Ejector pin mechanism and bonding apparatus

By designing a needle mechanism that switches the adsorption airway, the problem of insufficient adaptability of traditional needle mechanisms is solved, and the adaptability and cost-effectiveness of chips of different sizes are improved.

CN224306277UActive Publication Date: 2026-05-29天津中科晶禾电子科技有限责任公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
天津中科晶禾电子科技有限责任公司
Filing Date
2025-05-16
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Traditional ejector pin mechanisms lack adaptability and are difficult to be compatible with chips of different sizes. This results in the need to stop the machine to replace components or make repeated adjustments when changing specifications, which is inefficient. Furthermore, the fixed adsorption force mode is prone to causing damage to microchips or displacement of large-sized chips, making it difficult to guarantee the yield rate.

Method used

By switching the adsorption gas channels, a pin mechanism is designed, including a housing, a pin assembly, a lifting assembly, and a connector. Different adsorption gas channels provide different adsorption gas flow rates to adapt to the adsorption needs of chips of different sizes and improve applicability.

Benefits of technology

It can be adapted to different types of chips without changing the ejector pin mechanism, reducing manufacturing costs, improving compatibility and production efficiency, and reducing the risk of chip damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of ejector pin mechanism and bonding equipment, belong to semiconductor equipment technical field.Ejector pin mechanism includes shell, ejector pin assembly, jack-up assembly and connecting piece.Ejector pin assembly includes the ejector pin containing first air passage, and ejector pin assembly is configured to move along first direction to make the telescopic of ejector pin relative to first end portion.Jack-up assembly includes the jack-up rod of being passed and being contained second air passage in shell.Connecting piece includes the first end surface, second end surface and third end surface with air passage communication, and the first end surface, second end surface of connecting piece are sealedly connected with ejector pin assembly, jack-up assembly respectively.Third air passage is located in shell, and third air passage is sealedly connected with third end surface.First air passage, connecting piece, second air passage are sealedly connected and form first suction air passage.First air passage, connecting piece, third air passage are sealedly connected and form second suction air passage.First suction air passage and second suction air passage have different suction gas flow.The utility model can improve the applicability of ejector pin mechanism.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a pin mechanism and a bonding device. Background Technology

[0002] In semiconductor chip manufacturing processes, the ejector pin mechanism is a core component for chip transfer, testing, and packaging after wafer dicing. It uses an array of ejector pins to vertically lift the chip and apply vacuum suction force, ensuring chip positioning accuracy and operational stability. However, with the diversification of chip sizes, the widespread adoption of heterogeneous integration technology, and the increasing demand for flexible production lines, the adaptability bottleneck of traditional ejector pin mechanisms has become increasingly prominent. Vacuum suction force parameters must be strictly matched to chip specifications, resulting in a single mechanism only being compatible with chips of a specific size. Changing specifications requires downtime for component replacement or repeated adjustments, significantly reducing efficiency. Simultaneously, the fixed suction force mode is incompatible with the mechanical properties of chips of different sizes, easily leading to damage to microchips or displacement of large chips, making it difficult to guarantee yield. Furthermore, in mixed-size processing scenarios, traditional mechanisms lack adaptive adjustment capabilities and heavily rely on specialized tooling, hindering the intelligent upgrading of production lines.

[0003] This section provides background information related to this application, which is not necessarily prior art. Utility Model Content

[0004] The purpose of this invention is to provide a pin mechanism and bonding device that can improve the applicability of the pin mechanism and reduce the manufacturing cost by switching the adsorption gas channel.

[0005] To achieve the above objectives, the following technical solution is provided:

[0006] A pin mechanism, comprising:

[0007] The housing includes a first end portion disposed along a first direction;

[0008] A ejector assembly, located within the housing, includes an ejector pin containing a first air passage, the ejector assembly being configured to move along the first direction to extend or retract the ejector pin relative to the first end;

[0009] The lifting assembly includes a lifting rod that passes through the housing and has a second air passage;

[0010] The connector includes a first end face, a second end face, and a third end face connected by an air passage. The ejector assembly and the lifting assembly are respectively sealed to the first end face and the second end face of the connector. The third air passage is disposed in the housing and is sealed to the third end face.

