A heat dissipation structure of power electronic components

Abstract

The utility model relates to electronic components technical field especially relates to a power electronic components heat radiation structure, including bottom plate, bottom plate is heat conduction board, is equipped with PCB board in one side of bottom plate, and still be provided with the fixed frame that fixes to PCB board on bottom plate, be equipped with strip seat in the side edge corner of bottom plate away from PCB board, one end of strip seat is equipped with through -hole, and the other end of strip seat is equipped with second strip groove in the side close to bottom plate, second strip groove is along the length direction of strip seat, and first strip groove is equipped with in second strip groove, the front view projection of second strip groove is located in first strip groove. The utility model discloses through the design of strip seat, sliding block and connecting shaft, strip seat can rotate and move in the edge corner of bottom plate in many directions to adjust the position of through -hole flexibly, this makes PCB board to be able to adapt to the installation demand of different equipment, need not secondary punching, has improved the convenience and efficiency of installation significantly.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and in particular to a heat dissipation structure for power electronic components. Background Technology

[0002] Electronic components are the basic units that make up electronic circuits, used to realize functions such as signal generation, processing, transmission, storage, or control. They are the core components of electronic devices and systems, and are widely used in fields such as communications, computers, consumer electronics, industrial control, and medical equipment. Among them, PCB boards are one of the most common electronic components.

[0003] Currently, electronic components require mounting and securing to ensure stability within the device. However, existing electronic components, such as PCBs, are directly mounted using bolts and other fasteners. This can lead to mismatches between the component's size and the available mounting spaces, necessitating manual drilling to re-drill holes. This process is time-consuming and cumbersome. Furthermore, directly mounting the component means at least one side will be in contact with the device's inner wall, affecting its heat dissipation during operation. Therefore, a heat dissipation structure for power electronic components is proposed to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a heat dissipation structure for power electronic components.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a heat dissipation structure for power electronic components, including a base plate, the base plate being a heat-conducting plate, a PCB board being provided on one side of the base plate, and a fixing frame for fixing the PCB board being provided on the base plate.

[0006] A strip-shaped seat is provided at one corner of the base plate away from the PCB board. One end of the strip-shaped seat has a through hole, and the other end of the strip-shaped seat has a second strip-shaped groove on the side closer to the base plate. The second strip-shaped groove is along the length of the strip-shaped seat, and a first strip-shaped groove is provided in the second strip-shaped groove. The frontal projection of the second strip-shaped groove is located in the first strip-shaped groove. A disc-shaped slider is provided in the first strip-shaped groove. The outer wall of the slider is clearance-fitted with the inner wall of the first strip-shaped groove. A connecting shaft is installed on the slider, and the other end of the connecting shaft is vertically fixed to the base plate.

[0007] Preferably, circular slots are provided at the corners of the PCB board, and the fixing bracket includes multiple sleeves. The sleeves are vertically installed on the corner of the base plate near the PCB board, and the sleeves correspond to the slots. Threaded grooves are also provided inside the sleeves.

[0008] The mounting bracket also includes a mounting frame, which corresponds to the edge of the PCB board, and bolts are provided at the corners of the mounting frame, with the bolts corresponding to the sleeves.

[0009] Preferably, multiple spaced support plates are installed along the edge of the base plate near the PCB board, and the top of the support plates abuts against the fixed frame.

[0010] Preferably, the fixing frame is a heat-conducting plate.

[0011] Preferably, multiple inclined support bars are installed on the side of the base plate closest to the PCB board, with the support bars on both sides of the base plate being arranged opposite each other.

[0012] Preferably, silicone grease pads are installed on both the side of the support bar closest to the PCB board and the side of the fixing frame closest to the PCB board. The silicone grease pads are made of elastic thermally conductive silicone.

[0013] Preferably, elastic washers are provided at the bolt head near the fixing frame and along the edge of the through hole.

