A full-automatic PCB laser cutting and separating device

Abstract

The utility model discloses a full -automatic PCB board laser cutting panel dividing device, it includes frame, frame, its left and right two ends along X direction are equipped with a conveying mechanism, and the first Y direction mobile mechanism, second Y direction mobile mechanism are equipped with between two conveying mechanisms interval, frame top, be equipped with first elevating material transfer mechanism above first Y direction mobile mechanism, be equipped with second elevating material transfer mechanism above second Y direction mobile mechanism, first elevating material transfer mechanism and second elevating material transfer mechanism all with the side setting of conveying mechanism, frame top, be equipped with first laser processing mechanism above first Y direction mobile mechanism, and the side away from first elevating material transfer mechanism, be equipped with second laser processing mechanism above second Y direction mobile mechanism, and the side away from second elevating material transfer mechanism, the utility model discloses guarantee the precision of PCB board cutting simultaneously, has improved the efficiency of PCB board cutting process.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing and manufacturing technology, and in particular to a fully automatic PCB board laser cutting and separating device. Background Technology

[0002] Printed circuit boards (PCBs) are the foundation of modern electronic products, therefore, they require special care and precision in their production and manufacturing processes. Among these, how to cut a PCB to fit its application in a specific institution or device is one of the most critical procedures to consider.

[0003] Currently, most PCB boards are cut using mechanical milling cutters or stamping. These methods have problems such as low precision (above ±0.1mm), rapid tool wear, and the easy generation of burrs in small cuts. Although laser cutting has some applications, it faces challenges such as difficulty in controlling the heat shadow zone (HAZ), delamination of multi-layer boards, and material carbonization. In addition, most laser cutting on the market uses single-head cutting, which is slow. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a fully automatic PCB board laser cutting and separating device, which ensures the cutting accuracy of PCB boards while improving the efficiency of the PCB board cutting process.

[0005] The technical solution of this utility model is:

[0006] A fully automatic PCB board laser cutting and separating device is characterized in that it includes a frame, on which a conveying mechanism is provided at each of the left and right ends along the X direction, and a first Y-direction moving mechanism and a second Y-direction moving mechanism are provided at intervals between the two conveying mechanisms.

[0007] On the frame, a first lifting and transferring mechanism is provided above the first Y-axis moving mechanism; a second lifting and transferring mechanism is provided above the second Y-axis moving mechanism; both the first and second lifting and transferring mechanisms are arranged on the same side as the conveying mechanism.

[0008] On the frame, a first laser processing mechanism is provided above the first Y-axis moving mechanism and on the side away from the first lifting and transferring mechanism; a second laser processing mechanism is provided above the second Y-axis moving mechanism and on the side away from the second lifting and transferring mechanism.

[0009] Furthermore, the first laser processing mechanism and the second Y-axis moving mechanism are each equipped with a CCD positioning module.

[0010] Furthermore, each of the conveying mechanisms includes a fixed side plate, and a movable side plate is slidably connected between the two fixed side plates. A transmission belt assembly is provided on both the fixed side plate and the movable side plate, and the two transmission belt assemblies are driven to rotate by a rotary motor to convey the product.

[0011] Furthermore, the movable side plate is provided with a spacing adjustment mechanism, which includes a lead screw, a lead screw nut, and a lead screw motor for driving the lead screw to rotate;

[0012] The lead screw is vertically connected to the fixed side plate and the movable side plate, the lead screw nut is sleeved on the lead screw (701), and the movable side plate is fixed to the lead screw nut.

[0013] Furthermore, both the first Y-axis moving mechanism and the second Y-axis moving mechanism include a Y-axis moving module and a positioning transplanting seat slidably connected to the Y-axis moving module. The two Y-axis moving modules are spaced apart along the Y-axis of the frame. The conveying mechanism is installed on each positioning transplanting seat. The two Y-axis moving modules respectively drive the two positioning transplanting seats to reciprocate along the Y-axis.

