Semiconductor chip plastic encapsulation device

Abstract

This utility model relates to the field of chip molding technology and discloses a semiconductor chip molding device, including a lower mold, an upper mold movably connected to the upper end of the lower mold, an ejector rod movably sleeved on the inner wall of the bottom of the lower mold, a lifting plate fixedly connected to the lower end of the ejector rod located below the lower mold, and a first electric push rod fixedly installed in the middle of the lifting plate at the end away from the ejector rod. This utility model, through the cooperation between the lower mold, the ejector rod, the placement plate, and the telescopic assembly, utilizes the ejector rod and the placement plate to achieve the unloading of the molded semiconductor chip, effectively solving the problem of workers removing the molded semiconductor chip from the mold. The movement of the telescopic assembly drives the horizontal movement of the placement plate, allowing the semiconductor chip ejected by the ejector rod to be pushed to the outside of the molding device by the placement plate, thus facilitating the removal of the molded semiconductor chip by workers.

Description

Technical Field

[0001] This utility model relates to the field of chip molding technology, specifically a semiconductor chip molding device. Background Technology

[0002] The casing used to mount semiconductor integrated circuit chips serves to house, fix, seal, and protect the chips, enhance their electrothermal performance, and act as a bridge between the chip's internal world and external circuits. The contacts on the chip are connected to the pins of the package via wires, and these pins, in turn, connect to other devices via wires on the printed circuit board. Therefore, molding compounds play a crucial role in CPUs and other LSI integrated circuits. To facilitate the protection of semiconductor chips, a semiconductor chip molding device is needed for semiconductor chip production.

[0003] However, existing semiconductor chip molding processes involve placing the semiconductor chip in a molding apparatus for processing, and then removing the molded semiconductor chip after molding. The semiconductor chip retains a certain temperature after molding, which can interfere with the removal process. Furthermore, the removal process requires contact between the operator and the molding apparatus. As the number of semiconductor chip molding processes increases, so does the operator's contact with the molding apparatus, leading to operator fatigue. This not only reduces the efficiency of chip removal but also increases the risk of accidents during the chip removal process. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a semiconductor chip encapsulation device, which simplifies the handling of encapsulated semiconductor chips, reduces the workload of workers, and improves the encapsulation efficiency of semiconductor chips, thus solving the problems mentioned in the background art.

[0005] This utility model provides the following technical solution: a semiconductor chip molding device, including a lower mold, an upper mold movably connected to the upper end of the lower mold, an ejector rod movably sleeved on the inner wall of the bottom of the lower mold, a lifting plate located below the lower mold fixedly connected to the lower end of the ejector rod, a first electric push rod fixedly installed in the middle of the end of the lifting plate away from the ejector rod, a placement plate provided behind the lower mold, a pressure plate for clamping semiconductor chips movably connected inside the placement plate, a second electric push rod fixedly installed on the upper surface of the placement plate, and the lower end of the output shaft of the second electric push rod passing through the top of the placement plate and fixedly connected to the upper surface of the pressure plate, an extension rod fixedly installed on the back of the placement plate, a telescopic component for controlling the discharge of semiconductor chips provided on the inner wall of the extension rod, and a fixed rod located behind the placement plate movably sleeved on the outer wall of the extension rod.

[0006] Preferably, a heating plate located above the lifting plate is fixedly installed on the lower end face of the lower mold, a base located in front of the telescopic assembly is fixedly installed on the lower end face of the lower mold, support rods located outside the upper mold are fixedly connected to both sides of the base, and limiting rods located on the left and right sides of the lower mold are fixedly installed on the upper end face of the base.

[0007] Preferably, both the upper and lower ends of the extension rod are fixedly installed with sliders, and the end of the slider away from the extension rod is slidably connected to the inner wall of the fixed rod. The front end of the extension rod is fixedly installed with a short rod, and the end of the short rod away from the extension rod is fixedly connected to the back of the placement plate.

