A wafer processing loading and unloading handling equipment

Abstract

This utility model discloses a wafer processing loading and unloading handling device, including a main support assembly with a mounting slot; an auxiliary support assembly disposed on one side of the main support assembly; a wafer handling assembly disposed within the mounting slot; a wafer loading and storage assembly disposed on the main support assembly on one side of the wafer handling assembly; a wafer edge-finding assembly disposed on the main support assembly on the side of the wafer handling assembly away from the wafer loading and storage assembly; a wafer loading assembly disposed on the main support assembly; a positioning assembly disposed on the side of the main support assembly; a wafer unloading assembly disposed on the main support assembly near the auxiliary support assembly; and an unloading temporary storage assembly disposed on the main support assembly on the side of the wafer unloading assembly. Using this loading and unloading handling device replaces manual wafer handling, avoiding positional errors caused by manual wafer placement and effectively reducing the risk of wafer breakage during processing due to positional deviations during manual placement.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer processing loading and unloading handling equipment. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer.

[0003] During wafer processing, manual handling and placement of wafers are required. However, manual handling can lead to significant positional deviations, increasing the risk of wafer breakage during processing. Furthermore, manual handling is inefficient. Therefore, it is necessary to design a wafer processing loading and unloading handling device. Utility Model Content

[0004] The purpose of this invention is to solve the above-mentioned problems by designing a wafer processing loading and unloading handling device.

[0005] The technical solution of this utility model to achieve the above objectives is a wafer processing loading and unloading handling equipment, including a main support assembly for mounting a wafer handling assembly, and the main support assembly is provided with a mounting groove;

[0006] Auxiliary support components are located on one side of the main support components;

[0007] A wafer handling assembly is disposed within the mounting slot for handling wafers;

[0008] A wafer loading and storage assembly is mounted on the main support assembly and located on one side of the wafer handling assembly.

[0009] The wafer edge-finding component is mounted on the main support component and located on the side of the wafer handling component away from the wafer loading and storage component.

[0010] A wafer loading assembly is mounted on the main support assembly;

[0011] A positioning component is disposed on the side of the main support component;

[0012] A wafer feeding assembly is disposed on the main support assembly near the auxiliary support assembly;

[0013] The material feeding temporary storage component is located on one side of the main support component, which is situated on the wafer feeding component.

[0014] As a further description of this technical solution, the wafer handling assembly includes a wafer handling robot disposed in a mounting slot.

[0015] As a further description of this technical solution, the main support assembly includes a main support frame, an auxiliary installation box is provided on the main support frame, an installation groove is provided inside the auxiliary installation box, and a plurality of balance adjustment feet are provided at the bottom of the main support frame.

[0016] As a further description of this technical solution, the wafer loading and storage assembly includes an auxiliary connecting block disposed on the main support assembly. A fixed base plate is disposed on the auxiliary connecting block. A front limiting block and a rear limiting block are disposed on the fixed top plate. A wafer cassette is disposed on the fixed top plate between the front limiting block and the rear limiting block.

[0017] As a further description of this technical solution, the wafer loading assembly includes a wafer loading robot mounted on the main support assembly.

[0018] As a further description of this technical solution, the positioning component includes an auxiliary connecting rod disposed on the side of the main support component, a light source fixing seat disposed on the auxiliary connecting rod, a special-shaped bracket disposed on the light source fixing seat, and a positioning camera disposed on the special-shaped bracket.

[0019] As a further description of this technical solution, the wafer unloading assembly includes a wafer unloading robot arm disposed on the main support assembly near the auxiliary support assembly.

[0020] As a further description of this technical solution, the unloading temporary storage component includes a stage support mounted on one side of the main support component located on the wafer unloading component. A wafer stage is mounted on the stage support, and a plurality of wafer limiting blocks are mounted on the wafer stage.