[0014] Furthermore, each of the aforementioned positioning transplanting seats is also provided with a pressing mechanism on its conveying mechanism. The pressing mechanism includes a pressing cylinder mounted on a movable side plate or a fixed side plate and a pressing rod connected to the driving end of the pressing cylinder. The top surface of the pressing rod is provided with a downward bending part. The pressing cylinder drives the bending part to move closer to or away from the positioning transplanting seat along the Z direction.

[0015] Furthermore, the frame is provided with a first support frame, and the first lifting and transferring mechanism and the second lifting and transferring mechanism are installed on the first support frame at intervals;

[0016] The first lifting and transferring mechanism and the second lifting and transferring mechanism both include a first Z-axis lifting module mounted on the first support frame and a transferring frame slidably connected to the drive end of the first Z-axis lifting module. The bottom surface of each transferring frame is connected to the conveying mechanism.

[0017] The two first Z-axis lifting modules respectively drive the conveying mechanisms on the two transfer racks to rise and fall along the Z-axis.

[0018] Furthermore, each of the aforementioned transfer racks is provided with a limiting component. Each limiting component includes two photoelectric sensor seats installed along the Y direction on the transfer rack and a limiting post on the movable side plate of the conveying mechanism installed on the transfer rack. When the limiting post moves with the movable side plate to any photoelectric sensor seat, the movable side plate stops.

[0019] Furthermore, a second support frame is provided on the frame, parallel to the first support frame;

[0020] The second support frame is equipped with an X-axis moving module, and the first laser processing mechanism and the second laser processing mechanism are slidably mounted on the X-axis moving module at intervals.

[0021] The first laser processing mechanism and the second laser processing mechanism each include a second Z-axis lifting module slidably connected to the X-axis moving module and a laser cutting module slidably connected to the driving end of the second Z-axis lifting module.

[0022] Furthermore, the laser cutting module is provided with a connecting plate, and the CCD positioning module is mounted on the connecting plate.

[0023] The beneficial technical effects of this utility model are:

[0024] 1) The layout of the two conveying mechanisms, the first Y-axis moving mechanism, the second Y-axis moving mechanism, the first lifting and transferring mechanism, the second lifting and transferring mechanism, the first laser processing mechanism and the second laser processing mechanism of this utility model is reasonable, and the movement of the carrier on it is smooth. It can simultaneously meet the laser cutting processing of two sets of PCB boards, thus improving production efficiency.

[0025] 2) This utility model uses a combination of a laser cutting module and a CCD positioning module to cut the PCB board, ensuring the accuracy of the PCB board cutting.

[0026] 3) The conveying mechanism of this utility model is equipped with a spacing adjustment mechanism to realize automatic feeding of PCB boards of different specifications and sizes, so as to meet diverse production requirements. Attached Figure Description

[0027] Figure 1 This is an overall schematic diagram of the present invention;

[0028] Figure 2 This is a schematic diagram of the conveyor mechanism fixed on the frame;

[0029] Figure 3 yes Figure 2 Another perspective illustration;

[0030] Figure 4 These are schematic diagrams of the first and second lifting and transferring mechanisms;

[0031] Figure 5 This is a schematic diagram of the first Y-axis moving mechanism;

[0032] Figure 6 yes Figure 5 Enlarged view of the middle and lower pressure mechanism;

[0033] Figure 7 Schematic diagrams of the first and second laser processing mechanisms.

[0034] in:

[0035] 000, Carrier; 100, Frame; 101, First Support Frame; 102, Second Support Frame; 200, Conveying Mechanism; 201, Fixed Side Plate; 202, Movable Side Plate; 203, Transmission Belt Assembly; 2031, Transmission Gear; 2032, Belt; 204, Rotating Motor; 301, Y-axis Moving Module; 302, Positioning Transplant Seat; 303, Receiving Slot; 401, First Z-axis Lifting Module; 402, Transfer Rack; 403. Photoelectric sensor base; 404, limiting post; 500, X-axis moving module (500); 601, second Z-axis lifting module; 602, laser cutting module; 603, connecting plate; 604, dust removal pipe; 701, lead screw; 702, lead screw nut; 703, lead screw motor; 801, pressing cylinder; 802, pressing rod; 8021, bending part; 8022, rod body; 900, CCD positioning module; 901, arrival detection component. Detailed Implementation

