Coolant supply device and liquid cooling system

Abstract

This application relates to the field of liquid cooling technology, and discloses a coolant supply device and a liquid cooling system. The device is used to supply coolant to a server in a liquid-cooled cabinet, and includes an inlet channel, a first distribution channel, a second distribution channel, and a heat dissipation unit. The inlet channel has a first inlet for coolant to flow in, and the inlet channel is connected to the first and second distribution channels via the first and second distribution ports, respectively. The first distribution channel has a first outlet for coolant to flow out and into the server. The heat dissipation unit includes a housing, a fixing part, and heat-conducting fins. The heat dissipation unit is fixed to the server via the fixing part, and the heat-conducting fins are used to contact the target heat-generating devices in the server. The second distribution channel has a second outlet, and the housing has a second inlet and a third outlet at both ends along the fin extension direction of the heat-conducting fins, respectively. This application can prevent localized overheating of the server when dissipating heat.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, specifically to a coolant supply device and a liquid cooling system. Background Technology

[0002] Common liquid cooling methods include cold plate cooling, spray cooling, and immersion cooling. Among these, immersion liquid cooling has high heat transfer efficiency and is currently the superior solution for reducing energy consumption. By placing the server requiring heat dissipation in an immersion liquid cooling system, the coolant flowing through the server absorbs the heat generated by the server, thus achieving heat dissipation. Compared to phase change immersion liquid cooling, single-phase immersion liquid cooling has better material compatibility and fewer potential risks of contaminants during circulation; therefore, single-phase immersion liquid cooling is widely used.

[0003] Single-phase immersion liquid cooling removes heat by directly exposing the coolant to the heat-generating components in the server. The coolant typically flows from the bottom of the liquid-cooled cabinet to these components to dissipate heat. A flow equalizer is usually installed at the bottom of the cabinet to distribute the coolant from the Coolant Distribution Unit (CDU) to each server within the cabinet. While existing flow equalizers can distribute coolant to the servers, the uniform flow rate of coolant to each server, coupled with the varying heat generated by different heat-generating components, can lead to ineffective and timely cooling of higher-heat-generating components, resulting in localized overheating within the server. Utility Model Content

[0004] In view of the above problems, this application provides a coolant supply device and a liquid cooling system to solve the problem in the prior art that the heat generated by the server in the liquid-cooled cabinet cannot be dissipated in time.

[0005] According to one aspect of the embodiments of this application, a coolant supply device is provided for supplying coolant to a server in a liquid-cooled cabinet. The coolant supply device includes an inlet channel, a first distribution channel, a second distribution channel, and a heat dissipation unit. The inlet channel has a first inlet for coolant to flow into it, and the inlet channel is connected to the first distribution channel and the second distribution channel respectively through the first and second distribution ports along its flow direction. The first distribution channel has a first outlet for coolant flowing through the first distribution channel to flow out from the first outlet and flow to the server. The server; the heat dissipation unit includes a housing, a fixing part disposed on the housing, and heat-conducting fins fixed inside the housing. The heat dissipation unit is used to fix the server to the server through the fixing part. When the heat dissipation unit is fixed to the server, the target heat-generating device in the server is in contact with the heat-conducting fins. The second liquid distribution channel has a second liquid outlet, and the housing has a second liquid inlet and a third liquid outlet. The second liquid inlet and the third liquid outlet are respectively located at both ends of the housing along the fin extension direction of the heat-conducting fins. The second liquid inlet and the second liquid outlet are connected.

[0006] In one alternative embodiment, the outer casing includes a first casing and a second casing that are connected to each other; the first casing is funnel-shaped, the second liquid inlet is located at the small end of the first casing, the large end of the first casing is connected to the first end of the second casing; the heat-conducting fins are fixed inside the second casing, and the cross-sectional area of ​​the large end of the first casing matches the cross-sectional area of ​​the heat-conducting fins; the third liquid outlet is located at the second end of the second casing.

[0007] In one alternative embodiment, the coolant supply device includes a plurality of heat dissipation units, each corresponding to a plurality of target heat-generating devices in the server; the coolant flowing through the second distribution channel flows out from the second outlet and then flows into the second inlet of each of the heat dissipation units.

