A flexible graphene heat-conducting gasket

Abstract

The utility model discloses a flexible graphene heat conduction gasket, it includes graphene heat conduction base sheet and the frame that sets up around graphene heat conduction base sheet, graphene heat conduction base sheet include a plurality of graphene film laminated arrangement along horizontal direction, through flexible connecting layer bonding fixed between any two adjacent graphene film, the thickness of frame along vertical direction is greater than the thickness of graphene heat conduction base sheet, the bottom surface of frame is equipped with bonding layer. The utility model provides a flexible graphene heat conduction gasket, it can cover graphene heat conduction base sheet in frame, and the graphene heat conduction base sheet is positioned, and the offset is reduced, and because the existence of frame makes the process of taking not contact graphene heat conduction base sheet, reduces the probability of fragmentation, also reduces the probability of falling out of debris and graphene powder.

Description

Technical Field

[0001] This utility model relates to the technical field of thermal conductive pads, specifically a flexible graphene thermal conductive pad. Background Technology

[0002] Graphene has excellent thermal conductivity, making it suitable as a thermal pad to reduce the interfacial thermal resistance between heat source and heat dissipation devices. However, existing graphene thermal pads generally suffer from the following technical problems, hindering their widespread use in the thermal pad field.

[0003] 1) Graphene thermal pads are relatively thin and non-adhesive. Therefore, during production line construction, the graphene thermal pads may shift due to tilting or airflow in the surrounding environment, affecting assembly.

[0004] 2) Graphene thermal pads have poor strength. When the pads are directly handled for assembly, they are easy to break and generate debris. The debris is a conductive medium. Once it falls onto the circuit board, it is difficult to clean and may cause a short circuit and damage the equipment. Utility Model Content

[0005] This utility model aims to at least partially solve one of the technical problems in the related art: to provide a flexible graphene thermal conductive pad that can wrap the graphene thermal conductive substrate in the frame, limit the position of the graphene thermal conductive substrate, reduce displacement, and at the same time, the presence of the frame ensures that the graphene thermal conductive substrate will not come into contact with it during the picking process, reducing the chance of breakage and the chance of debris and graphene powder falling out.

[0006] Therefore, one objective of this invention is to provide a flexible graphene thermal conductive pad, comprising a graphene thermal conductive substrate and a frame surrounding the graphene thermal conductive substrate. The graphene thermal conductive substrate includes several graphene films stacked horizontally, with any two adjacent graphene films bonded together by a flexible connecting layer. The thickness of the frame in the vertical direction is greater than the thickness of the graphene thermal conductive substrate, and an adhesive layer is provided on the bottom surface of the frame. On the one hand, the frame confines the graphene thermal conductive substrate within its boundaries, thus preventing positional displacement due to tilting or airflow in the external environment during production line assembly. On the other hand, it avoids direct contact with the graphene thermal conductive substrate during handling, reducing the risk of breakage. Furthermore, any small amount of debris and graphene powder on the graphene thermal conductive substrate can be covered by the frame, reducing the risk of short circuits on the circuit board.

[0007] According to one example of this utility model, the frame is a flexible frame made of a flexible material.

[0008] According to one example of this utility model, a release film is attached to the adhesive layer; or a release film is attached to both the adhesive layer and the top surface of the frame. The release film can be applied to the adhesive layer before use to prevent dust accumulation.

[0009] According to one example of this invention, the top surface of the graphene thermally conductive substrate is flush with the top surface of the frame. An adhesive tape layer is attached to the top surface of the frame, with a portion of the tape layer extending horizontally inwards to the top surface of the graphene thermally conductive substrate. The adhesive tape layer covers the bonding gap between the graphene thermally conductive substrate and the frame, reducing the likelihood of graphene powder leaking out from this gap.

[0010] According to one example of this utility model, the graphene thermally conductive substrate has gaskets on both sides along the graphene film stacking direction. The gaskets are fixed to the graphene thermally conductive substrate and are attached to the inner sidewall of the frame. The graphene thermally conductive substrate is located within the frame in the vertical direction. The gaskets ensure that the graphene thermally conductive substrate is located within the frame before use, providing a buffering and protective function. During use, under pressure, it can rise relative to the frame until it is flush with the top surface of the frame.

[0011] According to one example of the present invention, the outer wall of the graphene thermally conductive substrate has a sealing film extending to the top and bottom surfaces.

