Spraying mechanism and silicon wafer cutting device

Abstract

The application provides a spraying mechanism and a silicon wafer cutting device, and relates to the field of silicon wafer cutting equipment. The spraying mechanism is arranged between a lifting mechanism and a cutting mechanism, and comprises a spraying pipe, a water pipe, an air pipe and a spraying head. The spraying head is arranged on the peripheral wall of the spraying pipe and is communicated with the spraying pipe. The spraying pipe has an inlet, the water pipe is arranged to be communicated with a water source and the inlet of the spraying pipe, and the air pipe is arranged to be communicated with a compressed air source and the inlet of the spraying pipe. The spraying mechanism provided by the application solves the technical problem that the existing silicon wafer cutting equipment is prone to wire breakage when lifting the material.

Description

Technical Field

[0001] This application relates to the field of silicon wafer cutting equipment, and more specifically, to a spraying mechanism and a silicon wafer cutting device. Background Technology

[0002] Existing silicon wafer dicing equipment includes a liftable carrier plate and a dicing wire mesh, with the liftable carrier plate positioned above the dicing wire mesh. A crystal ingot is mounted on the liftable carrier plate, which moves the ingot downwards, allowing the dicing wire mesh to cut the ingot into multiple silicon wafers. During the dicing process, cutting fluid is sprayed onto the ingot. After dicing is complete, the liftable carrier plate moves upwards to lift the wafers, detaching them from the dicing wire mesh.

[0003] During the material handling process, two adjacent silicon wafers are difficult to separate due to the adhesion of cutting fluid and atmospheric pressure, which leads to the problem of material handling line breakage. Utility Model Content

[0004] The purpose of this application is to provide a spraying mechanism and a silicon wafer cutting device to alleviate the technical problem of easy wire breakage during the feeding of silicon wafer cutting equipment in the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0006] In the first aspect, the spraying mechanism provided by this utility model is used to be installed between the lifting mechanism and the cutting mechanism, and includes a spray pipe, a water pipe, an air pipe and a spray head;

[0007] The spray head is installed on the peripheral wall of the spray pipe and is connected to the spray pipe;

[0008] The spray pipe has an inlet, and the water pipe is used to connect to a water source and is connected to the inlet of the spray pipe;

[0009] The air pipe is used to connect to a compressed air source and to the inlet of the spray pipe.

[0010] Furthermore, the air pipe is equipped with a one-way valve, which restricts the flow direction of fluid within the air pipe to be from the compressed air source to the spray pipe.

[0011] Furthermore, the angle between the spray direction of the spray head and the horizontal plane is set to 25°-35°.

[0012] Furthermore, multiple spray heads are provided, and the multiple spray heads are spaced apart along the axial direction of the spray pipe.

[0013] Furthermore, there are two spray pipes, with their axes spaced apart, and the multiple spray heads on the two spray pipes are staggered.

[0014] Furthermore, the first end of the spray pipe is configured as the inlet, and the second end is closed.

[0015] Furthermore, the spraying mechanism includes an adapter having a first connection port, a second connection port, and a third connection port that are interconnected.

[0016] The first connection port is connected to the first end of the spray pipe, the second connection port is connected to the water pipe, and the third connection port is connected to the air pipe.

[0017] Furthermore, the first connection port is fitted onto the first end of the spray pipe, the second connection port is fitted onto the end of the water pipe away from the water source, and the third connection port is fitted onto the end of the air pipe away from the compressed air source.

[0018] A first sealing element is installed between the first connection port and the spray pipe, a second sealing element is installed between the second connection port and the water pipe, and a third sealing element is installed between the third connection port and the air pipe.

[0019] Furthermore, the spraying mechanism also includes a spraying assembly;

[0020] The spray assembly is used to spray cutting fluid, and the spray pipe is installed on the spray assembly.

[0021] Secondly, the silicon wafer cutting device provided by this utility model includes a cutting mechanism, a lifting mechanism, and a spraying mechanism as described in any one of the above.

