A special bonding clamp suitable for a full-automatic bonding machine

By integrating placement, fixing, clamping, and testing mechanisms into the bonding fixture, the problems of versatility and temperature control of existing bonding fixtures are solved, enabling efficient and precise chip processing.

CN224306278UActive Publication Date: 2026-05-29SICHUAN HUIFENG REFINING TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SICHUAN HUIFENG REFINING TECH CO LTD
Filing Date
2025-05-23
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing fully automatic bonding machines lack versatility in their dedicated bonding fixtures, requiring frequent fixture replacements and failing to meet constant temperature processing requirements, thus affecting equipment operating efficiency.

Method used

A dedicated bonding fixture adapted to fully automatic bonding machines has been designed, integrating placement, fixing, clamping, heating and detection mechanisms. It has versatility and constant temperature function, and achieves precise positioning and real-time monitoring through servo rotary electric cylinder and infrared distance sensor.

Benefits of technology

It improves the applicability of the fixture, reduces the frequency of fixture replacement, improves bonding yield and equipment operating efficiency, and enables real-time temperature control and high-precision positioning of the chip.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224306278U_ABST
    Figure CN224306278U_ABST
Patent Text Reader

Abstract

The utility model discloses a special bonding clamp of adapting full -automatic bonding machine, including the bottom plate, the top of bottom plate is provided with the placing mechanism for placing chip when using full -automatic bonding machine, the top of placing mechanism is provided with the fixed mechanism that fixes with top mechanism, the top of fixed mechanism is provided with the clamping mechanism for clamping the chip on placing mechanism, the below of placing mechanism is provided with the heating mechanism for making the chip keep constant temperature, the below of heating mechanism is provided with the connecting mechanism for equipment and bottom plate connection, the top of bottom plate is provided with the detection mechanism for detecting whether the chip is placed in the inside of placing mechanism, the utility model discloses the collaborative design of placing mechanism and clamping mechanism has improved the single adaptability problem of traditional clamp. Make the clamp compatible chip of different size and package form, can reduce the replacement frequency of clamp.
Need to check novelty before this filing date? Find Prior Art