[0014] The design scheme proposed in this utility model has the following beneficial effects in application:

[0015] 1. Through the design of the strip seat, slider and connecting shaft, the strip seat can rotate and move in multiple directions at the corner of the base plate, thereby flexibly adjusting the position of the through hole. This allows the PCB board to adapt to the installation requirements of different equipment without the need for secondary drilling, which significantly improves the convenience and efficiency of installation.

[0016] 2. This utility model uses thermally conductive materials for both the base plate and the fixing frame, combined with inclined support strips and silicone pads (thermal conductive silicone), which can quickly conduct the heat generated by the PCB board to the outside. Furthermore, the gap between the support plates further optimizes the air contact area and improves the heat dissipation effect. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is an exploded view of the present invention;

[0019] Figure 3 This is a schematic diagram of the bottom structure of the base plate of this utility model;

[0020] Figure 4 This is a schematic diagram of the internal structure of the strip seat of this utility model.

[0021] In the diagram: 1. Base plate; 2. Connecting shaft; 3. Slider; 4. Strip seat; 5. First strip groove; 6. Second strip groove; 7. Through hole; 8. Support plate; 9. Fixing frame; 10. PCB board; 11. Slot; 12. Sleeve; 13. Bolt; 14. Silicone gasket; 15. Support strip. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Reference 1- Figure 4 A heat dissipation structure for a power electronic component includes a base plate 1, which is a heat-conducting plate. A PCB board 10 is provided on one side of the base plate 1. After the PCB board 10 is placed on the base plate 1, the heat plate on the PCB board 10 will be better transferred outward along the base plate 1. A fixing bracket for fixing the PCB board 10 is also provided on the base plate 1.

[0024] Among them, such as Figure 2 As shown, circular slots 11 are provided at the corners of the PCB board 10. The fixing bracket includes multiple sleeves 12. The sleeves 12 are vertically installed on the corner of the base plate 1 near the PCB board 10, and the sleeves 12 correspond to the slots 11. When the PCB board 10 is placed on the base plate 1, the sleeves 12 on the base plate 1 will pass through the slots 11 of the PCB board 10, thereby limiting and stabilizing the PCB board 10 placed on the base plate 1 to prevent the PCB board 10 from shaking on the base plate 1.

[0025] A threaded groove is also provided inside the sleeve 12, and the fixing bracket also includes a fixing frame 9. The fixing frame 9 corresponds to the edge of the PCB board 10, and bolts 13 are provided at the corners of the fixing frame 9. The bolts 13 correspond to the sleeve 12. After the PCB board 10 is placed on the base plate 1, the fixing frame 9 is removed and placed on the PCB board 10. Then the bolts 13 are screwed into the sleeve 12. This can provide a more stable fixing effect for the PCB board 10 and prevent the PCB board 10 from falling off the sleeve 12.

[0026] It should be noted that multiple support plates 8 are installed along the edge of the base plate 1 near the PCB board 10, and the top of the support plate 8 abuts against the fixed frame 9 to wrap the edge of the PCB board 10 to prevent the side of the PCB board 10 from being bumped. The gap between two adjacent support plates 8 allows air to pass through and contact the PCB board 10, ensuring the heat dissipation of the PCB board 10.

[0027] To further improve the heat dissipation capacity of the PCB board 10 on the base plate 1, multiple inclined support bars 15 are installed on the side of the base plate 1 near the PCB board 10. The support bars 15 on both sides of the base plate 1 are arranged opposite each other, allowing the air flowing to the side of the PCB board 10 to have more and more sufficient contact with the PCB board 10. In addition, thermal grease pads 14 are installed on the side of the support bars 15 near the PCB board 10 and on the side of the fixing frame 9 near the PCB board 10. The thermal grease pads 14 are elastic thermally conductive silicone, and the fixing frame 9 is a heat-conducting plate, which helps to guide the heat on the PCB board 10 outward more quickly, thus enhancing the heat dissipation capacity of the structure for the PCB board 10.