[0022] The cutting mechanism includes two rotating wheels and cutting lines. The axes of the two rotating wheels are spaced apart, and multiple cutting lines are provided. The multiple cutting lines are spaced apart along the axial direction of the rotating wheels, and each cutting line is wound around the two rotating wheels to form a cutting line mesh.

[0023] The lifting mechanism includes a lifting drive and a carrier plate. The carrier plate and the cutting wire mesh are arranged at intervals in the vertical direction. The lifting drive is connected to the carrier plate to drive the carrier plate to move towards or away from the cutting wire mesh.

[0024] The spray pipe in the spraying mechanism is installed above the rotating wheel, and the spray head faces the direction of the cutting wire mesh.

[0025] Based on the above technical solutions, the technical effects achievable by this utility model can be analyzed as follows:

[0026] The spraying mechanism provided by this utility model is installed between a lifting mechanism and a cutting mechanism, and includes a spray pipe, a water pipe, an air pipe, and a spray head. The spray head is installed on the peripheral wall of the spray pipe and communicates with the spray pipe. The spray pipe has an inlet; the water pipe is used to communicate with a water source and also with the inlet of the spray pipe; the air pipe is used to communicate with a compressed air source and also with the inlet of the spray pipe. The spray pipe is simultaneously connected to both the water pipe and the air pipe. Water is introduced into the spray pipe through the inlet, and compressed gas is introduced into the spray pipe through the inlet. The compressed gas and water mix in the spray pipe to form a water vapor spray, which is then sprayed out from the spray head. The water vapor spray is sprayed on the surface of the silicon wafer, reducing the adhesion between two adjacent silicon wafers, dispersing the silicon wafers that were originally tightly bonded together, avoiding the problem of material lifting line breakage, reducing the probability of damage to the cutting mechanism, and reducing the operator's cutting preparation time. The spray from the spray head of this spray pipe is a mixture of water and compressed gas, which has a low density, a large diffusion range, and a more uniform spray, achieving uniform spraying on the surface of the silicon wafer.

[0027] It is worth noting that the spray pipe is activated when the silicon wafer cutting device is in the feeding stage, spraying water vapor; when the silicon wafer cutting device is in the cutting state, the spray pipe is in the closed state to avoid affecting the spraying of cutting fluid. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 Schematic diagram of the silicon wafer dicing apparatus provided in the embodiments of this application Figure 1 ;

[0030] Figure 2 Schematic diagram of the silicon wafer dicing apparatus provided in the embodiments of this application Figure 2 ;

[0031] Figure 3 This is a schematic diagram of the structure of the spray pipe in the silicon wafer cutting device provided in the embodiments of this application.

[0032] icon:

[0033] 100 - Spray pipe; 110 - Inlet; 120 - Spray head; 130 - Straight pipe section; 140 - Bend section;

[0034] 200 - Spray assembly; 210 - Support tank; 220 - Overflow plate; 230 - Mounting component;

[0035] 300 - Cutting mechanism; 310 - Rotating wheel; 320 - Cutting wire; 330 - Frame;

[0036] 400 - Lifting mechanism; 410 - Lifting drive component; 420 - Carrier plate;

[0037] a - First direction; b - Second direction; c - Vertical direction. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0039] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] Example 1

[0042] After silicon wafer cutting is completed, the problem of silicon wafers being difficult to disperse during material handling is often encountered, especially for large-sized silicon wafers, which are even more difficult to separate due to their strong adhesion.

[0043] In view of this, see Figures 1 to 3The spraying mechanism provided in this embodiment of the utility model is used to be installed between the lifting mechanism 400 and the cutting mechanism 300, and includes a spray pipe 100, a water pipe, an air pipe and a spray head 120; the spray head 120 is installed on the peripheral wall of the spray pipe 100 and communicates with the spray pipe 100; the spray pipe 100 has an inlet 110, the water pipe is used to communicate with a water source and is also connected to the inlet 110 of the spray pipe 100; the air pipe is used to communicate with a compressed air source and is also connected to the inlet 110 of the spray pipe 100.

