A pin cleaning device for semiconductor chips

Abstract

This utility model discloses a pin cleaning device for semiconductor chips, comprising: a housing, with grooves on both sides of the upper end of the housing, a slider slidably connected to the inner side of the grooves, a movable frame fixedly connected to the upper end of the slider, a clamping rod slidably connected to the inner side of the movable frame, a groove at the front end of the clamping rod, a round rod fixedly connected to the center of the rear end of the clamping rod, a spring fixedly connected to the center of the rear end of the clamping rod, the rear end of the spring fixedly connected to the rear end of the movable frame, square rods fixedly connected to both sides of the rear end of the clamping rod, the square rods and the round rods slidably connected to the inner holes of the rear end of the movable frame, and a fixing rod fixedly connected to the rear ends of the round rods and the square rods. By pulling the handle, the clamping rod can be moved to the rear end; by releasing the handle, the spring can be reset. The semiconductor chip can be fixed by the clamping rod at the front end and the groove in the movable frame.

Description

Technical Field

[0001] This utility model relates to the field of pin cleaning technology, and in particular to a pin cleaning device for semiconductor chips. Background Technology

[0002] Semiconductor chip pin cleaning refers to the process of cleaning and maintaining the metal pins of electronic components such as integrated circuits, CPUs, GPUs, and memory modules. The purpose is to remove contaminants such as oxide layers, dust, stains, residual solder, or thermal grease to ensure good electrical contact and signal transmission performance.

[0003] A search revealed Chinese Patent Publication No. CN221581356U, which describes a semiconductor chip pin cleaning device. The device includes a placement plate and a cleaning box, with the placement plate mounted on one side of the cleaning box. The placement plate has several sets of placement slots for placing semiconductor chips, and each set of slots has vacuum suction holes for adsorbing and fixing the semiconductor chips. Hot air boxes are fixedly installed at both ends of the cleaning box, used to heat and melt residual tin and other residues on the semiconductor chip pins. This invention proposes a semiconductor chip pin cleaning device that uses vacuum adsorption to clean the pins of semiconductor chips in batches, and uses hot air from the hot air boxes to melt and collect the residues, effectively improving the pin cleaning efficiency. However, this device cannot effectively fix larger semiconductor chips, and after cleaning, the semiconductor chip can only be pulled out, which may cause the pins to detach or bend, thus damaging the semiconductor chip. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor chip pin cleaning device, which solves the problem that the semiconductor chip may bend or fall off when it is pulled out of the placement slot after cleaning.

[0005] To achieve the above objectives, a pin cleaning device for semiconductor chips is provided, comprising: a housing, on both sides of the upper end of the housing having sliding grooves, a slider slidably connected to the inner side of the sliding grooves, a movable frame fixedly connected to the upper end of the slider, a clamping rod slidably connected to the inner side of the movable frame, a groove being formed at the front end of the clamping rod, a groove being simultaneously formed at the front end of the inner side of the movable frame and having the same volume as the groove at the front end of the clamping rod, a round rod being fixedly connected at the center of the rear end of the clamping rod, a spring being fixedly connected at the center of the rear end of the clamping rod, and the rear end of the spring being fixedly connected to the rear end of the inner side of the movable frame;

[0006] Square rods are fixedly connected to both sides of the rear end of the clamping rod. Multiple sets of holes are opened at the rear end of the movable frame. The square rods and round rods are slidably connected to the inner holes at the rear end of the movable frame. Fixed rods are fixedly connected to the rear ends of the round rods and square rods.

[0007] According to the aforementioned semiconductor chip pin cleaning device, a handle is fixedly connected to the center of the rear end of the fixing rod.

[0008] According to the aforementioned semiconductor chip pin cleaning device, a screw is rotatably connected to the inner side of the slide groove, and a motor is fixedly connected to the upper left front end of the housing. The coupling of the motor's output shaft passes through the housing and is fixedly connected to the screw.