[0008] In one alternative embodiment, the liquid-cooled cabinet includes multiple servers, and the coolant supply device includes multiple first liquid distribution channels, each corresponding to one of the multiple servers; the inlet channel is connected to the multiple first liquid distribution channels one by one through multiple first liquid outlets along its liquid flow direction.

[0009] In one alternative embodiment, the coolant supply device includes a plurality of heat dissipation units and a plurality of second liquid distribution channels, each corresponding to one of the plurality of servers; the inlet channel is connected to the plurality of second liquid distribution channels one by one through a plurality of second liquid distribution ports along its liquid flow direction.

[0010] In one alternative embodiment, the liquid inlet channel includes a main channel, a first sub-channel, and a second sub-channel. The main channel is connected to both the first sub-channel and the second sub-channel, and the first liquid inlet is located in the main channel. A plurality of first liquid outlets are located in the first sub-channel, and a plurality of second liquid outlets are located in the second sub-channel.

[0011] In an alternative embodiment, the bottom of the coolant supply device is further provided with a fixing member for securing the server.

[0012] In one alternative embodiment, the coolant supply device further includes a pressure sensor and a controller; the pressure sensor is disposed within the fixture and is used to detect the pressure value applied to the fixture; the controller is used to acquire the pressure value, and if the pressure value is greater than a pressure threshold, it controls the first inlet to be in an open state, and if the pressure value is less than or equal to the pressure threshold, it controls the first inlet to be in a closed state.

[0013] According to another aspect of the embodiments of this application, a liquid cooling system is provided, including a server and the aforementioned coolant supply device, the coolant supply device being used to supply coolant to the server.

[0014] In one alternative embodiment, the server has a fourth liquid outlet on its side wall, through which coolant flowing from the first liquid outlet and through the server, and coolant flowing from the second liquid outlet and through the heat dissipation unit and then from the third liquid outlet, exit the server.

[0015] In this embodiment, the coolant flowing into the coolant supply device is divided into two parts by setting two distribution channels. One part of the coolant flows through the server to dissipate heat, and the other part flows through the heat-conducting fins to dissipate heat from target heat-generating devices with high heat output. Both the coolant flowing through the server and the coolant flowing through the heat-conducting fins absorb heat generated by the target heat-generating devices. Compared to using only a flow equalizer to supply coolant to the server, the increased coolant flow through the heat-conducting fins increases the amount of coolant absorbing heat from the target heat-generating devices, thus providing timely heat dissipation for these devices and preventing localized overheating of the server. Furthermore, since this embodiment does not increase the overall coolant flow rate to the server, the amount of coolant used can be reduced compared to methods that increase the overall coolant flow rate to the server, thus avoiding unnecessary waste.

[0016] Furthermore, the surface area of ​​the heat-conducting fins can be set to be larger than the surface area of ​​the target heat-generating device. After the target heat-generating device conducts heat to the heat-conducting fins, the heat is dissipated through the coolant. Compared with the method of the coolant flowing directly through the target heat-generating device to absorb the heat of the target heat-generating device, the heat generated by the target heat-generating device can be absorbed more efficiently, thereby improving the efficiency of heat dissipation for the target heat-generating device.

[0017] The above description is merely an overview of the technical solutions of the embodiments of this application. In order to better understand the technical means of the embodiments of this application and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this application more obvious and understandable, specific implementation methods of this application are described below. Attached Figure Description

[0018] The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0019] Figure 1 A schematic diagram of the liquid cooling system provided in an embodiment of this application is shown;

[0020] Figure 2 This diagram illustrates the flow direction of coolant in a server within a liquid cooling system, as provided in an embodiment of this application.

[0021] Figure 3 A partial schematic diagram of the liquid cooling system provided in an embodiment of this application is shown;

[0022] Figure 4 A schematic diagram of the structure of a liquid cooling system provided in another embodiment of this application is shown.