[0036] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0037] like Figures 1-7 As shown, this utility model provides a fully automatic PCB board laser cutting and separating device, which includes a frame 100 that provides a base for mounting other parts. On the frame 100, there is a conveying mechanism 200 at each of its left and right ends along the X direction. The conveying mechanism 200 at the left end of the frame is used for loading PCB boards, and the conveying mechanism 200 at the right end of the frame is used for unloading PCB boards. The two conveying mechanisms 200 on the frame 100 have the same structure and running direction. To avoid repetition, the conveying laser 200 at the left end of the frame will be used for description.

[0038] Each conveying mechanism 200 includes two fixed side plates 201 and one movable side plate 202. The two fixed side plates 201 are fixed to the frame 100 in parallel and spaced apart along the X direction. The movable side plate 202 is slidably connected between the two fixed side plates 201 through a spacing adjustment mechanism. The spacing adjustment mechanism includes a lead screw 701, a lead screw nut 702, and a lead screw motor 703. The lead screw 701 passes through one fixed side plate 201, the movable side plate 202, and another fixed side plate 201 in sequence along the Y direction. The lead screw nut 702 is sleeved on the lead screw 701, and the movable side plate 202 is fixedly connected to the lead screw nut. The fixed end of the lead screw motor 703 is connected to one of the fixed side plates 201, and its driving end is connected to the lead screw 701 to drive the lead screw to rotate. On the outer fixed side plate 201 and movable side plate 202, a transmission belt assembly 203 and a transmission motor 204 for driving the transmission belt assembly 203 to rotate are installed. Each transmission belt assembly 203 includes two transmission gears 2031 and a belt 2032. The two transmission gears 2031 are installed forward and backward along the X direction, respectively. The belt 2032 is sleeved on the two transmission gears 2031. The two belts and the distance between the two belts form a conveying channel. The carrier 000 carrying the PCB board is placed on the two belts 2032. The drive end of each transmission motor 204 is connected to a transmission gear 2031, which drives the belt 2032 to rotate, thus conveying the PCB board in the X direction.

[0039] When the PCB board or carrier has different model and size, the start screw motor 703 drives the screw 701 to rotate, so that the screw nut 702 drives the movable side plate 202 to move along the Y direction, thereby increasing or decreasing the distance between the movable side plate 202 and the outer fixed side plate 201, and thus adjusting the distance between the two belts 2032, so as to realize the automatic feeding of PCB boards or carriers of different specifications and sizes, and meet the diverse production requirements.

[0040] In addition, as a preferred embodiment, to increase the operational stability of the movable side plate 202, the present invention is provided with three lead screws 701. The three lead screws 701 are arranged in parallel and spaced apart on the fixed side plate 201 and the movable side plate 202. Each of the three lead screws 701 is fitted with a lead screw nut 702. Each lead screw nut 702 is fixedly connected to the movable side plate 202. The drive end of the lead screw motor 703 is connected to the input end of one of the lead screws 701.

[0041] Furthermore, each conveying mechanism 200 is equipped with a positioning detection element 901 to detect whether there is a carrier or PCB board on the conveying mechanism 200. The positioning detection element 901 of this utility model is a photoelectric sensor detector.

[0042] A first Y-axis moving mechanism and a second Y-axis moving mechanism are spaced apart and parallel to each other on the frame 100. The one closer to the left end of the conveyor 200 is defined as the first Y-axis moving mechanism, and the one closer to the right end of the conveyor 200 is defined as the second Y-axis moving mechanism. The first Y-axis moving mechanism and the second Y-axis moving mechanism are used to convey the PCB board on it along the Y direction to the corresponding first laser processing mechanism and second laser processing mechanism for laser cutting processing, respectively.

[0043] The first Y-axis moving mechanism and the second Y-axis moving mechanism have the same composition and operating direction. To avoid repetition, the first Y-axis moving mechanism will be used as an example for explanation.

