Heat spreader water cold head

Abstract

A water-cooled heat-dissipating head with a vapor chamber includes a vapor chamber, a support member for providing a space for the vapor chamber, and a cover disposed on the vapor chamber. The support member has a hollow portion for exposing the vapor chamber. The cover is provided with at least one water inlet, at least one water outlet, and a plurality of flow guide structures. The cover and the support member are assembled to jointly hold the edge of the vapor chamber, so that a heat exchange space is formed between the cover and the vapor chamber, which is connected to the at least one water inlet and the at least one water outlet. The plurality of flow guide structures contact the surface of the vapor chamber and define a water flow path in the heat exchange space.

Description

Technical Field

[0001] This utility model relates to a heat dissipation water cooling head, and more particularly to a heat dissipation water cooling head with a heat spreader. Background Technology

[0002] In the field of water cooling technology, water cooling blocks generally use a copper heat sink as the heat transfer medium for the heat source. In practice, the side of the copper heat sink that is in contact with the heat source receives the heat energy, which is then conducted to the other side of the copper heat sink, where it exchanges heat with the coolant. However, the aforementioned cooling system is limited by the thermal resistance of the copper heat sink, resulting in limited heat dissipation effect.

[0003] To address the aforementioned issues, current water-cooling technology utilizes vapor chambers instead of copper plates. A vapor chamber is a closed vacuum chamber with multiple capillary structures on its inner wall. When heat is conducted into the chamber, the working fluid, under vacuum conditions, undergoes liquid-phase vaporization at a specific temperature. As the working fluid absorbs heat, it expands, filling the chamber with vaporized working fluid. When this vaporized working fluid comes into contact with a cooler area, condensation occurs, and the condensed liquid working fluid flows back through the capillary action of these structures. This liquid-vapor conversion process circulates within the chamber, constituting the operating mode of the vapor chamber.

[0004] Returning to the water-cooled heat dissipation system, this system uses the thermal conductivity of the two-phase flow of the vapor chamber to transfer the heat energy on the component to be cooled to the vapor chamber, and then the vapor chamber exchanges heat with the water coolant, thereby improving the heat dissipation bottleneck caused by the copper plate implementation.

[0005] Currently published patents, such as CN 202617585U, CN 204335281U, and CN 107567248A, have proposed heat dissipation systems implemented with vapor chambers. However, the vapor chambers require an annealing process during manufacturing, which reduces their hardness. This leads to problems such as difficulty in assembly and poor water resistance when the vapor chambers are combined with water-cooling structures. Utility Model Content

[0006] The main purpose of this invention is to solve the problem of poor heat dissipation performance in conventional water cooling systems implemented with copper plates.

[0007] Another objective of this invention is to solve the problem of structural softening caused by annealing in conventional heat exchange plates.

[0008] To achieve the above objectives, this utility model provides a water cooling head with a vapor chamber, comprising a vapor chamber, a support member for mounting the vapor chamber, and a top cover mounted on the vapor chamber. The support member has a hollowed-out portion exposing the vapor chamber. The top cover has at least one inlet, at least one outlet, and multiple flow guiding structures. The top cover and the support member are assembled to clamp the edge of the vapor chamber, forming a heat exchange space between the top cover and the vapor chamber that connects the at least one inlet and the at least one outlet. The multiple flow guiding structures contact the surface of the vapor chamber and define a water flow path within the heat exchange space.

[0009] In one embodiment, the support includes a pressing portion that, together with the top cover, presses down the edge of the heat exchange plate, and an assembly skirt that extends outward from the pressing portion and is assembled with the top cover.

[0010] In one embodiment, the top cover is formed along its edge to provide a drop in height for the heat spreader to be installed therein.

[0011] In one embodiment, the heat exchanger has an extended centerline, and the plurality of flow guiding structures are spaced apart based on the extended centerline of the heat exchanger.

[0012] In one embodiment, the temperature distribution plate is provided with a plurality of support columns, and the projected position of each of the plurality of flow guiding structures overlaps with the position of at least one of the plurality of support columns.