[0044] Specifically, one end of the water pipe is connected to a water source, and the other end is connected to the inlet 110 of the spray pipe 100; one end of the air pipe is connected to a compressed air source, and the other end is connected to the inlet 110 of the spray pipe 100. The water source includes a water tank and a water pump. The water tank contains water, and the water pump delivers the water from the tank to the spray pipe 100 via the water pipe. The compressed air source includes an air compressor. The spray pipe 100 is connected to the air compressor via the air pipe, enabling the air compressor to supply compressed air to the spray pipe 100. The specific structure and connection method of the water tank, water pump, and air compressor can be configured according to actual conditions and are not limited here.

[0045] The spray pipe 100 is connected to both a water pipe and an air pipe. Water is introduced into the spray pipe 100 through the water pipe inlet 110, and compressed gas is introduced into the spray pipe 100 through the air pipe inlet 110. The compressed gas and water mix inside the spray pipe 100 to form a water vapor spray, which is then sprayed out from the spray head 120. The water vapor spray is sprayed onto the silicon wafer surface, reducing the adhesion between adjacent silicon wafers, thus dispersing the wafers that were originally tightly bonded together. This avoids the problem of wire breakage during material handling, reduces the probability of damage to the cutting mechanism 300, and shortens the operator's cutting preparation time. The spray from the spray head 120 of the spray pipe 100 is a mixture of water and compressed gas, which has a low density, a wide diffusion range, and a more uniform spray, achieving uniform spraying on the silicon wafer surface.

[0046] It is worth noting that the spray pipe 100 is activated when the silicon wafer cutting device is in the feeding stage, spraying water vapor; when the silicon wafer cutting device is in the cutting state, the spray pipe 100 is in the closed state to avoid affecting the spraying of cutting fluid.

[0047] The structure of the spraying mechanism is described in detail below:

[0048] In the optional solution provided by this utility model embodiment, the air pipe is equipped with a one-way valve, which restricts the flow direction of fluid in the air pipe from the compressed air source to the spray pipe 100.

[0049] Specifically, a one-way valve is installed at the end of the air pipe that connects to the spray pipe 100, so that the gas in the air pipe can flow out from the air pipe into the spray pipe 100, preventing water vapor in the spray pipe 100 or water in the water pipe from flowing into the air pipe.

[0050] The one-way valve controls the flow direction of fluid in the air pipe, preventing water or water vapor from flowing through the air pipe into the compressed air source and causing damage to the compressed air source.

[0051] In the optional embodiment of this utility model, the angle between the spraying direction of the spray head 120 and the horizontal plane is set to 25°-35°.

[0052] Specifically, the angle between the spray direction of the spray head 120 and the horizontal plane is set to 25°, 30°, or 35°, etc. Furthermore, the spray head 120 has a spray channel, one end of which is connected to the spray pipe 100, and the other end is directed toward the cutting wire mesh of the cutting mechanism 300; the cross-sectional area of ​​the spray channel gradually decreases from the end near the spray pipe 100 to the end away from the spray pipe 100, thereby increasing the spray force of the spray head 120.

[0053] The spray pattern of the spray head 120 is set at an angle of 25-35° with the horizontal plane, so that the sprayed water vapor is evenly sprayed on the surface of the silicon wafer and the adjacent silicon wafers are spread out.

[0054] In the optional solution provided by this utility model embodiment, multiple spray heads 120 are provided, and the multiple spray heads 120 are spaced apart along the axial direction of the spray pipe 100.

[0055] Specifically, see Figure 1 and Figure 2 The cutting mechanism 300 includes a plurality of cutting lines 320 (same as cutting lines 320 below) arranged parallel to each other along a first direction a. The axis of the spray pipe 100 extends along the first direction a. A plurality of spray heads 120 are arranged at intervals along the first direction a. Furthermore, each spray head 120 is located directly above the cutting line 320 opposite to it, so that the gap between the spray head 120 and the two adjacent silicon wafers is opposite, thereby allowing the water vapor sprayed by the spray head 120 to spray onto the surface of the two silicon wafers.

