A pretreatment device for high-density multilayer circuit board manufacturing
By using a pretreatment device with obliquely sprayed cleaning fluid and position adjustment, the problem of incomplete cleaning of the hole walls of multilayer circuit boards is solved, achieving efficient hole wall cleaning and ensuring the reliability and performance of the circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YANGXUAN ELECTRONICS (SUZHOU) CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-29
AI Technical Summary
Incomplete cleaning of the hole walls in existing high-density multilayer circuit boards leads to poor electroplating results in through holes, affecting the reliability and performance of the circuit boards.
Design a pretreatment device that uses oblique spraying of cleaning fluid combined with vertical position adjustment. The angle and position of the spray head are adjusted by a mounting plate and a lifting cylinder. The circuit board is fixed by a pneumatic clamp to avoid damage.
It effectively removes deposits from the hole walls, reduces blind spots in cleaning, improves cleaning efficiency, and ensures the cleanliness of the circuit board and the copper plating effect.
Smart Images
Figure CN224306016U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of multilayer circuit board manufacturing technology, and more specifically, to a pretreatment device for the preparation of high-density multilayer circuit boards. Background Technology
[0002] Through-hole electroplating technology for high-density multilayer circuit boards is the core process for realizing electrical interconnection between multilayer boards, and its quality directly affects the reliability and performance of the circuit board.
[0003] The core of through-hole electroplating is to deposit a layer of conductive metal on the inner wall of the through-hole in an insulating substrate, so that circuits in different layers can be electrically connected through the through-hole. The through-hole electroplating process is complex and requires multiple processing steps. Among them, the hole wall needs to be pre-treated before copper plating, i.e., the hole wall needs to be cleaned to prepare for subsequent copper plating.
[0004] However, existing hole wall cleaning methods mostly involve spraying cleaning fluid to treat the hole walls of multilayer circuit boards. While the cleaning method is simple, blind spots are easily created during the cleaning process, resulting in incomplete cleaning. Incomplete hole wall cleaning ultimately affects the subsequent copper plating effect and the use of the circuit board. This paper proposes a pretreatment device for the preparation of high-density multilayer circuit boards to improve the existing problems. Utility Model Content
[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a pretreatment device for the preparation of high-density multilayer circuit boards.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] A pretreatment apparatus for fabricating high-density multilayer circuit boards includes a mounting assembly, a cleaning assembly disposed on one side of the mounting assembly, and a placement assembly disposed below the mounting assembly.
[0008] The mounting assembly includes two sets of mounting brackets. Each set of mounting brackets has a sliding groove through its side wall. Each set of sliding grooves has a set of sliders inside its interior. Each set of mounting brackets has a lifting cylinder at its top. The output ends of the lifting cylinders are connected to the two sets of sliders.
[0009] The placement assembly includes a placement slot, inside which is a placement platform. Two sets of pneumatic clamps for fixing multilayer circuit boards are symmetrically arranged on the top of the placement platform.
[0010] The cleaning assembly includes a liquid storage tank, with an inlet pipe connected to the top of the liquid storage tank, a storage pipe connected to the end of the inlet pipe away from the liquid storage tank, and a spray head for spraying cleaning fluid connected to the bottom of the storage pipe.
[0011] By adopting the above technical solution, when cleaning a multi-layer circuit board, the circuit board is first placed on the top of the placement table, and then the pneumatic clamp is activated to fix the circuit board. Then the cleaning fluid is sprayed onto the surface of the circuit board from the spray nozzle to clean the circuit board.
[0012] The present invention is further configured such that: a mounting plate is provided at the middle position of the two sets of mounting brackets, the mounting plate is shaped like an inverted U, and a set of connecting rods is provided on each side of the mounting plate.
[0013] The present invention is further configured such that: the two sets of connecting rods are respectively fixedly connected to the mounting plate, and the ends of the two sets of connecting rods away from the mounting plate are respectively connected to the two sets of sliders.
[0014] The present invention is further configured such that: a motor is provided on one side of the mounting plate, and the motor is installed below one of the sets of connecting rods.
[0015] The present invention is further configured such that: the liquid storage tube is disposed below the mounting plate, one end of the liquid storage tube is provided with an output shaft, one end of the output shaft is connected to the liquid storage tube, and the other end of the output shaft is connected to the output end of the motor.