[0023] The reference numerals in the detailed embodiments are as follows:

[0024] 1. Liquid cooling system;

[0025] 10. Coolant supply unit; 20. Server;

[0026] 11. Liquid inlet channel; 12. First liquid distribution channel; 13. Second liquid distribution channel; 14. Heat dissipation unit; 15. Three-way valve; 16. Fixing component; 17. Pressure sensor;

[0027] 111. First liquid inlet; 112. First liquid distributor; 113. Second liquid distributor; 114. Main flow channel; 115. First sub-flow channel; 116. Second sub-flow channel; 121. First liquid outlet; 131. Second liquid outlet; 141. Outer shell; 142. Fixing part; 143. Heat-conducting fins; 1411. Second liquid inlet; 1412. Third liquid outlet; 1413. First shell; 1414. Second shell; 21. Fourth liquid outlet; 151. Inlet of three-way valve; 152. First outlet of three-way valve; 153. Second outlet of three-way valve. Detailed Implementation

[0028] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0030] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, representing any combination of the listed objects. For example, "A and / or B" can represent three possibilities: A exists, A and B exist simultaneously, or B exists. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0033] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0034] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0035] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0036] Typically, the flow equalization plate in a liquid-cooled server rack has outlet holes to distribute the coolant supplied by the CDU to each server placed in the rack. The flow rate of coolant flowing into the servers through these outlet holes is uniform. However, since the heat generated by different heat-generating components within a server varies, if the flow rate of coolant through the outlet holes is insufficient, the hottest components may not dissipate heat effectively, leading to localized overheating. Increasing the size of the outlet holes to increase the overall coolant flow would significantly increase coolant consumption, resulting in unnecessary waste.

[0037] Based on the above considerations, this application proposes a coolant supply device for supplying coolant to a server in a liquid-cooled cabinet. The device includes an inlet channel, a first distribution channel, a second distribution channel, and a heat dissipation unit. The inlet channel has a first inlet for coolant to flow into it. The inlet channel is connected to the first and second distribution channels via the first and second distribution ports, respectively. The first distribution channel has a first outlet for coolant to flow out and onto the server, thereby dissipating heat from the server. The heat dissipation unit includes a housing and heat-conducting fins. The heat dissipation unit is fixed to the server so that the heat-conducting fins are in contact with the target heat-generating device in the server. The second distribution channel has a second outlet, and the housing of the heat dissipation unit has a second inlet and a third outlet, allowing coolant flowing through the second distribution channel to flow out from the second outlet and into the heat dissipation unit from the second inlet, and then out from the third outlet after passing through the heat dissipation unit, thereby dissipating heat from the target heat-generating device. In this application, a heat dissipation unit is set up to dissipate heat from the target heat-generating device with a large amount of heat, thereby avoiding local overheating of the server. Furthermore, since this application does not increase the overall flow rate of coolant to the server, it avoids unnecessary waste.

[0038] Figure 1 A schematic diagram of the liquid cooling system provided in an embodiment of this application is shown. Figure 1 As shown, the liquid cooling system 1 includes a coolant supply device 10 and a server 20. The coolant supply device 10 includes an inlet channel 11, a first distribution channel 12, a second distribution channel 13, and a heat dissipation unit 14. The inlet channel 11 has a first inlet port 111 for coolant to flow into it. The solid arrow in the figure indicates the flow direction of the coolant inlet channel 11. The inlet channel 11 connects to the first distribution channel 12 and the second distribution channel 13 along its flow direction via the first distribution port 112 and the second distribution port 113, respectively. Therefore, after the coolant flows into the inlet channel 11 from the first inlet port 111, it is divided by the first distribution port 112 and the second distribution port 113, with a portion flowing into the first distribution channel 12 and the other portion flowing into the second distribution channel 13. The first distribution channel 12 has a first outlet 121, through which the coolant flowing through the first distribution channel 12 flows out from the first outlet 121 and into the server 20, thereby dissipating heat from the server. The dashed arrow in the figure indicates the direction of the coolant flowing out from the first outlet 121 and into the server 20.

