A heat dissipation assembly and electronic device

Abstract

The utility model discloses a heat dissipation assembly and electronic equipment for solving the technical problem of poor heat dissipation effect of the existing heat dissipation assembly. The heat dissipation assembly of the utility model is arranged on the mainboard in the electronic equipment and is used for dissipating heat of the first heating element and the second heating element on the mainboard, comprising the fan module connected on the mainboard and the heat conduction module used in cooperation with the fan module, the second heating element, the first heating element and the fan module are arranged in the first direction in proper order, the fan module has the first air outlet, and the first air outlet is arranged towards the first heating element, one end of the heat conduction module away from the fan module is used for sticking the first heating element and the second heating element, wherein the bottom surface of the heat conduction module corresponding to the first heating element is provided with the first heat dissipation fin group, and the first heat dissipation fin group is formed with the first air duct for guiding airflow to flow towards the direction of the second heating element.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation component and electronic device. Background Technology

[0002] The future trend of electronic devices is towards internal cooling technology. Internal cooling technology specifically refers to the use of fan modules and related heat conduction modules inside electronic devices. The fan modules drive airflow from inside the electronic device to the outside, thereby achieving the purpose of cooling the internal components of the electronic device.

[0003] Taking a laptop as an example, a laptop contains multiple heat-generating components, such as the first heat-generating component (GPU chip) and the second heat-generating component (CPU chip). Internal cooling technology can effectively solve the problem of excessively high laptop casing temperature. However, since the airflow is not directed towards the first and second heat-generating components, the amount of airflow received by these components will undoubtedly be reduced. This prevents the heat generated by these components from being effectively dissipated, causing them to operate at a high temperature, which seriously affects their normal operation and lifespan.

[0004] To address the aforementioned issues, existing technologies design fan modules with at least two air outlets. One outlet primarily faces the second end of the heat-conducting module, while the other primarily faces the first end. The first end is attached to both the first and second heating elements to accelerate heat dissipation. Due to the trend towards thinner and lighter laptops, the first and second heating elements are often positioned adjacent to each other. When the fan module blows air through the outlets towards the first and second heating elements, a portion of the heat-conducting module near the outlet obstructs the airflow towards the second heating element, causing its temperature to remain high and severely impacting its operational status.

[0005] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Utility Model Content

[0006] This utility model discloses a heat dissipation component and electronic device to solve the technical problem of poor heat dissipation effect of existing heat dissipation components.

[0007] This utility model provides a heat dissipation component, which is disposed on the motherboard in an electronic device and is used to dissipate heat from a first heat-generating element and a second heat-generating element on the motherboard. It includes: a fan module connected to the motherboard and a heat-conducting module used in conjunction with the fan module. The second heat-generating element, the first heat-generating element and the fan module are arranged sequentially in a first direction.

[0008] The fan module has a first air outlet port, which is positioned toward the first heating element. The end of the heat-conducting module away from the fan module is used to attach to the first heating element and the second heating element. The bottom surface of the heat-conducting module corresponding to the first heating element is provided with a first heat dissipation fin group, and a first air duct is formed in the first heat dissipation fin group to guide airflow toward the direction of the second heating element.

[0009] Optionally, the first heat dissipation fin group includes a plurality of first heat dissipation fins arranged in sequence, and a first air duct is formed between two adjacent first heat dissipation fins to guide airflow toward the direction of the second heat-generating element.

[0010] The air inlet of the first air duct is positioned facing the first air outlet, and the air outlet of the first air duct is positioned facing the direction of the second heating element.

[0011] Optionally, the first heat dissipation fins form a preset tilt angle with the first direction;

[0012] The preset tilt angle is greater than 10°.

[0013] Optionally, the distance between two adjacent first heat dissipation fins is greater than 1.2 mm;

[0014] The height of the first heat dissipation fin ranges from 2mm to 2.5mm;

[0015] The thickness of the first heat dissipation fin ranges from 0.1mm to 0.2mm.