[0013] In one embodiment, the cooling water block has at least one elastic washer disposed between the top cover and the vapor chamber, and compressed when the top cover and the support member clamp the vapor chamber together.

[0014] In one embodiment, the top cover is formed with at least one assembly groove, and the cooling water head has an assembly plate embedded in the at least one assembly groove.

[0015] As disclosed in the foregoing description of this utility model, compared with the conventional technology, this utility model has the following features: The cooling water block of this utility model has a heat spreader plate, and is assembled with the support member through the upper cover to jointly clamp the edge of the heat spreader plate, thereby solving the softening problem of the heat spreader plate caused by annealing. In addition, the upper cover of this utility model is further provided with the aforementioned multiple flow guiding structures to guide the flow of coolant. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of an embodiment of the present utility model;

[0017] Figure 2 This is an exploded view (a) of an embodiment of the present utility model;

[0018] Figure 3 This is an exploded view (II) of an embodiment of the present utility model;

[0019] Figure 4 This is a cross-sectional schematic diagram (a) of an embodiment of the present utility model;

[0020] Figure 5 This is a cross-sectional schematic diagram (II) of an embodiment of the present utility model.

[0021] [Symbol Explanation]

[0022] 20: Water cooling block

[0023] 21: Heat spreader

[0024] 211: Contact surface

[0025] 212: Heat exchange surface

[0026] 213: Chamber

[0027] 214: Extended midline

[0028] 215: Capillary Structure

[0029] 216: Support column

[0030] 217: Filling tube

[0031] 23: Support component

[0032] 231: Hollowed-out section

[0033] 232: Suppression Department

[0034] 233: Assemble the skirt

[0035] 234: Assembly Structure

[0036] 235: Missing slot

[0037] 236: convex part

[0038] 25: Top Cover

[0039] 251: Inlet

[0040] 252: Outlet

[0041] 253: Flow guiding structure

[0042] 254: Heat exchange space

[0043] 255: Drop

[0044] 256: Group Interface

[0045] 258: Assembly slot

[0046] 27: Elastic washer

[0047] 28: Assembly board

[0048] 29: Connector

[0049] 90: Coolant Detailed Implementation

[0050] The detailed description and technical content of this utility model are now explained in conjunction with the accompanying drawings:

[0051] Please see Figures 1 to 5 This utility model provides a heat dissipation water cooling head 20, comprising a heat spreader 21, a support member 23, and a top cover 25. The heat spreader 21 has a contact surface 211 and a heat exchange surface 212 opposite to the contact surface 211. The heat spreader 21 contacts a component to be cooled via the contact surface 211 and exchanges heat with the component. The support member 23 is located on the side of the heat spreader 21 where the contact surface 211 is located, and provides support for the heat spreader 21 without affecting the heat exchange between the heat spreader 21 and the component to be cooled. Specifically, the support member 23 has a hollow portion 231 that exposes at least a portion of the contact surface 211, allowing the heat spreader 21 to contact the component to be cooled. The top cover 25 is located on the side of the heat exchange surface 212 of the heat distribution plate 21. The top cover 25 is provided with at least one water inlet 251, at least one water outlet 252 and a plurality of flow guiding structures 253. The at least one water inlet 251 and the at least one water outlet 252 serve as the connectors between the heat dissipation water cooling head 20 and an external heat exchange device, and allow a coolant 90 to flow therethrough, so that the heat dissipation water cooling head 20 and the external heat exchange device form a circulation loop.

[0052] The top cover 25 is assembled with the support member 23 to jointly clamp the edge of the heat spreader 21, where the edge refers to the portion of the heat spreader 21 that does not have a chamber 213 for providing a working fluid flow. After the top cover 25 and the support member 23 are assembled, a heat exchange space 254 is formed between the top cover 25 and the heat spreader 21. The heat exchange space 254 connects the at least one inlet 251 and the at least one outlet 252. The flow guiding structures 253 are located in the heat exchange space 254 and contact the heat exchange surface 212 of the heat spreader 21. The flow guiding structures 253 define a water flow path in the heat exchange space 254. This water flow path allows the coolant 90 to enter through the at least one inlet 251, contact the heat exchange surface 212 of the heat spreader 21, and exchange heat, and finally be discharged through the at least one outlet 252.

