Circuit board assembly and electronic device

Abstract

This application provides a circuit board assembly and an electronic device. The circuit board assembly includes a detection module, a wireless charging module, and a motherboard. The detection element in the detection module is disposed on a first surface of a substrate, and a first chip is disposed on the first surface or the motherboard. A large area is reserved on the second surface of the substrate. The coil of the wireless charging module is arranged around the outer periphery of the substrate and is wound around a magnet. The magnet is used for magnetic attraction with the wireless charger, and the wireless coil is used for electromagnetic coupling with the wireless charger to achieve charging. The third surface of the magnet is fixed to the second surface of the substrate. The magnet can be set to a large area to reduce its thickness while meeting the magnetic attraction requirements, thereby reducing the thickness of the circuit board assembly and the electronic device. The motherboard and the substrate are electrically connected to achieve signal transmission between them.

Description

Technical Field

[0001] This application relates to the field of circuit board structure technology, and in particular to a circuit board assembly and electronic device. Background Technology

[0002] Electronic devices such as watches and wristbands typically house detection and wireless charging modules on their bottom casing. The detection module detects specific user information, while the wireless charging module includes a magnetic magnet and a wireless coil. The magnet magnetically engages with the wireless charger, and the wireless coil electromagnetically couples with the charger to achieve charging. Providing a circuit board assembly and electronic device with a thin magnetic magnet in the wireless charging module that meets magnetic force requirements is a challenge the industry needs to address. Utility Model Content

[0003] This application provides a circuit board assembly and an electronic device, wherein the thickness of the magnetic magnet in the wireless charging module is small, which meets the magnetic attraction requirements.

[0004] The embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a circuit board assembly, including: a detection module, a wireless charging module, and a motherboard. The detection module includes a substrate, a detection element, and a first chip. The substrate has a first surface and a second surface facing away from each other. The detection element is disposed on the first surface, and the first chip is disposed on the first surface or the motherboard. The wireless charging module includes a coil and a magnet, the coil being disposed around the outer periphery of the substrate. The magnet is sheet-shaped, and has a third surface and a fourth surface facing away from each other along the thickness direction of the magnet. The third surface of the magnet is fixed to the second surface of the substrate, and the magnet is located inside the coil. The motherboard and the fourth surface of the magnet are disposed facing each other, and the motherboard and the substrate are electrically connected.

[0006] The circuit board assembly provided in this application embodiment has a detection element in the detection module disposed on the first surface of the substrate, a first chip disposed on the first surface or the motherboard, and a large area reserved on the second surface of the substrate. The coil of the wireless charging module is arranged around the outer periphery of the substrate and wound around a magnet. The magnet is used for magnetic attraction with the wireless charger, and the wireless coil is used for electromagnetic coupling with the wireless charger to achieve charging. The third surface of the magnet is fixed to the second surface of the substrate. The magnet can be set to a large area to reduce its thickness while meeting the magnetic attraction requirements, thereby reducing the thickness of the circuit board assembly and the electronic device. An electrical connection is established between the motherboard and the substrate to achieve signal transmission between them.

[0007] In one alternative implementation, the third surface of the magnet and the second surface of the substrate can be glued, riveted, or fastened together. This facilitates a reliable connection between the magnet and the substrate.

[0008] In one alternative implementation, an electromagnetic shield is placed between the motherboard and the magnet. The electromagnetic shield can cover part of the electronic components on the motherboard, achieving electromagnetic shielding for these electronic components.

[0009] In one alternative implementation, an electromagnetic shield is disposed between the motherboard and the magnet. The electromagnetic shield and the fourth surface of the magnet are spaced apart. The detection module and the magnet are not integrated on the motherboard; instead, they are located on the bottom shell, and the motherboard is located on the middle frame.

[0010] In one alternative implementation, an electromagnetic shield is disposed between the motherboard and the magnet. The electromagnetic shield is fixed to the fourth surface of the magnet. The detection module is mounted on the electromagnetic shield of the motherboard via the magnet, eliminating the safety gap between the detection module and the motherboard, thereby reducing the thickness of the circuit board assembly and electronic device. The motherboard and the detection module can be electrically connected via a flexible part / flexible circuit board, which has a short length and small area.

[0011] In one alternative implementation, the electromagnetic shield and the fourth surface of the magnet are connected by adhesive bonding, riveting, or fasteners (such as screws). This facilitates a reliable connection between the electromagnetic shield and the magnet.

[0012] In one alternative implementation, the ratio of the area of ​​the third surface of the magnet to the area of ​​the second surface of the substrate is greater than or equal to 0.3. This allows for a smaller magnet thickness while still meeting magnetic attraction requirements, resulting in a smaller thickness for the circuit board assembly and electronic device.

[0013] In one alternative implementation, the area of ​​the third surface of the magnet can be greater than or equal to 50 square millimeters. Setting the magnet to a larger area allows for a smaller magnet thickness while still meeting magnetic attraction requirements, resulting in a smaller thickness for the circuit board assembly and electronic device.

[0014] In one alternative implementation, a first electronic device may be disposed on the second surface of the substrate, the height of which is less than or equal to the thickness of the magnet. By disposing of the first electronic device on the second surface of the substrate without affecting the thickness of the circuit board assembly or the placement of a large-area magnet, a predetermined circuit function can be achieved.