[0012] According to one example of this utility model, the frame includes a flexible base block with multiple mounting slots for embedding graphene thermally conductive substrates. Each mounting slot extends vertically through the upper and lower end faces of the flexible base block, and the shape of each mounting slot in the horizontal direction matches the corresponding graphene thermally conductive substrate. The flexible base block has multiple mounting slots, each containing its own graphene thermally conductive substrate, thereby enabling the simultaneous installation of multiple graphene thermally conductive substrates and making the installation process more convenient.

[0013] According to one example of this utility model, the flexible base block is located at the position of each mounting groove as a functional area, and the thickness of each functional area is 0.5mm~10mm.

[0014] The above technical solution has the following advantages or beneficial effects: First, the frame confines the graphene thermal conductive substrate within the frame, so the graphene thermal conductive substrate will not shift its position due to tilting or airflow in the external environment during the assembly process on the production line; at the same time, due to the presence of the frame, there is no need to touch the graphene thermal conductive substrate when picking it up, reducing the risk of the graphene thermal conductive substrate breaking; second, since the frame covers the entire outer wall of the graphene thermal conductive substrate, even if a small amount of debris and graphene powder falls from the graphene thermal conductive substrate, it can be confined inside the frame, reducing the risk of debris and powder falling onto the circuit board and causing a short circuit; finally, flexible substrates are prepared in advance according to the position and height difference of multiple heat-generating components on different circuit boards. Each mounting slot on the flexible substrate has a corresponding graphene thermal conductive substrate, enabling multiple heat-generating components on the same circuit board to be simultaneously mounted with graphene thermal conductive substrates, making the installation process fast and convenient.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the flexible graphene thermal pad of this utility model.

[0017] Figure 2 for Figure 1 A cross-sectional view along the "AA" direction.

[0018] Figure 3 This is a schematic diagram showing the flexible graphene thermal pad installed on the chip in use.

[0019] Figure 4 for Figure 3 An exploded diagram showing the flexible graphene thermal pad separated from the chip.

[0020] Figure 5 yes Figure 3 A top-down view of the diagram.

[0021] Figure 6 for Figure 5 A cross-sectional view along the "BB" direction.

[0022] Figure 7 for Figure 6 A magnified view of a portion of the "C" region.

[0023] Figure 8 This is a schematic diagram of a graphene thermally conductive substrate with gaskets attached to both sides.

[0024] Figure 9 This is a schematic diagram of the structure of a graphene thermally conductive substrate with a sealing film covering the outer wall.

[0025] Among them, 1. Graphene thermally conductive substrate; 1.1 Graphene film; 1.2 Connecting layer; 2. Frame; 2.1 Mounting groove; 3. Gasket; 4. Adhesive layer; 5. Release film; 6. Tape layer; 7. Circuit board; 8. Heating component; 9. Sealing film. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0027] The flexible graphene thermal pad according to an embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

[0028] This invention provides a flexible graphene thermally conductive pad, as shown in the figure. It includes a sheet-like graphene thermally conductive substrate 1 and a frame 2 surrounding the graphene thermally conductive substrate 1. The frame 2 has mounting grooves that match the graphene thermally conductive substrate 1, and these mounting grooves extend vertically through the upper and lower end faces of the frame 2. The graphene thermally conductive substrate 1 includes several graphene films 1.1 stacked horizontally. Any two adjacent graphene films 1.1 are bonded and fixed together by a flexible connecting layer 1.2. Specifically, each graphene film 1.1 is arranged horizontally along... Figure 8 The graphene films are stacked in the left-right direction as shown. Any two adjacent graphene films 1.1 are bonded and fixed together by a connecting layer 1.2. The thickness of the frame 2 in the vertical direction is greater than the thickness of the graphene thermally conductive substrate 1.

[0029] Preferably, the connecting layer 1.2 is an adhesive layer. The preparation process of the graphene thermally conductive substrate 1 involves laying a first graphene film 1.1 flat, then coating it with adhesive to form the connecting layer 1.2. A second graphene film 1.1 is then attached to the first graphene film 1.1, and so on, alternately stacking the graphene films 1.1 and the connecting layer 1.2. After all the graphene films 1.1 have been stacked and bonded, they are cut longitudinally to form a sheet-like graphene thermally conductive substrate 1. When the graphene thermally conductive substrate 1 is flipped to a horizontal position, each graphene film 1.1 in the graphene thermally conductive substrate 1... Figure 8 As shown, the graphene films are stacked in the left-right direction, and each graphene film 1.1 serves as a heat conduction channel to achieve heat transfer between the upper and lower surfaces of the graphene thermally conductive substrate 1.

[0030] Preferably, the frame 2 is a flexible frame 2 made of a flexible material. Specifically, the frame 2 is a flexible frame made of foam adhesive. This allows the flexible frame 2 to be compressed and deformed when subjected to vertical compressive force.