[0008] Preferably, the upper end of the pressure plate is fixedly installed with guide rods located on the left and right sides of the second electric push rod, and the outer wall of the guide rod is movably sleeved with the inner wall of the upper end of the placement plate. The upper end of the guide rod is fixedly installed with a disc located above the placement plate.

[0009] Preferably, a No. 3 electric push rod is fixedly installed on the upper end face of the upper mold, and the lower end of the No. 3 electric push rod is fixedly connected to a top plate located above the upper mold. The lower end of the output shaft of the No. 3 electric push rod passes through the interior of the top plate and is fixedly connected to the upper end face of the upper mold. Limiting rings are fixedly installed on both the left and right sides of the upper mold, and the inner wall of the limiting ring away from the upper mold is movably sleeved with the outer wall of the limiting rod. A feed pipe is fixedly installed on the back of the upper mold.

[0010] Preferably, brackets are fixedly installed on both the left and right sides of the lifting plate. An installation rod is fixedly sleeved on the inner wall of the bracket at the end away from the lifting plate. A roller is movably sleeved on the outer wall of the installation rod, and the outer wall of the roller is in rolling connection with the inner wall of the base. A round rod located outside the first electric push rod is fixedly installed on the lower end face of the lifting plate.

[0011] Preferably, the telescopic assembly includes a rotating shaft, a spur gear, and a ruler strip. The left and right ends of the rotating shaft are movably sleeved with the inner walls of the left and right sides of the fixed rod, respectively. The outer wall of the rotating shaft is fixedly sleeved with a spur gear. The upper end of the spur gear meshes with the ruler strip, and the upper end face of the ruler strip is fixedly connected to the top surface of the inner wall of the extension rod. A rotary motor located on the right side of the fixed rod is fixedly installed at the right end of the rotating shaft, and a reducer is provided on the output shaft of the rotary motor. A housing is fixedly sleeved on the outer wall of the rotary motor, and the left end of the housing is fixedly connected to the right side of the fixed rod. A reinforcing rod is fixedly installed at the lower end of the fixed rod, and the end of the reinforcing rod away from the fixed rod is fixedly connected to the back of the base.

[0012] Preferably, the outer wall of the first electric push rod is evenly distributed with crossbars, and an annular block located outside the round rod is fixedly installed at the end of the crossbar away from the first electric push rod. The inner wall of the annular block is movably connected with a ball, and the outer wall of the ball is in rolling connection with the outer wall of the round rod.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. This utility model, through the cooperation between the lower mold, ejector rod, placement plate and telescopic assembly, and by utilizing the setting of the ejector rod and placement plate, realizes the function of unloading the molded semiconductor chip, effectively solving the problem of workers taking the molded semiconductor chip out of the mold. The movement of the telescopic assembly drives the horizontal movement of the placement plate, so that the semiconductor chip ejected by the ejector rod can be pushed to the outside of the molding device by the placement plate, thereby facilitating the workers to take out the molded semiconductor chip.

[0015] 2. This utility model utilizes the cooperation between the placement plate, telescopic component, pressure plate, and second electric push rod. By setting up the pressure plate, it achieves the pressing effect on the plastic-encapsulated semiconductor chip in the placement plate, effectively solving the problem of the plastic-encapsulated semiconductor chip falling off when the placement plate moves. The extension of the telescopic rod inside the second electric push rod drives the pressure plate to press on the plastic-encapsulated semiconductor chip, which strengthens the tightness of the plastic-encapsulated semiconductor chip in the placement plate when the placement plate moves, thereby preventing the plastic-encapsulated semiconductor chip from falling off the placement plate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a rear view of the reinforcing rod of this utility model;

[0018] Figure 3 This is a side view of the rotary motor of this utility model;

[0019] Figure 4 This is a bottom view of the No. 1 electric push rod of this utility model;

[0020] Figure 5 This is a bottom view of the ball bearing of this utility model;

[0021] Figure 6 This is a side view of the round rod of this utility model;

[0022] Figure 7 This is a side view of the roller of this utility model;

[0023] Figure 8 This is a cross-sectional view of the fixing rod of this utility model.