[0016] Optionally, the first heat dissipation fin has multiple through holes.

[0017] Optionally, the fan module also has a second air outlet port;

[0018] The air outlet direction of the second air outlet port intersects with the air outlet direction of the first air outlet port.

[0019] Optionally, the heat-conducting module includes a heat pipe and a heat-conducting substrate;

[0020] The first end of the heat pipe is connected to the heat-conducting substrate, the heat-conducting substrate is used to attach the first heating element and the second heating element, and the first heat dissipation fin group is provided on the bottom surface of the heat-conducting substrate corresponding to the first heating element.

[0021] The second end of the heat pipe is connected to a second heat dissipation fin assembly, which is installed at the second air outlet port.

[0022] Optionally, the second heat dissipation fin group includes a plurality of second heat dissipation fins arranged in sequence, a second air duct is formed between two adjacent second heat dissipation fins, the air inlet of the second air duct is connected to the second air outlet, and the air outlet of the second air duct is disposed facing the outside of the motherboard.

[0023] Optionally, there are multiple heat pipes, with the first ends of the multiple heat pipes connected together to the heat-conducting substrate, and the second ends of the multiple heat pipes connected together to the second heat dissipation fin group.

[0024] This utility model discloses an electronic device, including a motherboard, a first heating element, a second heating element, and a heat dissipation assembly;

[0025] The first heating element, the second heating element, and the heat dissipation assembly are all connected to the motherboard;

[0026] The heat dissipation component includes a fan module connected to the motherboard and a heat-conducting module used in conjunction with the fan module;

[0027] The second heating element, the first heating element, and the fan module are arranged sequentially in the first direction;

[0028] The fan module has a first air outlet port, which is positioned toward the first heating element. The end of the heat-conducting module away from the fan module is attached to the first heating element and the second heating element. The bottom surface of the heat-conducting module corresponding to the first heating element is provided with a first heat dissipation fin group, and a first air duct is formed in the first heat dissipation fin group to guide airflow toward the direction of the second heating element.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] The second heating element, the first heating element, and the fan module in the heat dissipation assembly of this embodiment are arranged sequentially along a first direction. The end of the heat-conducting module away from the fan module is attached to the first heating element and the second heating element. A first heat dissipation fin group is provided on the bottom surface of the heat-conducting module corresponding to the first heating element. A first air duct is formed within the first heat dissipation fin group to guide airflow towards the direction of the second heating element. In this design, the airflow from the fan module through the first air outlet blows towards the portion of the heat-conducting module corresponding to the first heating element, and simultaneously flows through the first air duct within the first heat dissipation fin group towards the direction of the second heating element, thus flowing towards the portion of the heat-conducting module corresponding to the second heating element. This design effectively ensures that multiple heating elements receive effective heat dissipation, greatly improving the overall heat dissipation effect of the heat dissipation assembly. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic diagram of a heat dissipation component provided by this utility model;

[0033] Figure 2 An exploded view of the structure of a heat dissipation component provided by this utility model;

[0034] Figure 3 A top view of the structure of a heat dissipation component provided by this utility model;

[0035] Figure 4 A schematic diagram of the structure of a heat dissipation component, including a heat-conducting module and a first heat dissipation fin group, provided by this utility model;

[0036] Figure 5 A schematic diagram showing the inclined angle formed between the first heat dissipation fin and the first direction of a heat dissipation component provided by this utility model;

[0037] Figure 6 An enlarged view of the structure of the first heat dissipation fin group of a heat dissipation component provided by this utility model;

[0038] Figure 7 A schematic diagram of the structure of the second heat dissipation fin assembly of a heat dissipation component provided by this utility model;

[0039] Illustration: Mainboard 1; Fan module 2; Thermal module 3; Heat pipe 301; Thermal substrate 302; First heat sink fin group 4; First air duct 401; First heat sink fin 402; Second heat sink fin group 5; Second air duct 501; Second heat sink fin 502; First heating element 6; Second heating element 7; First air outlet port 8; Second air outlet port 9; Inclination angle a; Distance d between two adjacent first heat sink fins; Height h of the first heat sink fin; Thickness s of the first heat sink fin; First direction X. Detailed Implementation

[0040] This utility model discloses a heat dissipation component and electronic device to solve the technical problem of poor heat dissipation effect of existing heat dissipation components.

