diffusion furnace

Abstract

This application provides a diffusion furnace, comprising a diffusion furnace body, a containment space enclosed by the diffusion furnace body, a support boat, and temperature control rods. The support boat is disposed within the containment space along a first direction, and the temperature control rods are disposed within the containment space along a second direction, on the side away from the support boat. The first and second directions are perpendicular to each other. The containment space includes multiple different temperature control zones, and multiple temperature control rods are respectively disposed within the multiple temperature control zones and fixed to the inner wall of the diffusion furnace body corresponding to the temperature control zones. Thus, this structure allows for temperature adjustment of different temperature control zones within the containment space via the temperature control rods, ensuring the uniformity of the diffusion gas within the containment space, resulting in sufficient chip diffusion and thereby improving chip yield.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a diffusion furnace. Background Technology

[0002] In semiconductor manufacturing, chips are first placed on a quartz boat, which is then placed into a diffusion furnace. A diffusion gas (such as phosphorus oxychloride) is then introduced into the furnace, and the diffusion gas deposits on the chip surface, achieving the chip's conductivity. However, current diffusion furnaces on the market do not achieve sufficient diffusion of the chips, thus affecting the product yield. Utility Model Content

[0003] To overcome the technical problems mentioned in the above background, this application provides a diffusion furnace, the diffusion furnace comprising:

[0004] The diffusion furnace body and the accommodating space enclosed by the diffusion furnace body;

[0005] A support boat, which is disposed within the accommodating space along a first direction;

[0006] A temperature control rod is disposed in the accommodating space along a second direction and on the side away from the support boat, wherein the first direction and the second direction are perpendicular to each other;

[0007] The accommodating space includes multiple different temperature control zones, and multiple temperature control rods are respectively disposed in the multiple temperature control zones and fixed to the inner wall of the diffusion furnace body corresponding to the temperature control zone.

[0008] In one possible implementation, a plurality of the temperature control rods are arranged at equal intervals within the accommodating space and on the side away from the support boat.

[0009] In one possible implementation, the dimension between two adjacent temperature control rods in the first direction is a first dimension, which ranges from 15 mm to 25 mm.

[0010] In one possible implementation, different temperature control rods are respectively set in different temperature control areas, and the number of temperature control rods ranges from 5 to 8.

[0011] In one possible implementation, the support boat includes a plurality of spaced-apart support units on the side facing the temperature control rod, each support unit including two fixing slots for fixing the chip to be processed, wherein the opening directions of the two fixing slots are the same.

[0012] In one possible implementation, there are multiple support units, which are arranged at equal intervals on the side of the support boat facing the temperature control rod.

[0013] In the first direction, the dimensions of two adjacent support units are the second dimension, which ranges from 8 mm to 10 mm.

[0014] In one possible implementation, in the first direction, the dimension between the two fixing slots of each support unit is a third dimension, the third dimension ranging from 2.5 mm to 3.5 mm.

[0015] In one possible implementation, the fixing groove in the first direction has a fourth dimension on a cross section perpendicular to the plane of the support boat, and the fourth dimension ranges from 0.8 mm to 0.9 mm.

[0016] In one possible implementation, in each of the support units, the edge of the fixing groove facing the temperature control rod has a chamfer;

[0017] The chamfer angle ranges from 45 degrees to 60 degrees.

[0018] In one possible implementation, the temperature control rod is communicatively connected to a computer device, which is used to adjust the temperature of the temperature control rod, wherein the temperature range of the temperature control rod is 910 degrees Celsius to 930 degrees Celsius.

