Heat dissipation structure and electronic device

Abstract

The present disclosure provides a heat dissipation structure and electronic equipment applied to a case, comprising: a support body and a flow guide mechanism; the support body comprises a first ventilation part and a second ventilation part, and the first ventilation part and the second ventilation part are arranged at intervals; the flow guide mechanism is arranged at the second ventilation part and can adjust the angle; wherein the air outlet direction of the first ventilation part and the air outlet direction of the second ventilation part satisfy or do not satisfy the parallel condition.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic device. Background Technology

[0002] With the rapid growth in demand for artificial intelligence (AI) and image processing, workstations are increasingly demanding higher graphics card performance. At the same time, the power consumption of graphics cards is also constantly rising. Especially in small workstations, heat management of high-power graphics cards has become a significant issue.

[0003] In traditional designs, the lack of effective airflow isolation between the CPU and graphics card leads to the mixing of their hot airflows. This not only increases the internal temperature of the chassis but also raises the CPU's intake temperature. This cross-contamination of hot airflows puts additional pressure on the cooling of the graphics card itself and other critical components, including the CPU, thus affecting the overall performance stability of the system. Utility Model Content

[0004] To address the aforementioned problems, the first aspect of this disclosure proposes a heat dissipation structure for use in a computer chassis, comprising:

[0005] The supporting body includes a first ventilation section and a second ventilation section, which are spaced apart.

[0006] An adjustable airflow guide mechanism is located in the second ventilation section;

[0007] The air outlet direction of the first ventilation section and the air outlet direction of the second ventilation section may or may not satisfy the parallel condition.

[0008] In some embodiments, the first ventilation section includes a cylindrical body with a through first air duct; the second ventilation section includes a plate body connected to the cylindrical body.

[0009] The plate and the inner wall of the chassis form a second air duct, and the air guiding mechanism is disposed in the second air duct.

[0010] In some embodiments, the airflow guiding mechanism includes an airflow guiding plate disposed on the upper end of the plate body and rotatably connected to the plate body to adjust the airflow direction of the second air duct.

[0011] In some embodiments, the guide plate includes a connecting end and a free end disposed opposite to each other;

[0012] The guide plate is rotatably connected to the plate body via the connecting end, and the free end rotates relative to the connecting end to adjust the angle of the guide plate.

[0013] In some embodiments, the plate body and the corresponding position of the connecting end are provided with one of a connecting part and a connecting hole;

[0014] The connecting end is provided with the connecting part and the other of the connecting hole, and the connecting hole is connected to the connecting part so that the free end can rotate along the connecting part.

[0015] In some embodiments, the plate body is provided with a plurality of limiting holes along the rotation path of the free end, and the guide plate is provided with a corresponding limiting block. The limiting block cooperates with the limiting holes to limit and fix the guide plate.

[0016] In some embodiments, there are multiple guide vanes, which are spaced apart and connected by a linkage, which drives the multiple guide vanes to rotate synchronously.

[0017] In some embodiments, the plurality of guide vanes are distributed in a gradient, and the linkage is connected to different or the same height position of each of the guide vanes.

[0018] In some embodiments, the sidewall connecting the cylinder and the plate is a stepped structure; the stepped structure is used to increase the space of the second ventilation section.

[0019] In a second aspect, this application provides an electronic device, comprising: a processor, a graphics card, and a housing, wherein the processor and the graphics card are mounted within the housing;

[0020] The housing contains a heat dissipation structure, which is used in the chassis and includes a supporting body and a heat dissipation mechanism.

[0021] The supporting body includes a first ventilation section and a second ventilation section, which are spaced apart.

[0022] The airflow guiding mechanism is adjustable in angle and located in the second ventilation section;

[0023] The air outlet direction of the first ventilation section and the air outlet direction of the second ventilation section may or may not satisfy the parallel condition;

[0024] The processor is located within the first ventilation section, and the graphics card is located within the second ventilation section. Attached Figure Description

[0025] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0026] Figure 1 A schematic diagram of the heat dissipation structure disclosed in this application assembled in a chassis is shown.

[0027] Figure 2 A schematic diagram of the overall structure of the heat dissipation structure disclosed in this application is shown.

[0028] Figures 3(a) and 3(b) schematically show the disassembled structural diagrams of the heat dissipation structure disclosed in this application;

[0029] Figure 4 A schematic diagram of the electronic device structure disclosed in this application is shown.

