A precision photoresist coating device for semiconductor manufacturing

Abstract

This utility model discloses a precision photoresist coating apparatus for semiconductor manufacturing, relating to the field of semiconductor manufacturing technology. It includes a first driving component and a positioning component. Second driving components are connected to the bottom of both ends of the first driving component, and a coating component is mounted in the middle of the first driving component. The positioning component is mounted at one end of the coating component. This precision photoresist coating apparatus for semiconductor manufacturing, by mounting a positioning component below the precision coating nozzle, utilizes the structural design of the positioning component to structurally limit the semiconductor element to be coated, ensuring the structural stability and accuracy of the precision coating nozzle during coating processing and avoiding coating misalignment. Furthermore, the structural design of the first and second driving components provides sufficient structural adjustability for the entire coating component with the positioning component, thereby facilitating flexible processing operations.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a precision photoresist coating device for semiconductor manufacturing. Background Technology

[0002] Semiconductor manufacturing refers to the process of processing wafers into chips with specific functions through a series of complex technological steps. This process involves several key steps, including wafer fabrication, oxidation, photolithography, etching, deposition, ion implantation, metal wiring, electrical testing, and packaging.

[0003] A photoresist precision coating apparatus is a device used in semiconductor device manufacturing and micro / nano fabrication. Its main function is to uniformly and precisely coat photoresist onto the surface of a silicon wafer. This apparatus uses a series of complex mechanical and control systems to ensure the coating quality and precision of the photoresist, thereby meeting the high requirements of microelectronic device manufacturing.

[0004] For example, utility model application No. 202222018470.3 discloses a photoresist coating device. This photoresist coating device coats the periphery and sidewalls of the chip after photolithography before metal sputtering, thereby ensuring effective protection of the periphery and edges of the chip. After metal sputtering on both sides of the chip, organic solvents such as acetone can be used to remove the photoresist while peeling it off. No additional steps are required, and the periphery and sidewalls of the chip are kept clean and free of metal residue. This solves the problem of difficult metal peeling and metal residue after sputtering due to incomplete protection of the periphery during chip photolithography. However, similar photoresist coating devices in the above-mentioned document have limited overall chip stability due to the structural limitations of the vacuum chuck mechanism, which can easily affect the accuracy of photoresist coating. Utility Model Content

[0005] The purpose of this invention is to provide a precision photoresist coating device for semiconductor manufacturing, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a precision photoresist coating device for semiconductor manufacturing, comprising a first driving component and a positioning component, wherein a second driving component is connected to the bottom of the left and right ends of the first driving component, and a coating component is installed in the middle of the first driving component, and the positioning component is installed at one end of the coating component, the positioning component comprising a positioning frame, an electric push rod and a stabilizing post, wherein an electric push rod is symmetrically and vertically installed on the top of the positioning frame, and a stabilizing post is provided at the top of the electric push rod.

[0007] Furthermore, the first driving component includes a first base, a first guide rail, a first lead screw, a first servo motor, and a first movable seat. The first guide rail is horizontally mounted on the top surface of the first base, and the first lead screw is horizontally mounted above the first guide rail. The first servo motor is mounted on one end of the first lead screw via a coupling, and the first movable seat is mounted on the middle section of the first lead screw.

[0008] Furthermore, the bottom of the first movable seat is connected to the first guide rail using a slotted embedded structure, and the first movable seat and the first lead screw are connected by a thread.

[0009] Furthermore, the second driving component includes a second base, a second guide rail, a second lead screw, a second servo motor, and a second movable seat. The second guide rail is horizontally mounted on the top surface of the second base, and the second lead screw is horizontally mounted above the second guide rail. The second servo motor is mounted on one end of the second lead screw via a coupling, and the second movable seat is mounted on the middle section of the second lead screw.

[0010] Furthermore, the bottom of the second movable seat and the second guide rail are connected by a slotted embedded structure, and the second movable seat and the second lead screw are connected by a thread, and one end of the bottom of the first base is connected to the top of the second movable seat.