[0053] Please see Figures 1 to 5The implementation of the cooling head 20 will now be described. The vapor chamber 21 contacts the component to be cooled via its contact surface 211, assuming that initially the coolant 90 has not flowed into the heat exchange space 254. At this point, the contact surface 211 of the vapor chamber 21 receives the heat energy transferred from the component to be cooled, causing the liquid working fluid to transform into a vapor phase and rise towards the heat exchange surface 212. When the coolant 90 enters the heat exchange space 254 via at least one inlet 251, the coolant 90 is guided by the flow guiding structures 253 and flows along the water flow path. During its flow, the coolant 90 contacts the heat exchange surface 212 of the vapor chamber 21, cooling the vaporized working fluid, which then condenses and transforms back into a liquid phase, flowing back to the contact surface 211. At this time, the coolant 90, having absorbed the heat energy of the vaporized working fluid, becomes warm and flows out from the at least one outlet 252. When the cooling water head 20 of this utility model is combined with the external heat exchange device to form a heat dissipation system, the coolant 90 flowing out from the at least one outlet 252 will flow to the external heat exchange device, and after the heat exchange is completed, it will flow back into the heat exchange space 254 through the at least one inlet 251 of the cooling water head 20, thus continuously circulating.

[0054] As described above, the cooling water head 20 of this invention includes a heat spreader 21, which is connected to the support member 23 via the upper cover 25 to clamp the edge of the heat spreader 21, thereby solving the softening problem of the heat spreader 21 caused by annealing. Furthermore, the upper cover 25 of this invention is provided with flow guiding structures 253 to form a water flow path within the heat exchange space 254, thereby reducing turbulence generated after the coolant enters the heat exchange space 254.

[0055] Please see Figures 3 to 5 In this invention, the support member 23 comprises a pressing portion 232 and an assembly skirt 233 for assembling the heat spreader 21. The pressing portion 232 and the upper cover 25 together press the edge of the heat spreader 21. The assembly skirt 233 extends outward from the pressing portion 232 and is assembled with the upper cover 25. In this embodiment, the support member 23 uses the pressing portion 232 to form the hollow portion 231. In another embodiment, the upper cover 25 of this invention has a drop 255 formed along its edge. The drop 255 provides space for the heat spreader 21 to be installed and restricts the assembly position of the heat spreader 21. In another embodiment, in order to stably hold the heat exchange plate 21, the support member 23 and the upper cover 25 are provided with at least one set of interfaces 256 and at least one set of connection structures 234. Taking the accompanying drawings as an example, the at least one set of interfaces 256 is provided around the drop 255 of the upper cover 25, and the at least one set of connection structures 234 is provided on the assembly skirt 233 of the support member 23.

[0056] In addition, to prevent leakage of the coolant 90, in one embodiment of the present invention, the cooling head 20 has at least one elastic washer 27. The at least one elastic washer 27 is disposed between the upper cover 25 and the heat spreader 21, and is compressed when the upper cover 25 and the support member 23 clamp the heat spreader 21. After being compressed, the at least one elastic washer 27 can seal the gap between the upper cover 25 and the heat spreader 21, thereby achieving a water-blocking effect.

[0057] Furthermore, in addition to providing a guiding function, the flow guiding structure 253 of this invention also provides a supporting function. In one embodiment, the heat exchange plate 21 has an extended center line 214, and the flow guiding structures 253 are spaced apart based on the extended center line 214. Specifically, the flow guiding structures 253 are arranged as follows: First, one of the flow guiding structures 253 may be located on the extended center line 214 of the heat exchange plate 21, and the remaining flow guiding structures 253 are spaced apart from the aforementioned flow guiding structure 253; Second, the flow guiding structures 253 are not located on the extended center line 214 of the heat exchange plate 21, but rather two of the flow guiding structures 253 most adjacent to the extended center line 214 are spaced apart from the extended center line 214, and the remaining flow guiding structures 253 are arranged spaced apart from the aforementioned two flow guiding structures 253. Thus, the flow guiding structures 253 of this invention can support the heat exchange space 254.