[0030] Explanation of icon numbers:

[0031] 10. Support body; 11. First ventilation section; 111. Cylinder; 12. Second ventilation section; 121. Plate; 1211. Connecting part; 1212. Limiting hole;

[0032] 20. Flow guiding mechanism; 21. Flow guiding plate; 211. Connecting end; 2111. Connecting hole; 212. Free end; 22. Linkage component. Detailed Implementation

[0033] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0034] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.

[0035] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0037] like Figure 1 As shown, this disclosure proposes a heat dissipation structure for use in a chassis, including: a support body 10 and a heat dissipation mechanism 20;

[0038] The supporting body 10 includes a first ventilation section 11 and a second ventilation section 12, which are spaced apart.

[0039] The flow guiding mechanism 20 is adjustable in angle and located in the second ventilation section 12;

[0040] The air outlet direction of the first ventilation section 11 and the air outlet direction of the second ventilation section 12 may or may not meet the parallel condition.

[0041] Understandably, in order to improve the airflow efficiency inside the chassis, the heat dissipation structure is placed inside the chassis, thereby more effectively dissipating the heat generated by the computer hardware.

[0042] The supporting body 10 is the foundation of the entire heat dissipation structure, including a first ventilation section 11 and a second ventilation section 12. The first ventilation section 11 and the second ventilation section 12 are physically separated and have a certain spatial interval, which helps to optimize the airflow path and avoid direct airflow conflict or interference.

[0043] The first ventilation section 11 can be used to introduce cold air into the chassis and exhaust heated air. The air outlet direction of the first ventilation section 11 can be adjusted according to specific design requirements.

[0044] The second ventilation section 12 works in conjunction with the first ventilation section 11 and can be used to enhance the heat dissipation effect in specific areas (such as high heat source areas such as CPU and GPU).

[0045] The airflow guiding mechanism 20 is located at the second ventilation section 12, and its angle can be adjusted to control the direction and intensity of the airflow. The adjustability of the airflow guiding mechanism 20 allows users or the system to dynamically adjust the airflow according to actual needs to achieve the best heat dissipation effect.

[0046] For example, in high-performance computing tasks, when the system load increases and the temperature rises, the heat dissipation or cooling effect of a specific area can be enhanced by adjusting the angle of the airflow guiding mechanism 20.

[0047] The airflow direction of the first ventilation section 11 and the airflow direction of the second ventilation section 12 may or may not meet the parallel condition, allowing users to flexibly adjust the relative position and direction between the two ventilation sections according to the internal layout of the chassis and heat dissipation requirements.

[0048] When the airflow directions of the two components are parallel, a more concentrated and directional airflow pattern may be formed; when the airflow directions of the two components are not parallel, it may help to create an airflow circulation system throughout the entire chassis, thereby improving the heat dissipation effect.

[0049] The above-mentioned heat dissipation structure enhances the heat dissipation efficiency inside the chassis by providing a first ventilation section 11 and a second ventilation section 12 spaced apart on the support body 10, and by providing an adjustable-angle airflow guiding mechanism 20 in the second ventilation section 12.

[0050] Due to the adjustability of the airflow guiding mechanism 20, the airflow direction and intensity of the second ventilation section 12 can be dynamically adjusted according to actual needs to optimize the airflow path. By precisely controlling the airflow, not only can the noise caused by unnecessary high-speed fan operation be reduced, but also hardware overheating can be prevented, thereby extending the service life of the computer's internal components, improving the stability and reliability of the system, and providing users with a quieter and more efficient working environment.

[0051] In some embodiments, such as Figure 1-2 As shown, the first ventilation section 11 includes a cylinder 111, and the cylinder 111 is provided with a through first air duct; the second ventilation section 12 includes a plate 121, and the plate 121 is connected to the cylinder 111.

[0052] The plate 121 and the inner wall of the chassis form a second air duct, and the air guiding mechanism 20 is disposed in the second air duct.

[0053] Understandably, in order to achieve more effective heat dissipation management, the specific structure of the first ventilation section 11 and the second ventilation section 12 has been refined.

[0054] The first ventilation section 11 includes a cylindrical body 111, inside which is a through-flow first air duct. The first air duct is used to guide airflow, allowing cool air to effectively enter the chassis and hot air to be exhausted. The shape and size of the cylindrical body 111 can be designed according to actual needs to optimize airflow efficiency.