[0039] The heat dissipation unit 14 includes a housing 141, a fixing part 142, and heat-conducting fins 143. The fixing part 142 is disposed on the housing 141 and can be a fixing plate with fixing holes. The heat-conducting fins 143 are fixed inside the housing 141. The heat dissipation unit 14 is fixed to the server 20 via the fixing part 142. When the heat dissipation unit 14 is fixed to the server 20, the target heat-generating device (not shown in the figure) in the server is in contact with the heat-conducting fins 143, so that the target heat-generating device conducts the heat generated during its operation to the heat-conducting fins 143. The target heat-generating device is a component in the server that generates a large amount of heat when in operation, such as the central processing unit (CPU) in the server.

[0040] The second liquid distribution channel 13 has a second liquid outlet 131, and the outer casing 141 has a second liquid inlet 1411 and a third liquid outlet 1412. The second liquid inlet 1411 and the third liquid outlet 1412 are located at the two ends of the outer casing 141 along the fin extension direction of the heat-conducting fins 143. The second liquid inlet 1411 is connected to the second liquid outlet 131 so that the coolant flowing through the second liquid distribution channel 13 flows out from the second liquid outlet 131 and flows to the second liquid inlet 1411 in the heat dissipation unit 14. After flowing through the heat dissipation unit 14, it flows out from the third liquid outlet 1412.

[0041] Figure 2 This diagram illustrates the flow direction of coolant in a server within a liquid cooling system, as provided in an embodiment of this application. Figure 2 As shown, the coolant flowing from the first outlet 121 flows to various locations of the server 20, absorbing the heat generated by the heat-generating devices located at different locations of the server 20 during operation, and then flows out of the server 20 from the fourth outlet 21. The coolant flowing from the second outlet 131 flows into the heat dissipation unit 14 from the second inlet 1411, flows through the heat-conducting fins 143, flows out of the heat dissipation unit 14 from the third outlet 1412, and finally flows out of the server 20 from the fourth outlet 21.

[0042] In this embodiment, the coolant flowing into the coolant supply device 10 is divided into two parts by setting two liquid distribution channels. One part of the coolant flows through the server 20 to dissipate heat from the server 20, and the other part flows through the heat-conducting fins 143 to dissipate heat from the target heat-generating devices that generate a large amount of heat. Both the coolant flowing through the server 20 and the coolant flowing through the heat-conducting fins 143 absorb the heat generated by the target heat-generating devices. Compared to the method of supplying coolant to the server using only a flow equalizer, the increased amount of coolant flowing through the heat-conducting fins 143 increases the amount of coolant absorbing the heat generated by the target heat-generating devices, thereby providing timely heat dissipation for the target heat-generating devices that generate a large amount of heat and preventing localized overheating of the server. Furthermore, since this embodiment does not increase the overall coolant flow rate to the server, compared to the method of increasing the overall coolant flow rate to the server, the amount of coolant used can be reduced, thus avoiding unnecessary waste.

[0043] Furthermore, the surface area of ​​the heat-conducting fin 143 can be set to be larger than the surface area of ​​the target heat-generating device. After the target heat-generating device conducts heat to the heat-conducting fin 143, the heat is dissipated by the coolant. Compared with the method of the coolant flowing directly through the target heat-generating device to absorb the heat of the target heat-generating device, the heat generated by the target heat-generating device can be absorbed more efficiently, thereby improving the efficiency of heat dissipation for the target heat-generating device.

[0044] To further increase the heat dissipation efficiency of the target heat-generating device, in the embodiments of this application, such as Figure 1 As shown, the outer casing 141 includes a first casing 1413 and a second casing 1414 that are connected to each other. The first casing 1413 is funnel-shaped, and a second liquid inlet 1411 is opened at the small end of the first casing 1413, while the large end of the first casing 1413 is connected to the first end of the second casing 1414. Heat-conducting fins 143 are fixed inside the second casing 1414, and the cross-sectional area of ​​the large end of the first casing 1413 matches the cross-sectional area of ​​the heat-conducting fins 143. For example, if the cross-sectional area of ​​the heat-conducting fins 143 is larger, the corresponding cross-sectional area of ​​the large end of the first casing 1413 is also larger. A third liquid outlet 1412 is opened at the second end of the second casing 1414, and the first and second ends of the second casing 1414 are opposite ends.

