Substrate magnetic carriers and semiconductor manufacturing equipment

Abstract

This application relates to the field of semiconductor packaging technology, specifically to a substrate magnetic carrier and semiconductor manufacturing equipment. The substrate magnetic carrier includes: a magnetic support base and a metal cover plate magnetically adsorbed and connected to the magnetic support base to form a receiving cavity. The receiving cavity is used to receive a substrate on which a chip to be soldered is disposed. The magnetic support base has a first protrusion for supporting the bottom surface of the substrate, and the metal cover plate has a second protrusion for pressing the top surface of the substrate. In the received state, the first and second protrusions are used to bend the substrate along the warp direction of the chip to be soldered. When the substrate is received, the originally flat substrate can be bent and deformed under the action of the first and second protrusions, so that its bent surface fits against the warped surface of the chip to be soldered. This reduces the risk of solder ball cracking or poor soldering, and improves product yield.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and more specifically, to a substrate magnetic carrier and semiconductor manufacturing equipment. Background Technology

[0002] In FCBGA (Flip Chip Ball Grid Array) technology, with the development of FO (Fan Out), 2.5D, and 3D packaging technologies, chip warpage has become increasingly significant. Warpage is mainly caused by a mismatch in the coefficients of thermal expansion (CTE) between materials during manufacturing, especially during high-temperature reflow soldering. When a warped chip is soldered to a substrate, the inconsistent warpage inevitably leads to poor soldering, such as solder joint cracking and cold solder joints, thus affecting the reliability of the entire electronic device. Utility Model Content

[0003] The embodiments of this application aim to at least solve one of the technical problems existing in the prior art, and provide a substrate magnetic carrier and semiconductor process equipment.

[0004] In a first aspect, embodiments of this application provide a substrate magnetic carrier, comprising: a magnetic support base and a metal cover plate magnetically adsorbed and connected to the magnetic support base to form a receiving cavity, the receiving cavity being used to receive a substrate, on which a chip to be soldered is disposed; wherein...

[0005] The magnetic support is provided with a first protrusion for supporting the bottom surface of the substrate, and the metal cover is provided with a second protrusion for pressing the top surface of the substrate. In the receiving state, the first protrusion and the second protrusion are used to bend the substrate along the warping direction of the chip to be soldered.

[0006] In one alternative embodiment, the first boss and the second boss are specifically used to bend the substrate downwards.

[0007] In one alternative embodiment, the first boss and the second boss are respectively disposed near opposite ends of the receiving chamber.

[0008] In one optional embodiment, there are multiple first protrusions, which are distributed sequentially along the direction close to the second protrusion, and the thickness of the multiple first protrusions gradually decreases along the direction close to the second protrusion.

[0009] In one alternative embodiment, the side of the first boss and the second boss facing the substrate is either a plane or an arc surface.

[0010] In one alternative embodiment, the magnetic support is provided with a plurality of mounting portions, and the first boss may be selectively disposed in one of the mounting portions.

[0011] In one optional embodiment, the magnetic support is provided with a plurality of magnetic elements, and the metal cover is magnetically attracted to the magnetic support through the plurality of magnetic elements.

[0012] In one optional embodiment, the magnetic support is provided with a receiving groove, and the magnetic element is disposed in the receiving groove.

[0013] In one alternative embodiment, the magnetic support has a groove on the side facing the substrate for accommodating electrical components on the substrate.

[0014] Secondly, embodiments of this application also provide a semiconductor manufacturing apparatus, including the substrate magnetic carrier described in the first aspect.

[0015] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0016] The substrate magnetic carrier of this application embodiment has a magnetic support seat with a first protrusion for supporting the bottom surface of the substrate and a metal cover plate with a second protrusion for pressing the top surface of the substrate. When the substrate is housed in the receiving cavity between the magnetic support seat and the metal cover plate, the originally flat substrate can be bent and deformed under the action of the first and second protrusions, so that its bent surface fits with the warped surface of the chip to be soldered. This can reduce the risk of solder ball joint cracking or poor soldering and improve product yield.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a substrate magnetic carrier provided in an embodiment of this application is shown;

[0020] Figure 2 This paper shows a schematic diagram of the structure of a magnetic support provided in an embodiment of this application;

[0021] Figure 3 This illustration shows a structural schematic diagram of a metal cover plate provided in an embodiment of this application;

[0022] In the picture:

[0023] 1. Magnetic support; 11. First boss; 12. Magnetic component; 13. Groove; 2. Metal cover plate; 21. Second boss; 22. Opening; 3. Receiving chamber; 4. Substrate; 5. Chip to be soldered; 6. Solder ball. Detailed Implementation

[0024] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0025] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0027] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] refer to Figures 1 to 3 This application provides a magnetic carrier for a substrate 4, including a magnetic support 1 and a metal cover 2 magnetically adsorbedly connected to the magnetic support 1 to form a receiving chamber 3. The receiving chamber 3 is used to receive the substrate 4, and a chip 5 to be soldered is disposed on the substrate 4. In a specific configuration, the metal cover 2 is provided with an opening 22, which is used to place the chip 5 to be soldered at a corresponding position on the substrate 4.