[0024] In the diagram: 1. Lower mold; 2. Upper mold; 3. Ejector rod; 4. Lifting plate; 5. Electric push rod No. 1; 6. Placement plate; 7. Pressure plate; 8. Electric push rod No. 2; 9. Extension rod; 10. Telescopic assembly; 101. Rotating shaft; 102. Spur gear; 103. Ruler strip; 11. Fixing rod; 12. Heating plate; 13. Base; 14. Support rod; 15. Limiting rod; 16. Electric push rod No. 3; 17. Top plate; 18. Limiting ring; 19. Feed pipe; 20. Bracket; 21. Mounting rod; 22. Roller; 23. Round rod; 24. Crossbar; 25. Annular block; 26. Ball bearing; 27. Guide rod; 28. Disc; 29. ​​Slider; 30. Short rod; 31. Rotary motor; 32. Machine box; 33. Reinforcing rod. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1 , Figure 3 and Figure 4A semiconductor chip molding and encapsulation device includes a lower mold 1, an upper mold 2 movably connected to the upper end of the lower mold 1, and an ejector rod 3 movably sleeved on the inner wall of the bottom of the lower mold 1. The movement of the ejector rod 3 inside the lower mold 1 ejects the molded semiconductor chip from the lower mold 1, facilitating the removal of the molded semiconductor chip. A lifting plate 4 located below the lower mold 1 is fixedly connected to the lower end of the ejector rod 3. The lifting plate 4 connects the ejector rod 3 to a first electric push rod 5. A first electric push rod 5 is fixedly installed in the middle of the end of the lifting plate 4 away from the ejector rod 3. The extension and retraction of the output shaft inside the first electric push rod 5 provides power for the vertical lifting and lowering movement of the ejector rod 3. A placement plate 6 is provided behind the lower mold 1, and a pressure plate for clamping the semiconductor chip is movably connected inside the placement plate 6. 7. The pressure plate 7 can press the encapsulated semiconductor chip inside the placement plate 6, thereby strengthening the stability of the encapsulated semiconductor chip inside the placement plate 6. A second electric push rod 8 is fixedly installed on the upper end face of the placement plate 6, and the lower end of the output shaft of the second electric push rod 8 passes through the top of the placement plate 6 and is fixedly connected to the upper end face of the pressure plate 7. The extension and retraction of the output shaft inside the second electric push rod provides power for the vertical lifting and lowering movement of the pressure plate 7. An extension rod 9 is fixedly installed on the back of the placement plate 6. The movement of the extension rod 9 provides power for the horizontal movement of the placement plate 6. The inner wall of the extension rod 9 is provided with a telescopic component 10 for controlling the discharge of semiconductor chips. The telescopic component 10 provides power for the extension and retraction movement of the extension rod 9. A fixed rod 11 located behind the placement plate 6 is movably sleeved on the outer wall of the extension rod 9.

[0027] A heating plate 12 is fixedly installed on the lower end face of the lower mold 1, which is located above the lifting plate 4. A base 13 is fixedly installed on the lower end face of the lower mold 1, which is located in front of the telescopic component 10. Support rods 14 located outside the upper mold 2 are fixedly connected to both sides of the base 13. The installation of the support rods 14 serves to connect the base 13 and the upper mold 2. Limiting rods 15 located on the left and right sides of the lower mold 1 are fixedly installed on the upper end face of the base 13. The limiting rods 15 serve to limit the movement of the upper mold 2.