[0011] The first air passage, the connector, and the second air passage are sealed together to form a first adsorption air passage; the first air passage, the connector, and the third air passage are sealed together to form a second adsorption air passage; the first adsorption air passage and the second adsorption air passage have different adsorption gas flow rates.

[0012] As an alternative to the ejector mechanism, the ejector mechanism is configured to switch between opening the first adsorption airway and the second adsorption airway.

[0013] As an optional solution for the ejector pin mechanism, the first end face and the second end face are respectively disposed on two opposite sides of the connector along the first direction, and the third end face is disposed on one side of the connector along the second direction, the second direction intersecting the first direction.

[0014] As an optional solution for the ejector mechanism, the air passage connecting the first end face and the second end face is a first branch air passage. The ejector assembly is sealed to the first end face, and the lifting assembly is sealed to the second end face. The cross-sectional area of ​​the first branch air passage near the second end face is smaller than the cross-sectional area of ​​the first branch air passage near the first end face.

[0015] As an alternative to the ejector mechanism, the airway connecting the third end face and the first airway is a second airway, and the cross-sectional area of ​​the end of the second airway near the third end face is smaller than the cross-sectional area of ​​the end of the second airway near the first airway.

[0016] As an optional solution for the ejector mechanism, the flow resistance characteristics of the second air passage are greater than or less than those of the third air passage.

[0017] As an optional solution for the ejector mechanism, the cross-sectional area of ​​the second airway is greater than or less than the cross-sectional area of ​​the third airway.

[0018] As an optional solution for the ejector mechanism, a switching device is also included. The exhaust end of the second air passage and the exhaust end of the third air passage are both connected to the switching device. The switching device is used to switch the connection between the second air passage or the third air passage and the external exhaust device.

[0019] As an alternative to the ejector mechanism, the outer casing includes a housing, a first cover, and a second cover. The housing includes two openings opposite to each other along the first direction. The first cover and the second cover respectively cover the two openings. The first end includes the first cover.

[0020] As an alternative to the ejector mechanism, the third channel is provided in the second cover, the second cover is provided with a connecting hole, and the lifting assembly passes through the connecting hole to extend into the housing.

[0021] A bonding device comprising a pin mechanism as described in any of the preceding embodiments.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] The ejector mechanism and bonding device provided by this utility model include a housing, an ejector assembly, a lifting assembly, and a connector. Driven by the lifting assembly, the ejector assembly can extend and retract relative to the first end, either extending to the outside of the first end or retracting into the housing. The first and second adsorption channels have different adsorption gas flow rates, and can provide different adsorption forces to the end of the first channel. This allows the ejector mechanism to adsorb chips of different sizes and specifications, adapting to different types of chips without requiring replacement of the ejector mechanism, thus improving the adaptability of the ejector mechanism and reducing manufacturing costs. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0025] Figure 1 This is a cross-sectional schematic diagram of a pin mechanism in an embodiment of the present utility model;

[0026] Figure 2 for Figure 1 A magnified structural diagram of point P in the middle;

[0027] Figure 3 for Figure 1 Another enlarged structural diagram at point P;

[0028] Figure 4 for Figure 1 Another enlarged structural diagram at point P;

[0029] Figure 5 This is a cross-sectional schematic diagram of another ejector pin mechanism in an embodiment of this utility model.

[0030] Figure label:

[0031] 1. Outer shell; 10. First end; 11. Third air passage; 12. Shell; 13. First cover; 14. Second cover; 2. Ejector assembly; 20. Ejector; 21. First air passage; 3. Lifting assembly; 30. Lifting rod; 31. Second air passage; 4. Connector; 41. First end face; 42. Second end face; 43. Third end face; 44. First branch air passage; 45. Second branch air passage; 5. Switching device; X, First direction; Y, Second direction. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0036] Figure 1 This is a cross-sectional schematic diagram of a pin mechanism in an embodiment of the present utility model. Figure 2 for Figure 1 A magnified structural diagram of point P in the middle. Figure 3 for Figure 1 Another enlarged structural diagram at point P. Figure 4 for Figure 1 Another enlarged structural diagram at point P. Figure 5 This is a cross-sectional schematic diagram of another ejector pin mechanism in an embodiment of this utility model.