[0011] Furthermore, the coating component includes a support base, a telescopic rod, a precision coating nozzle, a quick connector, and a vision inspection component. The telescopic rod is vertically mounted in the middle section of the support base, and the precision coating nozzle is mounted at the bottom of the telescopic rod. A quick connector is provided at the top of the telescopic rod. The vision inspection component is mounted at the bottom of the support base at the end away from the first driving component.

[0012] Furthermore, the end of the support base furthest from the visual inspection component is mounted on the top of the first movable base, and the telescopic rod, precision coating nozzle, and quick connector are on the same vertical central axis.

[0013] Furthermore, the stabilizing pile is movably installed on the side of the support base, and the precision coating nozzle is located in the middle of the positioning frame.

[0014] This invention provides a precision photoresist coating device for semiconductor manufacturing, which has the following advantages:

[0015] 1. This utility model, by providing a positioning component at one end of the coating component, utilizes the telescopic structure of an electric push rod to vertically adjust the positioning frame connected to the bottom end within a certain distance. This structure ensures the flexibility of the device structure and allows for flexible structural adaptation to the size and thickness of semiconductor components. The mobility of the structure allows the bottom of the positioning frame to rest against the top surface of the semiconductor component. Simultaneously, the positioning frame structure ensures the structural stability of the semiconductor component without affecting the coating process, thus minimizing any impact on the accuracy of the coating process. Furthermore, the stabilizing pile and the support base are connected movably, allowing for the structural disassembly of the positioning component and the coating component, facilitating cleaning and maintenance.

[0016] 2. This utility model, by providing a first driving component and a second driving component, wherein the coating component, which is equipped with a positioning component, is mounted on the top of a first movable seat, when the first servo motor drives the first lead screw to rotate, the first base will simultaneously move horizontally along the surface of the first guide rail and the first lead screw. At the same time, the first base, which is connected to the second movable seat, drives the second lead screw connected to it to rotate under the operation of the second servo motor, so that the second movable seat will translate along the surface of the second guide rail and the second lead screw. With the above structure, the coating component and the positioning component can be simultaneously provided with horizontal X-axis and Y-axis movement adjustment, respectively. In this way, the structural mobility of the coating component and the positioning component can be maximized, thereby realizing flexible processing operation. In addition, the structure of the first driving component and the second driving component can provide precise adjustment of the coating component, thereby ensuring the accuracy of the coating process. The structure of the vision inspection component can monitor the movement stroke of the coating component and its relative position with the semiconductor components below the precision coating nozzle in real time, thereby ensuring the accuracy of the processing operation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main body of a precision photoresist coating device for semiconductor manufacturing according to the present invention;

[0018] Figure 2 This is a schematic diagram of the first driving component of a photoresist precision coating device for semiconductor manufacturing according to the present invention.

[0019] Figure 3 This is a three-dimensional structural diagram of the second driving component of a precision photoresist coating device for semiconductor manufacturing according to the present invention.

[0020] Figure 4This is a three-dimensional structural diagram of the coating component of a precision photoresist coating device for semiconductor manufacturing according to this utility model;

[0021] Figure 5 This is a three-dimensional structural diagram of the positioning component of a precision photoresist coating device for semiconductor manufacturing according to this utility model.

[0022] In the diagram: 1. First driving component; 101. First base; 102. First guide rail; 103. First lead screw; 104. First servo motor; 105. First moving seat; 2. Second driving component; 201. Second base; 202. Second guide rail; 203. Second lead screw; 204. Second servo motor; 205. Second moving seat; 3. Coating component; 301. Support seat; 302. Telescopic rod; 303. Precision coating nozzle; 304. Quick connector; 305. Vision inspection component; 4. Positioning component; 401. Positioning frame; 402. Electric push rod; 403. Stabilizing pile. Detailed Implementation