[0030] Furthermore, the magnetic support 1 is provided with a first protrusion 11 for supporting the bottom surface of the substrate 4, and the metal cover plate 2 is provided with a second protrusion 21 for pressing the top surface of the substrate 4. In the receiving state (when the substrate 4 is received in the receiving chamber 3), the first protrusion 11 and the second protrusion 21 are used to bend the substrate 4 along the warping direction of the chip 5 to be soldered.

[0031] In practical use, the substrate 4 is first placed in the receiving chamber 3 of the substrate 4 magnetic carrier, and then the chip 5 to be soldered is flipped onto the substrate 4 through the solder balls 6. Subsequently, the substrate 4 magnetic carrier with the substrate 4 and the chip 5 to be soldered is placed in a high-temperature furnace for soldering. Since the substrate 4 magnetic carrier has a first protrusion 11 supporting the bottom surface of the substrate 4 and a second protrusion 21 pressing the top surface of the substrate 4, the originally flat substrate 4 can be bent and deformed under the action of the first protrusion 11 and the second protrusion 21, so that its bent surface fits with the warped surface of the chip 5 to be soldered. This can reduce the risk of solder ball 6 solder joint cracking or poor soldering and improve product yield.

[0032] For example, such as Figure 1 As shown, the first protrusion 11 and the second protrusion 21 are specifically used to bend the substrate 4 downwards. In this embodiment, the first protrusion 11 and the second protrusion 21 are respectively positioned near opposite ends of the receiving chamber 3. In the receiving state, one end of the substrate 4 is confined between the first protrusion 11 and the metal cover plate 2, while the other end is pressed down by the second protrusion 21, thereby achieving downward bending. Of course, this embodiment does not specifically limit the bending direction of the substrate 4 or the positions of the first protrusion 11 and the second protrusion 21; they can be selected according to actual needs.

[0033] For example, such as Figure 1As shown, there are multiple first protrusions 11, which are sequentially distributed along the direction approaching the second protrusion 21, and the thickness of the multiple first protrusions 11 gradually decreases along the direction approaching the second protrusion 21. That is, the multiple first protrusions 11 and the second protrusion 21 are arranged in a straight line, and the thickness of the multiple first protrusions 11 gradually decreases along the direction approaching the second protrusion 21, forming a stepped shape. This arrangement can disperse the stress on the substrate 4 and prevent the substrate 4 from bending or warping unevenly. Of course, this embodiment does not specifically limit the number and thickness of the first protrusions 11, and can be selected according to actual needs.

[0034] For example, the side of the first boss 11 and the second boss 21 facing the substrate 4 is both a flat surface or a curved surface. Figure 1 As shown in the figure, the side of the first boss 11 facing the substrate 4 is flat, while the side of the second boss 21 facing the substrate 4 is curved. Because the side of the second boss 21 facing the substrate 4 is curved, the contact area between the second boss 21 and the substrate 4 is increased, avoiding localized stress concentration on the substrate 4. Of course, this embodiment does not specifically limit the curvature of the first boss 11 and the second boss 21; it can be selected according to actual needs.

[0035] For example, the magnetic carrier 1 is provided with multiple mounting portions, and the first protrusion 11 can be selectively disposed in one of the mounting portions. That is, the first protrusion 11 adopts a detachable design, and the first protrusion 11 can be installed at different positions on the magnetic carrier 1. This allows the substrate 4 to be bent at different curvatures by changing the position of the first protrusion 11, thereby accommodating chips with different warpage curvatures. In a specific configuration, the mounting portions can be mounting holes arrayed on the surface of the magnetic carrier 1, and the first protrusion 11 can be selectively inserted into one mounting hole. Of course, this embodiment does not specifically limit the structure and position of the mounting portions, and can be selected according to actual needs.

[0036] For example, refer to Figure 1 The magnetic support base 1 is provided with multiple magnetic components 12. The metal cover 2 is magnetically attracted to the magnetic support base 1 through the multiple magnetic components 12. That is, the metal cover 2 is attracted to the magnetic support base 1 by the magnetic attraction force of the multiple magnetic components 12. In specific settings, the magnetic components 12 can be magnets or other magnetic materials. Of course, this embodiment does not specifically limit the material of the magnetic components 12, and can be selected according to actual needs.