[0037] Please see Figure 1 and Figure 2 This utility model provides a pin mechanism, which includes a housing 1, a pin assembly 2, a lifting assembly 3, and a connector 4. The housing 1 includes a first end portion 10 disposed along a first direction X. The pin assembly 2 is located inside the housing 1 and includes a pin 20 containing a first air passage 21. The pin assembly 2 is configured to move along the first direction X to extend or retract the pin 20 relative to the first end portion 10. The lifting assembly 3 includes a lifting rod 30 passing through the housing 1 and containing a second air passage 31. The connector 4 includes a first end face 41, a second end face 42, and a third end face 43 connected by air passages. The pin assembly 2 and the lifting assembly 3 are respectively sealed to the first end face 41 and the second end face 42 of the connector 4. A third air passage 11 is disposed in the housing 1 and is sealed to the third end face 43. The first air passage 21, the connector 4, and the second air passage 31 are sealed to form a first adsorption air passage. The first air passage 21, the connector 4, and the third air passage 11 are sealed to form a second adsorption air passage. The first adsorption channel and the second adsorption channel have different adsorption gas flow rates.

[0038] The outer casing 1 is used to house the ejector pin assembly 2. The outer casing 1 can serve as a protective part for the ejector pin assembly 2, and the outer casing 1 can have a housing space. The outer casing 1 includes a first end portion 10 disposed along a first direction X. The first end portion 10 may be provided with a clearance opening, through which the ejector pin assembly 2 can extend to the outside of the outer casing 1. Optionally, the number of clearance openings and the number of ejector pins 20 in the ejector pin assembly 2 can be configured in a one-to-one correspondence. The shape of the outer casing 1 is not limited in this application embodiment. The shape of the outer casing 1 may include a cylindrical, cuboid, frustum-shaped, or other shape extending along the first direction X.

[0039] The ejector assembly 2 includes ejector pins 20, and the number of ejector pins 20 may be one or more. When there are multiple ejector pins 20, each ejector pin 20 has a first air passage 21. Each ejector pin 20 includes a body and the first air passage 21 located within the body; in other words, the body of the ejector pin 20 is a hollow structure. The ejector assembly 2 is configured to move along a first direction X to extend and retract the ejector pins 20 relative to the first end 10. This can be understood as follows: when the lifting rod 30 of the lifting assembly 3 moves along the first direction X, it can drive the ejector pins 20 to move along the first direction X, thereby extending and retracting the ejector pins 20 relative to the first end 10. Here, "extension and retraction" refers to the ejector pin 20 extending beyond the first end 10 to the outside of the housing 1 and retracting into the housing 1. When the ejector pin 20 extends beyond the first end 10 to the outside of the housing 1, it can be used to lift the chip, facilitating the robotic arm to pick it up.

[0040] The lifting assembly 3 includes a lifting rod 30. A portion of the lifting rod 30 may be located inside the housing 1, and another portion may be located outside the housing 1. The lifting rod 30 can move along a first direction X. When the lifting rod 30 moves downward, it can drive the ejector pin assembly 2 to move downward. When the lifting rod 30 moves upward, it can drive the ejector pin assembly 2 to move upward. Here, "moving upward" refers to moving towards the first end 10, and "moving downward" refers to moving away from the first end 10.

[0041] The lifting rod 30 includes a second air passage 31, that is, the lifting rod 30 is a hollow rod-shaped structure, and the end of the lifting rod 30 away from the first end 10 is the exhaust end, and an external exhaust device can be connected to the exhaust end.