[0044] The first Y-axis moving mechanism includes a Y-axis moving module 301 and a positioning transplanter 302 slidably connected to the Y-axis moving module 301. Each Y-axis moving module 301 is arranged along the Y-axis and drives the positioning transplanter 302 to reciprocate along the Y-axis. The positioning transplanter 302 is a rectangular open box with a conveying mechanism 200 installed on it. The fixed side plate 201 of the conveying mechanism 200 is fixedly connected to two opposite sides of the positioning transplanter 302 in parallel along the X-axis. The movable side plate 202 is also slidably connected between the two fixed side plates 201 through a spacing adjustment mechanism. The specific connection method is as described above and will not be repeated here.

[0045] When the positioning transplanter 302 in the first Y-direction moving mechanism moves along the Y-direction moving module 301 to the output end of the left conveying mechanism 200, and the positioning transplanter 302 in the second Y-direction moving mechanism moves along the Y-direction moving module 301 to the input end of the right conveying mechanism 200, the conveying channel positions of the left conveying mechanism 200, the conveying channel positions of the conveying mechanism 200 on the first Y-direction moving mechanism, the conveying channel positions of the conveying mechanism 200 on the second Y-direction moving mechanism, and the conveying channel positions of the right conveying mechanism 200 on the frame are aligned and applicable.

[0046] To prevent the carrier on the conveying mechanism 200 in the positioning transplanter 302 from shifting during processing and affecting processing accuracy, a pressing mechanism is also provided on the conveying mechanism 200 in each positioning transplanter 302. Each pressing mechanism includes a pressing cylinder 801 and a pressing rod 802. Each pressing rod 802 includes a long rectangular rod body 8022. The top surfaces of both ends of the rod body 8022 extend towards the central axis of the positioning transplanter 302 along the X direction and then extend downward to form a bend 8021. This utility model provides two sets of pressing mechanisms. One set is installed on the movable side plate 202, and the other set is symmetrically installed on the outer fixed side plate 201. The installation methods of the two sets of pressing mechanisms are similar. Here, the pressing mechanism installed on the outer fixed side plate 201 is described.

[0047] The two sides of the rod body 8022 of the pressure rod 802 are slidably connected to the outer surface of the fixed side plate 201. The two bent parts 8021 on the pressure rod 802 are located above the belt 2032. The fixed end of the pressure cylinder 801 is fixed to the fixed side plate 201, and its driving end is connected to the rod body 8022, driving it to rise and fall along the Z direction. The pressing mechanism on the movable side plate 202 of the positioning transplanting seat 302 is the same as described above.

[0048] Furthermore, the movable side plate 202 of each positioning transplanting seat 302 is located on the bottom surface of the belt, and the fixed side plate 201 on the outer side of each positioning transplanting seat 302 is located on the bottom surface of the belt, each being fixedly connected to a receiving groove 303.

[0049] To facilitate docking and transfer between multiple workstations and improve production efficiency, a first support frame 101 is provided along the X direction on the frame 100. A first lifting and transferring mechanism and a second lifting and transferring mechanism are spaced apart on the first support frame 101. The first lifting and transferring mechanism is located above the first Y-direction moving mechanism, and the second lifting and transferring mechanism is located above the second Y-direction moving mechanism.

[0050] The first lifting and transferring mechanism and the second lifting and transferring mechanism have the same composition and operating direction. Both the first lifting and transferring mechanism and the second lifting and transferring mechanism include a first Z-axis lifting module 401 fixed to the first support frame 101 and a transferring frame 402 slidably connected to the first Z-axis lifting module 401. The transferring frame 402 is a frame structure. A conveying mechanism 200 is connected to the bottom surface of each transferring frame 402. The two fixed side plates 201 of the conveying mechanism 200 are respectively fixed to the two opposite sides of the transferring frame 402 along the X direction. The movable side plate 202 is slidably connected between the two fixed side plates 201 through the spacing adjustment mechanism. When the two first Z-axis lifting modules 401 respectively drive the two transfer racks 402 and the conveying mechanism 200 on the two transfer racks 402 to descend between the conveying mechanisms 200 at the left and right ends of the frame, the conveying channel positions of the conveying mechanism 200 on the left side of the frame, the conveying channel positions of the conveying mechanism 200 on the first lifting transfer mechanism, the conveying channel positions of the conveying mechanism 200 on the second lifting transfer mechanism, and the conveying channel positions of the conveying mechanism 200 on the right side of the frame are aligned and applicable.

