High and low temperature test box and chip automatic test sorting system

Abstract

The utility model relates to a high and low temperature test box and chip automatic test sorting system belongs to integrated circuit test technical field. The test box includes high and low temperature box, one side of high and low temperature box is provided with the feeding door, the other side of high and low temperature box is provided with the discharge door, and the transmission tray is conveyed from the feeding door to the high and low temperature box, and is conveyed from the discharge door to the outside of high and low temperature box after completing the test in the high and low temperature box, the top of high and low temperature box is provided with test arm opening, and the test arm enters the high and low temperature box along the test arm opening and tests the chip on the transmission tray, the bottom of high and low temperature box is provided with test seat opening, and the test socket extends to the high and low temperature box along the test seat opening. The utility model provides a kind of short-stroke long-distance transmission mechanism, and the effect of short stroke and long transmission distance can be realized.

Description

Technical Field

[0001] This utility model belongs to the field of integrated circuit testing technology, and relates to high and low temperature test chambers and automatic chip testing and sorting systems. Background Technology

[0002] Chips used in aerospace environments must undergo high-temperature, low-temperature, and room-temperature tests according to national standards to ensure their performance and reliability. These tests assess the chip's performance under different ambient temperatures and predict its lifespan and reliability. Furthermore, high and low temperature testing improves chip manufacturing and production quality, reduces failure rates during actual use, and increases user satisfaction.

[0003] In summary, high and low temperature testing is a crucial quality control step for chips, ensuring their performance and reliability and enhancing product competitiveness. Therefore, high and low temperature testing is essential during chip design, manufacturing, and use to guarantee chip stability and reliability.

[0004] The high and low temperature online testing and sorting system can effectively solve the above problems, but ordinary high and low temperature chambers can no longer meet the requirements.

[0005] Defects and shortcomings of existing technology:

[0006] Ordinary ovens only have an observation and feeding door, which cannot meet the requirements of a real high and low temperature online testing and sorting system. The testing arm and testing system cannot enter the high and low temperature chamber, and the automatic loading and unloading system cannot enter the oven either. Utility Model Content

[0007] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a high and low temperature test chamber that can automatically complete chip testing inside the high and low temperature chamber, thereby improving testing efficiency.

[0008] According to a first aspect of the present disclosure, a high and low temperature test chamber is provided, the test chamber including a high and low temperature chamber body;

[0009] The high and low temperature chamber is provided with a feeding door on one side and a discharging door on the other side. The transfer tray is transported into the high and low temperature chamber through the feeding door and, after completing the test inside the high and low temperature chamber, is transported out of the high and low temperature chamber through the discharging door.

[0010] The top of the high and low temperature chamber is provided with a test arm opening, and the test arm enters the high and low temperature chamber through the test arm opening to test the chip on the transfer tray. The bottom of the high and low temperature chamber is provided with a test socket opening, and the test socket extends into the high and low temperature chamber through the test socket opening.

[0011] In one embodiment, a cylinder is provided at both the feed gate and the discharge gate.

[0012] In one embodiment, each inner wall of the high and low temperature chamber is provided with an insulation layer.

[0013] In one embodiment, the high and low temperature chamber is provided with a first cabinet door and a second cabinet door, and a connecting plate is provided between the first cabinet door and the second cabinet door.

[0014] In one embodiment, the first cabinet door is movably connected to the high and low temperature chamber via a first set of hinges, and the second cabinet door is movably connected to the high and low temperature chamber via a second set of hinges.

[0015] In one embodiment, a first lock body is provided on the side of the first cabinet door away from the first hinge group, and a first lock block that cooperates with the first lock body is provided on the side of the connecting plate near the first lock body; a second lock body is provided on the side of the second cabinet door away from the second hinge group, and a second lock block that cooperates with the second lock body is provided on the side of the connecting plate near the second lock body.

[0016] In one embodiment, the first cabinet door is provided with a first observation window, and the second cabinet door is provided with a second observation window.

[0017] According to a second aspect of this disclosure, an automatic chip testing and sorting system is provided, the automatic chip testing and sorting system including the high and low temperature testing chamber described above.

