Wafer centering device

Abstract

The utility model relates to the technical field of semiconductor processing discloses a wafer centering device. Wherein wafer centering device includes bottom plate, fixed plate, support spare, drive assembly, a plurality of support columns and a plurality of centering components. Fixed plate is connected to the bottom plate and is located the top of bottom plate, and fixed plate is provided with first through -hole;Support spare is worn in first through -hole and supports wafer;A plurality of support columns are set up on fixed plate;Drive assembly is set up on the bottom plate, and drive assembly drive connection is in support spare and is used for driving support spare to lift, to make support spare can place wafer on support column;A plurality of centering components are symmetrically set up relative to first through -hole;Drive assembly drive connection is in a plurality of centering components and is used for driving a plurality of centering components along the radial synchronous of first through -hole close or far, and a plurality of centering components can synchronous butt joint in the edge of wafer located on support column. The utility model can drive support spare lifting and the centering of wafer simultaneously, improves the versatility of wafer centering device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer alignment device. Background Technology

[0002] In integrated circuit manufacturing, wafer alignment control is an extremely critical step. As the basic material for chip manufacturing, the precise positioning of the wafer directly affects the accuracy and quality of numerous subsequent process steps such as photolithography, etching, and deposition, thus determining the chip's performance and yield.

[0003] Before wafers are transferred to various process equipment, precise alignment must be performed to ensure they are in a preset standard position. However, existing wafer alignment equipment has limited functionality, possessing only this core function. In actual production processes, wafer transfer between different devices requires not only alignment but also lifting operations to accommodate the varying working heights and transfer requirements of different equipment. Current alignment equipment cannot perform wafer lifting functions, thus reducing production efficiency.

[0004] Therefore, there is an urgent need for a wafer alignment device to solve the aforementioned problems. Utility Model Content

[0005] Based on the above, the purpose of this utility model is to provide a wafer alignment device that can simultaneously drive the lifting and lowering of the support component and the alignment of the wafer, thereby improving the versatility of the wafer alignment device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A wafer alignment device, comprising:

[0008] A base plate and a fixing plate, wherein the fixing plate is connected to the base plate and located above the base plate, and the fixing plate is provided with a first through hole;

[0009] A support member, which passes through the first through-hole and supports the wafer;

[0010] Multiple support columns are mounted on the fixed plate;

[0011] A driving component is disposed on the base plate. The driving component is driven to be connected to the support member and is used to drive the support member to rise and fall, so that the support member can place the wafer on the support column.

[0012] Multiple centering components are symmetrically arranged relative to the first through-hole; the driving component is connected to the multiple centering components and is used to drive the multiple centering components to synchronously move closer or further away from the first through-hole in a radial direction, and the multiple centering components can synchronously abut against the edge of the wafer located on the support post.

[0013] As a preferred technical solution for a wafer alignment device, the driving assembly includes a first driving component, a limiting component, a driving wheel, and a driving nut. The first driving component is disposed on the base plate and drivenly connected to the driving wheel. The driving wheel is connected to the driving nut. The support component is a lead screw. The driving nut is threadedly connected to the lead screw. The axes of the lead screw, the driving nut, and the driving wheel are collinear. The limiting component is used to restrict the rotation of the lead screw.

[0014] As a preferred technical solution for a wafer alignment device, the limiting component includes a limiting block, a first slider, and a first slide rail. The first slide rail extends along the axial direction of the support member. The limiting block is connected to the lead screw and the first slider, and the first slider is slidably connected to the first slide rail.

[0015] As a preferred technical solution of a wafer alignment device, the driving assembly includes a plurality of second driving components, each corresponding to the alignment assembly. Each second driving component includes a driven wheel and a first synchronous belt. The driven wheel and the driving wheel are radially spaced along the first through hole. One end of the first synchronous belt is wound around the driven wheel, and the other end is wound around the driving wheel. The alignment assembly is connected to the first synchronous belt, and the first synchronous belts of the plurality of second driving components are spaced apart in the vertical direction.

[0016] As a preferred technical solution of a wafer alignment device, the fixing plate is provided with a plurality of guide holes spaced apart circumferentially along the first through hole, and the plurality of guide holes extend radially along the first through hole; a plurality of alignment components correspond one-to-one with the plurality of guide holes, and the alignment components are slidably connected to the guide holes.

[0017] As a preferred technical solution of a wafer alignment device, the alignment component includes a connecting block and a positioning shaft. The connecting block is slidably connected to the guide hole. One end of the connecting block is connected to the first synchronous belt, and the other end is connected to the positioning shaft. The positioning shaft is used to abut against the outer edge of the wafer.

