Card device

By integrating series and parallel protection circuits into the card-type device, the problem of chip damage in wireless charging environments is solved, improving device reliability and reducing costs.

CN224318031UActive Publication Date: 2026-06-02BEIJING WATCH DATA SYSTEM CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING WATCH DATA SYSTEM CO LTD
Filing Date
2025-05-20
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Card-type devices are susceptible to overvoltage and overcurrent shocks in wireless charging environments, which can damage the chip. Existing technologies require additional identification devices or separate card readers and wireless chargers, which increases device integration and cost.

Method used

The card-type device integrates series and parallel protection circuits, including chips and radio frequency antennas, to protect the chip from overvoltage and overcurrent surges. The protection is achieved using electronic components.

Benefits of technology

It improves the reliability of the device in a wireless charging environment, reduces malfunctions caused by electromagnetic interference, and lowers the manufacturing cost of the card reader.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model belongs to the field of circuit technology, specifically relating to a card-type device, including: a chip, a radio frequency antenna, and a series-parallel protection circuit for protecting the chip from overvoltage and overcurrent shocks in a wireless charging environment; wherein, the series-parallel protection circuit is connected to the chip and the radio frequency antenna respectively. Therefore, by integrating the series-parallel protection circuit into the card-type device, the chip can be effectively protected from overvoltage and overcurrent shocks, improving the reliability of the device in a wireless charging environment and reducing failures caused by electromagnetic interference. Furthermore, this series-parallel protection circuit can achieve chip protection using only electronic components, thereby reducing the manufacturing cost of the card reader device.
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Description

Technical Field

[0001] This utility model belongs to the field of circuit technology, and in particular relates to a card-type device. Background Technology

[0002] With the increasing popularity of wireless charging technology, card-type devices (such as smart cards and RFID cards) are also operating more and more widely in wireless charging environments. Due to the electromagnetic overload of wireless charging, the chips in card-type devices are susceptible to overvoltage and overcurrent shocks, which can lead to chip burnout.

[0003] In related technologies, solutions for enabling card-type devices to function properly in a wireless charging environment include separating the card reader from the wireless charger; or adding a device to identify the card-type device so that it automatically pauses the wireless charging function when the card-type device is detected nearby.

[0004] However, separating the card reader from the wireless charger limits device integration and increases the device's footprint. Additionally, adding a card reader requires extra hardware, increasing costs. Utility Model Content

[0005] The purpose of this invention is to at least solve the problem of limited functionality in contactless cards. This purpose is achieved through the following technical solution:

[0006] The first aspect of this utility model provides a card-type device, comprising:

[0007] The chip, the radio frequency antenna, and the series-parallel protection circuit for protecting the chip from overvoltage and overcurrent surges in the wireless charging environment; among them,

[0008] The series and parallel protection circuits are connected to the chip and the radio frequency antenna, respectively.

[0009] The card-type device provided by this invention effectively protects the chip from overvoltage and overcurrent shocks by integrating a series-parallel protection circuit, improving device reliability in wireless charging environments and reducing malfunctions caused by electromagnetic interference. Furthermore, this series-parallel protection circuit uses only electronic components to achieve chip protection, thereby reducing the manufacturing cost of the card reader device.

[0010] In addition, the card-type device provided by this utility model may also have the following additional technical features:

[0011] In some embodiments of this utility model, the series-parallel protection circuit includes a first capacitor and circuit elements;

[0012] One end of the first capacitor is connected in series with one end of the radio frequency antenna, and the other end of the first capacitor is connected in series with one end of the chip;

[0013] One end of the circuit element is connected in parallel between the chip and the first capacitor, and the other end of the circuit element is connected in parallel between the chip and the radio frequency antenna.

[0014] In some embodiments of this utility model, one end of the radio frequency antenna is connected to the first capacitor, and the other end of the radio frequency antenna is connected to the chip and the circuit element respectively.

[0015] One end of the chip is connected to the first capacitor and a circuit element, while the other end of the chip is connected to a circuit element and a radio frequency antenna.

[0016] In some embodiments of this utility model, the number of first capacitors is one or more.

[0017] In some embodiments of this utility model, the number of circuit elements is one or more, and the circuit elements include a second capacitor or a resistor.

[0018] In some embodiments of this utility model, the card-type device includes a first module comprising a chip and a series-parallel protection circuit;

[0019] The first module is electrically connected to the radio frequency antenna by welding.

[0020] In some embodiments of this utility model, the first module includes a substrate, which includes a chip encapsulated with protective adhesive and a series-parallel protection circuit. The substrate is etched with the circuit positions of each device in the series-parallel protection circuit and the connection paths between each device.

