A compatible plug-in capacitor packaging structure

Abstract

The utility model discloses a compatible plug -in capacitor's packaging structure, including PCB board and the packaging area of setting on the PCB board, be equipped with n mutually overlapping setting's packaging unit in the packaging area, every packaging unit all with a plug -in capacitor adaptation, wherein, n is the integer greater than or equal to 2. Such design, in the product research and development process, can test the influence of the plug -in capacitor of different capacitance value to circuit performance to find the most adaptive plug -in capacitor parameter, need not constantly replace PCB board or carry out complex reformation to PCB board, the packaging structure of compatible plug -in capacitor that the application provides, and test personnel only need to install the plug -in capacitor of different capacitance value in corresponding packaging unit, need not make any change to PCB board layout, wiring etc. design, can quickly complete plug -in capacitor replacement and test, has improved the efficiency of test greatly, makes the research and development process can advance quickly.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and more specifically, to a packaging structure for a compatible plug-in capacitor. Background Technology

[0002] Printed Circuit Boards (PCBs), also known as PCBs or printed circuit boards, are essential components for the physical support and signal transmission of electronic products. With the rapid development of the electronics industry, through-hole capacitors, as electronic components used to store charge and energy, are indispensable parts of circuit design. In the design process of PCBs, through-hole capacitors are widely used, forming an important part of the circuit board and playing a crucial role in the realization of circuit functions and performance stability.

[0003] In PCB (Printed Circuit Board) design, the selection of plug-in capacitors is a critical step, affecting not only the circuit's functionality but also directly impacting product performance, reliability, and cost. The selection of plug-in capacitors is typically based on their capacitance value, rated voltage, operating frequency range, and temperature coefficient. These parameters determine whether the plug-in capacitor can meet the requirements of a specific application. Inaccurate estimation of the required capacitance value in the early stages of PCB design can lead to a series of problems. For example, if the selected capacitor's capacitance is too small, it may not effectively filter ripple or noise from the power supply, affecting circuit stability and signal quality. Conversely, if the capacitance is too large, it can slow down the circuit response and, in some cases, even cause unnecessary resonance, thus affecting the circuit's efficiency and stability. If an inappropriate plug-in capacitor selection is found in the initial design, a redesign is necessary, meaning a new PCB prototype must be made and tested again. This not only increases design time and material costs but also extends the product's timeline from concept to market. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, this utility model provides a compatible plug-in capacitor packaging structure, which allows for quick replacement of plug-in capacitors with different capacitance values ​​for testing without changing the PCB board design. This reduces the need for board design modifications, thereby reducing development time and production costs.

[0005] The technical solution of this utility model is as follows: a packaging structure for a compatible plug-in capacitor includes a PCB board and a packaging area disposed on the PCB board. The packaging area is provided with n overlapping packaging units, each of which is adapted to a plug-in capacitor, where n is an integer greater than or equal to 2.

[0006] Furthermore, when the silkscreen frames of the two packaging units overlap, the plug-in disks of the two packaging units are staggered. When the silkscreen frames of the two packaging units are staggered, the plug-in disks of the two packaging units can be overlapped or staggered.

[0007] Furthermore, the packaging unit is provided in two parts, namely a first packaging unit and a second packaging unit. The first packaging unit includes a first silkscreen frame and two first insert disks arranged in a straight line along the Y-axis. The second packaging unit includes a second silkscreen frame and two second insert disks arranged in a straight line along the X-axis. The first silkscreen frame and the second silkscreen frame overlap, and the two first insert disks and the two second insert disks are staggered.

[0008] Furthermore, the first plug-in disk and the second plug-in disk are offset by 90°.

[0009] Furthermore, the packaging unit is provided in two parts, namely a first packaging unit and a third packaging unit. The first packaging unit includes a first silkscreen frame and two first plug-in disks arranged in a straight line along the Y-axis. The third packaging unit includes a third silkscreen frame and two third plug-in disks arranged in a straight line along the Y-axis. The third silkscreen frame is located inside the first silkscreen frame. In the orthographic projection direction of the PCB board, one third plug-in disk overlaps with one first plug-in disk, and the other third plug-in disk overlaps with the other first plug-in disk.