[0016] The present invention is further configured such that: a sleeve is provided at one end of the liquid storage tube away from the output shaft, one end of the sleeve is connected to the liquid storage tube, the other end of the sleeve is rotatably connected to the mounting plate, and the liquid inlet tube passes through the inside of the sleeve and is connected to the liquid storage tube.
[0017] By adopting the above technical solution, the installation plate provides space for the installation design of the entire device, improving the stability of the relative positions of each component; by changing the tilt angle of the spray head, the cleaning fluid can enter the through hole in an oblique spray manner, flushing away contaminants that are difficult to reach in the traditional vertical direction; by adjusting the vertical distance between the spray head and the surface of the multi-layer circuit board, the intensity of the cleaning fluid can be controlled. For example, when close to the multi-layer circuit board, the impact force of the high-pressure spray is stronger, which is suitable for stubborn stains; when further away, the coverage area can be expanded to avoid damaging the multi-layer circuit board. The use of two sets of lifting cylinders to adjust the vertical position makes the adjustment position more accurate, and the more adjustment positions, the wider the range of cleaning intensity adjustment.
[0018] The present invention is further configured such that: two sets of pneumatic clamps are disposed below the liquid spray head, and the two sets of pneumatic clamps are disposed diagonally along the placement platform.
[0019] By adopting the above technical solution, the two sets of pneumatic clamps are used to press and fix multi-layer circuit boards. The pressure head surface of the pneumatic clamps is covered with soft cushioning material to disperse pressure and prevent scratching the board surface. At the same time, the end face of the pressure head is set as a flat surface with rounded corners to avoid right-angle edges cutting into the multi-layer circuit board and reduce damage to the multi-layer circuit board.
[0020] In summary, this application includes at least one of the following beneficial technical effects:
[0021] Drill chips can easily remain on the inner walls of through holes in multi-layer boards. By adjusting the angle, the spray nozzle can be injected into the through hole from an angled upward, and the cleaning fluid can form a spiral flow inside the hole. Combined with the up and down adjustment, the deposits on the hole wall can be effectively removed, improving cleaning efficiency and reducing blind spots in hole wall cleaning. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of a pretreatment device for the fabrication of high-density multilayer circuit boards according to the present invention.
[0023] Figure 2 for Figure 1 Isometric side view.
[0024] Figure 3 for Figure 1 The front view.
[0025] Figure 4 for Figure 1 Top view.
[0026] Explanation of reference numerals in the attached drawings: 1. Mounting component; 11. Mounting bracket; 12. Slider; 13. Lifting cylinder; 14. Mounting plate; 15. Motor; 16. Output shaft; 17. Connecting rod; 18. Sleeve rod;
[0027] 2. Component placement; 21. Placement slot; 22. Pneumatic clamp; 23. Placement platform;
[0028] 3. Cleaning components; 31. Liquid storage tank; 32. Liquid storage pipe; 33. Liquid inlet pipe; 34. Spray nozzle. Detailed Implementation
[0029] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0030] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0031] Please see Figure 1-4 The present invention provides the following technical solution:
[0032] Example 1, see Figure 1 A pretreatment apparatus for the fabrication of high-density multilayer circuit boards includes a mounting assembly 1, a cleaning assembly 3 disposed on one side of the mounting assembly 1, and a placement assembly 2 disposed below the mounting assembly 1.
[0033] See Figures 1-3 The mounting assembly 1 includes two sets of mounting brackets 11. A set of sliding grooves is opened through the side walls of the two sets of mounting brackets 11. A set of sliders 12 is arranged inside the two sets of sliding grooves. A set of lifting cylinders 13 is arranged on the top of the two sets of mounting brackets 11. The output ends of the two sets of lifting cylinders 13 are connected to the two sets of sliders 12 respectively.
[0034] See Figures 1-3 The placement component 2 includes a placement slot 21, and a placement platform 23 is provided inside the placement slot 21. Two sets of pneumatic clamps 22 for fixing multilayer circuit boards are symmetrically arranged on the top of the placement platform 23.