[0058] Please see again Figures 3 to 5 In one embodiment, the vapor chamber 21 of this invention has a plurality of capillary structures 215 disposed within the chamber 213. These capillary structures 215 are used to generate capillary action, assisting the condensation and reflux effect when the working fluid in the chamber 213 changes from a vapor phase to a liquid phase. In another embodiment, the vapor chamber 21 has a plurality of support columns 216 disposed within the chamber 213. Each of these support columns 216 is a copper column, thereby improving the heat exchange effect of the vapor chamber 21. In this embodiment, the projected position of each of these flow guiding structures 253 overlaps with at least one of the support columns 216, thereby achieving the effect of supporting the chamber 213 and the vapor chamber 21.

[0059] On another aspect, in one embodiment, the heat spreader 21 of this invention further includes a filling tube 217 communicating with the chamber 213. The filling tube 217 provides the heat spreader 21 with the working fluid to fill the chamber 213. The support member 23 is provided with a notch 235 for the filling tube 217. More specifically, the notch 235 is formed by two spaced protrusions 236 of the support member 23. In one embodiment, the two protrusions 236 extend from the pressing portion 232 toward the hollow portion 231.

[0060] On the other hand, in order to stably connect the cooling water head 20 of this invention to the component to be cooled, in one embodiment, the upper cover 25 is formed with at least one assembly groove 258, and the cooling water head 20 has an assembly plate 28, which is embedded in the at least one assembly groove 258 and used to connect the component to be cooled. Furthermore, in another embodiment, in order to connect the cooling water head 20 to the external heat exchange device, in one embodiment, the cooling water head 20 has at least two connectors 29, which are respectively located at the at least one inlet 251 and the at least one outlet 252 for connection to the external heat exchange device.

Claims

1. A heat dissipating water cold head with a uniform temperature plate, characterized by, Include: One temperature plate; A support member, on which the heat spreader is disposed, the support member having a cutout portion exposing the heat spreader; and A top cover is provided on the heat exchange plate. The top cover has at least one water inlet, at least one water outlet and multiple flow guiding structures. The top cover and the support member are assembled to clamp the edge of the heat exchange plate together, so that a heat exchange space connecting the at least one water inlet and the at least one water outlet is formed between the top cover and the heat exchange plate. The multiple flow guiding structures contact the surface of the heat exchange plate and define a water flow path in the heat exchange space.

2. The vapor chamber-equipped heat spreader cold plate of claim 1, wherein, The support includes a pressing portion that, together with the top cover, presses down the edge of the heat exchange plate, and an assembly skirt that extends outward from the pressing portion and is assembled with the top cover.

3. The vapor chamber-equipped heat spreader cold plate of claim 2, wherein, The top cover is shaped along its edge to provide a drop in height for the vapor chamber to be installed therein.

4. The vapor chamber-cooled heat spreader of any one of claims 1 to 3, wherein, The vapor chamber has an extended centerline, and the plurality of flow guiding structures are spaced apart based on the extended centerline of the vapor chamber.

5. The vapor chamber-cooled heat spreader of claim 4, wherein, The temperature distribution plate is provided with multiple support columns, and the projected position of each of the multiple flow guiding structures overlaps with the position of at least one of the multiple support columns.

6. The vapor chamber-cooled heat spreader of any one of claims 1 to 3, wherein, The cooling water block has at least one elastic washer disposed between the top cover and the vapor chamber, which is compressed when the top cover and the support member clamp the vapor chamber together.

7. The water cooling head with a heat dissipation plate as described in any one of claims 1 to 3, characterized in that, The top cover is formed with at least one assembly slot, and the cooling water block has an assembly plate embedded in the at least one assembly slot.

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