Wafer cutting detection device and uv debonding machine

Abstract

The utility model provides a kind of wafer cutting detection device and UV debonding machine platform, wafer cutting detection device is emitted to target wafer by light source emitter detection light, detection light is cut out after being passed between the adjacent two chips in target wafer gap, then pass through transparent wafer stage, to be received by light source receiver, light source receiver is received after passing through the light of transparent wafer stage, the light intensity of light passing through transparent wafer stage is identified simultaneously, and according to light intensity, light intensity detection signal is generated, and detection module determines whether the region to be detected in target wafer is cut completely according to light intensity detection signal, the target wafer has not been debonded by ultraviolet debonding machine at this time, when detecting that the region to be detected of wafer is not cut completely, wafer can be reworked, and cutting is carried out again, avoid the phenomenon that wafer cannot be reworked after debonding, leading to wafer scrap.

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