[0015] In one alternative implementation, the second surface of the substrate may not have the first electronic device disposed thereon, but instead a large-area magnet, so that the thickness of the magnet can be made small.

[0016] In one alternative implementation, the substrate is a rigid circuit board, and the substrate and the main board are electrically connected via a flexible circuit board. The flexible circuit board can be bent to facilitate adjustment of its position and orientation.

[0017] In one alternative implementation, the substrate is circular. The flexible circuit board includes a first portion and a second portion, the first portion being generally C-shaped and the second portion being generally U-shaped, with the middle of the first portion and one end of the second portion connected. The first portion is disposed near the edge of the substrate and is electrically connected to the substrate, while the other end of the second portion is electrically connected to the motherboard.

[0018] In one alternative implementation, the flexible circuit board and the substrate are soldered together. The flexible circuit board has a first pad, and the substrate has a second pad; the first and second pads are soldered together, for example, by pressure bonding.

[0019] In one alternative implementation, the flexible circuit board and the substrate are connected by a connector. The connector includes a first connecting part and a second connecting part that engage in a mating process; the first connecting part is disposed on the flexible circuit board, and the second connecting part is disposed on the substrate.

[0020] In one alternative implementation, the flexible circuit board and the motherboard are connected via a connector. The connector includes a first connecting part and a second connecting part that engage in a mating process; the first connecting part is located on the flexible circuit board, and the second connecting part is located on the motherboard.

[0021] In one alternative implementation, the flexible circuit board and the motherboard are soldered together. The flexible circuit board has a third pad, and the motherboard has a fourth pad; the third and fourth pads are soldered together, for example, by pressure bonding.

[0022] In one alternative implementation, the substrate includes a flexible portion and a reinforcing sheet, with the reinforcing sheet stacked on the flexible portion. The flexible portion and the main board are electrically connected. The flexible portion is bendable to facilitate adjustment of its position and orientation. The flexible portion has conductive traces, and devices on the flexible portion are electrically connected to the main board via these conductive traces. A first surface is located on the side of the flexible portion opposite to the reinforcing sheet, and a second surface is located on the side of the reinforcing sheet opposite to the flexible portion.

[0023] In one alternative implementation, the reinforcing sheet is circular. The flexible portion includes a first part and a second part, the first part being circular and the second part being generally strip-shaped or other shapes, with one end of the first part and the second part connected. The first part is fixed to the reinforcing sheet, and the other end of the second part is electrically connected to the main board.

[0024] In one alternative implementation, the flexible part and the motherboard can be connected via a connector. Alternatively, the flexible part and the motherboard can be soldered together, with the flexible part having a first pad and the motherboard having a second pad, and the first and second pads being soldered together.

[0025] In one alternative implementation, the substrate is a rigid-flex board, which includes a rigid portion and a flexible portion. The rigid portion and the flexible portion are electrically connected, and the flexible portion is electrically connected to the main board. The rigid portion and the flexible portion are an integral structure, with the rigid portion serving as a carrier for mounting the detection element and the magnet, and the flexible portion connecting the rigid portion and the main board.

[0026] In one alternative implementation, the substrate and the motherboard are electrically connected via a connector. The connector includes a first connecting portion and a second connecting portion that engage in a mating process; the first connecting portion is disposed on the substrate, and the second connecting portion is disposed on the motherboard.

[0027] In one alternative implementation, a magnetic conductor is provided on the first surface of the substrate, and the magnetic conductor and the detection element are spaced apart. This can improve the magnetic field distribution of the magnet, increase the magnetic attraction force, and reduce the thickness of the magnet.

[0028] In one alternative implementation, the detection element includes at least one of an optical volumetric sensor, an electrocardiogram sensor, and a temperature sensor. One or more detection elements with different functions can be configured as needed.

[0029] In one alternative implementation, the detection element includes an optical volumetric sensor, comprising one or more light-emitting diodes (LEDs) and one or more photodiodes, spaced apart, with the light-emitting surface of the LEDs facing away from the substrate and the light-receiving surface of the photodiodes facing away from the substrate. The first chip includes a heart rate sensing chip.

[0030] In one alternative implementation, a light-shielding element is provided between the light-emitting diode and the photodiode.

[0031] In one alternative implementation, the wireless charging module includes a magnetic ring, with a coil sleeved on the magnetic ring, which can enhance magnetic field coupling and improve charging efficiency.

[0032] Secondly, embodiments of this application provide a circuit board assembly, including: a detection module, a wireless charging module, and a motherboard. The detection module includes a substrate and a detection element. The substrate has a first surface and a second surface facing away from each other. The detection element is disposed on the first surface. The wireless charging module includes a coil and a magnet, the coil being disposed around the outer periphery of the substrate. The magnet is sheet-shaped, and has a third surface and a fourth surface facing away from each other along the thickness direction of the magnet. The third surface of the magnet is fixed to the second surface of the substrate, and the magnet is located inside the coil. An electromagnetic shield is disposed between the motherboard and the magnet. The electromagnetic shield is fixed to the fourth surface of the magnet. The motherboard and the substrate are electrically connected.