[0023] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0024] like Figures 1 to 5 As shown, a precision photoresist coating apparatus for semiconductor manufacturing includes a first driving component 1 and a positioning component 4. Second driving components 2 are connected to the bottom of both ends of the first driving component 1, and a coating component 3 is installed in the middle of the first driving component 1. The positioning component 4 is installed at one end of the coating component 3. The positioning component 4 includes a positioning frame 401, an electric push rod 402, and a stabilizing post 403. The electric push rod 402 is symmetrically and vertically mounted on the top of the positioning frame 401, and a stabilizing post 403 is provided at the top of the electric push rod 402. The stabilizing post 403 is movably installed on the side of the support base 301, and the precision coating nozzle 303 is located in the middle of the interior of the positioning frame 401. The coating component 3 includes a support base 301, a telescopic rod 302, a precision coating nozzle 303, and a quick connector 304. The visual inspection component 305 and the support base 301 are vertically mounted with a telescopic rod 302 in the middle section. A precision coating nozzle 303 is installed at the bottom of the telescopic rod 302, and a quick connector 304 is provided at the top of the telescopic rod 302. The visual inspection component 305 is installed at the bottom of the support base 301 away from the first driving component 1, and the end of the support base 301 away from the visual inspection component 305 is installed at the top of the first moving base 105. The telescopic rod 302, the precision coating nozzle 303, and the quick connector 304 are on the same vertical central axis. The telescopic structure of the electric push rod 402 can be used to adjust the positioning frame 401 connected to the bottom in the vertical direction within a certain distance. The structure can be flexibly adapted according to the size and thickness of the semiconductor components.

[0025] like Figures 1 to 5 As shown, the first driving component 1 includes a first base 101, a first guide rail 102, a first lead screw 103, a first servo motor 104, and a first movable seat 105. The first guide rail 102 is horizontally mounted on the top surface of the first base 101, and the first lead screw 103 is horizontally mounted above the first guide rail 102. One end of the first lead screw 103 is connected to the first servo motor 104 via a coupling, and the first movable seat 105 is mounted on the middle section of the first lead screw 103. The bottom of the first movable seat 105 and the first guide rail 102 are connected by a slotted embedded structure, and the first movable seat 105 and the first lead screw 103 are threaded together. The second driving component 2 includes a second base 201, a second guide rail 202, a second lead screw 203, a second servo motor 204, and a second movable seat 205. The second guide rail 202 is horizontally mounted on the top surface of the second base 201, and the first lead screw 103 is horizontally mounted above the first guide rail 104. A second lead screw 203 is mounted, and a second servo motor 204 is installed at one end of the second lead screw 203 via a coupling. A second movable seat 205 is installed in the middle section of the second lead screw 203. The bottom of the second movable seat 205 is connected to the second guide rail 202 by a slotted embedded structure, and the second movable seat 205 and the second lead screw 203 are threaded together. The bottom end of the first base 101 is connected to the top of the second movable seat 205. When the first servo motor 104 drives the first lead screw 103 to rotate, the first base 101 will simultaneously move horizontally along the surface of the first guide rail 102 and the first lead screw 103. At the same time, the first base 101, which is connected to the second movable seat 205, drives the second lead screw 203 connected to it to rotate under the operation of the second servo motor 204, so that the second movable seat 205 will translate along the surface of the second guide rail 202 and the second lead screw 203.

[0026] In summary, as Figures 1 to 5 As shown, in the semiconductor manufacturing photoresist precision coating device, when the upstream conveying device first transports the semiconductor components to be processed to the bottom of the device, the first driving component 1 and the second driving component 2 will operate simultaneously according to the processing needs. The first servo motor 104 at one end of the first base 101 starts to operate and drives the first lead screw 103 connected to its power output end to rotate horizontally, so that the first moving seat 105 connected to it will move horizontally along the surface of the first guide rail 102 and the first lead screw 103.

[0027] At the same time, the second servo motor 204 at one end of the second base 201 will drive the second lead screw 203 connected to its power output end to rotate axially in the horizontal direction, thereby driving the second moving seat 205 connected to the second lead screw 203 to translate along the surface of the second guide rail 202 and the second lead screw 203. Thus, under the operation of the first driving member 1 and the second driving member 2, the coating member 3 and the positioning member 4 move in the horizontal XY axis direction.

