Liquid leakage-proof SH tank and multi-tank cleaning machine

Abstract

The utility model relates to a kind of liquid leakage prevention SH tank and multi-tank cleaning machine.The liquid leakage prevention SH tank includes the skeleton of cuboid, first high temperature plate is equipped around skeleton, second high temperature plate is equipped in bottom, first high temperature plate and second high temperature plate jointly constitute tank body, installation cavity is equipped in tank body, heat insulation bracket is equipped above second high temperature plate, quartz tank is equipped in heat insulation bracket top, quartz tank is used to place semiconductor parts to be handled, quartz tank length direction side is equipped with spraying mechanism.The multi-tank cleaning machine includes the above-mentioned liquid leakage prevention SH tank, still include sink, cooling shell is equipped in skeleton side, cooling shell is communicated with installation cavity, the top surface of cooling shell is equipped with the exhaust passage that is communicated with cooling shell, exhaust fan is equipped at exhaust passage.The utility model can effectively reduce the heat transfer influence to SH tank in semiconductor processing process, to preferably avoid the structure damage of SH tank and produce leakage.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a leak-proof SH tank and a multi-tank cleaning machine. Background Technology

[0002] Semiconductor wet cleaning is a key process in semiconductor manufacturing for processing semiconductor components. SPM (sulfuric acid and hydrogen peroxide) is a cleaning technique used for photoresist stripping. SPM is widely used in wet cleaning processes for resist removal and surface treatment. This process is typically performed using a multi-tank cleaning machine, where the SH tank is a reaction tank.

[0003] Since the SPM cleaning process requires temperatures above 125°C, conventional SH tanks are prone to cavity damage and skeleton cracking due to long-term high-temperature operation, which in turn leads to leakage from the SH tank. Utility Model Content

[0004] This utility model provides a leak-proof SH tank and a multi-tank cleaning machine, which can overcome some or all the defects of the prior art.

[0005] According to the present invention, the leak-proof liquid SH tank includes a rectangular frame, a first high-temperature plate is provided around the frame, a second high-temperature plate is provided at the bottom, the first high-temperature plate and the second high-temperature plate together form the tank body, the tank body is provided with an installation cavity, a heat insulation bracket is provided above the second high-temperature plate, a quartz tank is provided at the top of the heat insulation bracket, the quartz tank is used to place the semiconductor parts to be processed, and a spraying mechanism is provided on one side of the length direction of the quartz tank.

[0006] In a preferred embodiment of this utility model, a heat insulation plate is provided between the heat insulation bracket and the second high-temperature plate.

[0007] In a preferred embodiment of this utility model, the spraying mechanism includes a liquid inlet pipe extending along the width of the frame. The liquid inlet pipe is used to introduce cleaning fluid, and multiple liquid inlet holes are provided at intervals at the liquid inlet pipe.

[0008] In a preferred embodiment of this invention, a flow valve is provided at the liquid inlet.

[0009] In a preferred embodiment of this invention, a liquid outlet channel is provided at the bottom of the mounting cavity on the side away from the spraying mechanism.

[0010] The multi-tank cleaning machine according to this utility model includes the above-mentioned leak-proof liquid SH tank, and also includes a water tank. A cooling shell is provided on one side of the frame, the cooling shell is connected to the mounting cavity, the top surface of the cooling shell is provided with an exhaust channel connected to the cooling shell, and an exhaust fan is provided at the exhaust channel.

[0011] In a preferred embodiment of this invention, a connecting pipe is provided on the side wall of the cooling shell, which is used to connect the water tank and the cooling shell.

[0012] In a preferred embodiment of this invention, the bottom wall of the cooling housing is inclined toward the top of the frame.

[0013] Beneficial effects:

[0014] The leak-proof SH tank provided in this embodiment of the utility model avoids damage to the SH tank structure caused by the heating of the quartz tank by setting up a heat-insulating bracket and a second high-temperature plate, thereby better achieving the goal of preventing leakage of the SH tank.

[0015] Furthermore, by setting up a spray mechanism, not only can cooling be achieved during the semiconductor processing, but the installation cavity can also be cleaned after the process is completed.

[0016] Furthermore, in the multi-tank cleaning machine provided in this embodiment of the present invention, the exhaust channel can exhaust air from both the SH tank and the water tank simultaneously. Since the airflow temperature in the water tank is low, when it encounters the acidic gas in the SH tank, part of the acidic gas will liquefy and flow back into the SH tank through the inclined cooling shell, thus facilitating subsequent recycling. Attached Figure Description

[0017] Figure 1 This is a partial isometric structural diagram of the anti-leakage SH tank in at least one embodiment of the present invention;

[0018] Figure 2 This is a partial structural diagram of the multi-tank cleaning machine in at least one embodiment of the present invention. Detailed Implementation

[0019] To clearly illustrate the technical solution of this utility model, the embodiments are described in full with reference to the accompanying drawings.

[0020] The accompanying drawings in this disclosure are not drawn to scale, and the number of spray mechanisms and liquid inlet holes are not limited to the numbers shown in the drawings. The specific dimensions and quantity of each structure can be determined according to actual needs.

[0021] Seen in Figure 1-2 This application provides a leak-proof SH tank, which includes a rectangular frame 1. The frame 1 is welded from stainless steel profiles and has high structural strength.

[0022] The frame 1 is provided with a first high temperature plate 21 on all four sides and a second high temperature plate 22 at the bottom. The first high temperature plate 21 and the second high temperature plate 22 together form a tank. The tank is provided with an installation cavity 3 for operation.