[0041] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Please see Figures 1 to 7 The present invention provides a heat dissipation component, which is disposed on a motherboard 1 in an electronic device and is used to dissipate heat from a first heat-generating element 6 and a second heat-generating element 7 on the motherboard 1. The component is characterized by comprising: a fan module 2 connected to the motherboard 1 and a heat-conducting module 3 used in conjunction with the fan module 2, wherein the second heat-generating element 7, the first heat-generating element 6 and the fan module 2 are arranged sequentially in a first direction.

[0043] The fan module 2 has a first air outlet port 8, which is disposed toward the first heating element 6. The end of the heat-conducting module 3 away from the fan module 2 is used to attach to the first heating element 6 and the second heating element 7. The bottom surface of the heat-conducting module 3 corresponding to the first heating element 6 is provided with a first heat dissipation fin group 4. A first air duct 401 is formed in the first heat dissipation fin group 4 to guide the airflow toward the direction of the second heating element 7.

[0044] It should be noted that the first direction mentioned above can be the length direction of the motherboard 1, wherein the second heating element 7, the first heating element 6 and the fan module 2 are arranged sequentially along the length direction. In this embodiment, the first heating element 6 is located between the first air outlet port 8 of the fan module 2 and the second heating element 7, and the first heating element 6 and the second heating element 7 are arranged adjacent to each other.

[0045] In addition, in this embodiment, the first heat dissipation fin group 4 is located between the heat conduction module 3 and the first heating element 6, and the first heat dissipation fin group 4 is attached to the first heating element 6.

[0046] The second heating element 7, the first heating element 6, and the fan module 2 in the heat dissipation assembly of this embodiment are arranged sequentially along a first direction. The end of the heat-conducting module 3 away from the fan module 2 is attached to the first heating element 6 and the second heating element 7. A first heat dissipation fin group 4 is provided on the bottom surface of the heat-conducting module 3 corresponding to the first heating element 6. A first air duct 401 is formed within the first heat dissipation fin group 4 to guide airflow towards the direction of the second heating element 7. In this design, while the airflow from the fan module 2 through the first air outlet 8 blows towards the portion of the heat-conducting module 3 corresponding to the first heating element 6, it also flows towards the second heating element 7 through the first air duct 401 within the first heat dissipation fin group 4. This design effectively ensures that multiple heating elements can receive effective heat dissipation, greatly improving the overall heat dissipation effect of the heat dissipation assembly.

[0047] Furthermore, in this embodiment, the first heat dissipation fin group 4 includes a plurality of first heat dissipation fins 402 arranged in sequence, and a first air duct 401 for guiding airflow toward the direction of the second heat-generating element 7 is formed between two adjacent first heat dissipation fins 402.

[0048] The air inlet of the first air duct 401 is positioned facing the first air outlet 8, and the air outlet of the first air duct 401 is positioned facing the direction of the second heating element 7.

[0049] It should be noted that a portion of the airflow blown out from the first air outlet 8 of the fan module 2 first blows towards the first heating element 6 and the corresponding portion of the heat-conducting module 3. At the same time, another portion of the airflow enters the first air duct 401 from the air inlet. After being guided by the first air duct 401, this portion of the airflow flows from the air outlet of the first air duct 401 to the second heating element 7 and the corresponding portion of the heat-conducting module 3, thereby effectively dissipating heat from the second heating element 7 and improving the heat dissipation effect of the heat dissipation component.