[0028] Please see Figure 2 , Figure 5 and Figure 7 Both ends of the extension rod 9 are fixedly installed with sliders 29, and the end of the slider 29 away from the extension rod 9 is slidably connected to the inner wall of the fixed rod 11. The movement of the slider 29 inside the fixed rod 11 strengthens the stability of the extension rod 9's telescopic movement. A short rod 30 is fixedly installed at the front end of the extension rod 9, and the end of the short rod 30 away from the extension rod 9 is fixedly connected to the back of the placement plate 6. The short rod 30 serves to connect the extension rod 9 and the placement plate 6.

[0029] The upper end of the pressure plate 7 is fixedly installed with guide rods 27 located on the left and right sides of the second electric push rod 8, and the outer wall of the guide rod 27 is movably sleeved with the inner wall of the upper end of the placement plate 6. The upper end of the guide rod 27 is fixedly installed with a disc 28 located above the placement plate 6. The installation of the disc 28 restricts the movement position of the guide rod 27 on the placement plate 6.

[0030] A third electric push rod 16 is fixedly installed on the upper end face of the upper mold 2. The extension and retraction of the output shaft inside the third electric push rod 16 provides power for the vertical lifting and lowering movement of the upper mold 2. The lower end of the third electric push rod 16 is fixedly connected to a top plate 17 located above the upper mold 2. The installation of the top plate 17 provides support and a platform for the installation of the third electric push rod 16. The lower end of the output shaft of the third electric push rod 16 passes through the interior of the top plate 17 and is fixedly connected to the upper end face of the upper mold 2. Limiting rings 18 are fixedly installed on both the left and right sides of the upper mold 2. The inner wall of the limiting ring 18 away from the upper mold 2 is movably sleeved with the outer wall of the limiting rod 15. The movement of the limiting ring 18 on the outer wall of the limiting rod 15 restricts the movement position of the upper mold 2. A feed pipe 19 is fixedly installed on the back of the upper mold 2.

[0031] Please see Figure 8 , Figure 7 and Figure 6 A bracket 20 is fixedly installed on both the left and right sides of the lifting plate 4. An installation rod 21 is fixedly sleeved on the inner wall of the end of the bracket 20 away from the lifting plate 4. The installation rod 21 is set to connect the bracket 20 and the roller 22. The roller 22 is movably sleeved on the outer wall of the installation rod 21, and the outer wall of the roller 22 is in rolling connection with the inner wall of the base 13. A round rod 23 located outside the first electric push rod 5 is fixedly installed on the lower end face of the lifting plate 4.

[0032] The telescopic assembly 10 includes a rotating shaft 101, a spur gear 102, and a ruler strip 103. The left and right ends of the rotating shaft 101 are respectively movably sleeved onto the inner walls of the left and right sides of the fixed rod 11. The spur gear 102 is fixedly sleeved onto the outer wall of the rotating shaft 101. The upper teeth of the spur gear 102 mesh with the ruler strip 103, and the upper end face of the ruler strip 103 is fixedly connected to the top surface of the inner wall of the extension rod 9. This meshing connection allows the spur gear 102 to rotate circumferentially while simultaneously driving the ruler strip 103 to move horizontally. The right end of the rotating shaft 101... A rotary motor 31 is fixedly installed on the right side of the fixed rod 11, and a reducer is provided on the output shaft of the rotary motor 31. The reducer is used to adjust the speed of the output shaft of the rotary motor 31. A housing 32 is fixedly sleeved on the outer wall of the rotary motor 31. The housing 32 protects the rotary motor 31, and the left end of the housing 32 is fixedly connected to the right side of the fixed rod 11. A reinforcing rod 33 is fixedly installed on the lower end of the fixed rod 11, and the end of the reinforcing rod 33 away from the fixed rod 11 is fixedly connected to the back of the base 13.

[0033] The outer wall of the first electric push rod 5 is evenly distributed with crossbars 24. At the end of the crossbar 24 away from the first electric push rod 5, an annular block 25 located outside the round rod 23 is fixedly installed. The inner wall of the annular block 25 is movably connected with a ball bearing 26, and the outer wall of the ball bearing 26 is in rolling connection with the outer wall of the round rod 23. The rolling of the ball bearing 26 on the round rod 23 can strengthen the stability of the vertical lifting movement of the lifting plate 4.