[0042] The connector 4 includes a first end face 41, a second end face 42, and a third end face 43 connected by air passages. This can be understood as follows: the first end face 41 and the second end face 42 are connected by air passages; the second end face 42 and the third end face 43 are connected by air passages; and the third end face 43 and the first end face 41 are connected by air passages. In some examples, the first end face 41, the second end face 42, and the third end face 43 are interconnected by sharing a common air passage. In other examples, the first end face 41, the second end face 42, and the third end face 43 can also be interconnected by independently configured air passages.

[0043] The ejector pin assembly 2 is sealed to the first end face 41 of the connector 4, the lifting assembly 3 is sealed to the second end face 42 of the connector 4, and the third air passage 11 disposed in the housing 1 is sealed to the third end face 43 of the connector 4. Here, "sealed connection" can refer to a direct sealed connection between the two components or an indirect sealed connection between the two components through other components. For example, the ejector pin 20 of the ejector pin assembly 2 is connected to the first end face 41, so that the first air passage 21 communicates with and is sealed to the air passage within the first end face 41. The lifting rod 30 of the lifting assembly 3 is connected to the second end face 42, so that the second air passage 31 communicates with and is sealed to the air passage within the second end face 42. The third air passage 11 disposed in the housing 1 and the third end face 43 of the connector 4 can be connected via a flexible hose, so that the third air passage 11 communicates with and is sealed to the air passage within the third end face 43.

[0044] The first air passage 21, the connector 4, and the second air passage 31 are sealed together to form the first adsorption air passage. It can be understood that the adsorption end of the first adsorption air passage is the end opening of the first air passage 21, and the exhaust end of the first adsorption air passage is the end opening of the second air passage 31.

[0045] The first air passage 21, the connector 4, and the third air passage 11 are sealed together to form the second adsorption air passage. It can be understood that the adsorption end of the second adsorption air passage is the end opening of the first air passage 21, and the exhaust end of the second adsorption air passage is the end opening of the third air passage 11.

[0046] The first and second adsorption channels have different adsorption gas flow rates. For example, the adsorption gas flow rate of the first adsorption channel is greater than that of the second adsorption channel, or the adsorption gas flow rate of the first adsorption channel is less than that of the second adsorption channel. It is understood that a higher adsorption gas flow rate results in stronger adsorption force at the end of the first channel 21 and stronger adsorption force of the ejector pin 20 on the chip. When adsorbing chips with larger dimensions (such as thickness or area perpendicular to the thickness direction), an adsorption channel with a higher adsorption gas flow rate can be used to reduce the risk of chip shaking or even falling during the ejector pin 20's lifting process. Conversely, a lower adsorption gas flow rate results in weaker adsorption force at the end of the first channel 21 and weaker adsorption force of the ejector pin 20 on the chip. When adsorbing chips with smaller dimensions (such as thickness or area perpendicular to the thickness direction), an adsorption channel with a lower adsorption gas flow rate can be used to reduce the risk of chip breakage during ejector pin 20 adsorption.

[0047] Optionally, the first and second adsorption channels can be selectively opened, i.e., only the first adsorption channel can be opened, or only the second adsorption channel can be opened. Of course, the first and second adsorption channels can also be opened simultaneously. When the first and second adsorption channels are opened at the same time, since the adsorption forces of the first and second adsorption channels are different, the adsorption force generated after simultaneous opening is less than the maximum adsorption force generated by the two adsorption channels, but greater than the minimum adsorption force generated by the two adsorption channels, so that the ejector pin mechanism can adsorb chips of various different specifications.

[0048] In the ejector mechanism provided in this application embodiment, the ejector mechanism includes a housing 1, an ejector assembly 2, a lifting assembly 3, and a connector 4. Driven by the lifting assembly 3, the ejector assembly 2 can extend and retract relative to the first end 10 to extend to the outside of the first end 10 or retract into the housing 1. The first adsorption channel and the second adsorption channel have different adsorption gas flow rates, and the first and second adsorption channels can provide different adsorption forces to the end of the first channel 21. This allows the ejector mechanism to adsorb chips of different sizes and specifications, adapting to different types of chips without replacing the ejector mechanism, improving the adaptability of the ejector mechanism and reducing manufacturing costs.