[0021] As a further description of this technical solution, the auxiliary support assembly includes an auxiliary support frame disposed on one side of the main support assembly. An overflow water tank is disposed on the auxiliary support frame, an overflow water pipe is disposed in the overflow water tank, a wafer cassette fixing bracket is disposed above the overflow water pipe in the overflow water tank, a wafer cassette is disposed on the wafer cassette fixing bracket, and a plurality of balance adjustment feet are disposed at the bottom of the auxiliary support frame.

[0022] Its beneficial effects are that the loading and unloading handling equipment of this technical solution has a clever structural design, strong practicality, and stable operation. Using this loading and unloading handling equipment, the manual handling of wafers is replaced, realizing automatic handling, automatic center finding, and automatic loading and unloading operations of wafers. It effectively reduces manual intervention, improves wafer handling efficiency, and also effectively improves wafer processing efficiency. Using this wafer processing loading and unloading handling equipment avoids the positional errors of manually placing wafers, effectively reducing the risk of wafer breakage during processing due to positional deviations during manual placement. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the installation structure of the wafer edge-finding component of this utility model;

[0024] Figure 2 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 3 This is a schematic diagram of the structure of the wafer loading and storage assembly of this utility model;

[0026] Figure 4 This is a schematic diagram of the installation structure of the overflow water tank of this utility model.

[0027] In the diagram, 1. Main support assembly; 2. Auxiliary support assembly; 3. Wafer handling assembly; 4. Wafer loading and storage assembly; 5. Wafer edge finding assembly; 6. Wafer loading assembly; 7. Positioning assembly; 8. Wafer unloading assembly; 9. Unloading temporary storage assembly; 10. Main support frame; 11. Auxiliary mounting box; 12. Mounting slot; 13. Balance adjustment foot; 14. Wafer handling robot; 15. Auxiliary connecting block; 16. Fixed base plate; 17. Front limit block; 18. Rear limit block; 19. Wafer cassette; 20. Wafer loading robot; 21. Auxiliary connecting rod; 22. Light source fixing seat; 23. Irregular bracket; 24. Positioning camera; 25. Wafer unloading robot; 26. Stage support; 27. Wafer stage; 28. Wafer limit block; 29. ​​Auxiliary support frame; 30. Overflow water tank; 31. Overflow water pipe; 32. Wafer cassette fixing bracket. Detailed Implementation

[0028] First, let me explain the design intention of this utility model. During the wafer processing, the wafer needs to be handled and placed manually. The positional deviation of the wafer during manual handling and placement is relatively large, which leads to the risk of fragmentation during wafer processing. In addition, the efficiency of manual handling is low. Therefore, this utility model designs a wafer processing loading and unloading handling device.

[0029] The present invention will now be described in detail with reference to the accompanying drawings, such as... Figures 1-4 As shown, a wafer processing loading and unloading handling device includes a main support assembly 1. The main support assembly 1 will be described in detail below. The main support assembly 1 includes a main support frame 10. An auxiliary mounting box 11 is provided on the main support frame 10. A mounting groove 12 is provided inside the auxiliary mounting box 11. A wafer handling assembly 3 is provided inside the mounting groove 12.

[0030] To ensure the stability of the main support frame 10, several balance adjustment feet 13 are provided at the bottom of the main support frame 10.

[0031] To facilitate the installation of the overflow water tank 30, an auxiliary support component 2 is provided on one side of the main support component 1. The auxiliary support component 2 will be described in detail below. The auxiliary support component 2 includes an auxiliary support frame 29 provided on one side of the main support component 1. An overflow water tank 30 is provided on the auxiliary support frame 29. An overflow water pipe 31 is provided in the overflow water tank 30. A wafer cassette fixing bracket 32 ​​is provided in the overflow water tank 30 above the overflow water pipe 31. A wafer cassette 19 is provided on the wafer cassette fixing bracket 32.

[0032] To ensure the stability of the auxiliary support frame 29, several balance adjustment feet 13 are provided at the bottom of the auxiliary support frame 29.