[0034] Working principle: In use, firstly, the semiconductor chip to be encapsulated is placed inside the lower mold 1. Then, the power to the third electric push rod 16 is turned on. The extension of the output shaft inside the third electric push rod 16 drives the upper mold 2 to move towards the lower mold 1. At this time, the sliding of the limiting ring 18 on the outer wall of the limiting rod 15 limits the lifting and lowering movement of the upper mold 2 until the upper mold 2 covers the lower mold 1. Then, the encapsulating material is filled into the lower mold 1 and the upper mold 2 through the feeding pipe 19 to facilitate the encapsulation of the semiconductor chip. Then, after the semiconductor chip is encapsulated, turn on the power to the third electric push rod 16. The retraction of the internal output shaft of the third electric push rod 16 separates the upper mold 2 from the lower mold 1, allowing the encapsulated semiconductor chip to be removed. Then, turn on the power to the first electric push rod 5. The extension of the internal output shaft of the first electric push rod 5, connected to the lifting plate 4, causes the ejector rod 3 to eject the encapsulated semiconductor chip from the lower mold 1. At this time, the ball bearing 26 is located between the annular block 25 and the round rod 23, causing the ball bearing 26 to roll on the round rod 23. Simultaneously, roller 22 rolls on the inner wall of base 13. Then, the power to the rotary motor 31 is turned on. After the rotary motor 31 is turned on, it drives the rotation of spur gear 102 via the shaft 101. Due to the meshing of the spur gear 102 and the ruler strip 103, the circumferential rotation of the spur gear 102 provides power for the horizontal movement of the ruler strip 103. The movement of the ruler strip 103 simultaneously drives the extension rod 9 to move in the same direction. At this time, the placement plate 6 is moved to the location of the encapsulated semiconductor chip via the short rod 30. This allows the encapsulated semiconductor chip to be placed inside the placement plate 6. Then, the power of the second electric push rod 8 is turned on, and the extension of the output shaft of the second electric push rod 8 is used to press the pressure plate 7 onto the encapsulated semiconductor chip, which reinforces the encapsulated semiconductor chip inside the placement plate 6. When the placement plate 6 places the encapsulated semiconductor chip, the ejector rod 3 separates from the encapsulated semiconductor chip. After the encapsulated semiconductor chip is placed, the movement of the telescopic component 10 is used to discharge the encapsulated semiconductor chip through the connection of the extension rod 9.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Additionally, in the accompanying drawings of this utility model, the fill patterns are merely for distinguishing layers and do not constitute any other limitation.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip molding apparatus comprising a lower mold (1), characterized by: The upper end of the lower mold (1) is movably connected to the upper mold (2). An ejector rod (3) is movably sleeved on the inner wall of the bottom of the lower mold (1). The lower end of the ejector rod (3) is fixedly connected to a lifting plate (4) located below the lower mold (1). An electric push rod (5) is fixedly installed in the middle of the end of the lifting plate (4) away from the ejector rod (3). A placement plate (6) is provided behind the lower mold (1). The interior of the placement plate (6) is movably connected to a pressure device for clamping semiconductor chips. The upper end face of the placement plate (6) is fixedly installed with a second electric push rod (8), and the lower end of the output shaft of the second electric push rod (8) passes through the top of the placement plate (6) and is fixedly connected to the upper end face of the pressure plate (7). An extension rod (9) is fixedly installed on the back of the placement plate (6). The inner wall of the extension rod (9) is provided with a telescopic component (10) for controlling the discharge of semiconductor chips. The outer wall of the extension rod (9) is movably sleeved with a fixed rod (11) located behind the placement plate (6).

