A motherboard integrated with AV output
By mounting components on the motherboard to fix the heat dissipation assembly and using side wings and bolts to fix the cooling fan, the problems of poor heat dissipation and motherboard bending in the prior art are solved, achieving more efficient heat dissipation and fixation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANJING YONGHAO ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-25
- Publication Date
- 2026-05-29
AI Technical Summary
In the existing technology, the way the cooling fan on the motherboard is fixed requires multiple screws, which can easily cause the motherboard to bend. In addition, the space above the CPU is limited, resulting in poor heat dissipation and inability to effectively dissipate heat from other components.
The heatsink is fixed to the CPU position above the motherboard using a mounting bracket. The cooling fan is secured using the side wing of the mounting bracket, requiring only two connecting bolts. Combined with heatsink fins and airflow deflectors, this enhances heat dissipation and reduces the risk of motherboard bending.
It improves the heat dissipation of the CPU and other components on the motherboard, reduces the risk of motherboard bending, and achieves a more efficient way to fix the cooling fan.
Smart Images

Figure CN224304126U_ABST