[0031] Based on the preferred embodiment described above, the bottom surface of the frame 2 is provided with an adhesive layer 4. Further, a release film 5 is attached to the adhesive layer 4, or release films 5 are attached to both the adhesive layer 4 and the top surface of the frame 2. The release film 5 prevents the adhesive layer 4 from being contaminated by impurities from the external environment before use of the flexible graphene thermal pad of this embodiment. Simultaneously, the release film located on the top surface of the frame 2 also ensures the cleanliness of the top surface of the frame 2.

[0032] In a preferred embodiment as described above, both the top and bottom surfaces of the frame 2 are provided with adhesive layers 4. Release films 5 are attached to both adhesive layers 4.

[0033] Furthermore, the flexible substrate has mounting grooves 2.1 for embedding the graphene thermally conductive substrate 1. Each mounting groove 2.1 extends vertically through the upper and lower end faces of the flexible substrate. The release film 5 has a sheet-like structure and covers the opening of the mounting groove 2.1 where the graphene thermally conductive substrate 1 is located. In this embodiment, the upper and lower release films 5 can form a sealed chamber with the mounting groove 2.1, thus isolating the graphene thermally conductive substrate 1 located in the mounting groove 2.1 from the external environment.

[0034] In a preferred embodiment, the bottom surface of the frame 2 is provided with an adhesive layer 4, and the top surface of the frame 2 is attached with an adhesive tape layer 6. The top surface of the graphene thermally conductive substrate 1 is flush with the top surface of the frame 2, and a portion of the adhesive tape layer 6 extends horizontally inward to the top surface of the graphene thermally conductive substrate 1. The adhesive tape layer seals the gap between the outer wall of the graphene thermally conductive substrate 1 and the inner wall of the mounting groove 2.1 in the frame 2, thereby reducing the probability of graphene powder particles falling out of the gap. In this embodiment, a release film 5 is covered on the adhesive tape layer 6, which can be torn off before use of the flexible graphene thermally conductive pad in this embodiment.

[0035] To reduce the risk of partial breakage or powder loss of the graphene film 1.1 in the graphene thermal conductive substrate 1 due to external impact forces during transportation, handling, and storage before use, the improvement in this embodiment is as follows: gaskets 3 are respectively provided on both sides of the graphene thermal conductive substrate 1 along the stacking direction of the graphene film 1.1. The gaskets 3 are fixed to the graphene thermal conductive substrate 1, and the gaskets 3 are attached to the inner sidewall of the frame 2. There is friction between the gaskets 3 and the inner sidewall of the frame 2. This friction is greater than the weight of the graphene thermal conductive substrate 1 itself. The graphene thermal conductive substrate 1 is located inside the frame 2 in the vertical direction. Specifically, the top and bottom surfaces of the graphene thermal conductive substrate 1 are both within the mounting groove 2.1, thereby the frame 2 provides buffer protection for the graphene thermal conductive substrate 1. When in use, the frame is placed on the heat-generating component 8 on the circuit board 7, which requires heat dissipation. The heat-generating component 8 can abut against the graphene thermal conductive substrate 1 and push the graphene thermal conductive substrate 1 upward. At this time, the top surface of the graphene thermal conductive substrate 1 is roughly flush with the top surface of the frame 2. The existing heat dissipation component is attached to the top surface of the graphene thermal conductive substrate 1. Thus, heat transfer between the heat-generating component 8 and the heat dissipation component is achieved through the graphene thermal conductive substrate 1, thereby achieving heat dissipation.

[0036] In existing technologies, various types of circuit boards 7 contain multiple heat-generating components 8 requiring heat dissipation. Each heat-generating component 8 needs to be individually mounted with a thermal pad, resulting in time-consuming assembly. This is especially problematic when some heat-generating components 8 are located close together, making the installation of the thermal pads inconvenient. To improve the efficiency of mounting thermal pads on multiple heat-generating components 8 on the same circuit board 7, this embodiment improves upon this by including a flexible base block on the frame 2. The flexible base block has multiple mounting slots 2.1 for embedding graphene thermally conductive substrates 1. Each mounting slot 2.1 extends vertically through the upper and lower end faces of the flexible base block, and the shape of each mounting slot 2.1 in the horizontal direction matches the corresponding graphene thermally conductive substrate 1. Through the multiple mounting slots 2.1 on the flexible base block, each graphene thermally conductive substrate 1 can be simultaneously attached to its corresponding heat-generating component 8.