[0033] The circuit board assembly provided in this application embodiment has a detection element in the detection module disposed on the first surface of the substrate. The coil of the wireless charging module is arranged around the outer periphery of the substrate and wound around a magnet. The magnet is used for magnetic attraction with the wireless charger, and the wireless coil is used for electromagnetic coupling with the wireless charger to achieve charging. By mounting the detection module onto the electromagnetic shielding of the motherboard via the magnet, the safety gap between the detection module and the motherboard is eliminated, reducing the thickness of the circuit board assembly and the electronic device. The motherboard, magnet, and detection module are an integral structure. The motherboard and detection module can be electrically connected via a flexible circuit board, which is shorter, smaller in area, and lower in cost. An electrical connection is established between the motherboard and the substrate to achieve signal transmission between them.

[0034] In one alternative implementation, the detection module further includes a first chip disposed on a first surface or a motherboard. With the first chip disposed on the first surface or motherboard, a larger area is reserved on the second surface of the substrate. The third surface of the magnet is fixed to the second surface of the substrate. The magnet can be configured with a larger area to reduce its thickness while still meeting magnetic attraction requirements, thereby reducing the thickness of the circuit board assembly and electronic device.

[0035] In one alternative implementation, the third surface of the magnet and the second surface of the substrate can be glued, riveted, or fastened together. This facilitates a reliable connection between the magnet and the substrate.

[0036] In one alternative implementation, the electromagnetic shield and the fourth surface of the magnet are connected by adhesive bonding, riveting, or fasteners (such as screws). This facilitates a reliable connection between the electromagnetic shield and the magnet.

[0037] In one alternative implementation, the ratio of the area of ​​the third surface of the magnet to the area of ​​the second surface of the substrate is greater than or equal to 0.3. This allows for a smaller magnet thickness while still meeting magnetic attraction requirements, resulting in a smaller thickness for the circuit board assembly and electronic device.

[0038] In one alternative implementation, the area of ​​the third surface of the magnet can be greater than or equal to 50 square millimeters. Setting the magnet to a larger area allows for a smaller magnet thickness while still meeting magnetic attraction requirements, resulting in a smaller thickness for the circuit board assembly and electronic device.

[0039] In one alternative implementation, a first electronic device may be disposed on the second surface of the substrate, the height of which is less than or equal to the thickness of the magnet. By disposing of the first electronic device on the second surface of the substrate without affecting the thickness of the circuit board assembly or the placement of a large-area magnet, a predetermined circuit function can be achieved.

[0040] In one alternative implementation, the second surface of the substrate may not have the first electronic device disposed thereon, but instead a large-area magnet, so that the thickness of the magnet can be made small.

[0041] In one alternative implementation, the substrate is a rigid circuit board, and the substrate and the main board are electrically connected via a flexible circuit board. The flexible circuit board can be bent to facilitate adjustment of its position and orientation.

[0042] In one alternative implementation, the substrate is circular. The flexible circuit board includes a first portion and a second portion, the first portion being generally C-shaped and the second portion being generally U-shaped, with the middle of the first portion and one end of the second portion connected. The first portion is disposed near the edge of the substrate and is electrically connected to the substrate, while the other end of the second portion is electrically connected to the motherboard.

[0043] In one alternative implementation, the flexible circuit board and the substrate are soldered together. The flexible circuit board has a first pad, and the substrate has a second pad; the first and second pads are soldered together, for example, by pressure bonding.

[0044] In one alternative implementation, the flexible circuit board and the substrate are connected by a connector. The connector includes a first connecting part and a second connecting part that engage in a mating process; the first connecting part is disposed on the flexible circuit board, and the second connecting part is disposed on the substrate.

[0045] In one alternative implementation, the flexible circuit board and the motherboard are connected via a connector. The connector includes a first connecting part and a second connecting part that engage in a mating process; the first connecting part is located on the flexible circuit board, and the second connecting part is located on the motherboard.

[0046] In one alternative implementation, the flexible circuit board and the motherboard are soldered together. The flexible circuit board has a third pad, and the motherboard has a fourth pad; the third and fourth pads are soldered together, for example, by pressure bonding.

[0047] In one alternative implementation, the substrate includes a flexible portion and a reinforcing sheet, with the reinforcing sheet stacked on the flexible portion. The flexible portion and the main board are electrically connected. The flexible portion is bendable to facilitate adjustment of its position and orientation. The flexible portion has conductive traces, and devices on the flexible portion are electrically connected to the main board via these conductive traces. A first surface is located on the side of the flexible portion opposite to the reinforcing sheet, and a second surface is located on the side of the reinforcing sheet opposite to the flexible portion.

[0048] In one alternative implementation, the reinforcing sheet is circular. The flexible portion includes a first part and a second part, the first part being circular and the second part being generally strip-shaped or other shapes, with one end of the first part and the second part connected. The first part is fixed to the reinforcing sheet, and the other end of the second part is electrically connected to the main board.

[0049] In one alternative implementation, the flexible part and the motherboard can be connected via a connector. Alternatively, the flexible part and the motherboard can be soldered together, with the flexible part having a first pad and the motherboard having a second pad, and the first and second pads being soldered together.

