A dual heat sink frequency converter

Abstract

The utility model discloses a kind of double radiator frequency converters, the double radiator frequency converter, including box, air inlet, air outlet, fan and main loop element, air inlet and air outlet are respectively set in the two sides of box, fan is set in box and its output end is towards air outlet;It further includes at least two element radiators, the number of main loop element is multiple, multiple main loop element is respectively pasted on two element radiators;Air inlet, fan and air outlet form air duct, two element radiators are respectively set in the two sides of air duct, and main loop element is located outside air duct.The heat dissipation efficiency of the two element radiators of the utility model is higher than the heat dissipation efficiency of single element radiator of same volume, and multiple main loop elements are respectively set on two element radiators and located outside air duct, so that main loop element can be dispersed to heat dissipation, thereby effectively reduce the situation that local heat flow density is too high, avoid the failure of main loop element due to local high temperature zone.

Description

Technical Field

[0001] This utility model relates to the field of frequency converters, and in particular to a dual-heater frequency converter. Background Technology

[0002] A frequency converter is a power control device that uses frequency conversion technology and microelectronics technology to control an AC motor by changing the frequency of the motor's power supply. A frequency converter is mainly composed of components such as a rectifier module, a DC filter unit, and an IGBT inverter module.

[0003] In existing frequency converters, only one heat sink is typically used, with the core electronic components of the main power circuit (including IGBT modules, rectifier bridges, etc.) concentrated on the surface of this heat sink and relying on a forced air cooling system for heat dissipation. This heat dissipation structure has shortcomings: concentrating multiple components on a limited heat dissipation area can easily lead to local heat flux densities exceeding the critical value of conventional air cooling, affecting local heat dissipation efficiency. Severe local high-temperature areas can cause IGBT thermal breakdown, solder joint creep fracture, and other failures. To ensure basic heat dissipation requirements are met, the size of the heat sink usually needs to be increased, which restricts the development of frequency converters towards compactness and high performance. Utility Model Content

[0004] The main purpose of this utility model is to propose a dual-heater inverter, which aims to solve the technical problem in existing inverters where multiple components are concentrated in a limited heat dissipation area, thereby affecting the local heat dissipation efficiency and, in severe cases, causing IGBT thermal breakdown, solder joint creep fracture and other faults.

[0005] To achieve the above objectives, the present invention proposes a dual-heater inverter, comprising a chassis cover, a housing, an air inlet, an air outlet, a fan, and main circuit components. The chassis cover is mounted on the housing, the air inlet and air outlet are respectively located on both sides of the housing, and the fan is located inside the housing with its output end facing the air outlet. The invention is characterized by further comprising at least two component heat sinks, and the number of main circuit components is multiple, with the multiple main circuit components respectively attached to two component heat sinks.

[0006] The air inlet, fan, and air outlet form an air duct, and the two heat sinks of the components are respectively arranged on both sides of the air duct. The main circuit component is located outside the air duct.

[0007] Optionally, the component heat sink is a first heat sink and a second heat sink. Both the first heat sink and the second heat sink include a substrate and fins. The fins of the first heat sink and the second heat sink are disposed on one side of the substrate. The plurality of main circuit components are respectively attached to the other side of the two substrates. The fins of the first heat sink and the second heat sink are located in the air duct.

[0008] Optionally, the air inlet and air outlet are respectively located on opposite sides of the housing, and the first radiator and the second radiator are symmetrically arranged inside the housing and located on opposite sides of the air duct.

[0009] Optionally, it also includes a first isolation plate and a second isolation plate, which are respectively disposed on both sides of the air duct. Both the first isolation plate and the second isolation plate are provided with through holes, and multiple main circuit components are respectively attached to the two substrates through the through holes.

[0010] Optionally, the conical hole includes an inlet and an outlet, the diameter of the inlet being larger than the diameter of the outlet, and the main circuit element is sequentially attached to the two substrates via the inlet and outlet.

[0011] Optionally, it also includes several electrolytic capacitors, which are disposed on one side of the first or second isolation plate and located inside the air duct.

[0012] Optionally, a third isolation plate is also included, which is disposed between the first heat sink and the second heat sink.

[0013] The technical solution of this utility model has the following beneficial effects:

[0014] The heat dissipation efficiency of two component heat sinks is higher than that of a single component heat sink of the same volume. Furthermore, since the two component heat sinks are positioned on opposite sides of the air duct, and multiple main circuit components are mounted on these two heat sinks and located outside the air duct, the heat dissipation of multiple main circuit components can be distributed. This effectively reduces the occurrence of local heat flux densities exceeding the critical value for conventional air cooling and avoids faults such as IGBT thermal breakdown and solder joint creep fracture caused by localized high-temperature areas. This is beneficial for the upgrading and development of frequency converters towards compactness and high performance. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of a dual-heater frequency converter according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the internal structure of a dual-heater frequency converter according to an embodiment of the present invention.