[0018] As a preferred technical solution for a wafer alignment device, the second driving component further includes a second slide rail and a second slider. The second slide rail extends along the length direction of the guide hole and is connected to the fixed plate. The second slider is connected to the connecting block and is slidably connected to the second slide rail.

[0019] As a preferred technical solution for a wafer alignment device, the alignment component further includes a detection sensor, which is used to detect the state of the positioning axis abutting against the wafer.

[0020] As a preferred technical solution for a wafer alignment device, a suction cup is provided on the top of the support member, and an air passage is provided in the center of the support member. One end of the air passage is connected to the suction cup, and the other end is connected to a vacuum device.

[0021] As a preferred technical solution for a wafer alignment device, the alignment components are at least four.

[0022] The beneficial effects of this utility model are as follows:

[0023] This invention provides a wafer alignment device. When wafer alignment is required, the wafer is first placed on a support member, and then a drive assembly drives the support member to descend until the support member can place the wafer on a support post. Simultaneously with the wafer's descent, the drive assembly drives multiple alignment components to synchronously approach along the radial direction of a first through-hole. These alignment components simultaneously abut against the edge of the wafer located on the support post, achieving wafer alignment and correction. After wafer alignment is complete, the drive assembly simultaneously drives the support member to rise and lift the aligned wafer, meeting the working height and conveying requirements of the equipment in the next process, and drives the multiple alignment components to synchronously move away along the radial direction of the first through-hole, awaiting the alignment of the next wafer. This invention, through its drive assembly's ability to simultaneously drive the support member's lifting and lowering and the wafer alignment, and the synchronous abutment of multiple alignment components against the wafer edge, can accommodate the alignment of various wafer models, improving the versatility of the wafer alignment device. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the wafer alignment device provided in a specific embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the wafer in the centering state provided by a specific embodiment of the present invention;

[0027] Figure 3 This is one of the partial structural schematic diagrams of the wafer alignment device provided in a specific embodiment of this utility model;

[0028] Figure 4 This is the second partial structural schematic diagram of the wafer alignment device provided in a specific embodiment of this utility model.

[0029] The markings in the image are as follows:

[0030] 100. Wafer;

[0031] 1. Base plate;

[0032] 2. Fixing plate; 21. First through hole; 22. Guide hole;

[0033] 3. Columns;

[0034] 4. Support components; 41. Suction cup;

[0035] 5. Drive assembly; 51. First drive component; 511. Support base; 512. Servo motor; 513. Second synchronous belt; 514. Transmission wheel; 52. Limiting component; 521. Limiting block; 522. First slider; 523. First slide rail; 53. Drive wheel; 54. Drive nut; 55. Second drive component; 551. Driven wheel; 552. First synchronous belt; 553. Second slide rail; 554. Second slider;

[0036] 6. Alignment component; 61. Connecting block; 62. Positioning shaft; 63. Detection sensor;

[0037] 7. Support columns. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0039] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0042] like Figure 1 and Figure 2 As shown, this embodiment provides a wafer alignment device, which includes a base plate 1, a fixing plate 2, a support member 4, a driving assembly 5, multiple support pillars 7, and multiple alignment components 6. Specifically, the fixing plate 2 is connected to the base plate 1 and located above the base plate 1, and the fixing plate 2 is provided with a first through hole 21; the support member 4 passes through the first through hole 21 and supports the wafer 100; multiple support pillars 7 are disposed on the fixing plate 2; the driving assembly 5 is disposed on the base plate 1, and the driving assembly 5 is connected to the support member 4 and is used to drive the support member 4 to move up and down, so that the support member 4 can place the wafer 100 on the support pillars 7; multiple alignment components 6 are symmetrically arranged relative to the first through hole 21; the driving assembly 5 is connected to the multiple alignment components 6 and is used to drive the multiple alignment components 6 to synchronously approach or move away from the first through hole 21 radially, and the multiple alignment components 6 can synchronously abut against the edge of the wafer 100 located on the support pillars 7. In this embodiment, a plurality of columns 3 are provided between the base plate 1 and the fixing plate 2. One end of the column 3 is connected to the base plate 1 and the other end is connected to the fixing plate 2. The driving component 5 is located between the base plate 1 and the fixing plate 2.