[0035] See Figures 1-3 The cleaning assembly 3 includes a liquid storage tank 31, with an inlet pipe 33 connected to the top of the liquid storage tank 31, a liquid storage pipe 32 connected to the end of the inlet pipe 33 away from the liquid storage tank 31, and a spray head 34 for spraying cleaning liquid connected to the bottom of the liquid storage pipe 32.
[0036] When cleaning a multi-layer circuit board, the circuit board is first placed on top of the placement platform 23, and then the pneumatic clamp 22 is activated to fix the circuit board. Then the cleaning fluid is sprayed onto the surface of the circuit board from the spray nozzle 34 to clean the circuit board.
[0037] See Figures 1-3 A mounting plate 14 is provided in the middle of the two sets of mounting brackets 11. The mounting plate 14 is shaped like an inverted U. A set of connecting rods 17 is provided on each side of the mounting plate 14.
[0038] See Figures 1-3 Two sets of connecting rods 17 are fixedly connected to the mounting plate 14, and the ends of the two sets of connecting rods 17 away from the mounting plate 14 are respectively connected to two sets of sliders 12.
[0039] See Figures 1-3 A motor 15 is provided on one side of the mounting plate 14, and the motor 15 is installed below one of the connecting rods 17.
[0040] See Figures 1-3 The liquid storage tube 32 is located below the mounting plate 14. One end of the liquid storage tube 32 is provided with an output shaft 16. One end of the output shaft 16 is connected to the liquid storage tube 32, and the other end of the output shaft 16 is connected to the output end of the motor 15.
[0041] See Figures 1-3 A sleeve rod 18 is provided at one end of the liquid storage tube 32 away from the output shaft 16. One end of the sleeve rod 18 is connected to the liquid storage tube 32, and the other end of the sleeve rod 18 is rotatably connected to the mounting plate 14. The liquid inlet tube 33 passes through the inside of the sleeve rod 18 and is connected to the liquid storage tube 32.
[0042] The installation of the mounting plate 14 provides space for the installation design of the entire device and improves the stability of the relative positions of the components.
[0043] The specific angle adjustment process is as follows:
[0044] When the motor 15 is started, the output shaft 16 rotates along with the motor 15. Since the sleeve rod 18 is rotatably connected to the mounting plate 14, the angle of the liquid storage tube 32 is adjusted under the drive of the output shaft 16 and the sleeve rod 18, thereby adjusting the angle of the spray head 34 and expanding the spraying range of the cleaning fluid.
[0045] By changing the tilt angle of the spray head 34, the cleaning fluid can enter the through hole at an angle, flushing out contaminants that are difficult to reach in the traditional vertical direction.
[0046] The specific process for adjusting up and down is as follows:
[0047] Two sets of lifting cylinders 13 are activated, and each set of lifting cylinders 13 drives its connected slider 12 to move along the slide groove opened in the mounting frame 11. Since the two sets of sliders 12 are connected to the two sets of connecting rods 17, and the two sets of connecting rods 17 are connected to the mounting plate 14, the mounting plate 14 slides along with the sliders 12. The liquid storage pipe 32, the liquid inlet pipe 33, and the spray head 34 are connected to the mounting plate 14 through the output shaft 16 and the sleeve rod 18. The spray head 34 can slide on the basis of the sliding of the mounting plate 14.
[0048] By adjusting the vertical distance between the spray head 34 and the surface of the multi-layer circuit board, the intensity of the cleaning fluid can be controlled. For example, when close to the multi-layer circuit board, the impact of the high-pressure spray is stronger, which is suitable for stubborn stains; when far away, the coverage area can be expanded to avoid damaging the multi-layer circuit board. The up and down position can be adjusted by setting two sets of lifting cylinders 13, so that the adjustment position is more accurate and the more adjustment positions are available, the wider the range of cleaning intensity adjustment.
[0049] The inlet pipe 33 is a flexible tube. When the angle is adjusted, the inlet pipe 33 can be adjusted accordingly. Similarly, when the downward adjustment is achieved, the inlet pipe 33 can also be adjusted accordingly.
[0050] Drill chips are easily left on the inner wall of the through holes of multi-layer boards. By adjusting the angle, the spray head 34 is injected into the through hole from the upper angle. The cleaning fluid can form a spiral flow in the hole. Then, combined with the up and down adjustment, the deposits on the hole wall can be effectively removed, the cleaning efficiency can be improved, and the blind spots of hole wall cleaning can be reduced.