[0009] According to the aforementioned semiconductor chip pin cleaning device, a slide rod is fixedly connected to the inner side of the slide groove, the slider is slidably connected to the slide rod, and the slider is threadedly connected to the screw.

[0010] According to the aforementioned semiconductor chip pin cleaning device, a through groove is provided on the upper right side of the housing, and a shielding plate is slidably connected to the inner side of the through groove. The upper end of the shielding plate is fixedly connected to the lower end of the clamping rod.

[0011] According to the aforementioned semiconductor chip pin cleaning device, multiple sets of nozzles are provided on the upper left side of the inner side of the housing.

[0012] According to the aforementioned semiconductor chip pin cleaning device, an exhaust fan is fixedly connected to the center of the front and rear ends of the outer side of the housing, and an air outlet slot is fixedly connected to the inner side of the housing.

[0013] According to the aforementioned semiconductor chip pin cleaning device, a through hole is provided at the rear end of the inner side of the housing, and a drain pipe is fixedly connected to the through hole at the rear end of the inner side of the housing, with a valve provided at the upper end of the drain pipe.

[0014] The above solution has the following advantages: By setting a clamping rod inside the movable frame, the rear end of the clamping rod is connected to a square rod, a round rod, and a spring. The rear ends of the square rod and the round rod are connected to a fixing rod, and the rear end of the fixing rod is connected to a handle. Both the clamping rod and the left side of the inner end of the movable frame have grooves. When in use, pulling the handle causes the fixing rod to drive the front round rod and the square rod. The square rod and the round rod slide in the hole of the fixing frame. The square rod and the round rod move backward, causing the front clamping rod to move backward. The rearward movement of the clamping rod compresses the spring at the rear end. At this time, the distance between the clamping rod and the movable frame is adjusted according to the size of the chip. After determining the size, the two ends of the chip are placed in the grooves on the inner side of the clamping rod and the movable frame, respectively. At this time, the handle is released, and the clamping rod and the movable frame firmly clamp the two ends of the chip under the action of the spring, thereby avoiding damage to the chip pins when fixing and removing the chip.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chip pin cleaning device according to the present invention.

[0018] Figure 2 This is a diagram showing the closed state of a pin cleaning device for a semiconductor chip according to this utility model;

[0019] Figure 3 This is a schematic diagram of the clamping assembly structure of a semiconductor chip pin cleaning device according to the present invention;

[0020] Figure 4 This is a schematic diagram of the internal components of the housing of a semiconductor chip pin cleaning device according to the present invention.

[0021] Legend:

[0022] 1. Housing; 2. Nozzle; 3. Slide rail; 4. Exhaust fan; 5. Movable frame; 6. Round rod; 7. Square rod; 8. Shielding plate; 9. Fixing rod; 10. Handle; 11. Valve; 12. Drain pipe; 13. Slider; 14. Spring; 15. Air outlet duct; 16. Screw; 17. Slide rail; 18. Through groove; 19. Motor; 20. Clamping rod. Detailed Implementation

[0023] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0024] Reference Figure 1-4 This utility model provides a semiconductor chip pin cleaning device, which includes: a housing 1, with grooves 3 on both sides of the upper end of the housing 1, a slider 13 slidably connected to the inner side of the grooves 3, a movable frame 5 fixedly connected to the upper end of the slider 13, a clamping rod 20 slidably connected to the inner side of the movable frame 5, a groove at the front end of the clamping rod 20, a groove at the front end of the inner side of the movable frame 5 with the same volume as the groove at the front end of the clamping rod 20, a round rod 6 fixedly connected to the center of the rear end of the clamping rod 20, and a spring 14 fixedly connected to the center of the rear end of the clamping rod 20, with the rear end of the spring 14 fixedly connected to the rear end of the inner side of the movable frame 5;

[0025] Square rods 7 are fixedly connected to both sides of the rear end of the clamping rod 20. Multiple sets of holes are opened at the rear end of the movable frame 5. Square rods 7 and round rods 6 are slidably connected to the inner holes at the rear end of the movable frame 5. Fixed rods 9 are fixedly connected to the rear ends of round rods 6 and square rods 7.