2. The semiconductor chip plastic encapsulation device according to claim 1, wherein: A heating plate (12) located above the lifting plate (4) is fixedly installed on the lower end face of the lower mold (1). A base (13) located in front of the telescopic assembly (10) is fixedly installed on the lower end face of the lower mold (1). Support rods (14) located outside the upper mold (2) are fixedly connected to both the left and right sides of the base (13). Limiting rods (15) located on the left and right sides of the lower mold (1) are fixedly installed on the upper end face of the base (13).

3. The semiconductor chip plastic packaging device according to claim 1, wherein: Both ends of the extension rod (9) are fixedly installed with sliders (29), and the end of the slider (29) away from the extension rod (9) is slidably connected to the inner wall of the fixed rod (11). The front end of the extension rod (9) is fixedly installed with a short rod (30), and the end of the short rod (30) away from the extension rod (9) is fixedly connected to the back of the placement plate (6).

4. The semiconductor chip plastic packaging device according to claim 1, wherein: The upper end of the pressure plate (7) is fixedly installed with guide rods (27) located on the left and right sides of the second electric push rod (8), and the outer wall of the guide rod (27) is movably sleeved with the inner wall of the upper end of the placement plate (6). The upper end of the guide rod (27) is fixedly installed with a disc (28) located above the placement plate (6).

5. A semiconductor chip encapsulation device according to claim 2, characterized in that: The upper mold (2) is fixedly mounted with a No. 3 electric push rod (16). The lower end of the No. 3 electric push rod (16) is fixedly connected to a top plate (17) located above the upper mold (2). The lower end of the output shaft of the No. 3 electric push rod (16) passes through the interior of the top plate (17) and is fixedly connected to the upper end of the upper mold (2). Limiting rings (18) are fixedly mounted on both the left and right sides of the upper mold (2). The inner wall of the limiting ring (18) away from the upper mold (2) is movably sleeved with the outer wall of the limiting rod (15). The back of the upper mold (2) is fixedly mounted with a feed pipe (19).

6. A semiconductor chip molding apparatus according to claim 2, characterized in that: The lifting plate (4) is fixedly installed with brackets (20) on both the left and right sides. The inner wall of the bracket (20) away from the lifting plate (4) is fixedly sleeved with an installation rod (21). The outer wall of the installation rod (21) is movably sleeved with a roller (22), and the outer wall of the roller (22) is tumblingly connected to the inner wall of the base (13). The lower end face of the lifting plate (4) is fixedly installed with a round rod (23) located outside the first electric push rod (5).

7. A semiconductor chip encapsulation device according to claim 2, characterized in that: The telescopic assembly (10) includes a rotating shaft (101), a spur gear (102), and a ruler strip (103). The left and right ends of the rotating shaft (101) are respectively movably sleeved with the inner walls of the left and right sides of the fixed rod (11). The outer wall of the rotating shaft (101) is fixedly sleeved with the spur gear (102). The upper end of the spur gear (102) is engaged with the ruler strip (103), and the upper end face of the ruler strip (103) is fixedly connected to the top surface of the inner wall of the extension rod (9). A rotary motor (31) located on the right side of the fixed rod (11) is fixedly installed at the right end of the 01), and a reducer is provided on the output shaft of the rotary motor (31). The outer wall of the rotary motor (31) is fixedly fitted with a housing (32), and the left end of the housing (32) is fixedly connected to the right side of the fixed rod (11). A reinforcing rod (33) is fixedly installed at the lower end of the fixed rod (11), and the end of the reinforcing rod (33) away from the fixed rod (11) is fixedly connected to the back of the base (13).

8. A semiconductor chip molding apparatus according to claim 6, characterized in that: The outer wall of the first electric push rod (5) is evenly distributed with crossbars (24). At the end of the crossbar (24) away from the first electric push rod (5), an annular block (25) located outside the round rod (23) is fixedly installed. The inner wall of the annular block (25) is movably connected with a ball (26), and the outer wall of the ball (26) is in rolling connection with the outer wall of the round rod (23).

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