[0051] Preferably, each transfer rack 402 is provided with a limiting component to limit the maximum and minimum positions of the conveying channel of the conveying mechanism 200 on the transfer rack 402. Each limiting component includes two photoelectric sensor seats 403 and a limiting post 404. The two photoelectric sensor seats 403 are fixedly connected to the transfer rack 402 along the Y-axis, and the limiting post 404 is fixedly connected to the top surface of the movable side plate 202 on the transfer rack 402. When the spacing adjustment mechanism drives the limiting post 404 on the movable side plate 202 to move to any photoelectric sensor seat 403, the movable side plate 202 stops.

[0052] Preferably, the conveying mechanisms 200 located at the left and right ends of the frame 100 are equipped with limiting components. When the limiting components are applied, the limiting post 404 is connected to the bottom surface of each movable side plate 202, and the two photoelectric sensor seats 403 are fixed to the frame 100 along the Y-axis.

[0053] On the frame 100, a second support frame 102 is provided on the side parallel to the first support frame 101 and away from the first lifting and transferring mechanism. An X-axis moving module 500 is provided on the second support frame 102. The first laser processing mechanism and the second laser processing mechanism are slidably mounted on the X-axis moving module 500 at intervals. The first laser processing mechanism is located above the first Y-axis moving mechanism, and the second laser processing mechanism is located above the second Y-axis moving mechanism.

[0054] The first laser processing mechanism and the second laser processing mechanism have the same composition and operating direction. Both the first laser processing mechanism and the second laser processing mechanism include a second Z-axis lifting module 601 and a laser cutting module 602 with the driving direction along the Z direction. Each second Z-axis lifting module 601 is slidably connected to the X-axis moving module 500, and each laser cutting module 602 is slidably connected to the second Z-axis lifting module 601. The laser cutting module 602 is used for laser cutting of PCB boards, which is the prior art.

[0055] Furthermore, each laser cutting module 602 is provided with a connecting plate 603, and a CCD positioning module 900 is fixed to the connecting plate 603, with each CCD positioning module 900 located in front of the laser cutting head 6021 in the laser cutting module 602. Under the control of the control system (not shown), the first Y-axis moving mechanism and the second Y-axis moving mechanism each drive the carrier 000 on it to the corresponding CCD positioning module 900. The X-axis moving module 500 and the second Z-axis lifting module 601 drive the CCD positioning module 900 to automatically move to the predetermined position identification point on the PCB board on the carrier 000 for automatic marking. Then, the identified position is fed back to the control system, which controls the laser cutting head 6021 to move to the predetermined position to perform laser cutting on the PCB board.

[0056] Furthermore, each laser cutting module 602 is also connected to a dust removal pipe 604, which is located below the laser cutting head 6021 and can remove the dust generated during the laser cutting process.

[0057] This invention enables simultaneous laser cutting of PCB boards on two sets of carriers. Its operation process is as follows:

[0058] Both carrier 1 (000) and carrier 2 (000) carry PCB boards to be laser-cut. Carrier 1 is first placed on the conveyor mechanism 200 on the left side of the frame. Carrier 1 (000) moves along the X-axis until it is transported to the conveyor mechanism 200 on the positioning transfer seat 302 in the first Y-axis moving mechanism. The Y-axis moving module 301 in the first Y-axis moving mechanism drives the conveyor mechanism 200 on the positioning transfer seat 302 to move to the CCD positioning module 900 on the first laser cutting module 602 for taking pictures and positioning. Then, the X-axis moving module 500 and the second Z-axis lifting module 601 drive the laser cutting head 6021 on the first laser cutting module 602 to laser cut the PCB board on carrier 1 according to the positioning position.

