Electroplating bath rapid uniform mechanism
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU ZHONGJING IND CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-06-02
AI Technical Summary
In existing electroplating processes, stirring devices can easily interfere with the workpiece, affecting the normal formation of the coating and leading to a decrease in product yield.
The electroplating tank rapid homogenization mechanism includes a support, a tank body, a first homogenization mechanism, and a second homogenization mechanism. The first movable frame moves reciprocally along the guide rail, and the second movable frame swings through the pulley seat. They work together to achieve rapid and uniform treatment of the electroplating solution, eliminating the need for a stirring device.
This technology enables rapid and uniform treatment of the electroplating solution, avoids the negative impact of the stirring device on the plating layer, and improves the product yield.
Smart Images

Figure CN224313694U_ABST