[0049] In some alternative embodiments, the ejector mechanism is configured to switch between opening the first adsorption channel and the second adsorption channel, for example, the adsorption gas flow rate of the first adsorption channel is less than that of the second adsorption channel. When the ejector mechanism requires a weaker adsorption force, it can open only the first adsorption channel; when it requires a stronger adsorption force, it can open only the second adsorption channel, thereby simplifying the control device of the ejector mechanism and reducing the difficulty of the production process.

[0050] In some alternative embodiments, please refer to Figure 1 and Figure 2 The first end face 41 and the second end face 42 are respectively located on opposite sides of the connector 4 along the first direction X, and the third end face 43 is located on one side of the connector 4 along the second direction Y, which intersects the first direction X. Optionally, the second direction Y is perpendicular to the first direction X.

[0051] Optionally, the projections of the first end face 41 along the first direction X and the second end face 42 along the first direction X are at least partially overlapped to shorten the length of the airway connecting the first end face 41 and the second end face 42, while increasing the cross-sectional area of ​​the airway connecting the first end face 41 and the second end face 42. Of course, the projections of the first end face 41 along the first direction X and the second end face 42 along the first direction X can also be spaced apart.

[0052] Optionally, the third end face 43 may be located on the side of the connector 4 close to the third air passage 11 along the second direction Y; or, the third end face 43 may be located on the side of the connector 4 away from the third air passage 11 along the second direction Y.

[0053] In these alternative embodiments, placing the first end face 41 and the second end face 42 on different sides of the connector 4 helps to simplify the connection structure between the ejector pin assembly 2 and the lifting assembly 3; placing the second end face 42 and the third end face 43 on different sides of the connector 4 helps to reduce the possibility of interference between the connection structure of the lifting assembly 3 and the third air passage 11 and the third end face 43, reduce the installation difficulty of the ejector pin mechanism, and improve assembly efficiency.

[0054] In some alternative embodiments, please refer to Figure 1 and Figure 3 The airway connecting the first end face 41 and the second end face 42 is the first branch airway 44. The ejector assembly 2 is sealed to the first end face 41, and the lifting assembly 3 is sealed to the second end face 42. The cross-sectional area of ​​the first branch airway 44 near the second end face 42 is smaller than the cross-sectional area of ​​the first branch airway 44 near the first end face 41.

[0055] For example, the cross-sectional size of the first air passage 44 gradually increases from the second end face 42 to the first end face 41; of course, it can also increase in a stepwise manner. It is understood that a larger cross-sectional size results in a slower flow rate, while a smaller cross-sectional size results in a faster flow rate. This allows the first air passage 44 to form a gas flow rate amplification structure, enabling the external exhaust device to achieve a larger gas flow rate within the first air passage 21 using a smaller exhaust rate, thereby reducing the power requirement of the external exhaust device and lowering production costs.

[0056] In some alternative embodiments, please refer to Figure 1 and Figure 4 The airway connecting the third end face 43 and the first branch airway 44 is the second branch airway 45. The cross-sectional area of ​​the end of the second branch airway 45 near the third end face 43 is smaller than the cross-sectional area of ​​the end of the second branch airway 45 near the first branch airway 44.

[0057] For example, the cross-sectional size of the second airway 45 gradually increases from the third end face 43 towards the first airway 44; of course, it can also increase in a stepwise manner. It is understood that a larger cross-sectional size results in a slower flow rate, while a smaller cross-sectional size results in a faster flow rate. This allows the second airway 45 to form a gas flow rate amplification structure, enabling the external exhaust device to achieve a larger gas flow rate within the first airway 21 using a smaller exhaust rate, thereby reducing the power requirement of the external exhaust device and lowering production costs. Furthermore, the second airway 45 connects to the first airway 44, making a portion of the airway structure of the first airway 44 a shared airway structure connecting the first end face 41 and the second end face 42, and connecting the first end face 41 and the third end face 43. This simplifies the internal airway structure of the connector 4, reduces the manufacturing difficulty of the connector 4, and lowers manufacturing costs.