[0050] In one alternative implementation, the substrate is a rigid-flex board, which includes a rigid portion and a flexible portion. The rigid portion and the flexible portion are electrically connected, and the flexible portion is electrically connected to the main board. The rigid portion and the flexible portion are an integral structure, with the rigid portion serving as a carrier for mounting the detection element and the magnet, and the flexible portion connecting the rigid portion and the main board.

[0051] In one alternative implementation, the substrate and the motherboard are electrically connected via a connector. The connector includes a first connecting portion and a second connecting portion that engage in a mating process; the first connecting portion is disposed on the substrate, and the second connecting portion is disposed on the motherboard.

[0052] In one alternative implementation, a magnetic conductor is provided on the first surface of the substrate, and the magnetic conductor and the detection element are spaced apart. This can improve the magnetic field distribution of the magnet, increase the magnetic attraction force, and reduce the thickness of the magnet.

[0053] In one alternative implementation, the detection element includes at least one of an optical volumetric sensor, an electrocardiogram sensor, and a temperature sensor. One or more detection elements with different functions can be configured as needed.

[0054] In one alternative implementation, the detection element includes an optical volumetric sensor, comprising one or more light-emitting diodes (LEDs) and one or more photodiodes, spaced apart, with the light-emitting surface of the LEDs facing away from the substrate and the light-receiving surface of the photodiodes facing away from the substrate. The first chip includes a heart rate sensing chip.

[0055] In one alternative implementation, a light-shielding element is provided between the light-emitting diode and the photodiode.

[0056] In one alternative implementation, the wireless charging module includes a magnetic ring, with a coil sleeved on the magnetic ring, which can enhance magnetic field coupling and improve charging efficiency.

[0057] Thirdly, embodiments of this application provide an electronic device, including a bottom shell, a middle frame, and the aforementioned circuit board assembly. The bottom shell is mounted on the middle frame. A detection module and a wireless charging module are disposed within the bottom shell, and the main board is disposed on the middle frame. A first surface of the substrate is disposed facing the inner side of the bottom shell, and the detection element of the detection module is located between the bottom shell and the substrate.

[0058] When a user uses an electronic device, the detection element inside the bottom shell faces the user's skin, and can detect specific user information through the detection element. The wireless charging module is used to magnetically engage with a wireless charger to achieve electromagnetic coupling charging.

[0059] In one alternative implementation, the mid-frame may house components such as a motherboard, battery, and display screen. The motherboard and battery are electrically connected. The battery may be located on the side of the motherboard facing away from the bottom casing. The display screen and bottom casing may be located at opposite ends of the mid-frame.

[0060] In one alternative implementation, the electronic device is a watch or bracelet, with a bottom case mounted on a mid-frame. The mid-frame can be connected to a watch strap or wristband for easy wear by the user. Attached Figure Description

[0061] Figure 1 (a) and (b) are cross-sectional views of the bottom shell location and the detection module in an electronic device of the related technology, respectively;

[0062] Figure 2 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0063] Figure 3 A partial cross-sectional view of the location of the bottom shell in an electronic device provided in an embodiment of this application;

[0064] Figure 4 for Figure 3 Assembly diagram of the substrate, flexible circuit board and magnet of electronic device;

[0065] Figure 5 This is a schematic diagram of the structure of an electronic device after the bottom shell has been removed, according to another embodiment of this application.

[0066] Figure 6 for Figure 5 Exploded view of electronic equipment;

[0067] Figure 7 for Figure 5 Assembly diagram of the bottom case and coil of the electronic device;

[0068] Figure 8 This is a schematic diagram of the structure of an electronic device after the bottom shell has been removed, according to another embodiment of this application.

[0069] Figure 9 for Figure 8 An exploded view of an electronic device.

[0070] Explanation of reference numerals in the attached figures:

[0071] 1-Electronic device; 2-Bottom shell; 4-Detection module; 4a-Substrate; 4b-Detection element; 4c-Chip; 5-Wireless charging module; 5a-Coil; 5b-Magnet; 6-Main board; 7-Safety gap;

[0072] 1000 - Electronic equipment; 100 - Circuit board assembly;

[0073] 10-Detection module; 11-Substrate; 11a-First surface; 11b-Second surface; 111-Second pad; 112-Flexible part; 1121-First part; 1122-Second part; 1123-First pad; 113-Reinforcing sheet; 12-Detection element; 121-Light emission diode; 122-Photodiode; 123-Light shield; 13-First chip;

[0074] 20 - Wireless charging module; 21 - Coil; 22 - Magnet; 22a - Third surface; 22b - Fourth surface; 23 - Magnetic conductor; 24 - Magnetic ring;

[0075] 30-Main board; 31-Electromagnetic shielding component; 32-Second solder pad; 33-Electronic component; 40-Colloid; 50-Flexible circuit board; 51-First part; 511-First solder pad; 52-Second part; 53-Connector; 531-First connecting part; 532-Second connecting part;

[0076] 200 - Bottom shell; 200a - Inner side surface;

[0077] 300 - Mid-frame; 400 - Battery; 500 - Display; 600 - Watch strap. Detailed Implementation