[0056] Multiple spray heads 120 are provided, which can disperse multiple groups of adjacent silicon wafers and further avoid the problem of material feeding line breakage.

[0057] In the optional solution provided by this utility model embodiment, there are two spray pipes 100, the axes of the two spray pipes 100 are spaced apart, and the multiple spray heads 120 on the two spray pipes 100 are staggered.

[0058] Specifically, both spray pipes 100 may be connected to the same compressed air source and water source; or, each spray pipe 100 may be equipped with a compressed air source and a water source. The staggered arrangement of multiple spray heads 120 on the two spray pipes 100 means that the gap between two adjacent spray heads 120 on one spray pipe 100 is opposite to the gap between two adjacent spray heads 120 on the other spray pipe 100.

[0059] The multiple spray heads 120 on the two spray pipes 100 are staggered, which enables water vapor to be sprayed between each pair of adjacent silicon wafers while reducing the number of spray heads 120 on a single spray pipe 100. This reduces the pressure required for the compressed air and water sources and avoids the problem that the spray head 120 is weak due to insufficient pressure and cannot spray evenly to the entire surface of the silicon wafer.

[0060] In the optional solution provided by this utility model embodiment, the first end of the spray pipe 100 is set as an inlet 110, and the second end is closed.

[0061] Specifically, in this embodiment, see Figure 3 The spray pipe 100 includes a straight pipe section 130 and a bent section 140. One end of the straight pipe section 130 is closed, and the other end is connected to the bent section 140 at an angle. A spray head 120 is installed on the straight pipe section 130. The end of the bent section 140 away from the straight pipe section 130 is an inlet 110. One end of the inlet 110 of the bent section 140 is connected to a water pipe and an air pipe. The inlet 110 is located at the end of the bent section 140 to facilitate connection with the water pipe and air pipe, and also to facilitate the manufacture of the spray pipe 100. Furthermore, the axis of the straight pipe section 130 is perpendicular to the axis of the bent section 140.

[0062] One end of the straight pipe section 130 is closed to increase the pressure inside the spray pipe 100, thereby increasing the spray force of the spray nozzle; the bent section 140 is perpendicular to the straight pipe section 130, which facilitates connection with air pipes and water pipes.

[0063] In another embodiment, the spray pipe 100 includes a bent section 140 and two straight pipe sections 130. The bent section 140 is located between the two straight pipe sections 130 and is connected to the two straight pipe sections 130 at an angle. The spray head 120 is installed on the straight pipe section 130. The ends of the two straight pipe sections 130 away from the bent section 140 are closed, and the ends of the bent section 140 away from the straight pipe sections 130 are set as inlets 110.

[0064] The inlet 110 is located on the bend 140 between the two straight pipe sections 130, which facilitates the connection between the spray pipe 100 and the air pipe and water pipe, and reduces the travel of water and compressed gas, so that the mixed water vapor can be sprayed out quickly, reducing the response time of the spray pipe 100.

[0065] In the optional solution provided by this utility model embodiment, the spraying mechanism includes an adapter, which has a first connection port, a second connection port and a third connection port that are interconnected; the first connection port is connected to the first end of the spray pipe 100, the second connection port is connected to the water pipe, and the third connection port is connected to the air pipe.

[0066] Specifically, the adapter is set as a tee.

[0067] The three connectors of the tee connect to the water pipe, air pipe, and spray pipe 100 respectively, allowing compressed air and water to enter the spray pipe 100 through the tee, thus achieving water-air mixed spraying. When the spray pipe 100 is activated, the water flow and compressed air mix thoroughly at the spray head 120, forming a fine and powerful water-air spray. This spray can be evenly sprayed on the silicon wafer surface, effectively reducing the adhesion between silicon wafers, allowing the originally tightly bonded silicon wafers to be easily dispersed, improving the efficiency and quality of material handling, and providing strong support for subsequent production processing.