[0033] A mounting slot 12 is provided on the main support component 1. In order to facilitate the transfer of the wafers stored in the wafer loading and storage component 4 to the wafer edge finding component 5, a wafer handling component 3 is provided in the mounting slot 12. The wafer handling component 3 will be described in detail below. The wafer handling component 3 includes a wafer handling robot 14 disposed in the mounting slot 12.

[0034] To facilitate storage before wafer loading and handling, a wafer loading and storage component 4 is provided on the main support component 1, located on one side of the wafer handling component 3. The wafer loading and storage component 4 will be described in detail below. The wafer loading and storage component 4 includes an auxiliary connecting block 15 provided on the main support component 1. A fixed base plate 16 is provided on the auxiliary connecting block 15. A front limiting block 17 and a rear limiting block 18 are provided on the fixed top plate. A wafer cassette 19 is provided on the fixed top plate between the front limiting block 17 and the rear limiting block 18.

[0035] To facilitate finding the center of the wafer and determining its position, a wafer edge finding component 5 is provided on the main support component 1 on the side of the wafer handling component 3 away from the wafer loading and storage component 4.

[0036] To facilitate the transfer of wafers from the wafer edge finding component 5 to the unloading temporary storage component 9, a wafer loading component 6 is provided on the main support component 1. The wafer loading component 6 will be described in detail below. The wafer loading component 6 includes a wafer loading robot 20 provided on the main support component 1.

[0037] A positioning component 7 is provided on the side of the main support component 1. The positioning component 7 will be described in detail below. The positioning component 7 includes an auxiliary connecting rod 21 provided on the side of the main support component 1. A light source fixing seat 22 is provided on the auxiliary connecting rod 21. A special-shaped bracket 23 is provided on the light source fixing seat 22. A positioning camera 24 is provided on the special-shaped bracket 23.

[0038] A polishing machine is provided on the side of the main support component 1, below the positioning component 7, and a wafer placement slot is provided on the polishing machine.

[0039] To facilitate the unloading of polished wafers, a wafer unloading component 8 is provided on the main support component 1 near the auxiliary support component 2. The wafer unloading component 8 will be described in detail below. The wafer unloading component 8 includes a wafer unloading robot 25 provided on the main support component 1 near the auxiliary support component 2.

[0040] To facilitate the temporary storage of the wafers being cut, a temporary storage component 9 is provided on the side of the main support component 1 located on the wafer cutting component 8. The temporary storage component 9 will be described in detail below. The temporary storage component 9 includes a stage support 26 provided on the side of the main support component 1 located on the wafer cutting component 8. A wafer stage 27 is provided on the stage support 26, and a plurality of wafer limiting blocks 28 are provided on the wafer stage 27.

[0041] The specific structure of this utility model has been described in detail above. The working principle of this utility model will be explained below: A wafer cassette 19 is placed on a cassette holder, and a wafer is placed inside the wafer cassette 19. A wafer handling robot 14 transports the wafer from the wafer cassette 19 on the cassette holder to the wafer edge-finding assembly 5. The wafer edge-finding assembly 5 locates the center of the wafer, and the data of the wafer center is sent to the wafer loading robot 20. The positioning assembly 7 locates the center data of the wafer placement slot and sends the data to the wafer loading robot 20. Then, the wafer loading robot 20 transports the wafer from the wafer edge-finding assembly 5 to the wafer placement slot. A polishing machine polishes the wafer in the wafer placement slot. After polishing, the wafer loading robot 20 transports the polished wafer to the unloading temporary storage assembly 9 for temporary storage. Then, the wafer unloading robot... The robotic arm 25 transports the wafers from the unloading temporary storage component 9 to the wafer cassette 19 within the overflow water tank 30. The overflow water tank 30 removes residual polishing fluid from the wafer surface, preventing contamination. This loading and unloading equipment features a clever structural design, strong practicality, and stable operation. It replaces manual wafer handling, achieving automated wafer transport, automatic centering, and automated loading and unloading operations. This effectively reduces manual intervention, improves wafer handling efficiency, and enhances wafer processing efficiency. Furthermore, this wafer handling equipment avoids the positional errors caused by manual wafer placement, effectively reducing the risk of wafer breakage during processing due to positional deviations during manual placement. It also reduces surface particle contamination caused by manual contact with the wafers, further improving the yield rate.