[0055] The second ventilation section 12 includes a plate 121, which is directly or indirectly connected to the cylinder 111 of the first ventilation section 11. The position of the plate 121 creates a space between the plate 121 and the inner wall of the chassis, i.e., a second air duct. The plate 121 utilizes the space inside the chassis to provide an airflow channel independent of the first air duct, i.e., a second air duct.

[0056] The airflow guiding mechanism 20 is installed in the second air duct. Since the angle of the airflow guiding mechanism 20 is adjustable, the airflow direction through the second air duct can be flexibly controlled, thereby accurately controlling the airflow path in the second air duct.

[0057] For example, by adjusting the angle of the airflow guiding mechanism 20 so that the ventilation direction of the second air duct is not parallel to that of the first air duct, one air duct is used to introduce low-temperature air to cool the heat-generating components inside the chassis, while the other air duct exhausts the high-temperature air inside the chassis for heat dissipation. This allows for precise cooling of the heat-generating components and improves the heat dissipation effect. The heat-generating components inside the chassis can be high-heat-generating components such as the CPU and GPU.

[0058] The aforementioned structure not only increases the airflow path within the chassis but also optimizes the path by adjusting the angle of the airflow guide mechanism 20, ensuring maximum cooling performance. It also utilizes the existing space inside the chassis to create additional airflow channels, improving space utilization and reducing the need for additional installation space. Furthermore, because the angle of the airflow guide mechanism 20 is adjustable, this cooling system can adjust the optimal cooling strategy according to different hardware configurations and operating environments, exhibiting high flexibility and adaptability.

[0059] In some embodiments, such as Figure 2 As shown in -3(b), the airflow guiding mechanism 20 includes a guide plate 21, which is disposed on the upper end of the plate 121 and is rotatably connected to the plate 121 to adjust the airflow direction of the second air duct.

[0060] Understandably, the airflow guiding mechanism 20 includes at least one airflow guide plate 21, and the airflow direction of the second air duct can be flexibly changed by adjusting the angle of the airflow guide plate 21, thereby achieving precise control of the airflow inside the chassis.

[0061] The deflector 21, as a key component of the airflow guiding mechanism 20, is used to guide the direction of airflow. It can be made of lightweight yet robust materials to ensure that it can effectively change the direction of airflow while maintaining structural stability.

[0062] The guide vane 21 is rotatably connected to the plate body 121, allowing the guide vane 21 to be angled as needed. The rotatable connection can be a hinge mechanism or a multi-axis rotation system.

[0063] By precisely controlling the airflow direction of the second air duct, the cooling airflow can be directed more directly to hot areas, significantly improving the heat dissipation effect in these areas. Alternatively, it can also direct the hot air inside the chassis to a designated direction through the guide plate 21 of the second air duct, preventing hot air from mixing with the cooling air and flowing back into the chassis.

[0064] Furthermore, since the angle of the air deflector 21 is adjustable, it can adapt to different hardware layouts and varying workloads, providing a more personalized heat dissipation solution. Compared to a fixed design, the rotating air deflector 21 is easier to clean and maintain, which helps to maintain the efficient operation of the heat dissipation system in the long term.

[0065] In some embodiments, as shown in FIG3(b), the guide plate 21 includes a connecting end 211 and a free end 212 disposed opposite to each other;

[0066] The guide plate 21 is rotatably connected to the plate body 121 via the connecting end 211, and the free end 212 rotates relative to the connecting end 211 to adjust the angle of the guide plate 21.

[0067] Understandably, the two ends of the guide plate 21 are respectively set as a connecting end 211 and a free end 212. The connecting end 211 is the part where the guide plate 21 is rotatably connected to the plate 121 of the second ventilation part 12. The connecting end 211 can be connected to the plate 121 through a hinge, a rotating shaft or other structure, and the guide plate 21 can be flexibly adjusted within a certain range.

[0068] The free end 212 is located at the other end of the air guide plate 21. Its position changes as the connecting end 211 rotates. The angle of the free end 212 can be adjusted according to the ventilation requirements of the second air duct to optimize the heat dissipation effect. The angle of the air guide plate 21 can be adjusted by moving the free end 212, which can achieve precise control of the airflow direction and adapt to the heat dissipation requirements of different hardware configurations and workloads.

[0069] In some embodiments, as shown in Figures 3(a) and 3(b), the plate body 121 and the corresponding position of the connecting end 211 are provided with one of the connecting part 1211 and the connecting hole 2111;

[0070] The connecting end 211 is provided with another of the connecting part 1211 and the connecting hole 2111. The connecting hole 2111 is connected to the connecting part 1211 so that the free end 212 can rotate along the connecting part 1211.