[0028] like Figure 1 and Figure 4 As shown, a strip seat 4 is provided at each corner of the base plate 1 away from the PCB board 10. One end of the strip seat has a through hole 7, and the other end of the strip seat 4, near the base plate 1, has a second strip groove 6. The second strip groove 6 runs along the length of the strip seat 4, and a first strip groove 5 is formed within the second strip groove 6. The frontal projection of the second strip groove 6 is located within the first strip groove 5. A disc-shaped slider 3 is provided within the first strip groove 5. The outer wall of the slider 3 is clearance-fitted with the inner wall of the first strip groove 5, allowing the slider to slide... Block 3 can not only move linearly within the first strip groove 5, but also rotate freely. A connecting shaft 2 is installed on the slider 3, and the other end of the connecting shaft 2 is vertically fixed to the base plate 1. This allows the strip seat 4 to rotate and move in multiple directions at the corners of the base plate 1. This allows the corresponding position of the through hole 7 to be adjusted according to the installation position of the PCB board 10 on the equipment, thereby improving the adaptability of the base plate 1 during installation. No secondary drilling or other operations are required, which improves the convenience of the overall installation process of the PCB board 10.

[0029] Furthermore, elastic washers are provided at the screw head of the bolt 13 near the fixed frame 9 and along the edge of the through hole 7 to improve the stability of the fixed frame 9 and the base plate 1 during installation and fixing.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a power electronic component, characterized in that: Includes a base plate (1), which is a heat-conducting plate. A PCB board (10) is provided on one side of the base plate (1), and a fixing frame for fixing the PCB board (10) is also provided on the base plate (1). A strip seat (4) is provided on one side corner of the base plate (1) away from the PCB board (10). A through hole (7) is provided at one end of the strip seat. A second strip groove (6) is provided on the other end of the strip seat (4) near the base plate (1). The second strip groove (6) is along the length of the strip seat (4). A first strip groove (5) is provided in the second strip groove (6). The frontal projection of the second strip groove (6) is located in the first strip groove (5). A disc-shaped slider (3) is provided in the first strip groove (5). The outer wall of the slider (3) is clearance-fitted with the inner wall of the first strip groove (5). A connecting shaft (2) is installed on the slider (3). The other end of the connecting shaft (2) is vertically fixed on the base plate (1).

2. The heat dissipation structure for a power electronic component according to claim 1, characterized in that: A circular slot (11) is provided at the corner of the PCB board (10), and the fixing bracket includes multiple sleeves (12). The sleeves (12) are vertically installed on the corner of the base plate (1) near the PCB board (10), and the sleeves (12) correspond to the slots (11). A threaded groove is also provided in the sleeves (12). It also includes a fixing frame (9), which corresponds to the edge of the PCB board (10), and bolts (13) are provided at the corners of the fixing frame (9), which correspond to the sleeve (12).

3. The heat dissipation structure for a power electronic component according to claim 2, characterized in that: Multiple support plates (8) are installed along one edge of the base plate (1) near the PCB board (10), and the top of the support plate (8) abuts against the fixed frame (9).

4. The heat dissipation structure for a power electronic component according to claim 3, characterized in that: The fixed frame (9) is a heat-conducting plate.

5. The heat dissipation structure for a power electronic component according to claim 4, characterized in that: Multiple inclined support bars (15) are installed on the side of the base plate (1) near the PCB board (10), and the support bars (15) on both sides of the base plate (1) are arranged opposite to each other.

6. The heat dissipation structure for a power electronic component according to claim 5, characterized in that: Silicone grease pads (14) are installed on the side of the support bar (15) near the PCB board (10) and on the side of the fixing frame (9) near the PCB board (10). The silicone grease pads (14) are made of elastic thermally conductive silicone.

7. The heat dissipation structure for a power electronic component according to claim 6, characterized in that: Elastic washers are provided on the fixed frame (9) near the bolt head (13) and along the edge of the through hole (7).

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