[0018] The following are the reference numerals: chassis cover 100, chassis 200, air inlet 300, operation keyboard 400, first isolation plate 510, second isolation plate 520, third isolation plate 530, first heat sink 610, second heat sink 620, electrolytic capacitor 700, main circuit components 800, fan 900.

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0022] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] This utility model proposes a dual-heater frequency converter.

[0024] like Figures 1 to 2As shown, in one embodiment of this utility model, the dual-heater inverter includes a chassis cover 100, a housing 200, an air inlet 300, an operation keyboard 400, an air outlet, a fan 900, component heat sinks, and main circuit components 800. The chassis cover 100 is mounted on the housing 200, and the operation keyboard 400 is located on the chassis cover 100. Operators can remove the chassis cover 100 for production and maintenance work and control the inverter via the operation keyboard 400. Since the structure and principle of the chassis cover 100 and the operation keyboard 400 are mature existing technologies, they will not be described in detail in this embodiment. In this embodiment, the air inlet 300 and the air outlet are respectively located on both sides of the housing 200, and the fan 900 is located inside the housing 200 with its output end facing the air outlet. In this embodiment, there are two component heat sinks and multiple main circuit components 800. The multiple main circuit components 800 are respectively attached to the two component heat sinks, so that heat is dissipated through the two component heat sinks respectively. The air inlet 300, fan 900 and air outlet form an air duct. The two component heat sinks are respectively arranged on both sides of the air duct, and the main circuit components 800 are located outside the air duct.

[0025] Specifically, the heat dissipation efficiency of two component heat sinks is higher than that of a single component heat sink of the same volume. Furthermore, since the two component heat sinks are respectively located on opposite sides of the air duct, and multiple main circuit components 800 are respectively mounted on the two component heat sinks and located outside the air duct, the multiple main circuit components 800 can dissipate heat in a dispersed manner. This effectively reduces the occurrence of local heat flux densities exceeding the critical value of conventional air-cooled heat dissipation, and avoids faults such as IGBT thermal breakdown and solder joint creep fracture caused by local high-temperature areas. This is beneficial for the upgrading and development of frequency converters towards compactness and high performance.

[0026] In this embodiment, the dual-heater inverter further includes a first isolation plate 510 and a second isolation plate 520. Both the first isolation plate 510 and the second isolation plate 520 have through holes. The two component heat sinks are a first heat sink 610 and a second heat sink 620, each including a base plate and fins. The fins of both the first heat sink 610 and the second heat sink 620 are disposed on one side of the base plate. Multiple main circuit components 800 are respectively attached to the other side of the two base plates. The fins of both the first heat sink 610 and the second heat sink 620 are located within the air duct. Specifically, the aforementioned air inlet 300 and air outlet are respectively disposed on opposite sides of the housing 200. The air duct formed by the air inlet 300, the fan 900, and the air outlet is in a straight line. The first isolation plate 510 and the first heat sink 610 are disposed on one side of the air duct, while the second isolation plate 520 and the second isolation plate 520 are disposed on the opposite side of the air duct. Furthermore, the aforementioned through hole is a tapered hole, which includes an inlet and an outlet. The diameter of the inlet is larger than the diameter of the outlet, and multiple main circuit components 800 are sequentially attached to the two substrates through the inlet and outlet.

[0027] During heat dissipation, airflow enters the housing 200 through the air inlet 300, flows through the fins of the first heat sink 610 and the second heat sink 620, enabling the first heat sink 610 and the second heat sink 620 to perform their heat dissipation function, and then exits the housing 200 through the fan 900 and the air outlet. In other embodiments, the air duct may be L-shaped or other shapes, and the first heat sink 610 and the second heat sink 620 may be respectively arranged on both sides of the air duct asymmetrically, but the fins of the first heat sink 610 and the second heat sink 620 are still located inside the air duct, and the main circuit components 800 are still respectively arranged on the side of the two substrates located outside the air duct, so that the multiple main circuit components 800 can dissipate heat, reducing the occurrence of local heat flux density exceeding the critical value of conventional air cooling, and avoiding failures such as IGBT thermal breakdown and solder joint creep fracture caused by local high temperature areas.