[0071] Understandably, a mechanical connection is used to achieve the rotational connection between the guide vane 21 and the plate body 121. This connection mechanism involves the plate body 121 and the guide vane 21 having one of a connecting part 1211 and a connecting hole 2111 respectively at their connection ends 211. The rotational function of the guide vane 21 is achieved through the cooperation of these two components.

[0072] The area corresponding to the connection end 211 of the guide plate 21 is provided with either a connection part 1211 or a connection hole 2111, and the connection end 211 of the guide plate 21 is equipped with the other of the connection part 1211 or the connection hole 2111.

[0073] For example, if the plate 121 has a connection hole 2111, then the connection end 211 of the guide plate 21 will be provided with a corresponding connection part 1211 (such as a rotating shaft), and vice versa.

[0074] Assembly of the two is achieved by connecting the connecting hole 2111 on the plate 121 to the connecting part 1211 on the connecting end 211 of the guide plate 21. This method not only ensures the stability of the structure, but also allows the free end 212 of the guide plate 21 to rotate along the connecting part 1211.

[0075] After assembly, the air deflector 21 can rotate around the connecting part 1211 on its connecting end 211, thereby adjusting the angle of the air deflector 21. Users can flexibly adjust the airflow direction according to actual heat dissipation needs to optimize the heat dissipation effect.

[0076] The simple and effective combination of the connecting hole 2111 and the connecting part 1211 facilitates installation and disassembly, is beneficial for daily maintenance and cleaning, and provides the necessary flexibility and stability for the air guide plate 21, enabling it to operate effectively in a variety of application environments and improving the heat dissipation efficiency and operational stability of the computer system.

[0077] In some embodiments, the plate 121 is provided with a plurality of limiting holes 1212 along the rotation path of the free end 212, and the guide plate 21 is provided with a corresponding limiting block. The limiting block cooperates with the limiting hole 1212 to limit and fix the guide plate 21.

[0078] Understandably, in order to further enhance the angle adjustment function of the guide plate 21 and ensure that it can be stably fixed at a specific angle, multiple limiting holes 1212 are set at intervals on the plate body 121 along the rotation path of the guide plate 21, and limiting blocks are set at corresponding positions of the guide plate 21 to cooperate with the limiting holes 1212 to achieve the limiting and fixing of the guide plate 21 after it is adjusted to a predetermined angle.

[0079] The limiting holes 1212 are distributed at different positions, corresponding to different angles that the guide plate 21 may need to be fixed at. Accordingly, limiting blocks are provided on the guide plate 21 to cooperate with the limiting holes 1212 on the plate body 121. When the guide plate 21 is adjusted to the required angle, the limiting block can be inserted into the corresponding limiting hole 1212 to achieve a stable fixation of the guide plate 21.

[0080] When the angle of the guide vane 21 needs to be adjusted, the user can pull the limiting block out of the current limiting hole 1212 and then rotate the guide vane 21 to the new position. Once the ideal angle is reached, the limiting block is reinserted into the corresponding limiting hole 1212 to complete the fixation. Alternatively, a lateral load can be applied to the free end 212, causing the limiting block to disengage from the limiting hole 1212 and move to a suitable limiting hole 1212. The limiting block then embeds into the limiting hole 1212, thus fixing the guide vane 21. This method simplifies the adjustment of the guide vane 21.

[0081] With the cooperation of the limiting hole 1212 and the limiting block, the guide plate 21 can select the most suitable configuration from a variety of preset angles, ensuring that the airflow direction is optimally optimized at that angle, while also ensuring the stability of the structure and avoiding angle deviation due to accidental collisions or vibrations.

[0082] In some embodiments, as shown in FIG3(b), there are multiple guide plates 21, which are spaced apart and connected by a linkage 22, which drives the multiple guide plates 21 to rotate synchronously.

[0083] Understandably, in order to further optimize airflow management and improve heat dissipation efficiency within the chassis, multiple air deflectors 21 are configured and connected together via a linkage 22. This enables the synchronous rotation of multiple air deflectors 21, ensuring the consistency and effectiveness of airflow direction.

[0084] Multiple deflectors 21 are spaced apart on the plate 121 of the second ventilation section 12. This not only increases the flexibility of airflow adjustment but also allows for a more uniform airflow distribution.