[0068] In the optional solution provided by this utility model embodiment, the first connection port is sleeved on the first end of the spray pipe 100, the second connection port is sleeved on the end of the water pipe away from the water source, and the third connection port is sleeved on the end of the air pipe away from the compressed air source; a first sealing element is installed between the first connection port and the spray pipe 100, a second sealing element is installed between the second connection port and the water pipe, and a third sealing element is installed between the third connection port and the air pipe.

[0069] Specifically, the first seal, the second seal, and the third seal can be configured as sealing rings or sealing strips.

[0070] Using sealing rings or sealing strips to seal interconnected pipes and joints prevents fluid leakage and improves sealing performance.

[0071] In the optional solution provided by the present utility model embodiment, the spraying mechanism further includes a spraying assembly 200; the spraying assembly 200 is used to spray cutting fluid, and the spraying pipe 100 is installed on the spraying assembly 200.

[0072] Specifically, the spray assembly 200 includes a support tank 210 and an overflow plate 220. The support tank 210 is located between the lifting mechanism 400 and the cutting mechanism 300, and has an opening at the top. The overflow plate 220 is connected to the side wall of the support tank 210 and is inclined. The axis of the spray pipe 100 is spaced apart from the axis of the support tank 210 along a second direction b, and both ends of the spray pipe 100 are mounted on the overflow plate 220 via mounting members 230. The first direction a and the second direction b are perpendicular and both are located in a horizontal plane. There is a gap between the peripheral wall of the spray pipe 100 and the surface of the overflow plate 220. The support tank 210 is used to hold the cutting fluid, and the overflow plate 220 is used to guide the cutting fluid overflowing from the support tank 210. The gap between the peripheral wall of the spray pipe 100 and the surface of the overflow plate 220 prevents the cutting fluid from sticking to the peripheral wall of the spray pipe 100, making it difficult to clean. Furthermore, the mounting component 230 is fitted with the spray pipe 100 and has a mounting protrusion, through which screws are connected to the overflow plate 220.

[0073] The spray pipe 100 is installed on the spray assembly 200 for spraying cutting fluid, thereby integrating the spray pipe 100 and the spray assembly 200. The structure is simple and the spray assembly 200 is used to support the spray pipe 100.

[0074] Example 2

[0075] The silicon wafer cutting device provided in this embodiment includes the spraying mechanism described in Embodiment 1, and therefore also possesses all the beneficial effects of Embodiment 1, which will not be repeated here.

[0076] In the optional embodiment of this utility model, the silicon wafer cutting device further includes a cutting mechanism 300 and a lifting mechanism 400. The cutting mechanism 300 includes two rotating wheels 310 and cutting lines 320. The axes of the two rotating wheels 310 are spaced apart, and multiple cutting lines 320 are provided. The multiple cutting lines 320 are spaced apart along the axial direction of the rotating wheels, and each cutting line 320 is wound around the two rotating wheels to form a cutting wire mesh. The lifting mechanism 400 includes a lifting drive 410 and a carrier plate 420. The carrier plate 420 and the cutting wire mesh are spaced apart along the vertical direction c. The lifting drive 410 is connected to the carrier plate 420 to drive the carrier plate 420 to move towards or away from the cutting wire mesh. The spray pipe 100 in the spraying mechanism is installed above the rotating wheels, and the spray head 120 faces the cutting wire mesh.

[0077] Specifically, the cutting mechanism 300 and the lifting mechanism 400 are spaced apart along the vertical direction c; two rotating wheels 310 can rotate along their own axes; the lifting drive 410 can be a motor, which is connected to the carrier plate 420 to drive the carrier plate 420 to rise or fall. A spray assembly 200 for overflowing cutting fluid is also installed above the rotating wheels. Furthermore, the cutting mechanism 300 includes a frame 330, with the rotating wheels rotatably mounted on the frame 330; the spray assembly 200 is fixedly mounted on the frame 330, and the spray pipe 100 is mounted on the overflow plate 220 of the spray assembly 200. Furthermore, the silicon wafer cutting device also includes a control mechanism, which is signal-connected to the cutting mechanism 300, the lifting mechanism 400, and the spraying mechanism. When the cutting mechanism 300 is started, the lifting mechanism 400 moves downward to cut the crystal rod, while the spraying component 200 in the spraying mechanism sprays cutting fluid. When the lifting mechanism 400 moves upward to retract the blade, the spraying component 200 in the spraying mechanism is turned off, and the spraying pipe 100 sprays water vapor.