[0021] In some embodiments of this utility model, each device is respectively attached to the circuit position of the connection path between the devices;

[0022] Soldering methods include wire bonding or solder paste soldering, and protective adhesives include epoxy resin protective adhesives.

[0023] In some embodiments of this utility model, the card-type device includes an antenna circuit, a second module, a third module, and a fourth module;

[0024] The antenna circuit includes a radio frequency antenna; the second module includes a chip, which is packaged on the substrate of the second module; the third module includes a first capacitor, which is packaged on the substrate of the third module; the fourth module includes a second capacitor, which is packaged on the substrate of the fourth module; wherein, the antenna circuit is configured based on the connection path of the series-parallel protection circuit.

[0025] The second, third, and fourth modules are respectively mounted on the antenna circuit via preset welding positions.

[0026] In some embodiments of this utility model, the card-type device is a smart card or an RFID card. Attached Figure Description

[0027] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0028] Figure 1 A schematic diagram of the circuit structure of a card-type device is shown.

[0029] Figure 2 A schematic diagram of a first module is shown.

[0030] Figure 3 A schematic diagram illustrating the electrical connection between the first module and the radio frequency antenna via welding is shown.

[0031] Figure 4 A schematic diagram of a module specifically designed to house a second module for chip U1 is shown.

[0032] Figure 5 A schematic diagram of a module is shown, which includes a third module for accommodating a first capacitor C1 and a fourth module for accommodating a second capacitor C2.

[0033] Figure 6 A schematic diagram of a second, third, and fourth module arranged on an antenna circuit is shown.

[0034] The labels in the attached diagram are as follows:

[0035] C1 - First capacitor, C2 - Second capacitor;

[0036] U1 - Chip, Radio Frequency Antenna (RF). Detailed Implementation

[0037] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0038] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0039] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0040] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0041] To enable card-type devices to function properly in a wireless charging environment, solutions include separating the card reader from the wireless charger; or adding a device to identify the card-type device and automatically suspend the wireless charging function when the card-type device is detected nearby.

[0042] Therefore, separating the card reader from the wireless charger limits device integration and increases the device's footprint. Furthermore, adding a card reader requires additional hardware, increasing costs.

[0043] To reduce malfunctions caused by electromagnetic interference and the manufacturing cost of card readers, this invention proposes a card-type device. Figure 1 A schematic diagram of a card-type device structure according to an embodiment of the present invention is shown, including a chip U1, a radio frequency antenna RF, and a series-parallel protection circuit for protecting the chip from overvoltage and overcurrent shocks in a wireless charging environment; wherein the series-parallel protection circuit is connected to the chip and the radio frequency antenna respectively.

[0044] Chip U1 has a certain degree of independence and security, with its own kernel, memory, encryption engine, etc., used to securely store and process sensitive data such as personal identity information, bank card data, and access control information. It can prevent data from being tampered with or stolen. In contactless cards, it can realize secure identity verification or payment functions through interaction with card readers.

[0045] The radio frequency (RF) antenna is another key component in the device, used for wireless communication. RF antennas can receive and transmit radio frequency signals, enabling card-type devices to communicate with card readers or other wireless devices.

[0046] Series-parallel protection circuits are designed to protect chips from overvoltage and overcurrent surges in wireless charging environments. Overvoltage and overcurrent can occur during wireless charging due to changes in the electromagnetic field or the characteristics of the chip itself, potentially damaging the chip.

[0047] Understandably, the RF antenna may sense excessively high current in a wireless charging environment. If this current is not controlled, it could be transmitted to the chip and cause damage. Therefore, to protect the chip, a series-parallel protection circuit is installed between the chip and the RF antenna. In the event of overvoltage or overcurrent, the series-parallel protection circuit can respond quickly, absorbing or diverting excess current and voltage to prevent chip damage.

[0048] The card-type device provided by this invention effectively protects the chip from overvoltage and overcurrent shocks by integrating a series-parallel protection circuit, improving device reliability in wireless charging environments and reducing malfunctions caused by electromagnetic interference. Furthermore, this series-parallel protection circuit uses only electronic components to achieve chip protection, thereby reducing the manufacturing cost of the card reader device.

[0049] In some embodiments of this utility model, the series-parallel protection circuit includes a first capacitor U1 and circuit elements;

[0050] One end of the first capacitor C1 is connected in series with one end of the radio frequency antenna RF, and the other end of the first capacitor C1 is connected in series with one end of the chip U1;

[0051] One end of the circuit element is connected in parallel between chip U1 and the first capacitor C1, and the other end of the circuit element is connected in parallel between chip U1 and the radio frequency antenna RF.