[0026] A handle 10 is fixedly connected to the center of the rear end of the fixed rod 9. Pulling the handle 10 can drive the fixed rod 9 to move synchronously to the rear end. The handle 9 adopts a U-shaped layout, which makes it more convenient to pull.

[0027] A screw 16 is rotatably connected to the inner side of the slide 3. A motor 18 is fixedly connected to the upper left front end of the housing 1. The coupling of the output shaft of the motor 18 passes through the housing 1 and is fixedly connected to the screw 16. The rotation of the output shaft of the motor 18 can synchronously drive the screw 16 to rotate through the coupling.

[0028] A slide rod 17 is fixedly connected to the inner side of the slide groove 3. The slider 13 is slidably connected to the slide rod 17. The slider 13 is threadedly connected to the screw 16. When the screw 16 rotates, the slider 13 can be driven to slide in the slide groove 3 under the action of the threaded connection. The sliding of the slider 13 drives the upper movable frame and the other end slider 13 to slide synchronously on the slide rod 17.

[0029] A through groove 18 is provided on the upper right side of the housing 1. A shielding plate 8 is slidably connected to the inside of the through groove 18. The upper end of the shielding plate 8 is fixedly connected to the lower end of the clamping rod 20. The shielding plate 8 and the front end of the clamping rod 20 are on the same vertical plane. There is a gap between the clamping rod 20 and the shielding plate 8 and the movable frame 5. The gap between the clamping rod 20 and the movable frame 5 is slightly smaller than the width of the semiconductor chip. When the semiconductor chip is being held, the force applied to the chip is not too great, thus avoiding damage to the semiconductor chip due to excessive force. When the clamping rod 20 holds the chip, the shielding plate 8 can work with the chip to achieve a semi-sealed state, so that the dust and waste generated during the cleaning of the semiconductor chip can be effectively shielded.

[0030] Multiple sets of nozzles 2 are installed on the upper left side of the inner side of the housing 1. The other end of the nozzle 2 is connected to a liquid supply pipe. The liquid sprayed from the inside of the nozzle 2 is isopropyl alcohol, which can effectively clean the slight oxidation and stubborn stains on the pins.

[0031] A fan 4 is fixedly connected to the center of the front and rear ends of the outer side of the housing 1, and an air outlet 15 is fixedly connected to the inner side of the housing 1. The fan 4 can draw in the outside air, filter it through the air outlet 15, and then clean the pins of the chip.

[0032] A through hole is provided at the rear end of the inner side of the box 1. A drain pipe 12 is fixedly connected to the through hole at the rear end of the inner side of the box 1. A valve 11 is provided at the upper end of the drain pipe 12. The drain pipe 12 can discharge the waste liquid generated during internal cleaning. The valve 11 can control the opening and closing of the drain pipe 12.