[0045] In this embodiment, the first housing 1413 is funnel-shaped so that the funnel-shaped cavity formed by the first housing 1413 can store the coolant flowing into the heat dissipation unit 14 from the second liquid inlet 1411. By matching the cross-sectional area of ​​the larger end of the first housing 1413 with the cross-sectional area of ​​the heat-conducting fins 143, the coolant flowing out from the larger end of the first housing 1413 can flow evenly to all positions of the heat-conducting fins 143, avoiding local overheating of the heat-conducting fins 143, thereby better dissipating heat from the heat-conducting fins 143 and improving the efficiency of heat dissipation for the target heat-generating device.

[0046] In some embodiments, a server has n target heat-generating devices with high heat output. The corresponding coolant supply device 10 includes n second distribution channels 13 and n heat dissipation units 14. The inlet channel 11 has n second distribution ports 113, which are connected to the n second distribution channels 13 through the n second distribution ports 113. The n second distribution channels 13 are connected to the n heat dissipation units 14, and the n heat dissipation units 14 are arranged one-to-one with the n target heat-generating devices in the server, so that the coolant flowing into the inlet channel 11 is distributed to the n heat dissipation units 14 to dissipate heat for the n target heat-generating devices. Here, n is a positive integer greater than 1.

[0047] Taking n=2 as an example, in some embodiments, in order to reduce the number of second liquid distribution channels 13 and improve the integration of the coolant supply device 10, the coolant supply device 10 includes a three-way valve. Figure 3 A partial schematic diagram of a liquid cooling system provided in an embodiment of this application is shown. Figure 3 As shown, the coolant supply device 10 in the liquid cooling system 1 also includes a three-way valve 15. The inlet 151 of the three-way valve is connected to the second outlet 131 of the second distribution channel 13, the first outlet 152 of the three-way valve is connected to the second inlet 1411 of one heat dissipation unit 14, and the second outlet 153 of the three-way valve is connected to the second inlet 1411 of another heat dissipation unit 14. The two outlets of the three-way valve 15 are respectively connected to the second inlets 1411 of the two heat dissipation units 14, so that the coolant flowing through the second distribution channel 13 flows out from the second outlet 131, then flows into the three-way valve 15 from the inlet 151, and then flows out from the two outlets of the three-way valve (the first outlet 152 and the second outlet 153 of the three-way valve, respectively) and flows into the two heat dissipation units 14 from their respective second inlets 1411. It is understood that this application only uses an n=2 example for introduction. If n is a positive integer greater than 2, multiple three-way valves can be set accordingly and connected to each other, so as to reduce the number of second liquid distribution channels 13.

[0048] In some embodiments, the liquid cooling system 1 includes m servers. To dissipate heat from the m servers, the corresponding coolant supply device 10 includes m first distribution channels 12, each corresponding to one of the m servers 20. The inlet channel 11 is connected to each of the m first distribution channels 12 via m first distribution ports 112 along its flow direction, so that the coolant flowing into the inlet channel 11 is distributed to the m first distribution channels 12 to dissipate heat from the m servers 20. Here, m is a positive integer greater than 1.

[0049] In some embodiments, the liquid cooling system 1 includes m servers, and each server includes n target heat-generating devices. In order to dissipate heat for the m servers and dissipate heat for the n target heat-generating devices in each server in a timely and effective manner, the cooling liquid supply device 10 can be configured in accordance with the aforementioned related embodiments, and will not be repeated here.

[0050] Figure 4 A schematic diagram of a liquid cooling system according to another embodiment of this application is shown. Figure 4 The provided liquid cooling system and Figure 1 The provided liquid cooling systems are similar, the main difference is that Figure 4 In this embodiment, the liquid cooling system 1 includes five servers. The liquid inlet channel 11 includes a main channel 114, a first sub-channel 115, and a second sub-channel 116. The main channel 114 is connected to both the first sub-channel 115 and the second sub-channel 116, and a first liquid inlet 111 is located on the main channel 114. Five first liquid outlets 112 are all located on the first sub-channel 115, and five second liquid outlets 113 are all located on the second sub-channel 116. In this embodiment, the above configuration allows for better control of the flow rate of coolant flowing to the servers and the heat dissipation unit.