[0028] In this embodiment, the dual-heatsink inverter also includes a third isolation plate 530 and several electrolytic capacitors 700. Specifically, the third isolation plate 530 is disposed between the first heatsink 610 and the second heatsink 620, dividing the airflow between the first heatsink 610 and the second heatsink 620 into two airflow channels, thereby further reducing wind resistance, improving the uniformity of airflow, and preventing the local heat flux density caused by turbulence from exceeding the critical value of conventional air-cooled heat dissipation. Further, the electrolytic capacitors 700 are disposed on one side of the first isolation plate 510 or the second isolation plate 520 and located within the airflow channels. The electrolytic capacitors 700 serve the functions of energy storage buffer, ripple suppression, and voltage stabilization. Disposing of the electrolytic capacitors 700 on one side of the first isolation plate 510 or the second isolation plate 520 and placing them within the airflow channels allows for heat dissipation of the electrolytic capacitors 700 through the airflow channels while making full use of the extra space within the airflow channels, and facilitates the appropriate density of the main circuit components 800 on the first heatsink 610 and the second heatsink 620.

[0029] Specifically, the working principle and process of this utility model are as follows:

[0030] By setting up two heat sinks for each component and arranging them appropriately, multiple main circuit components can be cooled in a distributed manner. This effectively reduces the occurrence of situations where the local heat flux density exceeds the critical value of conventional air cooling and avoids faults such as IGBT thermal breakdown and solder joint creep fracture caused by local high temperature areas. This is conducive to the upgrading and development of frequency converters towards compactness and high performance.

[0031] During heat dissipation, the heat dissipation efficiency of two component heat sinks is higher than that of a single component heat sink of the same volume. Furthermore, since the two component heat sinks are positioned on opposite sides of the air duct, and multiple main circuit components are mounted on the two component heat sinks and located outside the air duct, the multiple main circuit components can dissipate heat in a dispersed manner, effectively reducing the occurrence of local heat flux densities exceeding the critical value for conventional air cooling. Additionally, air is drawn in through the inlet by a fan and circulated along the air duct, dissipating heat from the electrolytic capacitors, the first heat sink, and the second heat sink, before exiting through the fan and outlet. The presence of a first, second, and third isolation plate prevents airflow from passing directly through the main circuit components, effectively reducing wind resistance, improving airflow uniformity, and preventing local heat flux densities exceeding the critical value for conventional air cooling caused by turbulence. In summary, this dual-heat sink inverter can prevent IGBT thermal breakdown and solder joint creep fracture caused by localized high-temperature areas, thus facilitating the upgrade and development of inverters towards compactness and high performance.

[0032] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A dual-heater inverter, comprising a chassis cover, a housing, an air inlet, an air outlet, a fan, and main circuit components, wherein the chassis cover is mounted on the housing, the air inlet and air outlet are respectively disposed on both sides of the housing, and the fan is disposed inside the housing with its output end facing the air outlet; characterized in that, It also includes at least two component heat sinks, and the number of main circuit components is multiple, with the multiple main circuit components respectively attached to two component heat sinks; The air inlet, fan, and air outlet form an air duct, and the two heat sinks of the components are respectively arranged on both sides of the air duct. The main circuit component is located outside the air duct.

2. The dual-heater inverter according to claim 1, characterized in that, The component heat sink is a first heat sink and a second heat sink. Both the first heat sink and the second heat sink include a substrate and fins. The fins of the first heat sink and the second heat sink are disposed on one side of the substrate. The multiple main circuit components are respectively attached to the other side of the two substrates. The fins of the first heat sink and the second heat sink are located in the air duct.

3. The dual-heater inverter according to claim 2, characterized in that, The air inlet and air outlet are respectively located on opposite sides of the housing. The first radiator and the second radiator are symmetrically arranged inside the housing and located on opposite sides of the air duct.

4. The dual-heater inverter according to claim 3, characterized in that, It also includes a first isolation plate and a second isolation plate, which are respectively disposed on both sides of the air duct. Both the first isolation plate and the second isolation plate are provided with through holes, and multiple main circuit components are respectively attached to the two substrates through the through holes.

5. The dual-heater inverter according to claim 4, characterized in that, The through hole is a tapered hole, which includes an inlet and an outlet. The diameter of the inlet is larger than the diameter of the outlet. The main circuit components are sequentially attached to the two substrates through the inlet and outlet.

6. The dual-heater inverter according to claim 4, characterized in that, It also includes several electrolytic capacitors, which are disposed on one side of the first isolation plate or the second isolation plate and located inside the air duct.

7. The dual-heater inverter according to claim 3, characterized in that, It also includes a third isolation plate, which is disposed between the first heat sink and the second heat sink.

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