[0059] As the first Y-axis moving mechanism moves carrier 1 000 closer to the first laser cutting module 602, the first Z-axis lifting module 401 in the first lifting and transferring mechanism drives the transfer rack 402 and the conveying mechanism 200 on the transfer rack 402 to descend until the conveying mechanism 200 on the transfer rack 402 aligns with the conveying mechanism 200 on the left side of the frame. Carrier 2 000 is then placed onto the conveying mechanism 200 on the left side of the frame. Carrier 2 000 moves along the X-axis with the transfer rack 402, and carrier 2 000 flows sequentially into the first lifting and transferring mechanism 602. In the material transfer mechanism, the conveying mechanism 200 in the second Y-axis moving mechanism is driven by the Y-axis moving module 301 to move the conveying mechanism 200 on the positioning transfer seat 302 to the CCD positioning module 900 on the second laser cutting module 602 for taking pictures and positioning. Then, the X-axis moving module 500 and the second Z-axis lifting module 601 drive the laser cutting head 6021 on the second laser cutting module 602 to perform laser cutting on the PCB board on the No. 2 carrier according to the positioning position.

[0060] While the PCB board on carrier 2 is undergoing laser cutting, the PCB board on carrier 1 is cut. The first Z-axis lifting module 401 in the first lifting and transferring mechanism drives the transfer rack 402 and the conveying mechanism 200 on the transfer rack 402 to rise. The Y-axis moving module 301 in the first Y-axis moving mechanism drives the conveying mechanism 200 to reset to the output side of the conveying mechanism 200 on the left side of the frame. The first Z-axis lifting module 401 in the second lifting and transferring mechanism drives the transfer rack 402 and the conveying mechanism 200 on the transfer rack 402 to rise. The conveying mechanism 200 descends until the conveying mechanism 200 on the transfer rack 402 docks with the conveying mechanism 200 on the right side of the frame. The conveying mechanism 200 in the first Y-axis moving mechanism drives the No. 1 carrier to run along the X-axis. The No. 1 carrier first flows into the conveying mechanism 200 in the second lifting and transfer mechanism. Then, the conveying mechanism 200 in the second lifting and transfer mechanism drives the No. 1 carrier to flow into the conveying mechanism 200 on the right side of the frame. Finally, the No. 1 carrier flows out through the conveying mechanism 200 on the right side of the frame, completing the entire feeding, laser cutting, and unloading process.

[0061] After the PCB board on carrier 2 is laser-cut, the first Z-axis lifting module 401 in the second lifting and transferring mechanism drives the transfer rack 402 and the conveying mechanism 200 on the transfer rack 402 to rise. The Y-axis moving module 301 in the second Y-axis moving mechanism drives the conveying mechanism 200 on it to reset to the input side of the conveying mechanism 200 on the right side of the frame. The conveying mechanism 200 in the second Y-axis moving mechanism drives carrier 2 on it to flow into the conveying mechanism 200 on the right side of the frame. Finally, carrier 2 is driven out by the conveying mechanism 200 on the right side of the frame, completing the entire loading, laser cutting, and unloading process.

[0062] This process is repeated.

[0063] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A fully automatic PCB board laser cutting and separating device, characterized in that, Includes a frame (100), on which a conveying mechanism (200) is provided at each of the left and right ends along the X direction, and a first Y-direction moving mechanism and a second Y-direction moving mechanism are provided at intervals between the two conveying mechanisms (200); On the frame (100), a first lifting and transferring mechanism is provided above the first Y-axis moving mechanism; a second lifting and transferring mechanism is provided above the second Y-axis moving mechanism; the first lifting and transferring mechanism and the second lifting and transferring mechanism are both arranged on the same side as the conveying mechanism (200); On the frame (100), a first laser processing mechanism is provided above the first Y-axis moving mechanism and on the side away from the first lifting and transferring mechanism; a second laser processing mechanism is provided above the second Y-axis moving mechanism and on the side away from the second lifting and transferring mechanism.