[0078] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this implementation. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0079] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0080] It should be understood that, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0082] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0083] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0084] See Figure 1In (a) and (b) of the related technology, an electronic device 1 includes a bottom shell 2, a middle frame, a detection module 4, a wireless charging module 5, and a motherboard 6. The detection module 4 and the wireless charging module 5 are disposed inside the bottom shell 2. The detection module 4 includes a substrate 4a, a detection element 4b, and a chip 4c. The wireless charging module 5 includes a coil 5a and a magnet 5b. The top surface of the substrate 4a is the side of the substrate 4a facing away from the bottom shell 2, and the bottom surface of the substrate 4a is the side of the substrate 4a facing the bottom shell 2. The top surface of the substrate 4a can be used to house the chip 4c, matching devices (such as resistors and capacitors), and the magnet 5b, occupying a height of approximately 1 mm or more. The bottom surface of the substrate 4a can be used to house the detection element 4b. In a space-constrained scenario, the area of ​​the substrate 4a is limited. The chip 4c and matching devices are placed on the top surface of the substrate 4a, while the area for arranging the magnet 5b is relatively small. By increasing the thickness of the magnet 5b (the dimension in the vertical direction), the magnetic attraction requirements can be met, but this will result in a larger overall thickness of the electronic device 1.

[0085] The detection module 4 is located inside the bottom shell 2, and the main board 6 is located inside the middle frame. A safety gap 7 needs to be reserved between the detection module 4 and the main board 6 to reduce the risk of failure or damage to the detection module 4 due to impact in a drop scenario. The setting of the safety gap 7 will make the overall thickness of the electronic device 1 relatively large. The substrate 4a and the main board 6 are connected by a redundant flexible circuit board to achieve the conductive connection between the detection module 4 and the main board 6. This flexible circuit board is relatively long and has a large area, resulting in high cost.

[0086] See Figure 2 , Figure 3 This application provides an electronic device 1000, including a bottom shell 200, a middle frame 300, and a circuit board assembly 100. The bottom shell 200 is mounted on the middle frame 300. The circuit board assembly 100 includes a detection module 10, a wireless charging module 20, and a motherboard 30. The detection module 10 and the wireless charging module 20 are disposed within the bottom shell 200, and the motherboard 30 is disposed within the middle frame 300. The detection module 10 can detect specific user information. The wireless charging module 20 is used to magnetically engage with a wireless charger to achieve electromagnetic coupling charging.

[0087] The electronic device 1000 can be any device with a detection module 10, such as a watch, bracelet, or other wearable device. The bottom shell 200 and the middle frame 300 both serve as the housing of the electronic device 1000. The middle frame 300 and the bottom shell 200 can be connected by adhesive bonding, snap-fit, or other methods.

[0088] The mid-frame 300 can house components such as the motherboard 30, battery 400, and display screen 500. The motherboard 30 can house electronic components 33 such as a processor and communication chip. The motherboard 30 and battery 400 are electrically connected, and the battery 400 supplies power to the motherboard 30, detection module 10, display screen 500, and other components. The battery 400 can be located on the side of the motherboard 30 facing away from the bottom housing 200. The display screen 500 and the bottom housing 200 can be located at opposite ends of the mid-frame 300. The detection module 10, located on the bottom housing 200, performs user detection. The display screen 500 has display functions, such as displaying information detected by the detection module 10. The display screen 500 may also have touch functionality to detect touch operations applied to or near it.

[0089] For example, the electronic device 1000 is a watch or bracelet, with a bottom shell 200 mounted on a mid-frame 300. The mid-frame 300 can be connected to a watch strap 600 or a wristband for easy wear by the user. When the user wears the wearable device, the bottom shell 200 rests against the user's skin, with the detection module 10 inside the bottom shell 200 facing the user's skin. The detection module 10 can detect specific user information. The bottom shell 200 may have a convex surface, which can rest against the user's skin when the user uses the device, facilitating detection by the detection module 10.

[0090] See Figure 3 This application provides a circuit board assembly 100, including a detection module 10, a wireless charging module 20, and a motherboard 30. The detection module 10 includes a substrate 11, a detection element 12, and a first chip 13. The substrate 11 has a first surface 11a and a second surface 11b facing each other. The detection element 12 is disposed on the first surface 11a, and the first chip 13 is disposed on the first surface 11a or the motherboard 30. The wireless charging module 20 includes a coil 21 and a magnet 22, the coil 21 being disposed around the outer periphery of the substrate 11. The magnet 22 is sheet-shaped, and the magnet 22 has a thickness direction along its thickness. Figure 3 The third surface 22a and the fourth surface 22b of the magnet 22 are opposite to each other in the vertical direction. The third surface 22a of the magnet 22 is fixed to the second surface 11b of the substrate 11, and the magnet 22 is located inside the coil 21. The main board 30 and the fourth surface 22b of the magnet 22 are arranged facing each other, and the main board 30 and the substrate 11 are electrically connected.

[0091] When the detection module 10 can be an optical volumetric recording module, the detection element 12 may include a light-emitting diode 121 and a photodiode 122. Alternatively, when the detection module 10 can be an electrocardiogram (ECG) module, the detection element 12 is an ECG sensor. Alternatively, when the detection module 10 can be a temperature detection module, the detection element 12 is a temperature sensor.

[0092] The coil 21 is arranged around the outer periphery of the substrate 11, meaning that it is in the thickness direction of the magnet 22. Figure 3(Up and down direction), the projection of coil 21 is outside the projection of substrate 11. Coil 21 and substrate 11 can be offset vertically or lie on the same plane.