[0043] When wafer 100 needs to be aligned, wafer 100 is first placed on support 4, and then drive assembly 5 drives support 4 to descend until support 4 can place wafer 100 on support post 7. While wafer 100 descends, drive assembly 5 drives multiple alignment components 6 to approach synchronously along the radial direction of first through hole 21. Multiple alignment components 6 simultaneously abut against the edge of wafer 100 located on support post 7 to achieve alignment and correction of wafer 100. After wafer 100 is aligned, drive assembly 5 simultaneously drives support 4 to rise and lift the aligned wafer 100 to meet the working height and conveying requirements of the equipment in the next process, and drives multiple alignment components 6 to move synchronously away along the radial direction of first through hole 21, waiting for the next wafer 100 to be aligned. In this embodiment, the drive component 5 can simultaneously drive the support component 4 to rise and fall and the wafer 100 to be aligned. The alignment method in which multiple alignment components 6 synchronously abut against the edge of the wafer 100 can meet the alignment requirements of various types of wafers 100 and improve the versatility of the wafer alignment device.

[0044] like Figure 3 and Figure 4 As shown, in this embodiment, the drive assembly 5 includes a first drive component 51, a limiting component 52, a drive wheel 53, and a drive nut 54. The first drive component 51 is disposed on the base plate 1 and is driven and connected to the drive wheel 53. The drive wheel 53 is connected to the drive nut 54. The support member 4 is a lead screw, and the drive nut 54 is threadedly connected to the lead screw. The axes of the lead screw, the drive nut 54, and the drive wheel 53 are collinear. The limiting component 52 is used to limit the rotation of the lead screw. When the first drive component 51 drives the drive wheel 53 to rotate, the limiting component 52 limits the rotation of the lead screw, and the drive nut 54 drives the lead screw to rise and fall, thereby realizing the lifting and lowering of the wafer 100.

[0045] Preferably, the limiting component 52 includes a limiting block 521, a first slider 522, and a first slide rail 523. The first slide rail 523 extends along the axis of the support member 4. The limiting block 521 is connected to the lead screw and the first slider 522, and the first slider 522 is slidably connected to the first slide rail 523. When the driving nut 54 drives the support member 4 to rise and fall, the first slider 522 slides relative to the first slide rail 523. The limiting block 521 can restrict the rotation of the support member 4 without affecting the rising and falling of the support member 4.

[0046] Furthermore, the drive assembly 5 includes multiple second drive components 55, each corresponding to a centering assembly 6. Each second drive component 55 includes a driven wheel 551 and a first synchronous belt 552. The driven wheel 551 and the drive wheel 53 are radially spaced along the first through hole 21. One end of the first synchronous belt 552 is wound around the driven wheel 551, and the other end is wound around the drive wheel 53. The centering assembly 6 is connected to the first synchronous belt 552. The first synchronous belts 552 of the multiple second drive components 55 are vertically spaced. When the first drive component 51 drives the drive wheel 53 to rotate, it can drive the first synchronous belt 552 to move radially along the first through hole 21, thereby driving the centering assembly 6 radially along the first through hole 21. Since the first synchronous belts 552 of the multiple second drive components 55 are vertically spaced, the drive wheel 53 can simultaneously drive multiple first synchronous belts 552 to move, thereby driving multiple centering assemblies 6 to synchronously move closer or further away radially along the first through hole 21. When the first driving component 51 drives the centering assembly 6 to move, it also drives the lead screw to lift and lower, which can synchronously drive the centering and lifting of the wafer 100, thereby improving production efficiency.

[0047] In this embodiment, the inner side of the first synchronous belt 552 is provided with a first tooth groove, and the outer walls of the drive wheel 53 and the driven wheel 551 are provided with a second tooth groove that meshes with the first tooth groove, thereby improving the movement accuracy of the first synchronous belt 552 and preventing the first synchronous belt 552 from slipping.

[0048] In this embodiment, there are six centering components 6 and six second driving components 55. The width of the second tooth groove on the driving wheel 53 is not less than the sum of the widths of the six first synchronous belts 552. Each driven wheel 551 is connected to the driving wheel 53 through a first synchronous belt 552. The six first synchronous belts 552 are arranged from top to bottom. When the driving wheel 53 rotates in the forward or reverse direction, it drives the six first synchronous belts 552 to rotate. The six centering components 6 move closer to or further away from the wafer 100 along with the first synchronous belts 552 to achieve clamping and centering of the wafer 100.

[0049] Preferably, the fixing plate 2 is provided with a plurality of guide holes 22 at intervals along the circumference of the first through hole 21, and the plurality of guide holes 22 extend radially along the first through hole 21; a plurality of centering components 6 correspond one-to-one with the plurality of guide holes 22, the centering components 6 are slidably connected to the guide holes 22, and the guide holes 22 provide guidance for the centering components 6, thereby improving the movement accuracy of the centering components 6.