[0050] Furthermore, in this embodiment, the first heat dissipation fin 402 forms a preset tilt angle with the first direction;

[0051] The preset tilt angle is greater than 10°.

[0052] It should be noted that the aforementioned tilt angle is mainly matched to the air outlet angle of the first air outlet port 8, and this embodiment does not limit the size of the preset angle. Preferably, the tilt angle is 20° or 15°. This design ensures that the airflow can flow from the surface of the heat dissipation fins to the maximum extent, thereby guaranteeing the heat dissipation effect.

[0053] Furthermore, in this embodiment, the distance between two adjacent first heat dissipation fins 402 is greater than 1.2mm. The distance can be selected as 1.3mm, 1.4mm, etc., and this embodiment does not limit it.

[0054] The thickness of the first heat dissipation fin 402 ranges from 0.1mm to 0.2mm. The thickness can be selected as 0.1mm, 0.15mm, etc., and this embodiment does not limit it.

[0055] It should be noted that the above design can reduce the flow resistance of airflow through the first heat dissipation fin group 4.

[0056] In addition, the height of the first heat dissipation fin 402 in this embodiment is in the range of 2mm to 2.5mm. The height of the first heat dissipation fin 402 can be selected as 2mm, 2.1mm, 2.5mm, etc., and this embodiment does not limit it.

[0057] It should be noted that, through the above design, while ensuring heat dissipation effect, controlling the height of the first heat dissipation fin 402 within the above range can meet the requirements of the thin and light design of electronic devices.

[0058] Furthermore, to reduce flow resistance and the weight of the heat dissipation components, multiple through holes may be provided on the first heat dissipation fin 402.

[0059] Furthermore, the fan module 2 in this embodiment also has a second air outlet port 9;

[0060] The air outlet direction of the second air outlet port 9 intersects with the air outlet direction of the first air outlet port 8.

[0061] It should be noted that in this embodiment, the air outlet direction of the first air outlet port 8 is perpendicular to the air outlet direction of the second air outlet port 9.

[0062] Furthermore, the heat-conducting module 3 in this embodiment includes a heat pipe 301 and a heat-conducting substrate 302;

[0063] The first end of the heat pipe 301 is connected to the heat-conducting substrate 302. The heat-conducting substrate 302 is used to attach the first heating element 6 and the second heating element 7. The first heat dissipation fin group 4 is provided on the bottom surface of the heat-conducting substrate 302 corresponding to the first heating element 6.

[0064] The second end of the heat pipe 301 is connected to a second heat dissipation fin group 5, which is installed at the second air outlet port 9.

[0065] It should be noted that in this embodiment, the heat-conducting substrate 302 connected to the first end is attached to the first heating element 6 and the second heating element 7. When airflow blows towards the heat-conducting substrate 302, part of the airflow blows towards the first heating element 6 and the corresponding part of the heat-conducting substrate 302. At the same time, another part of the airflow enters the first air duct 401 from the air inlet. After being guided by the first air duct 401, this part of the airflow flows from the air outlet of the first air duct 401 to the second heating element 7 and the corresponding part of the heat-conducting substrate 302, thereby effectively dissipating heat from the second heating element 7 and improving the heat dissipation effect of the heat dissipation component. In addition, the heat emitted by the first heating element 6 and the second heating element 7 will also be transferred to the second heat dissipation fin group 5 in sequence through the heat-conducting substrate 302 and the heat pipe 301. The fan module 2 blows airflow towards the second heat dissipation fin group 5 through the second air outlet 9 to dissipate the heat.

[0066] Specifically, in this embodiment, the second heat dissipation fin group 5 includes a plurality of second heat dissipation fins 502 arranged in sequence, and a second air duct 501 is formed between two adjacent second heat dissipation fins 502. The air inlet of the second air duct 501 is connected to the second air outlet 9, and the air outlet of the second air duct 501 is arranged facing the outside of the motherboard 1.