[0037] Preferably, the flexible substrate is positioned at the location of each mounting groove 2.1 as a functional area, and the thickness of each functional area is 0.5mm to 10mm. On one hand, for the heating components 8 at different locations and with different heights on the circuit board 7, this embodiment can perform die-cutting on the thickness of different functional areas on the flexible substrate, thereby creating a height difference in the graphene thermally conductive substrates 1 within the mounting grooves 2.1 of different functional areas. This allows the height of each graphene thermally conductive substrate 1 to be adjustable, matching the heating components 8 at their respective heights. On the other hand, when the circuit board 7 is uneven, the flexible frame 2 made of this flexible material can compensate for the unevenness of the circuit board 7 surface based on its compressibility, allowing the graphene thermally conductive substrate 1 to accurately adhere to the top surface of the heating component 8. Furthermore, by setting the thickness of each graphene thermally conductive substrate 1 to be different, the height difference of each heating component 8 is compensated, ultimately ensuring that the top surfaces of the graphene thermally conductive substrates 1 on each heating component 8 remain at the same horizontal plane after attachment.

[0038] Based on the preferred embodiment described above, in order to further reduce the shedding of debris and graphene powder from the graphene thermal conductive substrate 1, the graphene thermal conductive substrate 1 can be edge-sealed before being installed into the mounting groove 2.1 of the frame 2. Specifically, see [link to relevant documentation]. Figure 9 As shown, the outer wall of the graphene thermally conductive substrate 1 has a sealing film 9 extending to the top and bottom surfaces of the graphene thermally conductive substrate 1. The sealing film 9 is preferably an adhesive tape.

[0039] The circuit board 7 is preferably a SoC chip, and each heat-generating component 8 is an embedded processor, memory, dedicated function module, I / O interface module, on-chip bus, etc. on the SoC chip. The aforementioned heat-generating components 8 will generate a large amount of heat when the SoC chip is running.

[0040] It should be noted that in the description of this utility model, the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0045] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

[0046] For those skilled in the art, various changes and modifications will undoubtedly be apparent after reading the above description. Therefore, the appended claims should be considered as covering all changes and modifications that encompass the true intent and scope of this utility model. Any and all equivalent scope and content within the scope of the claims should be considered as still falling within the intent and scope of this utility model.

Claims

1. A flexible graphene thermally conductive pad, characterized in that: The device includes a graphene thermal conductive substrate (1) and a frame (2) surrounding the graphene thermal conductive substrate (1). The graphene thermal conductive substrate (1) includes several graphene films (1.1) stacked in the horizontal direction. Any two adjacent graphene films (1.1) are bonded and fixed together by a flexible connecting layer (1.2). The thickness of the frame (2) in the vertical direction is greater than the thickness of the graphene thermal conductive substrate (1). The bottom surface of the frame (2) is provided with an adhesive layer (4).

2. The flexible graphene thermal pad according to claim 1, characterized in that: The frame (2) is a flexible frame (2) made of flexible material.

3. The flexible graphene thermal pad according to claim 1, characterized in that: A release film (5) is attached to the adhesive layer (4); or a release film (5) is attached to both the adhesive layer (4) and the top surface of the frame (2).

4. The flexible graphene thermal pad according to claim 1, characterized in that: The top surface of the graphene thermal conductive substrate (1) is flush with the top surface of the frame (2). A tape layer (6) is attached to the top surface of the frame (2), and part of the tape layer (6) extends inward in the horizontal direction to the top surface of the graphene thermal conductive substrate (1).

5. The flexible graphene thermal pad according to claim 1, characterized in that: The graphene thermal conductive substrate (1) has gaskets (3) on both sides along the stacking direction of the graphene film (1.1). The gaskets (3) are fixed to the graphene thermal conductive substrate (1) and are attached to the inner sidewall of the frame (2). The graphene thermal conductive substrate (1) is located inside the frame (2) in the vertical direction.

6. The flexible graphene thermal pad according to claim 1, characterized in that: The graphene thermally conductive substrate (1) has sealing films (9) extending to the top and bottom surfaces on its outer sidewall.

7. The flexible graphene thermal pad according to any one of claims 2-6, characterized in that: The frame (2) includes a flexible base block with multiple mounting slots (2.1) for embedding graphene thermal conductive substrates (1). Each mounting slot (2.1) extends vertically through the upper and lower end faces of the flexible base block, and the shape of each mounting slot (2.1) in the horizontal direction matches the corresponding graphene thermal conductive substrate (1).

8. The flexible graphene thermal pad according to claim 7, characterized in that: The flexible base block is located in the position of each mounting groove (2.1) as a functional area, and the thickness of each functional area is 0.5mm~10mm.

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