[0033] Working principle: When in use, pull the handle 10. The handle 10 moves the fixed rod 9 backward, which in turn moves the round rod 6 and square rod 7 at the front end backward. The backward movement of the round rod 6 and square rod 7 causes the clamping rod 20 at the front end to move backward. The clamping rod 20 moves backward and compresses the spring 14. When the distance between the clamping rod 20 and the inner side of the movable frame 5 is greater than the semiconductor chip to be cleaned, place the front end of the semiconductor chip in the groove at the left end of the inner side of the movable frame 5. Slowly release the handle 10. Under the action of the spring 14, the clamping rod 20 at the front end is pushed forward to reset. The groove at the front end of the clamping rod 20 will fix the other end of the semiconductor chip, and the spring 14 will make the semiconductor chip firmly clamped. At this time, start the motor 19. Under the action of the coupling of the output shaft of the motor 19, the screw 16 will rotate. Under the action of the threaded connection, the slider 13 moves along the groove 3. The sliding rod 17 moves, and the movement of the slider 13 drives the upper movable frame 5, the inner components, and the shielding plate 8 at the lower end of the clamping rod 20 to move synchronously. The shielding plate 8, together with the semiconductor chip and the housing 1, forms a semi-enclosed space, so that the dust and waste generated during the cleaning of the semiconductor chip can be effectively shielded. When the movable frame 5 is in the closed state, the nozzle 2 is activated. The nozzle 2 can spray a mist of isoacetone to clean the pins at the bottom of the semiconductor chip. After the nozzle 2 finishes spraying, the exhaust fan 4 draws in the external air and dries the pins of the semiconductor chip through the air outlet 15, which can also blow away the fine dust on the pins. After cleaning, the waste liquid can be discharged from the drain pipe 12. There is a valve 11 on the drain pipe 12, which can control the opening and closing of the drain pipe 12 and the size of the opening and closing. After cleaning, the semiconductor chip can be removed by pulling the handle 10 without causing the pins to bend or fall off.

[0034] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A pin cleaning apparatus for a semiconductor chip, comprising: The box body (1) is characterized in that the upper end of the box body (1) is provided with sliding grooves (3) on both sides, the sliding grooves (3) are slidably connected to the inner side of the sliding grooves (3), the upper end of the sliding grooves (13) is fixedly connected to a movable frame (5), the inner side of the movable frame (5) is slidably connected to a clamping rod (20), the front end of the clamping rod (20) is provided with a groove, the front end of the inner side of the movable frame (5) is simultaneously provided with a groove and the same volume size as the groove at the front end of the clamping rod (20), the rear end of the clamping rod (20) is fixedly connected to a round rod (6) at the center position, the rear end of the clamping rod (20) is fixedly connected to a spring (14) at the center position, and the rear end of the spring (14) is fixedly connected to the rear end of the inner side of the movable frame (5); The clamping rod (20) is fixedly connected to square rods (7) on both sides of its rear end. The movable frame (5) has multiple sets of holes at its rear end. The square rods (7) and round rods (6) are slidably connected to the inner holes at the rear end of the movable frame (5). The round rods (6) and square rods (7) are fixedly connected to fixing rods (9) at their rear ends.

2. The pin cleaning apparatus for a semiconductor chip according to claim 1, wherein A handle (10) is fixedly connected to the center of the rear end of the fixed rod (9).

3. The pin cleaning apparatus for a semiconductor chip according to claim 1, wherein A screw (16) is rotatably connected to the inside of the slide (3), and a motor (19) is fixedly connected to the upper left front end of the housing (1). The coupling of the output shaft of the motor (19) passes through the housing (1) and is fixedly connected to the screw (16).

4. The pin cleaning apparatus for a semiconductor chip according to claim 1, wherein A slide rod (17) is fixedly connected to the inner side of the slide groove (3), the slider (13) is slidably connected to the slide rod (17), and the slider (13) is threadedly connected to the screw (16).

5. The pin cleaning device for a semiconductor chip according to claim 1, characterized in that, The upper right side of the box (1) is provided with a through groove (18), and a shielding plate (8) is slidably connected to the inside of the through groove (18). The upper end of the shielding plate (8) is fixedly connected to the lower end of the clamping rod (20).

6. The pin cleaning device for a semiconductor chip according to claim 1, characterized in that, Multiple sets of nozzles (2) are provided on the upper left side of the inner side of the housing (1).

7. The pin cleaning device for a semiconductor chip according to claim 1, characterized in that, A fan (4) is fixedly connected to the center of the front and rear ends of the outer side of the box (1), and an air outlet slot (15) is fixedly connected to the inner side of the box (1).

8. The pin cleaning device for a semiconductor chip according to claim 1, characterized in that, The inner rear end of the box (1) is provided with a through hole, and a drain pipe (12) is fixedly connected to the through hole at the inner rear end of the box (1). A valve (11) is provided at the upper end of the drain pipe (12).

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