[0067] It should be noted that, through the above design, the airflow blown out by the fan module 2 through the second air outlet enters the second air duct 501 through the air outlet, and after being guided by the second air duct 501, it flows out from the outside of the motherboard 1 through the air outlet, thereby dissipating heat from the electronic device.

[0068] Furthermore, in this embodiment, there are multiple heat pipes 301, with the first ends of the multiple heat pipes 301 connected to the heat-conducting substrate 302, and the second ends of the multiple heat pipes 301 connected to the second heat dissipation fin group 5.

[0069] It should be noted that, through the above design, a greater number of heat pipes 301 can enhance the heat conduction effect, thereby enabling the fan module 2 to dissipate heat more effectively.

[0070] Furthermore, in this embodiment, the fan module 2 is specifically a fan with a housing, which is essentially existing technology and will not be described in detail in this embodiment.

[0071] Furthermore, the thermally conductive substrate 302 and the heat pipe 301 in this embodiment can be made of a metal with good thermal conductivity, such as copper.

[0072] Please see Figures 1 to 7 An electronic device provided in this embodiment of the present invention includes a motherboard 1, a first heating element 6, a second heating element 7, and the aforementioned heat dissipation assembly;

[0073] The first heating element 6, the second heating element 7, and the heat dissipation assembly are all connected to the motherboard 1;

[0074] The heat dissipation component includes a fan module 2 connected to the motherboard 1 and a heat-conducting module 3 connected to the fan module 2;

[0075] The second heating element 7, the first heating element 6, and the fan module 2 are arranged sequentially along the first direction;

[0076] The fan module 2 has a first air outlet port 8, which is disposed toward the first heating element 6. The end of the heat-conducting module 3 away from the fan module 2 is attached to the first heating element 6 and the second heating element 7. The bottom surface of the heat-conducting module 3 corresponding to the first heating element 6 is provided with a first heat dissipation fin group 4. A first air duct 401 for guiding airflow toward the direction of the second heating element 7 is formed in the first heat dissipation fin group 4.

[0077] It should be noted that the aforementioned electronic device can specifically be a laptop computer, wherein the first heating element 6 can be a GPU and the second heating element 7 can be a CPU. In addition, the first heating element 6 can be a type of component and the second heating element 7 can also be a type of component; this embodiment does not impose any limitations on this.

[0078] In the aforementioned electronic device, the second heating element 7, the first heating element 6, and the fan module 2 in the heat dissipation assembly of this embodiment are arranged sequentially along a first direction. The end of the heat-conducting module 3 away from the fan module 2 is attached to the first heating element 6 and the second heating element 7. A first heat dissipation fin group 4 is provided on the bottom surface of the heat-conducting module 3 corresponding to the first heating element 6. A first air duct 401 is formed within the first heat dissipation fin group 4 to guide airflow towards the direction of the second heating element 7. In this design, while the airflow from the fan module 2 through the first air outlet 8 blows towards the portion of the heat-conducting module 3 corresponding to the first heating element 6, it also flows towards the second heating element 7 through the first air duct 401 within the first heat dissipation fin group 4, thus flowing towards the portion of the heat-conducting module 3 corresponding to the second heating element 7. This design effectively ensures that multiple heating elements can receive effective heat dissipation, greatly improving the overall heat dissipation effect of the heat dissipation assembly.

[0079] The above provides a detailed description of a heat dissipation component and electronic device provided by this utility model. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A heat dissipation assembly, disposed on a motherboard (1) within an electronic device and used to dissipate heat from a first heat-generating element (6) and a second heat-generating element (7) on the motherboard (1), characterized in that, include: A fan module (2) connected to the motherboard (1) and a heat-conducting module (3) used in conjunction with the fan module (2) are arranged sequentially in a first direction, including the second heating element (7), the first heating element (6) and the fan module (2). The fan module (2) has a first air outlet port (8) which is positioned toward the first heating element (6). The end of the heat-conducting module (3) away from the fan module (2) is used to attach to the first heating element (6) and the second heating element (7). The bottom surface of the heat-conducting module (3) corresponding to the first heating element (6) is provided with a first heat dissipation fin group (4). A first air duct (401) is formed in the first heat dissipation fin group (4) to guide the airflow toward the direction of the second heating element (7).

