High-precision visual positioning device for wafer with iron ring

By combining X-axis, Y-axis, and Theta-axis adjustment mechanisms with a transparent glass platform, CCD camera, and backlight device, the problem of insufficient positioning accuracy of wafers with iron rings was solved, achieving high-precision wafer positioning and meeting the high-precision requirements of semiconductor manufacturing.

CN224290596UActive Publication Date: 2026-05-26DOBEST SEMICON TECH (SUZHOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DOBEST SEMICON TECH (SUZHOU) CO LTD
Filing Date
2025-05-12
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Insufficient positioning accuracy of wafers with iron rings affects the high-precision requirements of semiconductor manufacturing, leading to deviations in key processes such as photolithography, which in turn affects product quality and production efficiency.

Method used

By employing X-axis, Y-axis, and Theta-axis adjustment mechanisms, combined with a transparent glass platform, CCD camera, and backlight device, high-precision wafer positioning is achieved, eliminating the reliance on the positioning accuracy of the iron ring. High-resolution camera and adjustable brightness backlight improve the accuracy of image capture.

Benefits of technology

It achieves high-precision wafer positioning, meets the high-precision process requirements of semiconductor manufacturing, improves positioning accuracy and imaging accuracy, and expands the scope of application.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of positioning devices, in particular to a high-precision visual positioning device for a wafer with an iron ring. According to the technical scheme, the device comprises a rack and a bottom frame, and further comprises an X shaft, a Y shaft and a Theta shaft which are arranged on the bottom frame, a transparent glass platform is installed on the bottom frame, a wafer is placed on the transparent glass platform, and an iron ring is arranged on the wafer; the CCD camera is installed on the machine frame, and a backlight source device installed on the machine frame is arranged below the CCD camera. According to the utility model, the wafer is directly photographed, and the edge position of the wafer is accurately identified by using the transparent glass platform and the backlight source device, so that the dependence on the iron ring positioning precision is eliminated, the wafer positioning precision is effectively improved, and the photographing precision and the wafer positioning diversity are improved at the same time.
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