[0028] During this process, the visual inspection component 305 at the bottom of one end of the support 301 will monitor the relative position of the entire coating component 3 in real time until the precision coating nozzle 303 at the lower end of the telescopic rod 302 moves to the top of the semiconductor element. Under the extension and retraction of the telescopic rod 302, the precision coating nozzle 303 is brought close to the top surface of the semiconductor element. At this time, the coating component 3 is pre-connected to the external feeding device with the use of the quick connector 304, so that the coating material is delivered to the inside of the precision coating nozzle 303 and coated on the semiconductor element.

[0029] During this process, the electric push rod 402 will push the positioning frame 401 vertically downward, thereby pressing the positioning frame 401 against the top surface of the semiconductor component, thus providing good structural positioning and fixing the semiconductor component to ensure the accuracy of coating.

[0030] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A precision photoresist coating apparatus for semiconductor manufacturing, comprising a first driving component (1) and a positioning component (4), characterized in that: The bottom of the left and right ends of the first driving component (1) is connected to the second driving component (2), and the middle of the first driving component (1) is equipped with a coating component (3). The positioning component (4) is installed at one end of the coating component (3). The positioning component (4) includes a positioning frame (401), an electric push rod (402) and a stabilizing pile (403). The top of the positioning frame (401) is symmetrically and vertically equipped with an electric push rod (402), and the top of the electric push rod (402) is provided with a stabilizing pile (403).

2. The precision photoresist coating apparatus for semiconductor manufacturing according to claim 1, characterized in that, The first driving component (1) includes a first base (101), a first guide rail (102), a first lead screw (103), a first servo motor (104), and a first movable seat (105). The first guide rail (102) is horizontally mounted on the top surface of the first base (101), and the first lead screw (103) is horizontally mounted above the first guide rail (102). The first servo motor (104) is mounted on one end of the first lead screw (103) through a coupling, and the first movable seat (105) is mounted on the middle section of the first lead screw (103).

3. The semiconductor manufacturing photoresist precision coating apparatus according to claim 2, characterized in that, The bottom of the first movable seat (105) is connected to the first guide rail (102) by a slotted embedded structure, and the first movable seat (105) and the first lead screw (103) are connected by a thread.

4. The precision photoresist coating apparatus for semiconductor manufacturing according to claim 2, characterized in that, The second driving component (2) includes a second base (201), a second guide rail (202), a second lead screw (203), a second servo motor (204), and a second movable seat (205). The second guide rail (202) is horizontally mounted on the top surface of the second base (201), and the second lead screw (203) is horizontally mounted above the second guide rail (202). The second servo motor (204) is mounted on one end of the second lead screw (203) through a coupling, and the second movable seat (205) is mounted on the middle section of the second lead screw (203).

5. The precision photoresist coating apparatus for semiconductor manufacturing according to claim 4, characterized in that, The bottom of the second movable seat (205) and the second guide rail (202) are connected by a slotted embedded structure, and the second movable seat (205) and the second lead screw (203) are connected by a thread. Moreover, one end of the bottom of the first base (101) is connected to the top of the second movable seat (205).

6. The precision photoresist coating apparatus for semiconductor manufacturing according to claim 1, characterized in that, The coating component (3) includes a support base (301), a telescopic rod (302), a precision coating nozzle (303), a quick connector (304), and a vision inspection component (305). The telescopic rod (302) is vertically installed in the middle section of the support base (301), and the precision coating nozzle (303) is installed at the bottom of the telescopic rod (302). The quick connector (304) is provided at the top of the telescopic rod (302). The vision inspection component (305) is installed at the bottom of the end of the support base (301) away from the first driving component (1).

7. The semiconductor manufacturing photoresist precision coating apparatus according to claim 6, characterized in that, The end of the support base (301) away from the visual inspection component (305) is installed on the top of the first movable base (105), and the telescopic rod (302), precision coating nozzle (303), and quick connector (304) are on the same vertical central axis.

8. The semiconductor manufacturing photoresist precision coating apparatus according to claim 6, characterized in that, The stabilizing pile (403) is movably installed on the side of the support base (301), and the precision coating nozzle (303) is located in the middle of the positioning frame (401).

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