2. The heat dissipation assembly according to claim 1, characterized in that, The first heat dissipation fin group (4) includes a plurality of first heat dissipation fins (402) arranged in sequence, and a first air duct (401) is formed between two adjacent first heat dissipation fins (402) to guide airflow toward the direction of the second heat-generating element (7). The air inlet of the first air duct (401) is set toward the first air outlet (8), and the air outlet of the first air duct (401) is set toward the direction of the second heating element (7).

3. The heat dissipation assembly according to claim 2, characterized in that, The first heat dissipation fin (402) forms a preset tilt angle with the first direction; The preset tilt angle is greater than 10°.

4. The heat dissipation assembly according to claim 2, characterized in that, The distance between two adjacent first heat dissipation fins (402) is greater than 1.2 mm; The height of the first heat dissipation fin (402) ranges from 2mm to 2.5mm; The thickness of the first heat dissipation fin (402) ranges from 0.1mm to 0.2mm.

5. The heat dissipation assembly according to claim 2, characterized in that, The first heat dissipation fin (402) has multiple through holes.

6. The heat dissipation assembly according to claim 1, characterized in that, The fan module (2) also has a second air outlet (9); The air outlet direction of the second air outlet (9) intersects with the air outlet direction of the first air outlet (8).

7. The heat dissipation assembly according to claim 6, characterized in that, The heat-conducting module (3) includes a heat pipe (301) and a heat-conducting substrate (302); The first end of the heat pipe (301) is connected to the heat-conducting substrate (302). The heat-conducting substrate (302) is used to attach the first heating element (6) and the second heating element (7). The first heat dissipation fin group (4) is provided on the bottom surface of the heat-conducting substrate (302) corresponding to the first heating element (6). The second end of the heat pipe (301) is connected to a second heat dissipation fin group (5), which is installed at the second air outlet (9).

8. The heat dissipation assembly according to claim 7, characterized in that, The second heat dissipation fin group (5) includes a plurality of second heat dissipation fins (502) arranged in sequence. A second air duct (501) is formed between two adjacent second heat dissipation fins (502). The air inlet of the second air duct (501) is connected to the second air outlet (9). The air outlet of the second air duct (501) is arranged facing the outside of the motherboard (1).

9. The heat dissipation assembly according to claim 7, characterized in that, The number of heat pipes (301) is multiple, the first ends of the multiple heat pipes (301) are connected to the heat-conducting substrate (302), and the second ends of the multiple heat pipes (301) are connected to the second heat dissipation fin group (5).

10. An electronic device, characterized in that, It includes a motherboard (1), a first heating element (6), a second heating element (7), and a heat dissipation assembly as described in any one of claims 1-9; The first heating element (6), the second heating element (7), and the heat dissipation assembly are all connected to the motherboard (1); The heat dissipation assembly includes a fan module (2) connected to the motherboard (1) and a heat-conducting module (3) used in conjunction with the fan module (2); The second heating element (7), the first heating element (6), and the fan module (2) are arranged sequentially in the first direction; The fan module (2) has a first air outlet port (8) facing the first heating element (6). The end of the heat-conducting module (3) away from the fan module (2) is attached to the first heating element (6) and the second heating element (7). The bottom surface of the heat-conducting module (3) corresponding to the first heating element (6) is provided with a first heat dissipation fin group (4). A first air duct (401) for guiding airflow toward the direction of the second heating element (7) is formed in the first heat dissipation fin group (4).

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