[0052] In some embodiments of this utility model, the shape of the card-type device includes, but is not limited to, square, round, etc., for easy carrying. For example, the size of the contactless card is designed as a square of 32mm*25mm or 23mm*15mm, or as a circle with a diameter of 32mm.

[0053] In this system, capacitors store electrical energy through charging and discharging, and release it quickly when needed. Series connections help control the current passing through the RF antenna and the chip, thereby reducing potential damage to the chip. Parallel connections help quickly absorb excess charge when overvoltage occurs across the chip, acting as a voltage regulator and preventing the chip from being damaged by excessive voltage.

[0054] In some embodiments of this utility model, one end of the radio frequency antenna is connected to the first capacitor, and the other end of the radio frequency antenna is connected to the chip and the circuit element respectively; one end of the chip is connected to the first capacitor and the circuit element respectively, and the other end of the chip is connected to the circuit element and the radio frequency antenna respectively.

[0055] For example, when the alternating magnetic field emitted by the wireless charging transmitter induces an electromotive force in the card's radio frequency antenna, the series capacitor will impede the rapid rise of the current, allowing the current to slowly increase to a suitable charging current value. Simultaneously, if the voltage across the chip rises during charging due to some reason (such as a sudden power change at the transmitter, electromagnetic interference, etc.), the parallel capacitor will immediately conduct, storing the excess charge and keeping the voltage across the chip within a safe range.

[0056] Meanwhile, the NFC card couples with the magnetic field of wireless charging. After careful calculation, a corresponding series capacitor is added and combined with the radio frequency antenna to filter the complex electromagnetic environment of wireless charging. This effectively filters out ultra-high frequency and ultra-low frequency energy, so that the card chip will not receive ultra-high frequency and ultra-low frequency energy in the wireless charging environment, thus preventing interference from ultra-high frequency and ultra-low frequency energy when the NFC card is working in the magnetic field.

[0057] In some embodiments of this invention, the number of first capacitors C1 is one or more. The number of circuit elements is one or more, and the circuit elements include second capacitors C2 or resistors.

[0058] In some embodiments of this utility model, the card-type device includes a first module containing a chip and a series-parallel protection circuit; the first module is electrically connected to the radio frequency antenna by welding.

[0059] The card-type device contains a specific first module, which comprises two key components: a chip and a series-parallel protection circuit. The electrical connection between the two components is achieved by melting metal solder (usually tin) and allowing it to form a stable connection after cooling. This connection ensures efficient electrical signal transmission between the first module and the radio frequency antenna. The radio frequency antenna handles wireless communication, while the first module handles the data processing and protection functions required for this communication.

[0060] In some embodiments of this utility model, the first module includes a substrate, which includes a chip encapsulated with protective adhesive and a series-parallel protection circuit. The substrate is etched with the circuit positions of each device in the series-parallel protection circuit and the connection paths between each device.

[0061] The substrate serves as the physical foundation of the module, providing a platform for mounting the chips and series / parallel protection circuitry. On the substrate, the chips and protection circuitry are encapsulated in protective adhesive. This encapsulation process typically uses epoxy resin or other types of protective adhesives to protect these sensitive electronic components from physical damage, environmental factors (such as humidity and dust), and chemical corrosion. Encapsulation also helps improve the module's mechanical strength, ensuring durability during manufacturing, transportation, and use.

[0062] In this process, circuit patterns are etched onto the substrate. These patterns define the locations of various electronic components (such as capacitors and resistors) in the series and parallel protection circuits, as well as the electrical connection paths between these components. Etching is a manufacturing process that creates circuit patterns on a substrate, typically involving the removal of a portion of the substrate surface to form the desired circuit traces.

[0063] The first module, for example Figure 2 As shown, the chip and the series-parallel protection circuit are packaged on the same substrate.

[0064] In some embodiments of this utility model, each component is individually mounted on the circuit location of the connection path between the components; the soldering method includes wire bonding or solder paste soldering, and the protective adhesive includes epoxy resin protective adhesive. A schematic diagram of the electrical connection between the first module and the RF antenna via soldering is shown below. Figure 3 As shown.

[0065] In the embodiments of this application, the circuit structure of this solution is simple, easy to implement and integrate into existing card designs, and will not have a significant impact on the overall structure and size of the card, thus exhibiting good compatibility and scalability.