[0023] It is worth noting that both the first high-temperature plate 21 and the second high-temperature plate 22 are CPVC high-temperature plates, which have good high-temperature resistance.

[0024] Among them, a heat insulation bracket 4 is provided above the second high temperature plate 22, and a quartz groove is provided on the top of the heat insulation bracket 4. The quartz groove is used to place the semiconductor parts to be processed, and a spraying mechanism is provided on one side of the length direction of the quartz groove.

[0025] During the processing of semiconductor components, the temperature inside the quartz tank is high. By setting up the heat insulation bracket 4, the quartz tank can be prevented from directly contacting the second high-temperature plate 22. The spray mechanism can spray coolant into the mounting cavity 3 to remove heat and prevent damage to the components inside the SH tank or deformation and cracking of the SH tank as a whole, thus better avoiding leakage of the SH tank.

[0026] Furthermore, a heat insulation plate 5 is provided between the heat insulation bracket 4 and the second high-temperature plate 22. The heat insulation plate 5 is a PTFE heat insulation plate 5, which can further reduce the heat transfer between the heat insulation bracket 4 and the second high-temperature plate 22.

[0027] In this embodiment, the spraying mechanism includes a liquid inlet pipe 6 extending along the width direction of the frame 1. The liquid inlet pipe 6 is used to introduce cleaning fluid, and multiple liquid inlet holes are provided at intervals at the liquid inlet pipe 6. Coolant enters the liquid inlet pipe 6 through an external delivery pipeline and enters the mounting cavity 3 through the liquid inlet holes.

[0028] Furthermore, a flow valve is installed at the liquid inlet, which is used to control the spray flow rate of the coolant.

[0029] In this embodiment, a liquid outlet channel is provided at the bottom of the mounting cavity 3 on the side away from the spraying mechanism. The liquid outlet channel is used to discharge the liquid in the mounting cavity 3.

[0030] During use, the acidic liquid in the quartz tank may flow out of the quartz tank and fall into the bottom of the mounting cavity 3 during the reaction. The flow valve is always in the open state, which can not only reduce the temperature of the acidic liquid, but also reduce the concentration of the acidic liquid. After the semiconductor processing is completed, the spraying mechanism can spray and clean the inside of the mounting cavity 3, thereby keeping the inside of the mounting cavity 3 clean.

[0031] This utility model also provides a multi-tank cleaning machine, which includes the aforementioned leak-proof SH tank and a water tank. A cooling shell 7 is provided on one side of the frame 1, and the cooling shell 7 is connected to the mounting cavity 3. An exhaust channel 8 connected to the cooling shell 7 is provided on the top surface of the cooling shell 7, and an exhaust fan is provided at the exhaust channel 8. The exhaust fan can exhaust the high-temperature acidic gas in the SH tank and reduce the temperature in the SH tank.

[0032] Furthermore, the cooling housing 7 has a connecting pipe 9 on its side wall, which is used to connect the water tank and the cooling housing 7. The bottom wall of the cooling housing 7 is inclined towards the top of the frame 1.

[0033] By setting up the connecting pipe 9, the exhaust channel 8 can exhaust air from both the SH tank and the water tank at the same time. Since the airflow temperature in the water tank is low, when it encounters the acidic gas in the SH tank, part of the acidic gas will liquefy and flow back into the SH tank through the inclined cooling shell 7, thus facilitating subsequent recycling.

[0034] It is readily understood that those skilled in the art can combine, split, or reorganize the embodiments provided in this application to obtain other embodiments, all of which do not exceed the protection scope of this application.

Claims

1. A leak-proof liquid SH tank, characterized in that, The device includes a rectangular frame with a first high-temperature plate on all four sides and a second high-temperature plate at the bottom. The first and second high-temperature plates together form a tank with an installation cavity inside. A heat-insulating bracket is provided above the second high-temperature plate, and a quartz tank is provided on the top of the heat-insulating bracket. The quartz tank is used to place the semiconductor parts to be processed, and a spraying mechanism is provided on one side along the length of the quartz tank.

2. The leak-proof liquid SH tank according to claim 1, characterized in that, A heat insulation plate is installed between the heat insulation bracket and the second high-temperature plate.

3. The leak-proof liquid SH tank according to claim 1, characterized in that, The spraying mechanism includes an inlet pipe extending along the width of the frame, which is used to introduce cleaning fluid, and multiple inlet holes are provided at intervals at the inlet pipe.

4. The leak-proof liquid SH tank according to claim 3, characterized in that, A flow valve is installed at the liquid inlet.

5. The leak-proof liquid SH tank according to claim 1, characterized in that, A liquid outlet channel is provided at the bottom of the mounting cavity on the side away from the spray mechanism.

6. A multi-tank cleaning machine, characterized in that, The system includes the anti-leakage liquid SH tank as described in any one of claims 1-5, and also includes a water tank. A cooling shell is provided on one side of the frame, the cooling shell is connected to the mounting cavity, the top surface of the cooling shell is provided with an exhaust channel connected to the cooling shell, and an exhaust fan is provided at the exhaust channel.

7. The multi-tank cleaning machine according to claim 6, characterized in that, The cooling housing has a connecting pipe on its side wall, which is used to connect the water tank and the cooling housing.

8. The multi-tank cleaning machine according to claim 6, characterized in that, The bottom wall of the cooling housing slopes towards the top of the frame.

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