[0093] Fixing the third surface 22a of the magnet 22 to the second surface 11b of the substrate 11 means that the third surface 22a of the magnet 22 and the second surface 11b of the substrate 11 are mechanically connected face to face.

[0094] Magnet 22 is located inside coil 21, meaning that in the thickness direction of magnet 22, the projection of coil 21 is outside the projection of magnet 22. Coil 21 and magnet 22 can be offset vertically or lie on the same plane.

[0095] The circuit board assembly 100 provided in this application embodiment has a detection element 12 in the detection module 10 disposed on the first surface 11a of the substrate 11, and a first chip 13 disposed on the first surface 11a or the main board 30. A large area is reserved on the second surface 11b of the substrate 11. The coil 21 of the wireless charging module 20 is disposed around the outer periphery of the substrate 11 and is wound around the magnet 22. The magnet 22 is used for magnetic attraction with the wireless charger, and the wireless coil 21 is used for electromagnetic coupling with the wireless charger to achieve charging. The third surface 22a of the magnet 22 is fixed to the second surface 11b of the substrate 11. The magnet 22 can be set to a large area to make the thickness of the magnet 22 small and meet the magnetic attraction requirements, thereby making the thickness of the circuit board assembly 100 and the electronic device 1000 small. The main board 30 and the substrate 11 are electrically connected to realize signal transmission between the main board 30 and the substrate 11.

[0096] When the circuit board assembly 100 is applied to the electronic device 1000, the first surface 11a of the substrate 11 is disposed facing the inner side surface 200a of the bottom shell 200, and the detection element 12 of the detection module 10 is located between the bottom shell 200 and the substrate 11. When the user uses the electronic device 1000, the detection element 12 inside the bottom shell 200 faces the user's skin, and specific user information can be detected through the detection element 12. The wireless coil 21 is electrically connected to the battery 400, and the wireless coil 21 is electromagnetically coupled to the wireless charger to charge the battery 400.

[0097] In some embodiments, see Figure 3 The third surface 22a of the magnet 22 and the second surface 11b of the substrate 11 can be bonded together with adhesive 40, riveted, or fastened. Using the above mechanical connection method, a reliable connection between the magnet 22 and the substrate 11 can be easily achieved.

[0098] For example, when the magnet 22 and the substrate 11 are connected by the adhesive 40, the adhesive 40 can be double-sided adhesive. The double-sided adhesive is placed on the magnet 22 or the substrate 11, and then the magnet 22 and the substrate 11 are bonded together by the double-sided adhesive. The double-sided adhesive is an adhesive layer disposed between the magnet 22 and the substrate 11.

[0099] For example, when the magnet 22 and the substrate 11 are connected by the adhesive 40, the adhesive 40 can be dispensing. Liquid adhesive is applied to the magnet 22 or the substrate 11, and the magnet 22 and the substrate 11 are pressed together and cured by the liquid adhesive to achieve the connection between the magnet 22 and the substrate 11.

[0100] In some embodiments, see Figure 3 An electromagnetic shielding component 31 is disposed between the motherboard 30 and the magnet 22. The electromagnetic shielding component 31 can cover part of the electronic components 33 on the motherboard 30, thereby achieving electromagnetic shielding for these electronic components 33. The electromagnetic shielding component 31 can be made of metals such as iron and steel, and has a good electromagnetic shielding effect.

[0101] In some embodiments, see Figure 3 An electromagnetic shielding component 31 is provided between the main board 30 and the magnet 22. The electromagnetic shielding component 31 and the fourth surface 22b of the magnet 22 are spaced apart. The detection module 10 and the magnet 22 are not integrated on the main board 30; the detection module 10 and the magnet 22 are located on the bottom shell 200, and the main board 30 is located on the middle frame 300.

[0102] In some embodiments, see Figures 5 to 7 An electromagnetic shielding component 31 is provided between the motherboard 30 and the magnet 22. The electromagnetic shielding component 31 is fixed to the fourth surface 22b of the magnet 22. The detection module 10 is assembled onto the electromagnetic shielding component 31 of the motherboard 30 via the magnet 22, eliminating the safety gap between the detection module 10 and the motherboard 30, thereby reducing the thickness of the circuit board assembly 100 and the electronic device 1000. Moreover, the motherboard 30, the magnet 22, and the detection module 10 are an integral structure, and the motherboard 30 and the detection module 10 can be electrically connected through the flexible part 112 / flexible circuit board. The flexible part 112 / flexible circuit board has a shorter length and smaller area, resulting in lower cost.

[0103] In some embodiments, see Figure 5 and Figure 6 The electromagnetic shielding component 31 and the fourth surface 22b of the magnet 22 are connected by adhesive bonding, riveting, or fasteners (such as screws). Using these mechanical connection methods, a reliable connection between the electromagnetic shielding component 31 and the magnet 22 can be easily achieved.

[0104] For example, when the electromagnetic shielding component 31 and the magnet 22 are connected by an adhesive, the adhesive can be double-sided tape. The double-sided tape is placed on the electromagnetic shielding component 31 or the magnet 22, and then the electromagnetic shielding component 31 and the magnet 22 are bonded together by the double-sided tape. The double-sided tape is an adhesive layer placed between the electromagnetic shielding component 31 and the magnet 22.