[0018] The implementation of this disclosure includes the following technical effects:

[0019] The high and low temperature test chamber in this embodiment features an inlet door on one side and an outlet door on the other. This allows a transfer tray to be conveyed into the chamber through the inlet door, tested inside, and then discharged out through the outlet door. A test arm opening is located at the top of the chamber, allowing the test arm to enter and test the chips on the transfer tray. A test socket opening is located at the bottom of the chamber, allowing the test socket to extend into the chamber. This allows the online high and low temperature testing and sorting system to automatically complete chip testing inside the chamber, thus improving testing efficiency. Furthermore, the inlet door on one side and the outlet door on the other facilitate automatic loading and unloading, further enhancing the automation level of the entire high and low temperature testing and sorting system. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the high and low temperature test chamber disclosed herein.

[0021] Figure 2 This is a schematic diagram of the high and low temperature chamber in the high and low temperature test chamber disclosed herein.

[0022] In the diagram, 1-high and low temperature chamber, 2-cylinder, 3-air conditioning unit, 11-feed door, 12-discharge door, 13-test arm opening, 14-test seat opening, 15-first cabinet door, 16-second cabinet door, 17-connecting plate, 18-first observation window, 19-second observation window. Detailed Implementation

[0023] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0024] like Figure 1 and Figure 2 As shown, the high and low temperature test chamber in this embodiment includes a high and low temperature chamber 1; a feed door 11 is provided on one side of the high and low temperature chamber 1, and a discharge door 11 is provided on the other side of the high and low temperature chamber 1. The transfer tray is transported into the high and low temperature chamber 1 through the feed door 11, and after completing the test in the high and low temperature chamber 1, it is transported out of the high and low temperature chamber 1 through the discharge door 11; a test arm opening 13 is provided on the top of the high and low temperature chamber 1, and the test arm enters the high and low temperature chamber 1 through the test arm opening 13 to test the chip on the transfer tray; a test socket opening 14 is provided on the bottom of the high and low temperature chamber 1, and the test socket extends into the high and low temperature chamber 1 through the test socket opening 14.

[0025] In this embodiment of the high and low temperature test chamber, an inlet door 11 is provided on one side of the high and low temperature chamber 1, and an outlet door 1 is provided on the other side of the high and low temperature chamber 1. This allows the transfer tray to be transported into the high and low temperature chamber 1 through the inlet door 11, and after testing is completed inside the high and low temperature chamber 1, it is transported out of the high and low temperature chamber 1 through the outlet door 11. Simultaneously, a test arm opening 13 is provided at the top of the high and low temperature chamber 1, allowing the test arm to enter the high and low temperature chamber 1 through the test arm opening 13 to test the chips on the transfer tray. A test socket opening 14 is provided at the bottom of the high and low temperature chamber 1, allowing the test socket to extend into the high and low temperature chamber 1 through the test socket opening 14. This allows the high and low temperature online testing and sorting system to automatically complete chip testing inside the high and low temperature chamber 1, thereby improving testing efficiency. Furthermore, in this embodiment of the high and low temperature test chamber, by providing an inlet door 11 on one side of the high and low temperature chamber 1 and an outlet door 11 on the other side, automatic feeding and unloading are facilitated, thus improving the automation level of the entire high and low temperature testing and sorting system.

[0026] like Figure 1 and Figure 2 As shown, cylinders 2 are installed at both the feed gate 11 and the discharge gate 11.

[0027] In this embodiment, a cylinder 2 is provided at both the feed gate 11 and the discharge gate 11 to drive the feed gate 11 and the discharge gate 11 to open or close automatically.

[0028] Preferably, each inner wall of the high and low temperature chamber is provided with a heat insulation layer.

[0029] In this embodiment, an insulation layer is provided on each inner wall of the high and low temperature chamber to reduce the influence of ambient temperature on the internal temperature of the high and low temperature chamber, thereby improving the accuracy of chip testing inside the high and low temperature chamber.

[0030] like Figure 1 As shown, the high and low temperature chamber 1 is provided with a first cabinet door 15 and a second cabinet door 16, and a connecting plate 17 is provided between the first cabinet door 15 and the second cabinet door 16.

[0031] In this embodiment, a first cabinet door 15 and a second cabinet door 16 are provided on the high and low temperature chamber, and a connecting plate 17 is provided between the first cabinet door 15 and the second cabinet door 16, so that the high and low temperature chamber can be opened or closed through the first cabinet door 15 and the second cabinet door 16.

[0032] like Figure 1 As shown, the first cabinet door 15 is movably connected to the high and low temperature chamber 1 via a first hinge group, and the second cabinet door 16 is movably connected to the high and low temperature chamber 1 via a second hinge group.