[0042] The above technical solution only embodies the preferred technical solution of this utility model. Any changes that may be made by those skilled in the art to certain parts of it embody the principle of this utility model and fall within the protection scope of this utility model.

Claims

1. A wafer processing loading and unloading handling device, characterized in that, It includes a main support assembly (1) for mounting a wafer handling assembly (3), and the main support assembly (1) is provided with a mounting slot (12); An auxiliary support component (2) is disposed on one side of the main support component (1); A wafer handling assembly (3) is disposed in the mounting slot (12) for handling wafers; The wafer loading and storage assembly (4) is disposed on the main support assembly (1) on one side of the wafer handling assembly (3); The wafer edge finding component (5) is located on the main support component (1) on the side of the wafer handling component (3) away from the wafer loading and storage component (4); A wafer loading assembly (6) is disposed on the main support assembly (1); A positioning component (7) is disposed on the side of the main support component (1); The wafer feeding assembly (8) is disposed on the main support assembly (1) on the side close to the auxiliary support assembly (2); The material unloading temporary storage component (9) is located on the side of the main support component (1) located on the wafer unloading component (8).

2. The wafer processing loading and unloading handling equipment according to claim 1, characterized in that, The wafer handling assembly (3) includes a wafer handling robot (14) disposed in the mounting slot (12).

3. The wafer processing loading and unloading handling equipment according to claim 1, characterized in that, The main support assembly (1) includes a main support frame (10), an auxiliary installation box (11) is provided on the main support frame (10), an installation groove (12) is provided in the auxiliary installation box (11), and a number of balance adjustment feet (13) are provided at the bottom of the main support frame (10).

4. The wafer processing loading and unloading handling equipment according to claim 1, characterized in that, The wafer loading and storage assembly (4) includes an auxiliary connecting block (15) disposed on the main support assembly (1). A fixed base plate (16) is disposed on the auxiliary connecting block (15). A front limiting block (17) and a rear limiting block (18) are disposed on the fixed base plate. A wafer cassette (19) is disposed between the front limiting block (17) and the rear limiting block (18) on the fixed base plate.

5. The wafer processing loading and unloading handling equipment according to claim 1, characterized in that, The wafer loading assembly (6) includes a wafer loading robot (20) mounted on the main support assembly (1).

6. The wafer processing loading and unloading handling equipment according to claim 1, characterized in that, The positioning component (7) includes an auxiliary connecting rod (21) disposed on the side of the main support component (1), a light source fixing seat (22) is disposed on the auxiliary connecting rod (21), a special-shaped bracket (23) is disposed on the light source fixing seat (22), and a positioning camera (24) is disposed on the special-shaped bracket (23).

7. The wafer processing loading and unloading handling equipment according to claim 1, characterized in that, The wafer unloading assembly (8) includes a wafer unloading robot (25) disposed on the main support assembly (1) near the auxiliary support assembly (2).

8. The wafer processing loading and unloading handling equipment according to claim 1, characterized in that, The material unloading temporary storage component (9) includes a stage support (26) disposed on the side of the main support component (1) located on the wafer unloading component (8). A wafer stage (27) is disposed on the stage support (26), and a plurality of wafer limiting blocks (28) are disposed on the wafer stage (27).

9. A wafer processing loading and unloading handling device according to claim 1, characterized in that, The auxiliary support assembly (2) includes an auxiliary support frame (29) disposed on one side of the main support assembly (1). An overflow water tank (30) is provided on the auxiliary support frame (29). An overflow water pipe (31) is provided in the overflow water tank (30). A wafer cassette fixing bracket (32) is provided above the overflow water pipe (31) in the overflow water tank (30). A wafer cassette (19) is provided on the wafer cassette fixing bracket (32). Several balance adjustment feet (13) are provided at the bottom of the auxiliary support frame (29).

Images