[0058] In some alternative embodiments, the flow resistance characteristics of the second air passage 31 are greater than or less than the flow resistance characteristics of the third air passage 11.

[0059] Flow resistance characteristics refer to the degree of obstruction to flow of a fluid (such as gas or liquid) when it passes through a pipe or other flow path, due to factors such as pipe geometry, material properties, and fluid properties. The flow resistance characteristics of the second air passage 31 and the third air passage 11 can be adjusted by adjusting the cross-sectional area, length, shape, and inner wall roughness of the second air passage 31 and the third air passage 11.

[0060] In some alternative embodiments, the cross-sectional area of ​​the second air passage 31 is greater than or less than the cross-sectional area of ​​the third air passage 11. The cross-sectional area of ​​the second air passage 31 can be adjusted according to the radial dimension of the lifting rod 30, thereby reducing the difficulty of manufacturing the lifting rod 30 and reducing the difficulty of adjusting the adsorption gas flow rate of the first and second adsorption air passages.

[0061] In some alternative embodiments, please refer to Figure 5 The ejector mechanism also includes a switching device 5. The exhaust end of the second air passage 31 and the exhaust end of the third air passage 11 are both connected to the switching device 5. The switching device 5 is used to switch the connection between the second air passage 31 or the third air passage 11 and the external exhaust device.

[0062] External exhaust systems include vacuum devices, such as vacuum pumps.

[0063] The switching device 5 can connect the external exhaust device to the second air passage 31 or to the third air passage 11. The switching device 5 can control whether the second air passage 31 and the third air passage 11 are connected to the external exhaust device by manual or automatic switching. Optionally, the switching device 5 may include a solenoid valve.

[0064] It is understandable that when the external exhaust device is connected to the second air passage 31, the first adsorption air passage is opened so that the ejector pin 20 can adsorb the chip; when the external exhaust device is connected to the third air passage 11, the second adsorption air passage is opened so that the ejector pin 20 can adsorb the chip. When the external exhaust device outputs a constant power, the switching device 5 can switch the conduction state of the second air passage 31 and the third air passage 11 with the external exhaust device, thereby switching the strength of the adsorption force of the ejector pin 20 on the chip, thereby improving the switching efficiency. This allows the ejector pin mechanism to lift chips of different sizes and specifications located on the same support platform, thus improving the applicability of the ejector pin mechanism.

[0065] In some alternative embodiments, please refer to Figure 1 and Figure 5 The outer shell 1 includes a shell 12, a first cover 13 and a second cover 14. The shell 12 includes two openings opposite each other along the first direction X. The first cover 13 and the second cover 14 respectively cover the two openings. The first end 10 includes the first cover 13.

[0066] Exemplarily, the housing 12 can enclose the sidewalls forming the receiving space, the first cover 13 can form the top wall of the receiving space, and the second cover 14 can form the bottom wall of the receiving space. Optionally, the first cover 13 can be connected to the housing 12 via a connecting structure; of course, the first cover 13 can also be directly connected to the housing 12. Optionally, the first cover 13 can be detachably connected to the housing 12 via a lock nut. Optionally, the second cover 14 can be connected to the housing 12 via a connecting structure; of course, the second cover 14 can also be directly connected to the housing 12. Optionally, the second cover 14 can be connected to the housing 12 via a nut.

[0067] The first end 10 includes a first cover 13, which causes the ejector pin 20 to extend or retract relative to the first cover 13 when the ejector pin assembly 2 moves along the first direction X.

[0068] In some alternative embodiments, please refer to Figure 5 The third channel is provided in the second cover 14, and the second cover 14 is provided with a connecting hole. The lifting component 3 passes through the connecting hole to extend into the housing 12.

[0069] For example, the third channel is provided to penetrate the second cover 14 along the first direction X. Of course, the extension direction of the third channel can also be other directions.

[0070] The lifting assembly 3 has a connecting hole to extend into the housing 12. It can be understood that a part of the structure of the lifting assembly 3 passes through the connecting hole into the housing 12 and connects with the connector 4, while another part of the structure of the lifting assembly 3 is located outside the housing 1 for connection with other structures.