[0033] In this embodiment, the first cabinet door 15 is movably connected to the high and low temperature chamber 1 via the first hinge group, and the second cabinet door 16 is movably connected to the high and low temperature chamber 1 via the second hinge group. This movable connection method is simple and reliable.

[0034] like Figure 1 As shown, a first lock body is provided on the side of the first cabinet door 15 away from the first hinge group, and a first lock block that cooperates with the first lock body is provided on the side of the connecting plate 17 near the first lock body; a second lock body is provided on the side of the second cabinet door 16 away from the second hinge group, and a second lock block that cooperates with the second lock body is provided on the side of the connecting plate 17 near the second lock body.

[0035] In this embodiment, a first lock body is provided on the side of the first cabinet door 15 away from the first hinge group, and a first lock block that cooperates with the first lock body is provided on the side of the connecting plate 17 near the first lock body; a second lock body is provided on the side of the second cabinet door 16 away from the second hinge group, and a second lock block that cooperates with the second lock body is provided on the side of the connecting plate 17 near the second lock body. The first cabinet door 15 is locked to the connecting plate 17 by the cooperation of the first lock body and the first lock block, and the second cabinet door 16 is locked to the connecting plate 17 by the cooperation of the second lock body and the second lock block. This prevents the first cabinet door 15 and / or the second cabinet door 16 from suddenly opening during the test, thereby affecting the accuracy of the chip test.

[0036] like Figure 1 As shown, the first cabinet door 15 is provided with a first observation window 18, and the second cabinet door 16 is provided with a second observation window 19.

[0037] In this embodiment, a first observation window 18 is provided on the first cabinet door 15, and a second observation window 19 is provided on the second cabinet door 16, so that the operator can observe the chip testing status inside the high and low temperature chamber 1 at any time through the first observation window 18 and the second observation window 19.

[0038] It is understood that the cold and hot air inside the high and low temperature chamber in this embodiment are provided by an externally connected air conditioning unit 3.

[0039] According to a second aspect of this disclosure, an automatic chip testing and sorting system is provided, the automatic chip testing and sorting system including the high and low temperature testing chamber described above.

[0040] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0041] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A high and low temperature test chamber, characterized in that, The test chamber includes a high and low temperature chamber; The high and low temperature chamber is provided with a feeding door on one side and a discharging door on the other side. The transfer tray is transported into the high and low temperature chamber through the feeding door and, after completing the test inside the high and low temperature chamber, is transported out of the high and low temperature chamber through the discharging door. The top of the high and low temperature chamber is provided with a test arm opening, and the test arm enters the high and low temperature chamber through the test arm opening to test the chip on the transfer tray. The bottom of the high and low temperature chamber is provided with a test socket opening, and the test socket extends into the high and low temperature chamber through the test socket opening.

2. The high and low temperature test chamber as described in claim 1, characterized in that, Both the feed gate and the discharge gate are equipped with cylinders.

3. The high and low temperature test chamber as described in claim 1 or claim 2, characterized in that, Each inner wall of the high and low temperature chamber is equipped with an insulation layer.

4. The high and low temperature test chamber as described in claim 1 or claim 2, characterized in that, The high and low temperature chamber is equipped with a first cabinet door and a second cabinet door, and a connecting plate is provided between the first cabinet door and the second cabinet door.

5. The high and low temperature test chamber as described in claim 4, characterized in that, The first cabinet door is movably connected to the high and low temperature chamber via a first set of hinges, and the second cabinet door is movably connected to the high and low temperature chamber via a second set of hinges.

6. The high and low temperature test chamber as described in claim 5, characterized in that, A first lock body is provided on the side of the first cabinet door away from the first hinge group, and a first lock block that cooperates with the first lock body is provided on the side of the connecting plate near the first lock body; a second lock body is provided on the side of the second cabinet door away from the second hinge group, and a second lock block that cooperates with the second lock body is provided on the side of the connecting plate near the second lock body.

7. The high and low temperature test chamber as described in claim 4, characterized in that, The first cabinet door is provided with a first observation window, and the second cabinet door is provided with a second observation window.

8. An automated chip testing and sorting system, characterized in that, The automatic chip testing and sorting system includes the high and low temperature testing chamber as described in any one of claims 1 to 7.

Images