[0050] In this embodiment, the centering component 6 includes a connecting block 61 and a positioning shaft 62. The connecting block 61 is slidably connected to the guide hole 22. One end of the connecting block 61 is connected to the first synchronous belt 552, and the other end is connected to the positioning shaft 62. The positioning shaft 62 is used to abut against the outer edge of the wafer 100. When the first driving component 51 drives the first synchronous belt 552 to move, the first synchronous belt 552 can drive the connecting block 61 and the positioning shaft 62 to move, so that the multiple positioning shafts 62 can abut against the edge of the wafer 100.

[0051] Preferably, the part where the positioning shaft 62 contacts the wafer 100 is provided with a soft coating to protect the wafer 100 and prevent damage to the wafer 100.

[0052] More preferably, the second driving component 55 further includes a second slide rail 553 and a second slider 554. The second slide rail 553 extends along the length of the guide hole 22 and is connected to the fixed plate 2. The second slider 554 is connected to the connecting block 61 and is slidably connected to the second slide rail 553. The connecting block 61 can slide under the guidance of the second slide rail 553 and the second slider 554, improving the moving accuracy and smoothness of the centering component 6.

[0053] More preferably, the alignment component 6 further includes a detection sensor 63, which is used to detect the state of the positioning axis 62 abutting against the wafer 100. The detection sensor 63 determines whether the positioning axis 62 has touched the wafer 100. The combination of multiple positioning axes 62 and detection sensors 63 can determine whether the wafer 100 is aligned, which can effectively avoid problems such as insufficient accuracy due to insufficient clamping during alignment caused by deviations in the size of the wafer 100, or wafer breakage or chipping due to excessive clamping.

[0054] To match wafer 100 with notches or flat edges, at least four alignment components 6 are required. The alignment of wafer 100 is completed when at least three alignment components 6 are abutted against wafer 100.

[0055] Preferably, a suction cup 41 is provided on the top of the support member 4, and an air passage is provided in the center of the support member 4. One end of the air passage is connected to the suction cup 41, and the other end is connected to a vacuum device, so that the external vacuum device can provide negative pressure to adsorb and fix the wafer 100 on the suction cup 41. When the wafer 100 is placed on the support member 4, the suction cup 41 can vacuum adsorb the wafer 100, improving the stability of the wafer 100. When the support member 4 descends, causing the wafer 100 to move above the support pillars 7, the suction cup 41 stops adsorbing. At this time, the wafer 100 can move relative to the multiple support pillars 7, which facilitates the centering of the wafer 100.

[0056] Furthermore, the drive wheel 53 is provided with a second through hole, and the drive wheel 53 is rotatably connected to the base plate 1 or the fixed plate 2. The limiting member 52 is located below the drive wheel 53, and the support member 4 passes through the second through hole and extends into the lower part of the drive wheel 53 to connect with the limiting member 52.

[0057] To avoid the positions of the limiting component 52 and the bottom of the support member 4, in this embodiment, the first driving component 51 includes a support base 511, a servo motor 512, a second synchronous belt 513, and a transmission wheel 514. The support base 511 is mounted on the base plate 1, the servo motor 512 is disposed on the support base 511, and the servo motor 512 is driven and connected to the transmission wheel 514. One end of the second synchronous belt 513 is wound around the transmission wheel 514, and the other end is wound around the driving wheel 53. When the servo motor 512 rotates forward or reverse, it can synchronously drive the centering and lifting of the wafer 100, thereby improving production efficiency. The support base 511 is disposed on one side of the driving wheel 53, avoiding the positions of the limiting component 52 and the bottom of the support member 4. The limiting component 52 is disposed on the side wall of the support base 511.

[0058] like Figures 1-4 As shown, it should be noted that this embodiment also provides the working steps of the wafer alignment device, as follows:

[0059] Step 1: With the device powered on, wafer 100 is placed on the suction cup 41 at the top of support 4. The suction cup 41 is vacuum-activated. At this time, support 4 is at its highest point, and positioning axis 62 and detection sensor 63 are in their initial state, located at the maximum diameter.

[0060] Step 2: The servo motor 512 starts running, the lead screw descends, and when the suction cup 41 drives the wafer 100 to the position of the support column 7, the suction cup 41 closes the vacuum, the wafer 100 is placed on the support column 7, and the positioning axis 62 of the centering component 6 and the detection sensor 63 move inward synchronously.

