A high integration core circuit board

Abstract

A kind of high integration core circuit board, including top layer circuit board, middle layer circuit board and bottom layer circuit board, the top layer circuit board, middle layer circuit board and bottom layer circuit board are relatively equidistant distribution, the upper end of the top layer circuit board is installed with multiple wiring plugs by right side and rear side, and the upper end of gusset plate two front side is installed with transformer, the outer wall of the top layer circuit board, middle layer circuit board and bottom layer circuit board is processed with heat dissipation copper sheet in left and right sides. By the cooperation between top layer circuit board, middle layer circuit board, bottom layer circuit board, heat dissipation copper sheet, processing chip, since each layer is provided with separate heat dissipation copper sheet, so that it has better and more significant heat dissipation effect when compared with single circuit board heat dissipation copper sheet in contact with low-temperature airflow, effectively avoid the problem that the electronic components of single-layer high integration core circuit board are too much, and the heat dissipation capacity of single-layer circuit board is limited, leading to easy burnout of electronic components due to high temperature during use.

Description

Technical Field

[0001] This utility model relates to the field of core circuit board technology, and in particular to a highly integrated core circuit board. Background Technology

[0002] With the rapid development of industrial and electronic technologies, equipment has increasingly higher and more detailed requirements for core circuit boards, especially in terms of integration, cost, performance, and interface resources. For example, the application with application number "202221794126.7" describes a highly integrated core circuit board, which includes a main control chip module (CPU), a memory chip module (eMMC), a power management module (PMIC), a memory chip module (LPDDR4), stamp hole pads, and LGA pads.

[0003] However, although it can save the cost of more than four connectors, the single-layer high-integration core circuit board has too many electronic components, and the heat dissipation capacity of the single-layer circuit board is limited, which makes it easy for the electronic components to burn out due to the high temperature during use. Summary of the Invention

[0004] This invention aims to solve the problem in the prior art where single-layer high-integration core circuit boards have too many electronic components, and the limited heat dissipation capacity of single-layer circuit boards makes them prone to burning out due to high temperatures during use. The invention provides a high-integration core circuit board.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: This highly integrated core circuit board includes a top circuit board, a middle circuit board, and a bottom circuit board. The top circuit board, the middle circuit board, and the bottom circuit board are distributed relatively equally. Multiple wiring plugs are installed on the upper end of the top circuit board through the right side and the rear side. The upper rear side of the middle circuit board is fixedly connected to multiple relays through a pad plate one. A pad plate two is fixedly connected to the upper front side of the bottom circuit board. Multiple capacitors are installed on the upper rear side of the pad plate two, and a transformer is installed on the upper front side of the pad plate two. Heat dissipation copper fins are processed on the left and right sides of the outer walls of the top circuit board, the middle circuit board, and the bottom circuit board.

[0006] To further improve the design, the heat dissipation copper fins on both sides of the top-layer circuit board, the middle-layer circuit board, and the bottom-layer circuit board are arranged in an alternating pattern.

[0007] To further improve the design, a processing chip is installed on the upper right front of the top-level circuit board, and a junction box is installed on the upper left side of the top-level circuit board.

[0008] To further improve the design, multiple sensors are installed above the top circuit board, pad one, and pad two.

[0009] To further improve the design, the top-layer circuit board is internally machined with through holes for pad one and pad two to pass through.

[0010] To further improve the design, wiring socket one and wiring socket two are respectively installed on the upper front sides of the top circuit board.

[0011] The beneficial effects of this utility model are as follows: This utility model, through the cooperation between the top circuit board, middle circuit board, bottom circuit board, heat sink copper sheet, and processing chip, enables the use of a multi-layer circuit board structure. Blind holes are set for assembly, transforming the original single circuit board structure into a multi-layer circuit board structure with gaps between them. In actual use, the heat dissipation is better achieved by airflow through the gaps between the multi-layer circuit boards. At the same time, since each layer is equipped with an individual heat sink copper sheet, it has a better and more significant heat dissipation effect when in contact with low-temperature airflow compared to the heat sink copper sheet of a single circuit board. This effectively avoids the problem that a single-layer high-integration core circuit board has too many electronic components, and the heat dissipation capacity of a single-layer circuit board is limited, which can easily lead to the burnout of electronic components due to high temperatures during use. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the front right side structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the front left side structure of this utility model;

[0014] Figure 3 This is a schematic diagram of the structure of the top circuit board in this utility model;

[0015] Figure 4 This is a schematic diagram of the structure of the middle layer circuit board in this utility model;

[0016] Figure 5 This is a schematic diagram of the structure of the bottom circuit board in this utility model.