[0078] The spray pipe 100 is installed above the rotating wheel, so that the spray head 120 can spray water vapor toward the position of the cutting wire mesh.

[0079] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0080] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A spraying mechanism for installation between a lifting mechanism (400) and a cutting mechanism (300), characterized in that, include: Sprinkler pipe (100), water pipe, air pipe and sprinkler head (120); The spray head (120) is installed on the peripheral wall of the spray pipe (100) and communicates with the spray pipe (100); The spray pipe (100) has an inlet (110), and the water pipe is used to communicate with a water source and is connected to the inlet (110) of the spray pipe (100); The air pipe is used to connect to a compressed air source and to the inlet (110) of the spray pipe (100).

2. The spraying mechanism according to claim 1, characterized in that, The air pipe is equipped with a one-way valve, which restricts the flow direction of fluid in the air pipe to be from the compressed air source to the spray pipe (100).

3. The spraying mechanism according to claim 2, characterized in that, The angle between the spray direction of the spray head (120) and the horizontal plane is set to 25°-35°.

4. The spraying mechanism according to claim 3, characterized in that, Multiple spray heads (120) are provided, and the multiple spray heads (120) are spaced apart along the axial direction of the spray pipe (100).

5. The spraying mechanism according to claim 4, characterized in that, There are two spray pipes (100), with their axes spaced apart, and the multiple spray heads (120) on the two spray pipes (100) are staggered.

6. The spraying mechanism according to claim 3, characterized in that, The first end of the spray pipe (100) is set as the inlet (110), and the second end is closed.

7. The spraying mechanism according to claim 6, characterized in that, The spraying mechanism includes an adapter, which has a first connection port, a second connection port, and a third connection port that are interconnected. The first connection port is connected to the first end of the spray pipe (100), the second connection port is connected to the water pipe, and the third connection port is connected to the air pipe.

8. The spraying mechanism according to claim 7, characterized in that, The first connection port is sleeved on the first end of the spray pipe (100), the second connection port is sleeved on the end of the water pipe away from the water source, and the third connection port is sleeved on the end of the air pipe away from the compressed air source. A first sealing element is installed between the first connection port and the spray pipe (100), a second sealing element is installed between the second connection port and the water pipe, and a third sealing element is installed between the third connection port and the air pipe.

9. The spraying mechanism according to any one of claims 1-8, characterized in that, The spraying mechanism also includes a spraying assembly (200); The spray assembly (200) is used to spray cutting fluid, and the spray pipe (100) is installed on the spray assembly (200).

10. A silicon wafer dicing apparatus, characterized in that, It includes a cutting mechanism (300), a lifting mechanism (400), and a spraying mechanism as described in any one of claims 1-9; The cutting mechanism (300) includes two rotating wheels (310) and cutting lines (320). The axes of the two rotating wheels (310) are spaced apart, and multiple cutting lines (320) are provided. The multiple cutting lines (320) are spaced apart along the axial direction of the rotating wheels, and each cutting line (320) is wound around the two rotating wheels to form a cutting line mesh. The lifting mechanism (400) includes a lifting drive (410) and a carrier plate (420). The carrier plate (420) and the cutting wire mesh are spaced apart along the vertical direction (c). The lifting drive (410) is connected to the carrier plate (420) in a transmission manner to drive the carrier plate (420) to move toward or away from the cutting wire mesh. The spray pipe (100) in the spraying mechanism is installed above the rotating wheel, and the spray head (120) faces the direction of the cutting wire mesh.

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