[0071] In these alternative embodiments, by setting the connection of the third channel and the lifting component 3 on the second cover 14, it is beneficial to simplify the structure of the shell 12. The split structure of the shell 12 is beneficial to reduce the manufacturing difficulty of the installation mechanism and reduce the manufacturing difficulty and cost of the outer shell 1.

[0072] This embodiment provides a bonding device including the ejector mechanism of any of the above embodiments. Since the bonding device provided in this application includes the ejector mechanism of any of the above embodiments, it possesses the beneficial effects of the ejector mechanism of any of the above embodiments, which will not be elaborated further here.

[0073] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A pin mechanism, characterized in that, include: The outer casing (1) includes a first end portion (10) disposed along a first direction (X); A ejector assembly (2), located within the housing (1), includes an ejector (20) containing a first air passage (21), the ejector assembly (2) being configured to move along the first direction (X) to extend or retract the ejector (20) relative to the first end (10); The lifting assembly (3) includes a lifting rod (30) that passes through the housing (1) and includes a second air passage (31); The connector (4) includes a first end face (41), a second end face (42), and a third end face (43) connected by an air passage. The ejector assembly (2) and the lifting assembly (3) are respectively sealed to the first end face (41) and the second end face (42) of the connector (4). The third air passage (11) is disposed in the outer shell (1) and is sealed to the third end face (43). The first air passage (21), the connector (4), and the second air passage (31) are sealed together to form a first adsorption air passage; the first air passage (21), the connector (4), and the third air passage (11) are sealed together to form a second adsorption air passage; the first adsorption air passage and the second adsorption air passage have different adsorption gas flow rates.

2. The ejector mechanism according to claim 1, characterized in that, The ejector pin mechanism is configured to switch on and off between the first adsorption channel and the second adsorption channel.

3. The ejector mechanism according to claim 1, characterized in that, The first end face (41) and the second end face (42) are respectively disposed on the two sides opposite to each other along the first direction (X) of the connector (4), and the third end face (43) is disposed on one side of the connector (4) along the second direction (Y), which intersects with the first direction (X).

4. The ejector mechanism according to claim 3, characterized in that, The airway connecting the first end face (41) and the second end face (42) is the first branch airway (44). The pin assembly (2) is sealed to the first end face (41), and the lifting assembly (3) is sealed to the second end face (42). The cross-sectional area of ​​the first branch airway (44) near the second end face (42) is smaller than the cross-sectional area of ​​the first branch airway (44) near the first end face (41).

5. The ejector mechanism according to claim 4, characterized in that, The airway connecting the third end face (43) and the first branch airway (44) is the second branch airway (45). The cross-sectional area of ​​the second branch airway (45) near the third end face (43) is smaller than the cross-sectional area of ​​the second branch airway (45) near the first branch airway (44).

6. The ejector mechanism according to claim 1, characterized in that, The flow resistance characteristics of the second air passage (31) are greater than or less than the flow resistance characteristics of the third air passage (11).

7. The ejector mechanism according to claim 6, characterized in that, The cross-sectional area of ​​the second airway (31) is greater than or less than the cross-sectional area of ​​the third airway (11).

8. The ejector mechanism according to claim 1, characterized in that, It also includes a switching device (5), the exhaust end of the second air passage (31) and the exhaust end of the third air passage (11) are both connected to the switching device (5), the switching device (5) is used to switch the connection between the second air passage (31) or the third air passage (11) and the external exhaust device.

9. The ejector mechanism according to claim 1, characterized in that, The outer casing (1) includes a shell (12), a first cover (13) and a second cover (14). The shell (12) includes two openings opposite each other along the first direction (X). The first cover (13) and the second cover (14) respectively cover the two openings. The first end (10) includes the first cover (13).

10. The ejector mechanism according to claim 9, characterized in that, The third channel is provided in the second cover (14), the second cover (14) is provided with a connecting hole, and the lifting component (3) passes through the connecting hole to extend into the housing (12).

11. A bonding apparatus comprising a pin mechanism as described in any one of claims 1 to 10.