[0010] Furthermore, the packaging unit is provided in two parts, namely a second packaging unit and a third packaging unit. The second packaging unit includes a second silkscreen frame and two second plug-in disks arranged in a straight line along the X-axis. The third packaging unit includes a third silkscreen frame and two third plug-in disks arranged in a straight line along the Y-axis. The third silkscreen frame is located inside the second silkscreen frame, and the two third plug-in disks and the two second plug-in disks are staggered with each other.

[0011] Furthermore, the second plug-in disk and the third plug-in disk are offset by 90°.

[0012] Furthermore, the packaging unit comprises three units: a first packaging unit, a second packaging unit, and a third packaging unit. The first packaging unit includes a first silkscreen frame and two first insert trays arranged in a straight line along the Y-axis. The second packaging unit includes a second silkscreen frame and two second insert trays arranged in a straight line along the X-axis. The first and second silkscreen frames overlap, and the two first insert trays and two second insert trays are staggered. The third packaging unit includes a third silkscreen frame and two third insert trays arranged in a straight line along the Y-axis. The third silkscreen frame is located within the first silkscreen frame. One third insert tray overlaps with one first insert tray, and the other third insert tray overlaps with the other first insert tray.

[0013] Furthermore, the first plug-in disk and the second plug-in disk are offset by 90°.

[0014] According to the above-described solution, the beneficial effects of this utility model are as follows: A compatible plug-in capacitor packaging structure includes a PCB board and a packaging area disposed on the PCB board. The packaging area has n overlapping packaging units, each of which is adapted to a plug-in capacitor, where n is an integer greater than or equal to 2. This design allows for testing the impact of plug-in capacitors of different capacitance values ​​on circuit performance during product development, in order to find the most suitable plug-in capacitor parameters without constantly replacing the PCB board or making complex modifications. With the compatible plug-in capacitor packaging structure provided in this application, testers only need to install plug-in capacitors of different capacitance values ​​into the corresponding packaging units, without making any changes to the PCB board layout, wiring, or other designs, to quickly complete plug-in capacitor replacement and testing, greatly improving testing efficiency and enabling rapid progress in the R&D process. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the packaging structure of the compatible plug-in capacitor in Embodiment 1 of this utility model;

[0017] Figure 2 This is a schematic diagram of the packaging structure of the compatible plug-in capacitor in Embodiment 2 of this utility model;

[0018] Figure 3This is a schematic diagram of the packaging structure of the compatible plug-in capacitor in Embodiment 3 of this utility model;

[0019] Figure 4 This is a schematic diagram of the packaging structure of the compatible plug-in capacitor in Embodiment 4 of this utility model.

[0020] In the diagram, 1 is the PCB board; 2 is the first packaging unit; 21 is the first silkscreen frame; 22 is the first plug-in tray; 3 is the second packaging unit; 31 is the second silkscreen frame; 32 is the second plug-in tray; 4 is the third packaging unit; 41 is the third silkscreen frame; and 42 is the third plug-in tray. Detailed Implementation

[0021] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention by way of example, but should not be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0022] To better understand this utility model, the following description, in conjunction with the accompanying drawings and embodiments, will further illustrate the present utility model:

[0023] In electronic product development, any modification to a PCB board involves collaborative work across multiple professional fields. This ranges from schematic design adjustments and PCB layout and routing replanning to PCB prototyping, surface mount technology (SMT) soldering, and other processes. During product development, it's crucial to frequently test the impact of different capacitance values ​​on circuit performance to find the optimal capacitor parameters. Traditional methods require constantly replacing or complexly modifying the PCB to switch between different capacitance values, which not only consumes significant manpower and resources but also leads to a substantial increase in time costs due to the cumbersome process.

[0024] Based on this, this specific embodiment provides a compatible plug-in capacitor packaging structure, including a PCB board 1 and a packaging area disposed on the PCB board 1. The packaging area has n overlapping packaging units, each of which is adapted to a plug-in capacitor, where n is an integer greater than or equal to 2. This design allows for quick replacement of plug-in capacitors with different capacitance values ​​for testing without changing the design of the PCB board 1, reducing the need for board design modifications and thus reducing development time and production costs.