[0085] The various guide vanes 21 are connected by a linkage 22, enabling multiple guide vanes 21 to rotate simultaneously and in the same direction. Adjusting the angle of one guide vane 21 will cause the other guide vanes 21 to change their angles accordingly, maintaining a consistent airflow direction. The linkage 22 can be a linkage system.

[0086] The linkage 22 enables all guide vanes 21 to rotate synchronously, allowing for easy adjustment of the airflow direction of the entire duct system and improving overall heat dissipation performance. This simplifies user operation and enhances ease of use. Furthermore, the linkage 22 prevents the risk of overall airflow turbulence caused by inaccurate positioning of a single guide vane 21, thus enhancing system stability and reliability.

[0087] In some embodiments, such as Figure 1 As shown in -3(b), multiple guide vanes 21 are distributed in a gradient, and linkage components 22 are connected to different or the same height positions of each guide vane 21.

[0088] Understandably, in order to adapt to the diverse layout of the chassis, the guide plates 21 with different heights can be arranged at intervals to form a stepped distribution, and the linkage 22 can be connected according to the different or the same height position of each guide plate 21 to maintain the synchronization of each guide plate 21.

[0089] The multiple guide vanes 21 are arranged according to a certain gradient (i.e., tilt angle or height difference). The linkage 22 can be connected to different height positions of each guide vane 21, or it can be connected at the same height position.

[0090] The linkage 22 is designed to accommodate the gradient distribution between the guide vanes 21; it can be a linkage, gear system, or other mechanical transmission device. This ensures that the guide vanes 21 can rotate synchronously even when they are at different heights or tilt angles.

[0091] Although the height of each air deflector 21 is different, all air deflectors 21 can be adjusted synchronously by adjusting the linkage 22 at one time. This greatly simplifies the user operation and achieves the effect of precise control of airflow path. It can effectively avoid the problem of uneven mixing of hot and cold air, further improve the performance of the heat dissipation system, and maintain the optimal operating temperature of the computer's internal components.

[0092] In some embodiments, as shown in FIG3(a), the sidewall connecting the cylinder 111 and the plate 121 is a stepped structure; the stepped structure is used to enhance the space of the second ventilation section 12.

[0093] Understandably, in order to improve the space utilization of the second ventilation section 12 and optimize the airflow path, the side wall connecting the cylinder 111 and the plate 121 is designed as a stepped structure, which can not only increase the effective space of the second ventilation section 12, but also manage the airflow inside the chassis more effectively.

[0094] The side wall where the cylinder 111 meets the plate 121 adopts a stepped structure. The side wall does not have to be straight, but rather has steps or layers, thereby creating additional space and increasing the space of the second ventilation section 12. This not only helps to improve air circulation, but also allows the airflow to be distributed more evenly throughout the area, improving heat dissipation and cooling efficiency.

[0095] By increasing the space of the second ventilation section 12 and optimizing the airflow path, the trapezoidal structure cleverly utilizes space that might otherwise be overlooked, improving the space utilization rate inside the chassis and making the layout more compact and efficient.

[0096] The second aspect of this application, such as Figure 4 As shown, an electronic device is proposed, comprising: a processor, a graphics card, and a housing, wherein the processor and the graphics card are installed inside the housing;

[0097] The housing contains a heat dissipation structure, which is used in the chassis and includes a support body 10 and a heat dissipation mechanism 20.

[0098] The support body 10 includes a first ventilation section 11 and a second ventilation section 12, which are spaced apart.

[0099] The airflow guiding mechanism 20 is adjustable in angle and located in the second ventilation section 12;

[0100] The air outlet direction of the first ventilation section 11 and the air outlet direction of the second ventilation section 12 may or may not meet the parallel condition.

[0101] The processor is located in the first ventilation section 11, and the graphics card is located in the second ventilation section 12.

[0102] Understandably, electronic devices integrate heat dissipation structures to improve the cooling efficiency of critical components such as processors and graphics cards. This electronic device includes a processor, graphics card, and a housing, with a dedicated heat dissipation structure housed within the housing.

[0103] The processor, as the core computing unit of the electronic device, is responsible for performing various computing tasks; the graphics card is used to handle graphics-related workloads. Both are housed within a casing, which protects the internal components from physical damage and works in conjunction with the cooling system to ensure that the internal components maintain a suitable operating temperature.

