuum adsorption hole (503) passes through the carrier plate body (501) and corresponds to the bottom end of the display screen, while the other end is connected to the vacuum chamber, which is connected to a vacuum generator.

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