[0061] Step 3: The servo motor 512 continues to run, and the drive wheel 53 drives the suction cup 41 to continue to descend. The positioning shaft 62 of the centering component 6 and the detection sensor 63 move inward synchronously. The wafer 100 is supported by at least three support pillars 7. The positioning shaft 62 moves inward to clamp the wafer 100. In this embodiment, there are six detection sensors 63. Since the wafer 100 has a notch or flat edge, when more than five or more detection sensors 63 determine that the wafer is clamped in place, the servo motor 512 stops rotating, and the wafer 100 is centered.

[0062] Step 4: The servo motor 512 reverses, the positioning axis 62 of the centering component 6 and the detection sensor 63 move outward, the support 4 drives the suction cup 41 to rise, when it reaches the height of the support column 7, the vacuum of the suction cup 41 is opened, adsorbs the wafer 100 and continues to rise, returning to the original state.

[0063] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A wafer alignment device, characterized in that, include: A base plate (1) and a fixing plate (2), wherein the fixing plate (2) is connected to the base plate (1) and located above the base plate (1), and the fixing plate (2) is provided with a first through hole (21); A support member (4) passes through the first through hole (21) and supports the wafer (100); Multiple support columns (7) are disposed on the fixed plate (2); A drive assembly (5) is disposed on the base plate (1). The drive assembly (5) is driven and connected to the support member (4) and is used to drive the support member (4) to rise and fall so that the support member (4) can place the wafer (100) on the support column (7). Multiple centering components (6) are symmetrically arranged relative to the first through hole (21); the driving component (5) is connected to the multiple centering components (6) and is used to drive the multiple centering components (6) to move synchronously closer or further away from the first through hole (21) in the radial direction; the multiple centering components (6) can synchronously abut against the edge of the wafer (100) located on the support post (7).

2. The wafer alignment device according to claim 1, characterized in that, The drive assembly (5) includes a first drive component (51), a limiting component (52), a drive wheel (53), and a drive nut (54). The first drive component (51) is disposed on the base plate (1) and drivenly connected to the drive wheel (53). The drive wheel (53) is connected to the drive nut (54). The support member (4) is a lead screw. The drive nut (54) is threadedly connected to the lead screw. The axes of the lead screw, the drive nut (54), and the drive wheel (53) are collinear. The limiting component (52) is used to limit the rotation of the lead screw.

3. The wafer alignment device according to claim 2, characterized in that, The limiting component (52) includes a limiting block (521), a first slider (522) and a first slide rail (523). The first slide rail (523) extends along the axial direction of the support member (4). The limiting block (521) is connected to the lead screw and the first slider (522). The first slider (522) is slidably connected to the first slide rail (523).

4. The wafer alignment device according to claim 2, characterized in that, The drive assembly (5) includes a plurality of second drive components (55), each of which corresponds to one of the centering assembly (6). Each second drive component (55) includes a driven wheel (551) and a first synchronous belt (552). The driven wheel (551) and the drive wheel (53) are arranged radially at intervals along the first through hole (21). One end of the first synchronous belt (552) is wound around the driven wheel (551), and the other end is wound around the drive wheel (53). The centering assembly (6) is connected to the first synchronous belt (552). The first synchronous belts (552) of the plurality of second drive components (55) are arranged at intervals along the vertical direction.

5. The wafer alignment device according to claim 4, characterized in that, The fixing plate (2) is provided with a plurality of guide holes (22) spaced circumferentially along the first through hole (21), and the plurality of guide holes (22) extend radially along the first through hole (21); a plurality of centering components (6) correspond one-to-one with the plurality of guide holes (22), and the centering components (6) are slidably connected to the guide holes (22).

6. The wafer alignment device according to claim 5, characterized in that, The centering component (6) includes a connecting block (61) and a positioning shaft (62). The connecting block (61) is slidably connected to the guide hole (22). One end of the connecting block (61) is connected to the first synchronous belt (552), and the other end is connected to the positioning shaft (62). The positioning shaft (62) is used to abut against the outer edge of the wafer (100).

7. The wafer alignment apparatus according to claim 6, characterized in that, The second driving component (55) further includes a second slide rail (553) and a second slider (554). The second slide rail (553) extends along the length direction of the guide hole (22) and is connected to the fixing plate (2). The second slider (554) is connected to the connecting block (61) and is slidably connected to the second slide rail (553).

8. The wafer alignment device according to claim 6, characterized in that, The centering component (6) further includes a detection sensor (63) for detecting the state of the positioning axis (62) abutting the wafer (100).

9. The wafer alignment device according to claim 1, characterized in that, The top of the support member (4) is provided with a suction cup (41), and the center of the support member (4) is provided with an air passage. One end of the air passage is connected to the suction cup (41), and the other end is connected to a vacuum device.

10. The wafer alignment apparatus according to claim 1, characterized in that, The centering component (6) is at least four.

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