[0019] Based on any of the above aspects, this application provides a diffusion furnace, which includes a diffusion furnace body, a containment space enclosed by the diffusion furnace body, a support boat, and temperature control rods. The support boat is disposed within the containment space along a first direction, and the temperature control rods are disposed within the containment space along a second direction, on the side away from the support boat. The first and second directions are perpendicular to each other. The containment space includes multiple different temperature control zones, and multiple temperature control rods are respectively disposed within the multiple temperature control zones and fixed to the inner wall of the diffusion furnace body corresponding to the temperature control zones. Thus, the above structure can adjust the temperature of different temperature control zones within the containment space through the temperature control rods to ensure the uniformity of the diffusion gas within the containment space, thereby ensuring sufficient diffusion of the chip and improving the product yield of the chip. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of a diffusion furnace provided for the prior art;

[0022] Figure 2 A schematic diagram of a support boat provided for existing technology;

[0023] Figure 3 This is one of the schematic diagrams of a diffusion furnace provided in this embodiment;

[0024] Figure 4 This is a second schematic diagram of a diffusion furnace provided in this embodiment;

[0025] Figure 5 This is a top view of the support boat provided in this embodiment;

[0026] Figure 6 This is a cross-sectional view of the support boat provided in this embodiment;

[0027] Figure 7 for Figure 6 A magnified view of the middle dashed coil Q1;

[0028] Figure 8 for Figure 6 A magnified view of the middle dashed coil Q2.

[0029] Icons: 1-Diffusion furnace, 10-Diffusion furnace body, 11-Inlet end, 12-Outlet end, 20-Accommodation space, 200-Temperature control area, 30-Support boat, 31-Support unit, 310-Fixing groove, 311-Chamfer, 40-Temperature control rod. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0035] The inventors discovered that in the semiconductor manufacturing field, during the diffusion process of chip 2, chip 2 is first placed on a quartz boat, which is then placed into a diffusion furnace 1. A diffusion gas (e.g., phosphorus oxychloride) is then introduced into the diffusion furnace 1. The diffusion gas deposits on the surface of chip 2, achieving its conductivity. The amount of diffusion gas deposited directly affects the resistance of chip 2. Excessive deposition results in a low resistance, while insufficient deposition leads to a high resistance. This resistance affects subsequent resistance consistency, ultimately impacting the overall yield of chip 2.

[0036] Please refer to Figure 1 , Figure 1 The diagram shows a diffusion furnace 1 of the related technology. During the diffusion process, the diffusion gas enters from the tail of the furnace 1 and exits from the furnace opening. However, the distribution of the diffusion gas in the diffusion furnace 1 is uneven, which affects the resistance value of the chip 2. Specifically, the concentration of the diffusion gas is usually high at the tail of the furnace, so the concentration of the chip 2 near the tail of the furnace is relatively high, which leads to a higher resistance value of the chip 2. Conversely, the concentration of the diffusion gas is low at the furnace opening, so the concentration of the chip 2 near the furnace opening is relatively low, which leads to a lower resistance value of the chip 2.

[0037] Additionally, please refer to Figure 1 and Figure 2 , Figure 2 The diagram shows a quartz boat in the related technology. In the related technology, the chips 2 are arranged at equal intervals on the quartz boat. In this case, because the spacing between two adjacent chips 2 is too small, the diffusion gas flow between them is insufficient, which further affects the resistance value of the chips 2 and reduces the product yield of the chips 2.

[0038] Therefore, in order to solve the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, and the specific implementation scheme of this application will be described in detail below with reference to the accompanying drawings.

[0039] Please see Figure 3 and Figure 4 , Figure 3 This is one of the schematic diagrams of a diffusion furnace 1 provided in this embodiment. Figure 4 This is a second schematic diagram of a diffusion furnace 1 provided in this embodiment. The diffusion furnace 1 includes a diffusion furnace body 10, a receiving space 20 enclosed by the diffusion furnace body 10, a support boat 30, and a temperature control rod 40. The support boat 30 is disposed within the receiving space 20 along a first direction A1, and the temperature control rod 40 is disposed within the receiving space 20 along a second direction A2, on the side away from the support boat 30. The first direction A1 and the second direction A2 are perpendicular to each other.

[0040] In this embodiment, the diffusion furnace body 10 includes an inlet end 11 and an outlet end 12 disposed opposite to each other. The support boat 30 is disposed in the line direction connecting the inlet end 11 and the outlet end 12 of the diffusion furnace body 10, and is usually disposed near the bottom of the diffusion furnace body 10. The line direction connecting the inlet end 11 and the outlet end 12 of the diffusion furnace body 10 is the first direction A1.