[0051] See Figure 4 Two sets of pneumatic clamps 22 are positioned below the spray head 34, and the two sets of pneumatic clamps 22 are positioned diagonally along the placement platform 23.
[0052] The two sets of pneumatic clamps 22 are used to press and fix multi-layer circuit boards. The pressure head surface of the pneumatic clamps 22 is covered with soft cushioning material to disperse pressure and prevent scratching the board surface. At the same time, the end face of the pressure head is set as a flat surface with rounded corners to avoid the right-angle edge cutting into the multi-layer circuit board and reduce damage to the multi-layer circuit board.
[0053] Specifically, when cleaning a multi-layer circuit board, the circuit board is first placed on top of the placement platform 23, and then the pneumatic clamp 22 is activated to press and fix the circuit board. Then, the cleaning fluid is sprayed onto the surface of the circuit board by the spray head 34. The spray head 34 can be adjusted up and down and angle while spraying the cleaning fluid to achieve a comprehensive and uniform cleaning of the circuit board.
[0054] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
Claims
1. A pretreatment apparatus for fabricating high-density multilayer circuit boards, characterized in that: It includes an installation component (1), a cleaning component (3) is provided on one side of the installation component (1), and a placement component (2) is provided below the installation component (1). The mounting assembly (1) includes two sets of mounting brackets (11). A set of sliding grooves is provided through the side walls of the two sets of mounting brackets (11). A set of sliders (12) is provided inside the two sets of sliding grooves. A set of lifting cylinders (13) is provided on the top of the two sets of mounting brackets (11). The output ends of the two sets of lifting cylinders (13) are connected to the two sets of sliders (12). The placement component (2) includes a placement slot (21), and a placement platform (23) is provided inside the placement slot (21). Two sets of pneumatic clamps (22) for fixing multilayer circuit boards are symmetrically arranged on the top of the placement platform (23). The cleaning assembly (3) includes a liquid storage tank (31), the top of which is connected to an inlet pipe (33), the end of the inlet pipe (33) away from the liquid storage tank (31) is connected to a liquid storage pipe (32), and the bottom of the liquid storage pipe (32) is connected to a spray head (34) for spraying cleaning liquid.
2. The pretreatment apparatus for fabricating high-density multilayer circuit boards according to claim 1, characterized in that: A mounting plate (14) is provided in the middle of the two sets of mounting brackets (11). The mounting plate (14) is shaped like an inverted U. A set of connecting rods (17) is provided on each side of the mounting plate (14).
3. The pretreatment apparatus for fabricating high-density multilayer circuit boards according to claim 2, characterized in that: The two sets of connecting rods (17) are fixedly connected to the mounting plate (14) respectively, and the ends of the two sets of connecting rods (17) away from the mounting plate (14) are respectively connected to the two sets of sliders (12).
4. The pretreatment apparatus for fabricating high-density multilayer circuit boards according to claim 3, characterized in that: A motor (15) is provided on one side of the mounting plate (14), and the motor (15) is installed below one of the connecting rods (17).
5. The pretreatment apparatus for fabricating high-density multilayer circuit boards according to claim 4, characterized in that: The liquid storage tube (32) is located below the mounting plate (14). One end of the liquid storage tube (32) is provided with an output shaft (16). One end of the output shaft (16) is connected to the liquid storage tube (32), and the other end of the output shaft (16) is connected to the output end of the motor (15).
6. The pretreatment apparatus for fabricating high-density multilayer circuit boards according to claim 5, characterized in that: The liquid storage tube (32) is provided with a sleeve (18) at one end away from the output shaft (16). One end of the sleeve (18) is connected to the liquid storage tube (32), and the other end of the sleeve (18) is rotatably connected to the mounting plate (14). The liquid inlet tube (33) passes through the inside of the sleeve (18) and is connected to the liquid storage tube (32).
7. The pretreatment apparatus for fabricating high-density multilayer circuit boards according to claim 1, characterized in that: The two sets of pneumatic clamps (22) are positioned below the spray head (34), and the two sets of pneumatic clamps (22) are positioned diagonally along the placement platform (23).