[0105] For example, when the electromagnetic shielding component 31 and the magnet 22 are connected by an adhesive, the adhesive can be dispensed. Liquid adhesive is applied to the electromagnetic shielding component 31 or the magnet 22, and the electromagnetic shielding component 31 and the magnet 22 are pressed together and cured by the liquid adhesive to achieve the connection between the electromagnetic shielding component 31 and the magnet 22.

[0106] In some embodiments, see Figure 3 and Figure 6 The ratio of the area of ​​the third surface 22a of magnet 22 to the area of ​​the second surface 11b of substrate 11 is greater than or equal to 0.3. Increasing the area occupied by magnet 22 on substrate 11 allows for a smaller magnet thickness while still meeting magnetic attraction requirements, thereby reducing the thickness of circuit board assembly 100 and electronic device 1000. Furthermore, the larger the area of ​​magnet 22, the smaller its thickness can be while still meeting magnetic attraction requirements.

[0107] For example, the ratio of the area of ​​the third surface 22a of the magnet 22 to the area of ​​the second surface 11b of the substrate 11 can be 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, or any range of the two preceding numbers.

[0108] In some embodiments, see Figure 3 and Figure 6 The area of ​​the third surface 22a of magnet 22 can be greater than or equal to 50 square millimeters (mm²). 2 With a limited area on the second surface 11b of the substrate 11, the magnet 22 is set to have a larger area, so that the thickness of the magnet 22 is small and the magnetic attraction force requirement is met, thereby making the thickness of the circuit board assembly 100 and the electronic device 1000 smaller.

[0109] For example, the area of ​​the third surface 22a of the magnet 22 can be 50 mm². 2 55mm 2 60mm 2 65mm 2 70mm 2 705mm 2 80mm 2 , or the range of any two preceding numbers.

[0110] In some embodiments, a first electronic device may be disposed on the second surface 11b of the substrate 11, the height of which is less than or equal to the thickness of the magnet 22. The height of the first electronic device is its dimension in the thickness direction of the magnet 22. Without affecting the thickness of the circuit board assembly 100 or the arrangement of a large-area magnet 22, the first electronic device is disposed on the second surface 11b of the substrate 11 to achieve a predetermined circuit function. The first electronic device may be a resistor, capacitor, or other similar device.

[0111] In other embodiments, the second surface 11b of the substrate 11 may not be provided with the first electronic device, but with a large-area magnet 22, so that the thickness of the magnet 22 can be made small.

[0112] In some embodiments, see Figures 3 to 6 The substrate 11 is a rigid circuit board, and the substrate 11 and the main board 30 are electrically connected via a flexible circuit board 50. The flexible circuit board 50 is a flexible printed circuit (FPC), which can be bent to facilitate adjustment of its position and orientation. The flexible circuit board 50 has conductive traces, enabling signal transmission through the electrical connection between the substrate 11 and the main board 30. A small number of devices can be disposed on the second surface 11b of the substrate 11. The shapes of the substrate 11 and the flexible circuit board 50 can be designed as needed.

[0113] For example, the substrate 11 is circular. The flexible circuit board 50 includes a first portion 51 and a second portion 52. The first portion 51 is generally C-shaped, and the second portion 52 is generally U-shaped. The middle of the first portion 51 and one end of the second portion 52 are connected. The first portion 51 is disposed near the edge of the substrate 11 and is electrically connected to the substrate 11. The other end of the second portion 52 is electrically connected to the main board 30. Furthermore, the substrate 11 and the flexible circuit board 50 can be configured in other shapes.

[0114] There are several possible implementation methods when the flexible circuit board 50 and the substrate 11 are electrically connected. Two implementation methods are given below as examples.

[0115] The first method for electrically connecting the flexible circuit board 50 and the substrate 11: See [link / reference] Figure 3 The flexible circuit board 50 and the substrate 11 are soldered together. The flexible circuit board 50 has a first pad 511, and the substrate 11 has a second pad 111. The first pad 511 and the second pad 111 are soldered together, for example, by pressure bonding. The second pad 111 can be on either the first surface 11a or the second surface 11b of the substrate 11.

[0116] The flexible circuit board 50 and the substrate 11 are connected by solder pads, which facilitates assembly and achieves a conductive connection between them. During assembly, the first solder pad 511 and the second solder pad 111 are soldered together, thereby achieving a conductive connection between the flexible circuit board 50 and the substrate 11.

[0117] The second method for electrically connecting the flexible circuit board 50 and the substrate 11 is as follows: the flexible circuit board 50 and the substrate 11 are connected by a connector (not shown). The connector includes a first connecting part and a second connecting part that engage in a plug-in manner. The first connecting part is disposed on the flexible circuit board 50, and the second connecting part is disposed on the substrate 11.

[0118] The flexible circuit board 50 and the substrate 11 are connected by a connector, which facilitates assembly and enables a conductive connection between them. During assembly, the first connecting part is inserted into the second connecting part, thereby achieving a conductive connection between the flexible circuit board 50 and the substrate 11 through the first and second connecting parts.

