A coating device for semiconductor production

Abstract

This utility model relates to the field of semiconductor manufacturing technology and discloses a coating device for semiconductor manufacturing, including a worktable. A mounting frame is fixedly connected to the upper surface of the worktable, and a coating device is disposed inside the mounting frame. Two placement plates are disposed on the upper surface of the worktable and are fixedly connected. A placement groove is formed on the upper surface of the placement plate, and a top plate is disposed inside the placement groove. Two clamping plates are disposed on the upper surface of the placement plate, and connecting plates are fixedly connected to both sides of the clamping plates. Through the cooperation between the connecting plates, driving plates, horizontal grooves, inclined grooves, fixing rods, through grooves, and other structures, the semiconductor is automatically ejected after the clamping is removed, which greatly facilitates the removal of the coated semiconductor by the operator, reduces the number of operation steps, has high practicality, facilitates the unloading of semiconductors, and is simple to operate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a coating device for semiconductor manufacturing. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors.

[0003] In the prior art, CN220496819U discloses a coating apparatus for semiconductor production. However, in actual use, after the semiconductor is placed in the groove on the surface of the placement plate and the coating is completed, the operator needs to hold both sides of the semiconductor and remove it from the groove. Due to the small contact area with the operator's hands, it is very likely that the semiconductor will slip out of the hand during unloading. In actual use, it is not convenient to remove the coated semiconductor, which has certain limitations and poor practicality. In view of this, we propose a coating apparatus for semiconductor production to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a coating apparatus for semiconductor production, thereby solving the problem that some existing semiconductor coating apparatuses are inconvenient for material unloading.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a coating apparatus for semiconductor production, comprising a worktable, a mounting frame fixedly connected to the upper surface of the worktable, a coating apparatus disposed inside the mounting frame, two placement plates fixedly connected to the upper surface of the worktable, a placement groove formed on the upper surface of the placement plate, a top plate disposed inside the placement groove, two clamping plates fixedly connected to both sides of the clamping plates, two sliding grooves formed on the upper surface of the placement plate, a connecting assembly disposed inside the sliding groove, the connecting assembly comprising a drive plate slidably connected inside the sliding groove, the drive plates inside the two sliding grooves being mirror images of each other, the two drive plates being fixedly connected to the connecting plates on both sides respectively, and a horizontal groove and an oblique groove formed inside the drive plate, the horizontal groove and the oblique groove being connected.

[0006] Preferably, the placement groove has a through groove inside, the through groove is connected to the sliding groove, and a fixing rod is fixedly connected to both sides of the top plate. The fixing rod is slidably connected inside the through groove, and the fixing rod extends into the sliding groove and is slidably connected inside the horizontal groove and the inclined groove.

[0007] Preferably, four fixing plates are fixedly connected to the upper surface of the placement plate, and a bidirectional threaded rod is rotatably connected between the two front fixing plates. The two front connecting plates are threaded onto the two opposite threads of the bidirectional threaded rod.

[0008] Preferably, a handle is fixedly connected to the left end of the bidirectional threaded rod, and the handle rotates through the interior of the left fixed plate.

[0009] Preferably, a guide rod is fixedly connected between the two rear fixing plates, and the two rear connecting plates are slidably sleeved on the outside of the guide rod.

[0010] Preferably, the upper surface of the workbench is provided with a guide groove, a first threaded rod is rotatably connected inside the guide groove, a guide block is slidably connected inside the guide groove, the guide block is threaded onto the outer surface of the first threaded rod, and the guide block is fixedly connected to two placement plates.

[0011] Preferably, a motor is fixedly connected to the front surface of the worktable, the output shaft of the motor rotates through the interior of the worktable, and the front end of the first threaded rod also rotates through the interior of the worktable. The output shaft of the motor is fixedly connected to the first threaded rod through a coupling.

[0012] Compared with the prior art, the present invention provides a coating apparatus for semiconductor production, which has the following advantages:

[0013] 1. This semiconductor coating device, through the cooperation of connecting plates, driving plates, horizontal slots, inclined slots, fixing rods, and through slots, enables the automatic ejection of semiconductors after the clamping is removed. This greatly facilitates the removal of coated semiconductors by workers, reduces the number of operating steps, has high practicality, facilitates semiconductor unloading, and is simple to operate.

[0014] 2. The semiconductor coating device effectively ensures the continuity of semiconductor coating work through the cooperation between the first threaded rod, guide block and other structures, and facilitates the switching of processing stations. When one station is coating, another station can load and unload materials, saving workers' time and effectively improving processing efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a coating apparatus for semiconductor manufacturing according to the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of the placement plate of this utility model;

[0017] Figure 3 This is a cross-sectional view of the placement plate of this utility model;

[0018] Figure 4 This is a cross-sectional view of the guide groove of this utility model.