[0051] It is worth noting that in this embodiment, only five servers are included in the liquid cooling system 1 as an example. In some embodiments, the liquid cooling system 1 may include only one server or multiple servers. The number of servers is not limited here.

[0052] Please refer to Figure 3 In some embodiments, the bottom of the coolant supply device 10 is also provided with a fixing member 16, a pressure sensor 17 and a controller (not shown in the figure). The coolant supply device 10 fixes the server 20 through the fixing member 16 so that the coolant supply device 10 and the server 20 are relatively fixed in the liquid cooling system 1. Figure 3In this configuration, server 20 is fixed above fastener 16. To further facilitate the arrangement of server 20, in some embodiments, server 20 is provided with a mating part that cooperates with fastener 16. By connecting fastener 16 of coolant supply device 10 with the mating part in server 20, server 20 can be easily arranged inside coolant supply device 10.

[0053] Pressure sensor 17 is disposed within fixture 16. When server 20 is fixed to coolant supply device 10 via fixture 16, the pressure value detected by pressure sensor 17 within fixture 16 changes due to the pressure exerted on fixture 16 by server 20. Specifically, when server 20 is not fixed to coolant supply device 10, fixture 16 is not subjected to pressure from server 20, therefore the pressure value detected by pressure sensor 17 is zero. When server 20 is fixed to coolant supply device 10, fixture 16 is subjected to pressure from server 20, therefore the pressure value detected by pressure sensor 17 is greater than zero.

[0054] The controller determines whether the server 20 is currently fixed to the coolant supply device 10 by acquiring the pressure value detected by the pressure sensor 17, and then controls the state of the first inlet 111. Specifically, if the acquired pressure value is greater than the pressure threshold, it indicates that the server 20 is currently fixed to the coolant supply device 10. The controller then controls the first inlet 111 to be open, allowing coolant to flow from the first inlet 111 into the inlet channel 11, and then diverting it to the server 20 and the heat dissipation unit 14, thereby dissipating heat for the server 20 and the target heat-generating device. If the acquired pressure value is less than or equal to the pressure threshold, it indicates that the server 20 is not currently fixed to the coolant supply device 10, meaning that there is no need to dissipate heat for the server. The controller then controls the first inlet 111 to be closed, preventing coolant from flowing into the inlet channel 11, thereby avoiding coolant waste. The pressure threshold can be set as needed, for example, it can be set to a value greater than zero.

[0055] In some examples, the liquid cooling system 1 is also equipped with a cooling device. After the coolant flowing through the server 20 and the heat dissipation unit 14 absorbs heat, the temperature of the coolant rises. The heated coolant flows out from the fourth outlet 21 and into the cooling device, which cools the heated coolant. The cooled coolant then flows into the coolant supply device 10 from the first inlet 111, thereby realizing the recycling of the coolant. This cooling device can be a CDU or a chiller unit, or other cooling equipment.

[0056] During the coolant recycling process, the pump in the liquid cooling system 1 provides power to the coolant so that it can be recycled within the system. The pump is a variable frequency pump, and its speed is controlled by a programmable logic controller (PLC) in the liquid cooling system 1. The higher the pump speed, the faster the coolant flow rate, and the greater the power consumption of the liquid cooling system 1.

[0057] In this embodiment, by setting up a heat dissipation unit 14 to absorb the heat generated by the target heat-generating device, localized overheating of the server can be avoided. Compared to methods that significantly increase the pump speed to increase the flow rate of coolant through the flow equalization plate to the server for timely heat dissipation, this application does not require a significant increase in pump speed, thus avoiding a significant increase in the power consumption of the liquid cooling system 1, resulting in greater energy efficiency. Numerous specific details are set forth in the specification provided herein. However, it is understood that embodiments of this application can be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0058] Similarly, it should be understood that, in order to simplify this application and aid in understanding one or more of the various aspects of the invention, features of the embodiments of this application are sometimes grouped together in a single embodiment, figure, or description thereof in the above description of exemplary embodiments of this application. However, this method of disclosure should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim.