[0066] In some embodiments of this utility model, the card-type device includes an antenna circuit, a second module, a third module, and a fourth module; the antenna circuit includes a radio frequency antenna; the second module includes a chip, which is packaged on the substrate of the second module; the third module includes a first capacitor, which is packaged on the substrate of the third module; the fourth module includes a second capacitor, which is packaged on the substrate of the fourth module; wherein the antenna circuit is configured based on the connection path of a series-parallel protection circuit; wherein the second module, the third module, and the fourth module are respectively disposed on the antenna circuit through preset soldering positions.

[0067] The second module is specifically designed to house chip U1, which is encapsulated on the module's substrate for protection and support. The third module houses the first capacitor C1, which is also encapsulated on the third module's substrate. The fourth module houses the second capacitor C2, which is encapsulated on the fourth module's substrate. The second, third, and fourth modules are fixed to the antenna circuit via pre-designed solder joints. These pre-designed solder joints are connection points designed to electrically connect the modules to the antenna circuit, ensuring signal and power transmission.

[0068] In this embodiment, the card-type device consists of an antenna circuit and three modules. Each module encapsulates specific electronic components (chip U1, first capacitor C1, and second capacitor C2) and is fixed to the antenna circuit via preset soldering points. This design allows each module to perform its specific function within the device, while simultaneously enabling electrical connection and signal transmission through the antenna circuit. Such a structural design helps improve the reliability, stability, and functionality of the device.

[0069] Among them, the second module specifically designed to house chip U1 is, for example Figure 4 As shown. The third and fourth modules, for accommodating the first capacitor C1 and the second capacitor C2, are, for example... Figure 5 As shown.

[0070] Among them, the second, third, and fourth modules set on the antenna circuit are as follows: Figure 6 As shown, the second, third, and fourth modules are fixed to the antenna circuit via preset soldering points.

[0071] In this embodiment, by integrating a series-parallel protection circuit into the card-type device, the chip can be effectively protected from overvoltage and overcurrent shocks, improving the reliability of the device in a wireless charging environment and reducing failures caused by electromagnetic interference. Furthermore, this series-parallel protection circuit can achieve chip protection using only electronic components, thereby reducing the manufacturing cost of the card reader device.

[0072] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A card-type device, characterized in that, include: The chip, the radio frequency antenna, and the series-parallel protection circuit for protecting the chip from overvoltage and overcurrent surges in the wireless charging environment; wherein, The series-parallel protection circuits are connected to the chip and the radio frequency antenna, respectively.

2. The card-type device according to claim 1, characterized in that, The series-parallel protection circuit includes a first capacitor and circuit elements; One end of the first capacitor is connected in series with one end of the radio frequency antenna, and the other end of the first capacitor is connected in series with one end of the chip; One end of the circuit element is connected in parallel between the chip and the first capacitor, and the other end of the circuit element is connected in parallel between the chip and the radio frequency antenna.

3. The card-type device according to claim 2, characterized in that, One end of the radio frequency antenna is connected to the first capacitor, and the other end of the radio frequency antenna is connected to the chip and the circuit element respectively; One end of the chip is connected to the first capacitor and the circuit element, respectively, and the other end of the chip is connected to the circuit element and the radio frequency antenna, respectively.

4. The card-type device according to claim 2, characterized in that, The number of the first capacitors is one or more.

5. The card-type device according to claim 2, characterized in that, The number of the circuit elements is one or more, and the circuit elements include a second capacitor or a resistor.

6. The card-type device according to claim 1, characterized in that, The card-type device includes a first module comprising the chip and the series-parallel protection circuit; The first module is electrically connected to the radio frequency antenna by welding.

7. The card-type device according to claim 6, characterized in that, The first module includes a substrate, which includes the chip encapsulated with protective adhesive and the series-parallel protection circuit. The substrate is etched with the circuit positions of each device in the series-parallel protection circuit and the connection paths between each device.

8. The card-type device according to claim 7, characterized in that, Each of the components is respectively attached to the circuit position of the connection path between the components; The welding method includes wire bonding or solder paste welding, and the protective adhesive includes epoxy resin protective adhesive.

9. The card-type device according to claim 5, characterized in that, The card-type device includes an antenna circuit, a second module, a third module, and a fourth module; The antenna circuit includes the radio frequency antenna; the second module includes the chip, which is packaged on the substrate of the second module. The third module includes the first capacitor, and the first capacitor is packaged on the substrate of the third module. The fourth module includes the second capacitor, which is encapsulated on the substrate of the fourth module; wherein, the antenna circuit is configured based on the connection path of the series-parallel protection circuit; The second module, the third module, and the fourth module are respectively mounted on the antenna circuit via preset welding positions.

10. The card-type device according to any one of claims 1-9, characterized in that, The card-type device is a smart card or an RFID card.