[0019] In the diagram: 1. Workbench; 2. Mounting frame; 3. Coating device; 4. Placement plate; 5. Placement slot; 6. Top plate; 7. Clamping plate; 8. Connecting plate; 9. Sliding slot; 10. Drive plate; 11. Horizontal slot; 12. Inclined slot; 13. Through slot; 14. Fixing rod; 15. Fixing plate; 16. Bidirectional threaded rod; 17. Guide rod; 18. Handle; 19. Guide slot; 20. First threaded rod; 21. Guide block; 22. Motor. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-4 This utility model provides a technical solution: a coating device for semiconductor production, including a workbench 1, a mounting frame 2 fixedly connected to the upper surface of the workbench 1, a coating device 3 disposed inside the mounting frame 2, the coating device 3 being prior art, specifically referring to the published patent with announcement number CN220496819U, therefore it will not be described in detail here. The upper surface of the workbench 1 is provided with two placement plates 4, which are fixedly connected. Since the two placement plates 4 have the same structure, the following description focuses on one placement plate 4. The upper surface of the placement plate 4 is provided with a placement groove 5, and a top plate 6 is disposed inside the placement groove 5. The upper surface of the placement plate 4 is provided with two clamping plates 7, and connecting plates 8 are fixedly connected to both sides of the clamping plates 7. The upper surface of the placement plate 4 is provided with two sliding grooves 9, and connecting components are disposed inside the sliding grooves 9.

[0022] The connecting component includes a drive plate 10, which is slidably connected inside the sliding groove 9. The drive plates 10 inside the two sliding grooves 9 are mirror images of each other. The two drive plates 10 are fixedly connected to the connecting plates 8 on both sides respectively. The drive plate 10 has a horizontal groove 11 and an oblique groove 12 inside, which are connected to each other.

[0023] The placement slot 5 has a through slot 13 inside, which is connected to the sliding slot 9. The top plate 6 has fixed rods 14 on both sides. The fixed rods 14 are slidably connected inside the through slot 13. The fixed rods 14 extend into the sliding slot 9 and are slidably connected inside the horizontal slot 11 and the inclined slot 12.

[0024] Rubber pads can be installed on the adjacent surfaces of the two clamping plates 7, which can not only avoid hard contact with the semiconductor, but also ensure the stability of the semiconductor clamping and improve the overall safety of the device.

[0025] Four fixing plates 15 are fixedly connected to the upper surface of the placement plate 4. A bidirectional threaded rod 16 is rotatably connected between the two front fixing plates 15. The two front connecting plates 8 are threaded onto the two opposite threads of the bidirectional threaded rod 16. The setting of the bidirectional threaded rod 16 reduces the operation steps of the staff, realizes the synchronous movement of the two clamping plates 7, and facilitates the positioning of the semiconductor.

[0026] A handle 18 is fixedly connected to the left end of the bidirectional threaded rod 16. The handle 18 rotates through the interior of the left fixed plate 15.

[0027] A guide rod 17 is fixedly connected between the two rear fixing plates 15, and the two rear connecting plates 8 are slidably sleeved on the outside of the guide rod 17. The guide rod 17 effectively ensures the stability of the clamping plate 7 when it moves.

[0028] The upper surface of the workbench 1 is provided with a guide groove 19. A first threaded rod 20 is rotatably connected inside the guide groove 19. A guide block 21 is slidably connected inside the guide groove 19. The guide block 21 is threaded onto the outer surface of the first threaded rod 20. The guide block 21 is fixedly connected to two placement plates 4. By rotating the first threaded rod 20, the two placement plates 4 can be moved with the help of the guide block 21, thereby realizing the switching of work positions.

[0029] A motor 22 is fixedly connected to the front surface of the workbench 1. The output shaft of the motor 22 rotates and penetrates into the interior of the workbench 1. The front end of the first threaded rod 20 also rotates and penetrates into the interior of the workbench 1. The output shaft of the motor 22 is fixedly connected to the first threaded rod 20 through a coupling.

[0030] Among them, the motor 22 is also equipped with a power supply, wires, controller and microcomputer, etc. Since they are not the main structures, they will not be described in detail in this article.