[0059] Those skilled in the art will understand that modules in the device of the embodiments can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiments can be combined into a single module, unit, or component, and can be divided into multiple sub-modules, sub-units, or sub-components. Except where at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or device so disclosed. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0060] It should be noted that the above embodiments are illustrative of this application and not limiting of it, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. This application can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A coolant supply device for supplying coolant to a server in a liquid-cooled rack, characterized in that, The coolant supply device includes an inlet channel, a first distribution channel, a second distribution channel, and a heat dissipation unit; The liquid inlet channel is provided with a first liquid inlet for coolant to flow in, and the liquid inlet channel is connected to the first liquid distribution channel and the second liquid distribution channel respectively through a first liquid distribution port and a second liquid distribution port along its liquid flow direction; The first liquid distribution channel is provided with a first liquid outlet so that the coolant flowing through the first liquid distribution channel can flow out from the first liquid outlet and flow to the server; The heat dissipation unit includes a housing, a fixing part disposed on the housing, and heat-conducting fins fixed inside the housing. The heat dissipation unit is used to be fixed to the server by the fixing part. When the heat dissipation unit is fixed to the server, the target heat-generating device in the server is in contact with the heat-conducting fins. The second liquid distribution channel has a second liquid outlet, and the outer shell has a second liquid inlet and a third liquid outlet. The second liquid inlet and the third liquid outlet are located at the two ends of the outer shell along the fin extension direction of the heat-conducting fins, and the second liquid inlet is connected to the second liquid outlet.

2. The coolant supply device according to claim 1, characterized in that, The outer casing includes a first casing and a second casing that are connected to each other; The first housing is funnel-shaped, the second liquid inlet is located at the small end of the first housing, and the large end of the first housing is connected to the first end of the second housing; The heat-conducting fins are fixed inside the second housing, and the cross-sectional area of ​​the large end of the first housing matches the cross-sectional area of ​​the heat-conducting fins. The third liquid outlet is opened at the second end of the second housing.

3. The coolant supply device according to claim 1, characterized in that, The coolant supply device includes a plurality of heat dissipation units, each configured to correspond one-to-one with a plurality of target heat-generating devices in the server. The coolant flowing through the second distribution channel flows out from the second outlet and then flows into the second inlet of each of the heat dissipation units.

4. The coolant supply device according to claim 1, characterized in that, The liquid-cooled cabinet includes multiple servers, and the coolant supply device includes multiple first liquid distribution channels, each corresponding to one of the multiple servers. The inlet channel is connected to multiple first distribution channels one by one through multiple first distribution ports along its liquid flow direction.

5. The coolant supply device according to claim 4, characterized in that, The coolant supply device includes multiple heat dissipation units and multiple second liquid distribution channels, which are respectively configured to correspond one-to-one with multiple servers; The inlet channel is connected to multiple second distribution channels one by one through multiple second distribution ports along its liquid flow direction.

6. The coolant supply device according to claim 5, characterized in that, The liquid inlet channel includes a main channel, a first sub-channel, and a second sub-channel. The main channel is connected to the first sub-channel and the second sub-channel, respectively, and the first liquid inlet is located in the main channel. Multiple first liquid outlets are opened in the first sub-flow channel, and multiple second liquid outlets are opened in the second sub-flow channel.

7. The coolant supply device according to claim 1, characterized in that, The bottom of the coolant supply device is also provided with a fixing component, which is used to fix the server.

8. The coolant supply device according to claim 7, characterized in that, The coolant supply device also includes a pressure sensor and a controller; The pressure sensor is disposed inside the fastener and is used to detect the pressure value applied to the fastener; The controller is used to acquire the pressure value. If the pressure value is greater than the pressure threshold, the controller controls the first liquid inlet to be in an open state. If the pressure value is less than or equal to the pressure threshold, the controller controls the first liquid inlet to be in a closed state.

9. A liquid cooling system, characterized in that, It includes a server and a coolant supply device as described in any one of claims 1 to 8, the coolant supply device being used to supply coolant to the server.

10. The liquid cooling system according to claim 9, characterized in that, The server has a fourth liquid outlet on its side wall, so that the coolant flowing out from the first liquid outlet and through the server, and the coolant flowing out from the second liquid outlet and through the heat dissipation unit and then from the third liquid outlet, can flow out of the server from the fourth liquid outlet.

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