[0025] Specifically, in the product development process, the compatible plug-in capacitor packaging structure provided in this embodiment can be used to test the impact of plug-in capacitors of different capacitance values ​​on circuit performance, in order to find the most suitable plug-in capacitor parameters. This eliminates the need for constantly replacing PCB board 1 or making complex modifications to it. Testers only need to repeatedly remove and reinstall the plug-in capacitors to replace them with different capacitance values ​​on the same PCB board 1 for testing. Specifically, PCB board 1 has a packaging area containing multiple overlapping packaging units. These packaging units are individually compatible with plug-in capacitors of different capacitance values. Testers only need to accurately install the plug-in capacitors of different capacitance values ​​into the corresponding packaging units. During this process, no changes are required to the complex design of PCB board 1, such as layout and wiring. This not only enables a fast and efficient plug-in capacitor replacement and testing process, greatly improving testing efficiency, but also allows the entire development process to proceed rapidly, saving significant time and costs for electronic product development.

[0026] In compact PCB designs, if the silkscreen outlines of two capacitors completely overlap and their mounting pads also overlap, installation errors can easily occur. Therefore, the compatible mounting capacitor packaging structure provided in this application allows for the following: when the silkscreen outlines of two packaging units overlap, the mounting pads of the two packaging units are staggered; when the silkscreen outlines of two packaging units are staggered, the mounting pads of the two packaging units can be either overlapped or staggered.

[0027] Specifically, when the silkscreen frames of two packaging units overlap, by staggering the plug-in disks, it can be ensured that each capacitor has its unique installation position. This method avoids the confusion and misinstallation problems that may occur in high-density packaging areas.

[0028] Example 1

[0029] This embodiment 1 provides a compatible plug-in capacitor packaging structure, which includes two packaging units: a first packaging unit 2 and a second packaging unit 3. The first packaging unit 2 includes a first silkscreen frame 21 and two first plug-in disks 22 arranged in a straight line along the Y-axis. The second packaging unit 3 includes a second silkscreen frame 31 and two second plug-in disks 32 arranged in a straight line along the X-axis. The first silkscreen frame 21 and the second silkscreen frame 31 overlap, and the two first plug-in disks 22 and the two second plug-in disks 32 are staggered.

[0030] In this embodiment 1, the plug-in capacitor corresponding to the first packaging unit 2 and the plug-in capacitor corresponding to the second packaging unit 3 have the same physical size, but the positive and negative pole spacing of the plug-in capacitor corresponding to the first packaging unit 2 and the plug-in capacitor corresponding to the second packaging unit 3 are not equal. Therefore, the center distance between the two first plug-in disks 22 and the center distance between the two second plug-in disks 32 are not equal.

[0031] Preferably, the first plug-in disk 22 and the second plug-in disk 32 are offset by 90°.

[0032] Example 2

[0033] This embodiment 2 provides a compatible plug-in capacitor packaging structure, which includes two packaging units: a first packaging unit 2 and a third packaging unit 4. The first packaging unit 2 includes a first silkscreen frame 21 and two first plug-in pads 22 arranged in a straight line along the Y-axis. The third packaging unit 4 includes a third silkscreen frame 41 and two third plug-in pads 42 arranged in a straight line along the Y-axis. The third silkscreen frame 41 is located inside the first silkscreen frame 21. In the orthographic projection direction of the PCB board 1, one third plug-in pad 42 overlaps with one first plug-in pad 22, and the other third plug-in pad 42 overlaps with the other first plug-in pad 22.

[0034] In this embodiment 2, the plug-in capacitors corresponding to the first packaging unit 2 and the third packaging unit 4 have different physical sizes, but the positive and negative electrode spacing of the plug-in capacitors corresponding to the first packaging unit 2 and the third packaging unit 4 are equal. Therefore, the center distance between the two third plug-in disks 42 is equal to the center distance between the two first plug-in disks 22.

[0035] Example 3

[0036] This embodiment 3 provides a compatible plug-in capacitor packaging structure, which includes two packaging units: a second packaging unit 3 and a third packaging unit 4. The second packaging unit 3 includes a second silkscreen frame 31 and two second plug-in disks 32 arranged in a straight line along the X-axis. The third packaging unit 4 includes a third silkscreen frame 41 and two third plug-in disks 42 arranged in a straight line along the Y-axis. The third silkscreen frame 41 is located inside the second silkscreen frame 31, and the two third plug-in disks 42 and the two second plug-in disks 32 are staggered.

[0037] Preferably, the second plug-in disk 32 and the third plug-in disk 42 are offset by 90°.

