A heat exchange plate

CN224302877UActive Publication Date: 2026-05-29INNER MONGOLIA TONGWEI HIGH PURITY CRYSTAL SILICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
INNER MONGOLIA TONGWEI HIGH PURITY CRYSTAL SILICON CO LTD
Filing Date
2025-05-16
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Traditional plate heat exchangers have shortcomings in terms of heat transfer enhancement and cleaning cycle. Conventional corrugated plates have low effective heat transfer area and prominent surface fouling problems.

Method used

Multiple V-shaped plates are arranged in a wave-like structure, and polygonal grooves are set on the surface of the V-shaped plates to form micro-sized vortices to enhance the heat transfer effect and extend the cleaning cycle.

Benefits of technology

It effectively increases the heat transfer area, avoids the formation of laminar flow layers, and extends the cleaning cycle.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224302877U_ABST
Patent Text Reader

Abstract

The utility model provides a kind of heat exchange plate, the purpose is to solve the technical problems of low effective heat transfer area and short cleaning cycle in prior art heat transfer plate.The heat exchange plate comprises: V-shaped plate, for strip, multiple grooves are equipped on the two side surfaces of the V-shaped plate;Wherein, multiple V-shaped plates are arranged side by side, the length direction of all V-shaped plates is consistent, the plate body of heat exchange plate is formed, the plate body is in wavy structure, the wave direction of this wavy structure is perpendicular to the length direction of V-shaped plate, the groove is equipped on the wave peak surface of the plate body, the groove is polygonal structure.The heat exchange plate is arranged to form plate body by multiple v-shaped plates once, and the overall structure of plate body is wavy, so as to effectively improve the effective heat transfer area of the heat dissipation plate, and several grooves are arranged on V-shaped plate, so as to form micro-size vortex on the surface of V-shaped plate, avoid forming laminar flow bottom layer, so as to increase cleaning cycle.
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