[0037] For example, the magnetic support 1 is provided with a receiving groove (not shown in the figure). The magnetic element 12 is disposed within the receiving groove. Figure 2As shown in the figure, this embodiment illustrates a plurality of magnetic components 12 arranged in an array. Specifically, the plurality of magnetic components 12 are arranged in a linear fashion around the outer side of the receiving chamber. Of course, this embodiment does not impose specific limitations on the number and arrangement of the magnetic components 12, and can be selected according to actual needs.

[0038] For example, such as Figure 2 As shown, a groove 13 is provided on the side of the magnetic support 1 facing the substrate 4. The groove 13 is used to accommodate electrical components on the substrate 4. Specifically, the groove 13 is located on the bottom surface of the accommodating chamber, which can avoid electrical components such as capacitors and pins on the substrate 4, thus preventing damage to the electrical components due to pressure. Of course, this embodiment does not specifically limit the shape and depth of the groove 13, and it can be selected according to actual needs.

[0039] In this embodiment of the magnetic carrier for substrate 4, the magnetic support base 1 is provided with a first protrusion 11 for supporting the bottom surface of substrate 4, and the metal cover plate 2 is provided with a second protrusion 21 for pressing the top surface of substrate 4. When substrate 4 is housed in the receiving cavity 3 between magnetic support base 1 and metal cover plate 2, the originally flat substrate 4 can be bent and deformed under the action of the first protrusion 11 and the second protrusion 21, so that its bent surface fits with the warped surface of the chip 5 to be soldered. This can reduce the risk of solder ball 6 solder joint cracking or poor soldering and improve product yield.

[0040] This application also provides a semiconductor manufacturing apparatus, including a substrate 4 magnetic carrier in the first aspect. The specific structure of the substrate 4 magnetic carrier has been described in detail above and will not be repeated here.

[0041] The semiconductor manufacturing apparatus of this application includes the magnetic carrier of substrate 4 described above. The magnetic carrier of substrate 4 includes a magnetic support 1 and a metal cover 2. The magnetic support 1 is provided with a first protrusion 11 for supporting the bottom surface of substrate 4, and the metal cover 2 is provided with a second protrusion 21 for pressing the top surface of substrate 4. When substrate 4 is housed in the receiving cavity 3 between magnetic support 1 and metal cover 2, the originally flat substrate 4 can be bent and deformed under the action of the first protrusion 11 and the second protrusion 21, so that its bent surface fits with the warped surface of the chip 5 to be soldered. This can reduce the risk of solder ball 6 solder joint cracking or poor soldering and improve product yield.

[0042] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0043] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A substrate magnetic carrier, characterized in that, include: A magnetic support and a metal cover plate magnetically adsorbed and connected to the magnetic support to form a receiving cavity, the receiving cavity being used to receive a substrate on which a chip to be soldered is disposed; wherein... The magnetic support is provided with a first protrusion for supporting the bottom surface of the substrate, and the metal cover is provided with a second protrusion for pressing the top surface of the substrate. In the receiving state, the first protrusion and the second protrusion are used to bend the substrate along the warping direction of the chip to be soldered.

2. The substrate magnetic carrier according to claim 1, characterized in that, The first boss and the second boss are specifically used to bend the substrate downwards.

3. The substrate magnetic carrier according to claim 2, characterized in that, The first boss and the second boss are respectively located near the opposite ends of the receiving chamber.

4. The substrate magnetic carrier according to claim 3, characterized in that, The number of the first protrusions is multiple, and the multiple first protrusions are distributed sequentially along the direction close to the second protrusion, and the thickness of the multiple first protrusions gradually decreases along the direction close to the second protrusion.

5. The substrate magnetic carrier according to claim 1, characterized in that, Both the first boss and the second boss have a flat or curved side facing the substrate.

6. The substrate magnetic carrier according to claim 1, characterized in that, The magnetic support is provided with multiple mounting parts, and the first boss can be selectively disposed in one of the mounting parts.

7. The substrate magnetic carrier according to claim 1, characterized in that, The magnetic support is provided with multiple magnetic components, and the metal cover plate is magnetically attracted to the magnetic support through the multiple magnetic components.

8. The substrate magnetic carrier according to claim 7, characterized in that, The magnetic support is provided with a receiving groove, and the magnetic component is disposed in the receiving groove.

9. The substrate magnetic carrier according to claim 1, characterized in that, The magnetic support has a groove on the side facing the substrate, which is used to accommodate electrical components on the substrate.

10. A semiconductor manufacturing process apparatus, characterized in that, Includes the substrate magnetic carrier as described in any one of claims 1-9.

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