[0038] Example 4

[0039] This embodiment 4 provides a compatible plug-in capacitor packaging structure, which includes three packaging units: a first packaging unit 2, a second packaging unit 3, and a third packaging unit 4. The first packaging unit 2 includes a first silkscreen frame 21 and two first plug-in disks 22 arranged in a straight line along the Y-axis. The second packaging unit 3 includes a second silkscreen frame 31 and two second plug-in disks 32 arranged in a straight line along the X-axis. The first silkscreen frame 21 and the second silkscreen frame 31 overlap, and the two first plug-in disks 22 and the two second plug-in disks 32 are staggered. The third packaging unit 4 includes a third silkscreen frame 41 and two third plug-in disks 42 arranged in a straight line along the Y-axis. The third silkscreen frame 41 is located inside the first silkscreen frame 21. One third plug-in disk 42 overlaps with one first plug-in disk 22, and another third plug-in disk 42 overlaps with another first plug-in disk 22.

[0040] Preferably, the first plug-in disk 22 and the second plug-in disk 32 are offset by 90°.

[0041] It should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art, or the orientation or positional relationship that the product is usually placed in during use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0042] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0043] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A packaging structure for a compatible plug-in capacitor, characterized in that, It includes a PCB board and a packaging area disposed on the PCB board. The packaging area is provided with n overlapping packaging units, each of which is adapted to a plug-in capacitor, where n is an integer greater than or equal to 2. The packaging unit is provided in two parts, namely a first packaging unit and a second packaging unit. The first packaging unit includes a first silkscreen frame and two first plug-in disks arranged in a straight line along the Y-axis. The second packaging unit includes a second silkscreen frame and two second plug-in disks arranged in a straight line along the X-axis. The first silkscreen frame and the second silkscreen frame overlap, and the two first plug-in disks and the two second plug-in disks are staggered.

2. The packaging structure of a compatible plug-in capacitor as described in claim 1, characterized in that: When the silkscreen frames of the two packaging units overlap, the plug-in disks of the two packaging units are staggered. When the silkscreen frames of the two packaging units are staggered, the plug-in disks of the two packaging units can be overlapped or staggered.

3. The packaging structure of a compatible plug-in capacitor as described in claim 1, characterized in that: The first plug-in disk and the second plug-in disk are offset at 90°.

4. The packaging structure of a compatible plug-in capacitor as described in claim 1, characterized in that: The packaging unit is provided in two parts, namely a first packaging unit and a third packaging unit. The first packaging unit includes a first silkscreen frame and two first plug-in disks arranged in a straight line along the Y-axis. The third packaging unit includes a third silkscreen frame and two third plug-in disks arranged in a straight line along the Y-axis. The third silkscreen frame is located inside the first silkscreen frame. In the orthographic projection direction of the PCB board, one third plug-in disk overlaps with one first plug-in disk, and the other third plug-in disk overlaps with the other first plug-in disk.

5. The packaging structure of a compatible plug-in capacitor as described in claim 1, characterized in that: The packaging unit is provided in two parts, namely a second packaging unit and a third packaging unit. The second packaging unit includes a second silkscreen frame and two second plug-in disks arranged in a straight line along the X-axis. The third packaging unit includes a third silkscreen frame and two third plug-in disks arranged in a straight line along the Y-axis. The third silkscreen frame is located inside the second silkscreen frame, and the two third plug-in disks and the two second plug-in disks are staggered with each other.

6. The packaging structure of a compatible plug-in capacitor as described in claim 5, characterized in that: The second and third plug-in disks are offset at 90°.

7. The packaging structure of a compatible plug-in capacitor as described in claim 1, characterized in that: The packaging unit comprises three units: a first packaging unit, a second packaging unit, and a third packaging unit. The first packaging unit includes a first silkscreen frame and two first insert trays arranged in a straight line along the Y-axis. The second packaging unit includes a second silkscreen frame and two second insert trays arranged in a straight line along the X-axis. The first and second silkscreen frames overlap, and the two first insert trays and two second insert trays are staggered. The third packaging unit includes a third silkscreen frame and two third insert trays arranged in a straight line along the Y-axis. The third silkscreen frame is located within the first silkscreen frame. One third insert tray overlaps with one first insert tray, and the other third insert tray overlaps with the other first insert tray.

8. The packaging structure of a compatible plug-in capacitor as described in claim 7, characterized in that: The first plug-in disk and the second plug-in disk are offset at 90°.

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