[0041] The accommodating space 20 includes multiple temperature-controlled zones 200, with multiple temperature-controlled rods 40 respectively disposed within each temperature-controlled zone 200 and fixed to the inner wall of the diffusion furnace body 10 corresponding to each temperature-controlled zone 200. During the diffusion process of the chip 2, the uniformity of diffusion gas deposition is typically measured by measuring the resistance value of the chip 2. The uniformity of diffusion gas deposition directly affects the subsequent resistance consistency. Specifically, during the diffusion process, three chips 2 are randomly selected from the furnace opening, furnace middle, and furnace tail of the diffusion furnace 1 to test their resistance values. When the amount of diffusion gas deposited is too large, the resistance value of the chip 2 is too low; when the amount of diffusion gas deposited is too small, the resistance value of the chip 2 is too high.

[0042] Therefore, in this embodiment, the temperature of the accommodating space 20 is controlled by zones. The temperature of the temperature-controlled zone 200 can be adjusted in real time according to the resistance value of the chip 2 corresponding to each temperature-controlled zone 200. Specifically, when the resistance value of the chip 2 in the temperature-controlled zone 200 is too high, the temperature of the temperature-controlled zone 200 is increased; when the resistance value of the chip 2 in the temperature-controlled zone 200 is too low, the temperature of the temperature-controlled zone 200 is decreased. This ensures the uniformity of the temperature within the accommodating space 20, thereby ensuring the uniform distribution of the diffusion gas within the accommodating space 20, allowing the chip 2 to diffuse sufficiently, and effectively improving the product yield of the chip 2.

[0043] Furthermore, please refer to again Figure 4 Multiple temperature control rods 40 are arranged at equal intervals within the accommodating space 20, and are located on the side away from the supporting boat 30.

[0044] In this embodiment, the accommodating space 20 is divided into multiple equal and continuous temperature control zones 200. Multiple temperature control rods 40 are respectively arranged in the temperature control zones 200, and the spacing between the multiple temperature control rods 40 is the same, so as to ensure the temperature uniformity in each temperature control zone 200 controlled by each temperature control rod 40.

[0045] Furthermore, please refer to again Figure 4 In the first direction A1, the dimension between two adjacent temperature control rods 40 is the first dimension D1, which ranges from 15 mm to 25 mm. For example, the size of the first dimension D1 is 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, 20 mm, 21 mm, 22 mm, 23 mm, 24 mm, and 25 mm, etc.

[0046] It is worth noting that the size between two adjacent temperature control rods 40 is not specifically limited here, and can be selected from the above range according to the actual situation.

[0047] Furthermore, please refer to again Figure 4 Different temperature control rods 40 are correspondingly set in different temperature control zones 200. The number of temperature control rods 40 ranges from 5 to 8. For example, the number of temperature control rods 40 is 5, 6, 7, and 8, etc. Figure 4 As shown, Figure 4 This is a schematic diagram when there are 5 temperature control rods (40).

[0048] In this embodiment, the number of temperature control zones 200 divided by the accommodating space 20 corresponds to the number of temperature control rods 40. For example, if the accommodating space 20 of the diffusion furnace 1 is divided into 5 temperature control zones 200, then each temperature control zone 200 is provided with one temperature control rod 40, and the number of temperature control rods 40 is also 5.

[0049] It is worth noting that the number of temperature control rods 40 is not specifically limited here, and can be selected from the above range according to the actual situation. Furthermore, two temperature control rods 40 can be installed within the temperature control zone 200 to achieve temperature control of that zone.

[0050] Furthermore, please refer to again Figure 5 and Figure 6 , Figure 5 This is a top view of the support boat 30 provided in this embodiment. Figure 6 The cross-sectional view of the support boat 30 provided in this embodiment shows that the support boat 30 includes a plurality of spaced support units 31 on the side facing the temperature control rod 40. Each support unit 31 includes two fixing slots 310, which are used to fix the chip 2 to be processed. The opening directions of the two fixing slots 310 are the same.