[0104] The first ventilation section 11 is used for ventilation to cool the processor. It can effectively introduce cold air and exhaust heated air, so that the heat generated by the processor can be quickly removed and the processor's optimal operating temperature can be maintained.

[0105] The second ventilation section 12 is located near the graphics card and can ventilate to enable efficient cooling of the graphics card, allowing the hot air exhausted by the graphics card fan to be directed to the outside of the casing through the second ventilation section 12.

[0106] The second ventilation section 12 is spaced apart from the first ventilation section 11 to avoid airflow interference and ensure smooth airflow within their respective areas.

[0107] An adjustable-angle air guide plate 21 is located inside the second ventilation section 12. The airflow direction can be optimized by adjusting the angle. Since the graphics card generates a lot of heat under high load, flexibly adjusting the angle of the air guide plate 21 can help to expel the heat from the chassis more effectively. It can also effectively prevent the hot air expelled from the second ventilation section 12 from mixing with the cooling air and then entering the chassis through the first ventilation section 11.

[0108] The processor is located within the first ventilation section 11, ensuring it receives sufficient cooling air to effectively dissipate the heat it generates. The graphics card is positioned within the second ventilation section 12, near the adjustable airflow guide mechanism 20, which allows for airflow direction adjustment based on the graphics card's actual operating status, achieving optimal heat dissipation.

[0109] The heat dissipation structure in electronic devices uses independent ventilation sections designed specifically for processors and graphics cards, and an adjustable airflow guiding mechanism 20 corresponding to the graphics card to change the airflow direction of the graphics card heat dissipation, preventing hot air from re-entering the casing, significantly improving heat dissipation efficiency and reducing the risk of overheating.

[0110] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0111] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0112] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0113] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, Applications include chassis, including: The supporting body includes a first ventilation section and a second ventilation section, which are spaced apart. An adjustable airflow guide mechanism is located in the second ventilation section; The air outlet direction of the first ventilation section and the air outlet direction of the second ventilation section may or may not satisfy the parallel condition.

2. The heat dissipation structure according to claim 1, characterized in that, The first ventilation section includes a cylindrical body, and the cylindrical body is provided with a through first air duct; The second ventilation section includes a plate, which is connected to the cylinder. The plate and the inner wall of the chassis form a second air duct, and the air guiding mechanism is disposed in the second air duct.

3. The heat dissipation structure according to claim 2, characterized in that, The airflow guiding mechanism includes an airflow guiding plate, which is disposed on the upper end of the plate and rotatably connected to the plate to adjust the airflow direction of the second air duct.

4. The heat dissipation structure according to claim 3, characterized in that, The guide plate includes a connecting end and a free end that are disposed opposite to each other; The guide plate is rotatably connected to the plate body via the connecting end, and the free end rotates relative to the connecting end to adjust the angle of the guide plate.

5. The heat dissipation structure according to claim 4, characterized in that, The plate body and the corresponding position of the connecting end are provided with one of the connecting part and the connecting hole; The connecting end is provided with the connecting part and the other of the connecting hole, and the connecting hole is connected to the connecting part so that the free end can rotate along the connecting part.

6. The heat dissipation structure according to claim 5, characterized in that, The plate body is provided with a plurality of limiting holes along the rotation path of the free end, and the guide plate is provided with a corresponding limiting block. The limiting block cooperates with the limiting hole to limit and fix the guide plate.

7. The heat dissipation structure according to claim 4, characterized in that, There are multiple guide plates, which are spaced apart and connected by a linkage, which drives the multiple guide plates to rotate synchronously.

8. The heat dissipation structure according to claim 7, characterized in that, The multiple guide vanes are distributed in a gradient, and the linkage is connected to different or the same height position of each of the guide vanes.

9. The heat dissipation structure according to claim 2, characterized in that, The side wall connecting the cylinder and the plate has a stepped structure; the stepped structure is used to increase the space of the second ventilation section.

10. An electronic device, characterized in that, include: A processor, a graphics card, and a housing, wherein the processor and the graphics card are mounted within the housing; The housing contains a heat dissipation structure, which is used in the chassis and includes a supporting body and a heat dissipation mechanism. The supporting body includes a first ventilation section and a second ventilation section, which are spaced apart. The airflow guiding mechanism is adjustable in angle and located in the second ventilation section; The air outlet direction of the first ventilation section and the air outlet direction of the second ventilation section may or may not satisfy the parallel condition; The processor is located within the first ventilation section, and the graphics card is located within the second ventilation section.

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