[0017] Explanation of reference numerals in the attached diagram: 1. Top layer circuit board, 2. Middle layer circuit board, 3. Bottom layer circuit board, 4. Capacitor, 5. Processing chip, 6. Transformer, 7. Wiring socket one, 8. Wiring socket two, 9. Sensor, 10. Junction box, 11. Relay, 12. Heat sink copper plate, 13. Wiring plug, 14. Pad one, 15. Pad two. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings:

[0019] See attached document Figure 1-5In this embodiment, a highly integrated core circuit board includes a top circuit board 1, a middle circuit board 2, and a bottom circuit board 3. The top circuit board 1, middle circuit board 2, and bottom circuit board 3 are distributed relatively equidistantly. Multiple connectors 13 are installed on the upper end of the top circuit board 1 via the right and rear sides. The upper rear side of the middle circuit board 2 is fixedly connected to multiple relays 11 via a pad 14. The relays 11 are used to control the switching of the circuit. A pad 2 15 is fixedly connected to the upper front side of the bottom circuit board 3. Multiple capacitors 4 are installed on the upper rear side of the pad 2 15. The capacitors 4 are used to store charge and are commonly used in filter circuits. A transformer 6 is installed on the upper front side of the pad 2 15. The transformer 6 is used for power transmission and voltage conversion. Heat dissipation copper fins 12 are processed on the left and right sides of the outer walls of the top circuit board 1, middle circuit board 2, and bottom circuit board 3. The specific material of the heat dissipation copper fins 12 can be determined according to specific application requirements.

[0020] See attached document Figure 1-5 In this embodiment, the heat dissipation copper fins 12 on both sides of the top circuit board 1, the middle circuit board 2, and the bottom circuit board 3 are staggered. A processing chip 5 is installed on the upper right front of the top circuit board 1. The processing chip 5 integrates multiple electronic components on one chip to perform complex functions. A junction box 10 is installed on the upper left of the top circuit board 1. Multiple sensors 9 are installed above the top circuit board 1, pad 14, and pad 2 15. The sensors 9 can detect the real-time status of the circuit board. Specific types can include temperature sensors, radiation sensors, etc., which can be selected according to actual usage requirements. The top circuit board 1 has through holes for pad 14 and pad 2 15 to pass through. In this case, all electronic components can be selected according to the specific model required in actual use. Wiring socket 1 7 and wiring socket 2 8 are installed on the upper front sides of the top circuit board 1, respectively.

[0021] Working principle:

[0022] When this highly integrated core circuit board is needed, the top-layer circuit board 1, the middle-layer circuit board 2, and the bottom-layer circuit board 3 are first fixed together using blind holes at their four corners and bolts. At the same time, there are gaps between each layer for subsequent soldering connections, enabling the multi-layer circuit board to achieve circuit connectivity. In practical use, different external circuits and power supplies can be connected according to the corresponding wiring sockets 7, 8, junction box 10, and connector 13. The processing chip 5 controls and calculates the corresponding signals and performs subsequent control processes. The relay 11 controls the connection status of a single circuit, and the sensor 9 detects the real-time status of the circuit board. Specific types can include... Including temperature sensors, radiation sensors, etc., which can be selected according to actual usage needs. This case adopts a multi-layer circuit board structure and sets blind holes for assembly, transforming the original single circuit board structure into a multi-layer circuit board structure with gaps between them. This allows for better heat dissipation through airflow in actual use, as heat can be carried away through the gaps between the multi-layer circuit boards. At the same time, since each layer is equipped with an individual heat sink 12, it has a better and more significant heat dissipation effect when in contact with low-temperature airflow compared to the heat sink of a single circuit board. This effectively avoids the problem that a single-layer high-integration core circuit board has too many electronic components, and the heat dissipation capacity of a single-layer circuit board is limited, which can easily lead to the burnout of electronic components due to high temperatures during use.

[0023] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art should understand that various changes in form and detail are possible within the scope of the claims.

Claims

1. A highly integrated core circuit board, comprising a top circuit board (1), a middle circuit board (2), and a bottom circuit board (3), wherein the top circuit board (1), the middle circuit board (2), and the bottom circuit board (3) are distributed relatively equidistantly, characterized in that: The top circuit board (1) has multiple wiring plugs (13) installed on its upper end via the right and rear sides. The upper rear side of the middle circuit board (2) is fixedly connected to multiple relays (11) via a pad (14). The upper front side of the bottom circuit board (3) is fixedly connected to a pad (15). Multiple capacitors (4) are installed on the upper rear side of the pad (15), and a transformer (6) is installed on the upper front side of the pad (15). The top circuit board (1), middle circuit board (2) and bottom circuit board (3) are all equipped with heat dissipation copper sheets (12) on their outer walls.

2. The highly integrated core circuit board according to claim 1, characterized in that: The heat dissipation copper sheets (12) on both sides of the top circuit board (1), the middle circuit board (2) and the bottom circuit board (3) are staggered.

3. The highly integrated core circuit board according to claim 1, characterized in that: A processing chip (5) is installed on the upper right front of the top circuit board (1), and a junction box (10) is installed on the upper left side of the top circuit board (1).

4. The highly integrated core circuit board according to claim 1, characterized in that: Multiple sensors (9) are mounted on top of the top circuit board (1), pad one (14) and pad two (15).

5. The highly integrated core circuit board according to claim 1, characterized in that: The top circuit board (1) has through holes for pad one (14) and pad two (15) to pass through.

6. The highly integrated core circuit board according to claim 1, characterized in that: The top circuit board (1) has a wiring socket 1 (7) and a wiring socket 2 (8) installed on the front two sides of the top end.

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