[0051] In this embodiment, the chip to be processed 2 includes a front side and a back side facing each other. The diffused gas is typically deposited on the front side of the chip to be processed 2. Therefore, the two chips to be processed 2 are respectively fixed in two fixing slots 310, and the back sides of the two chips to be processed 2 are arranged opposite each other. In related technologies, such as... Figure 2 As shown, the chips to be processed 2 are typically arranged at equal intervals on the support boat 30. In this case, the spacing between two adjacent chips to be processed 2 is too small, which restricts the diffusion gas between them and affects the diffusion effect. However, in this embodiment, two fixed grooves 310 are used as a support unit 31, and the spacing between two adjacent support units 31 is increased, so that the diffusion gas flows fully between the two adjacent support units 31 and directly contacts the front of the chip to be processed 2, ensuring sufficient diffusion of the chip to be processed 2, thereby improving the product yield of the chip to be processed 2.

[0052] Further, please refer to Figure 6 and Figure 7 , Figure 7 for Figure 6 The enlarged view of the dotted coil Q1 shows that in this embodiment, there are multiple support units 31, which are arranged at equal intervals on the side of the support boat 30 facing the temperature control rod 40. This further enhances the uniformity of the diffusion gas flow between adjacent support units 31 and promotes the uniform distribution of the diffusion gas.

[0053] In the first direction A1, the size of two adjacent support units 31 is the second size D2, which ranges from 8 mm to 10 mm. For example, the size of the second size D2 is 8 mm, 9 mm, and 10 mm, etc.

[0054] It is worth noting that the size of two adjacent support units 31 is not specifically limited here, and can be selected from the above range according to the actual situation.

[0055] Furthermore, please refer to again Figure 6 and Figure 7 In the first direction A1, the dimension between the two fixing slots 310 of each support unit 31 is a third dimension D3, which ranges from 2.5 mm to 3.5 mm. For example, the size of the third dimension D3 is 2.5 mm, 2.6 mm, 2.7 mm, 2.8 mm, 3 mm, 3.1 mm, 3.2 mm, 3.3 mm, 3.4 mm, 3.5 mm, etc.

[0056] In this embodiment, the two fixed slots 310 are used as a support unit 31. The size between the two fixed slots 310 should be smaller than the size between the two support units 31 to ensure that the distance between the two support units 31 is increased, so that the diffused gas can be evenly distributed between the two support units 31. In this way, the stability of the chip 2 to be processed on the two fixed slots 310 can be guaranteed, as well as the diffusion uniformity of the chip 2 to be processed can be guaranteed.

[0057] It is worth noting that the size between the two fixing slots 310 is not specifically limited here, and can be selected from the above range according to the actual situation.

[0058] Further, please refer to Figure 6 and Figure 8 , Figure 8 for Figure 6 A partially enlarged view of the dotted coil Q2. On a cross-section perpendicular to the plane of the support boat 30, the fixing groove 310 in the first direction A1 has a fourth dimension D4. The fourth dimension D4 ranges from 0.8 mm to 0.9 mm. For example, the size of the fourth dimension D4 is 0.8 mm, 0.81 mm, 0.82 mm, 0.83 mm, 0.84 mm, 0.85 mm, 0.86 mm, 0.87 mm, 0.88 mm, 0.89 mm, and 0.9 mm, etc.

[0059] In this embodiment, the size of the fixing slot 310 should match the size of the chip 2 to be processed that is fixed in the fixing slot 310.

[0060] Further, please refer to Figure 6 In this embodiment, the edge of the fixing groove 310 facing the temperature control rod 40 has a chamfer 311. This allows the chip to be processed 2 to be smoothly inserted into the fixing groove 310, ensuring the integrity of the chip to be processed 2.

[0061] In this embodiment, the chamfer 311 has an angle range of 45 degrees to 60 degrees. For example, the angle of the chamfer 311 is 45 degrees, 50 degrees, 55 degrees and 60 degrees.

[0062] It is worth noting that the angle of chamfer 311 is not specifically limited here, and can be selected from the above range according to the actual situation.

[0063] Furthermore, the temperature control rod 40 is communicatively connected to a computer device, which is used to adjust the temperature of the temperature control rod 40. The temperature range of the temperature control rod 40 is 910 degrees Celsius to 930 degrees Celsius. For example, the temperature values ​​of the temperature control rod 40 are 910 degrees Celsius, 915 degrees Celsius, 920 degrees Celsius, 925 degrees Celsius, and 930 degrees Celsius.