2. The fully automatic PCB board laser cutting and separating device according to claim 1, characterized in that, The first laser processing mechanism and the second Y-axis moving mechanism are each equipped with a CCD positioning module (900).

3. The fully automatic PCB board laser cutting and separating device according to claim 2, characterized in that, Each of the conveying mechanisms (200) includes a fixed side plate (201), and a movable side plate (202) is slidably connected between the two fixed side plates (201). A transmission belt assembly (203) is provided on one of the fixed side plates (201) and the movable side plate (202). The two transmission belt assemblies (203) are driven to rotate by a rotating motor (204) to convey products.

4. The fully automatic PCB board laser cutting and separating device according to claim 3, characterized in that, The movable side plate (202) is provided with a spacing adjustment mechanism, which includes a lead screw (701), a lead screw nut (702), and a lead screw motor (703) for driving the lead screw to rotate. The lead screw (701) is vertically connected to the fixed side plate (201) and the movable side plate (202), the lead screw nut (702) is sleeved on the lead screw (701), and the movable side plate (202) is fixed to the lead screw nut (702).

5. The fully automatic PCB board laser cutting and separating device according to claim 4, characterized in that, The first Y-axis moving mechanism and the second Y-axis moving mechanism each include a Y-axis moving module (301) and a positioning transplanting seat (302) slidably connected to the Y-axis moving module (301). The two Y-axis moving modules (301) are spaced apart along the Y-axis of the frame. The conveying mechanism (200) is installed on each positioning transplanting seat (302). The two Y-axis moving modules (301) respectively drive the two positioning transplanting seats (302) to reciprocate along the Y-axis.

6. The fully automatic PCB board laser cutting and separating device according to claim 5, characterized in that, Each of the positioning transplanting seats (302) is further provided with a pressing mechanism on the conveying mechanism (200). The pressing mechanism includes a pressing cylinder (801) installed on the movable side plate (202) or the fixed side plate (201) and a pressing rod (802) connected to the driving end of the pressing cylinder (801). The top surface of the pressing rod (802) is provided with a downward bending part (8021). The pressing cylinder (801) drives the bending part (8021) to move closer to or away from the positioning transplanting seat (302) along the Z direction.

7. The fully automatic PCB board laser cutting and separating device according to claim 4, characterized in that, The frame (100) is provided with a first support frame (101), and the first lifting and transferring mechanism and the second lifting and transferring mechanism are installed on the first support frame (101) at intervals; The first lifting and transferring mechanism and the second lifting and transferring mechanism both include a first Z-axis lifting module (401) mounted on the first support frame (101) and a transfer frame (402) connected to the drive end of the first Z-axis lifting module (401). The bottom surface of each transfer frame (402) is connected to the conveying mechanism (200). The two first Z-axis lifting modules (401) respectively drive the conveying mechanisms (200) on the two material transfer racks (402) to lift along the Z-axis.

8. The fully automatic PCB board laser cutting and separating device according to claim 7, characterized in that, Each of the aforementioned transfer racks (402) is provided with a limiting component. Each limiting component includes two photoelectric sensor seats (403) installed along the Y direction on the transfer rack (402) and a limiting post (404) installed on the movable side plate (202) of the conveying mechanism on the transfer rack. When the limiting post (404) moves with the movable side plate (202) to any photoelectric sensor seat (403), the movable side plate (202) stops.

9. The fully automatic PCB board laser cutting and separating device according to claim 7, characterized in that, A second support frame (102) is provided on the frame (100) parallel to the first support frame (101); The second support frame (102) is provided with an X-axis moving module (500), and the first laser processing mechanism and the second laser processing mechanism are slidably mounted on the X-axis moving module (500) at intervals; The first laser processing mechanism and the second laser processing mechanism each include a second Z-axis lifting module (601) slidably connected to the X-axis moving module (500) and a laser cutting module (602) slidably connected to the driving end of the second Z-axis lifting module (601).

10. The fully automatic PCB board laser cutting and separating device according to claim 9, characterized in that, The laser cutting module (602) is provided with a connecting plate (603), and the CCD positioning module (900) is installed on the connecting plate (603).

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