[0031] Working principle:

[0032] When using this semiconductor coating apparatus, the operator places the semiconductor to be coated inside the placement groove 5. Then, the operator rotates the bidirectional threaded rod 16 using the handle 18. The rotation of the bidirectional threaded rod 16 moves the connecting plate 8, which in turn moves the clamping plate 7 until the clamping plate 7 clamps the semiconductor with the help of the internal rubber pad. At the same time, the connecting plates 8 on the front and rear sides also drive the two drive plates 10 to slide inside the sliding groove 9. Meanwhile, the fixing rod 14 slides inside the transverse groove 11. After the semiconductor is fixed, the motor 22 is started. The rotation of the output shaft of the motor 22 and the coupling drive the rotation of the first threaded rod 20. The rotation of the first threaded rod 20 moves the guide block 21, which in turn moves the two placement plates 4 until the semiconductor is moved to the lower side of the coating apparatus 3. The coating apparatus 3 can then perform coating on the semiconductor.

[0033] When a semiconductor on the upper side of a placement plate 4 is coated, the other placement plate 4 can repeat the above steps to fix the second semiconductor. After the coating is completed, the output shaft of the motor 22 is rotated in the reverse direction. At this time, the other placement plate 4 will move to the lower side of the coating device 3, thereby ensuring the continuity of the coating operation.

[0034] When semiconductors need to be unloaded, the bidirectional threaded rod 16 is reversed by the handle 18. At this time, the two clamping plates 7 will move away from each other. The connecting plate 8 will also drive the drive plate 10 to move. When the drive plate 10 moves, the fixing rod 14 will first slide in the transverse groove 11, and then the fixing rod 14 will slide inside the inclined groove 12. Finally, after the clamping plates 7 release the semiconductor, the top plate 6 can move upward when the two clamping plates 7 continue to move away from each other, thus ejecting the semiconductor.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coating apparatus for semiconductor manufacturing, comprising a worktable (1), characterized in that: The upper surface of the workbench (1) is fixedly connected to a mounting bracket (2), and a coating device (3) is provided inside the mounting bracket (2). The upper surface of the workbench (1) is provided with two placement plates (4), which are fixedly connected. The upper surface of the placement plate (4) is provided with a placement groove (5), and a top plate (6) is provided inside the placement groove (5). The upper surface of the placement plate (4) is provided with two clamping plates (7), and connecting plates (8) are fixedly connected to both sides of the clamping plates (7). The upper surface of the placement plate (4) is provided with two sliding grooves (9), and a connecting component is provided inside the sliding grooves (9).

2. The semiconductor coating apparatus according to claim 1, characterized in that: The connecting assembly includes a drive plate (10), which is slidably connected inside the sliding groove (9). The drive plates (10) inside the two sliding grooves (9) are mirror images of each other. The two drive plates (10) are fixedly connected to the connecting plates (8) on both sides respectively. The drive plate (10) has a horizontal groove (11) and an inclined groove (12) inside, which are connected to each other.

3. The semiconductor coating apparatus according to claim 2, characterized in that: The placement slot (5) has a through slot (13) inside, and the through slot (13) is connected to the sliding slot (9). The top plate (6) has fixed rods (14) fixedly connected to both sides of the top plate (6). The fixed rods (14) are slidably connected inside the through slot (13). The fixed rods (14) extend into the sliding slot (9) and are slidably connected inside the horizontal slot (11) and the inclined slot (12).

4. A coating apparatus for semiconductor manufacturing according to claim 2, characterized in that: The upper surface of the placement plate (4) is fixedly connected with four fixing plates (15), and a bidirectional threaded rod (16) is rotatably connected between the two fixing plates (15) on the front side. The two connecting plates (8) on the front side are threaded onto the two opposite threads of the bidirectional threaded rod (16).

5. A coating apparatus for semiconductor manufacturing according to claim 4, characterized in that: The left end of the bidirectional threaded rod (16) is fixedly connected to a handle (18), which rotates through the interior of the left fixed plate (15).

6. A coating apparatus for semiconductor manufacturing according to claim 5, characterized in that: A guide rod (17) is fixedly connected between the two rear fixing plates (15), and the two rear connecting plates (8) are slidably sleeved on the outside of the guide rod (17).

7. A coating apparatus for semiconductor manufacturing according to claim 1, characterized in that: The upper surface of the workbench (1) is provided with a guide groove (19), and a first threaded rod (20) is rotatably connected inside the guide groove (19). A guide block (21) is slidably connected inside the guide groove (19). The guide block (21) is threaded onto the outer surface of the first threaded rod (20). The guide block (21) is fixedly connected to two placement plates (4).

8. A coating apparatus for semiconductor manufacturing according to claim 7, characterized in that: A motor (22) is fixedly connected to the front surface of the workbench (1). The output shaft of the motor (22) rotates through the interior of the workbench (1). The front end of the first threaded rod (20) also rotates through the interior of the workbench (1). The output shaft of the motor (22) and the first threaded rod (20) are fixedly connected.

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