[0064] In this embodiment, the computer equipment can be an industrial control computer, a programmable logic controller (PLC), or a dedicated temperature control unit with data processing, storage, and communication functions. During the diffusion process of chip 2, the uniformity of diffusion gas deposition is typically measured by measuring the resistance value of chip 2, which directly affects the subsequent resistance consistency. Therefore, in this embodiment, the temperature of the temperature control rod 40 can be adjusted in real time based on the detected resistance value of the chip 2 to ensure the uniformity of temperature within the containment space 20. This, in turn, ensures the uniform distribution of diffusion gas within the containment space 20, resulting in sufficient diffusion of chip 2 and effectively improving the product yield of chip 2.

[0065] In summary, this application provides a diffusion furnace, comprising a diffusion furnace body, a containment space enclosed by the diffusion furnace body, a support boat, and temperature control rods. The support boat is disposed within the containment space along a first direction, and the temperature control rods are disposed within the containment space along a second direction, on the side away from the support boat. The first and second directions are perpendicular to each other. The containment space includes multiple different temperature control zones, and multiple temperature control rods are respectively disposed within multiple temperature control zones and fixed to the inner wall of the diffusion furnace body corresponding to each temperature control zone. Thus, the above structure can adjust the temperature of different temperature control zones within the containment space via the temperature control rods to ensure the uniformity of the diffusion gas within the containment space, resulting in sufficient chip diffusion and thereby improving the product yield of the chip.

[0066] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A diffusion furnace characterized by comprising: The diffusion furnace includes: The diffusion furnace body and the accommodating space enclosed by the diffusion furnace body; A support boat, which is disposed within the accommodating space along a first direction; A temperature control rod is disposed in the accommodating space along a second direction and on the side away from the support boat, wherein the first direction and the second direction are perpendicular to each other; The accommodating space includes multiple different temperature control zones, and multiple temperature control rods are respectively disposed in the multiple temperature control zones and fixed to the inner wall of the diffusion furnace body corresponding to the temperature control zone.

2. The diffusion furnace of claim 1, wherein Multiple temperature control rods are arranged at equal intervals within the accommodating space, on the side away from the supporting boat.

3. The diffusion furnace of claim 2, wherein In the first direction, the dimension between two adjacent temperature control rods is a first dimension, which ranges from 15 mm to 25 mm.

4. The diffusion furnace as described in claim 1, characterized in that, Different temperature control rods are set in different temperature control areas, and the number of temperature control rods ranges from 5 to 8.

5. The diffusion furnace as described in claim 1, characterized in that, The support boat includes multiple spaced support units on the side facing the temperature control rod. Each support unit includes two fixing slots for fixing the chip to be processed, wherein the opening directions of the two fixing slots are the same.

6. The diffusion furnace as described in claim 5, characterized in that, The number of support units is multiple, and the multiple support units are arranged at equal intervals on the side of the support boat facing the temperature control rod; In the first direction, the dimensions of two adjacent support units are the second dimension, which ranges from 8 mm to 10 mm.

7. The diffusion furnace as described in claim 5, characterized in that, In the first direction, the dimension between the two fixing slots of each support unit is a third dimension, which ranges from 2.5 mm to 3.5 mm.

8. The diffusion furnace as described in claim 5, characterized in that, On a cross-section perpendicular to the plane of the support boat, the dimension of the fixing groove in the first direction is a fourth dimension, and the fourth dimension ranges from 0.8 mm to 0.9 mm.

9. The diffusion furnace as described in claim 5, characterized in that, In each of the support units, the edge of the fixing groove facing the temperature control rod has a chamfer; The chamfer angle ranges from 45 degrees to 60 degrees.

10. The diffusion furnace as described in claim 1, characterized in that, The temperature control rod is communicatively connected to a computer device, which is used to adjust the temperature of the temperature control rod, wherein the temperature range of the temperature control rod is 910 degrees Celsius to 930 degrees Celsius.

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