[0119] The connector can be a board-to-board (BTB) connector, a zero-insertion-force (ZIF) connector, or other types of connectors. ZIF connectors do not require additional insertion force during connection and achieve a stable connection through a snap-fit ​​mechanism.

[0120] When the flexible circuit board 50 and the motherboard 30 are electrically connected, there are several possible implementation methods. Two implementation methods are given as examples below.

[0121] The first method for electrically connecting the flexible circuit board 50 and the main board 30: See [link / reference] Figure 3 , Figure 4 The flexible circuit board 50 and the main board 30 are connected by a connector 53. The connector 53 includes a first connecting part 531 and a second connecting part 532 that are mated together. The first connecting part 531 is disposed on the flexible circuit board 50 and the second connecting part 532 is disposed on the main board 30.

[0122] The flexible circuit board 50 and the main board 30 are connected by a connector 53, which facilitates assembly and enables a conductive connection between them. During assembly, the first connecting part 531 is inserted into the second connecting part 532, thereby achieving a conductive connection between the flexible circuit board 50 and the main board 30 through the first connecting part 531 and the second connecting part 532.

[0123] Connector 53 can be a board-to-board connector, a zero-insertion-force connector, or other types of connectors.

[0124] The second method for electrically connecting the flexible circuit board 50 and the main board 30 involves soldering the flexible circuit board 50 and the main board 30 together. The flexible circuit board 50 has a third pad (not shown), and the main board 30 has a fourth pad (not shown). The third pad and the fourth pad are soldered together, for example, by pressure bonding.

[0125] The flexible circuit board 50 and the main board 30 are connected by solder pads, which facilitates assembly and achieves a conductive connection between them. During assembly, the third and fourth solder pads are soldered together to achieve a conductive connection between the flexible circuit board 50 and the main board 30.

[0126] In some embodiments, see Figure 8 and Figure 9 The substrate 11 includes a flexible portion 112 and a reinforcing sheet 113, with the reinforcing sheet 113 stacked on top of the flexible portion 112. The flexible portion 112 is electrically connected to the main board 30. The flexible portion 112 is a flexible printed circuit board, which can be bent to facilitate adjustment of its position and orientation. The flexible portion 112 has conductive traces, and devices on the flexible portion 112 are electrically connected to the main board 30 through these conductive traces. A first surface 11a is located on the side of the flexible portion 112 opposite to the reinforcing sheet 113, and a second surface 11b is located on the side of the reinforcing sheet 113 opposite to the flexible portion 112. That is, the detection element 12 is disposed on the flexible portion 112, and the magnet 22 is fixed to the reinforcing sheet 113. The shapes of the flexible portion 112 and the reinforcing sheet 113 are designed as needed.

[0127] For example, the reinforcing piece 113 is circular. The flexible portion 112 includes a first portion 1121 and a second portion 1122. The first portion 1121 is circular, and the second portion 1122 is generally strip-shaped or other shapes. One end of the first portion 1121 and the second portion 1122 are connected. The first portion 1121 and the reinforcing piece 113 are fixed, and the other end of the second portion 1122 is electrically connected to the main board 30. Furthermore, the flexible portion 112 and the reinforcing piece 113 can be configured in other shapes.

[0128] When the flexible part 112 and the main board 30 are electrically connected, the flexible part 112 and the main board 30 can be connected via a connector (not shown). Alternatively, the flexible part 112 and the main board 30 can be soldered together, with the flexible part 112 having a first pad 1123 and the main board 30 having a second pad 32, and the first pad 1123 and the second pad 32 soldered together. For specific configuration methods, please refer to the previous embodiment of the electrical connection between the flexible circuit board 50 and the substrate 11, which will not be repeated here.

[0129] In some embodiments, the substrate 11 is a rigid-flexible plate, which includes a rigid portion and a flexible portion, which are electrically connected to each other, and the flexible portion is electrically connected to the main board 30. The substrate 11 adopts the form of a rigid-flexible plate, with the rigid portion and the flexible portion being an integral structure. The rigid portion serves as a carrier for mounting the detection element 12 and the magnet 22, and the flexible portion is connected between the rigid portion and the main board 30.

[0130] When the flexible part and the main board 30 are electrically connected, they can be connected via a connector (not shown). Alternatively, the flexible part and the main board 30 can be soldered together for electrical connection. For specific configuration details, please refer to the previous embodiment of the electrical connection between the flexible circuit board 50 and the substrate 11; these details will not be repeated here.

[0131] In some embodiments, the substrate 11 and the motherboard 30 are electrically connected via a connector (not shown). The connector includes a first connecting portion and a second connecting portion that engage with each other. The first connecting portion is disposed on the substrate 11, and the second connecting portion is disposed on the motherboard 30. The substrate 11 and the motherboard 30 can be positioned and fixed together by means of snap-fit ​​or similar methods. During assembly, the first connecting portion is inserted into the second connecting portion, thereby achieving an electrical connection between the substrate 11 and the motherboard 30 through the first and second connecting portions.

[0132] In some embodiments, see Figure 3 The first surface 11a of the substrate 11 is provided with a magnetic conductive element 23, which is spaced apart from the detection element 12. Within the limited space inside the bottom shell 200, the magnetic conductive element 23 on the substrate 11 improves the distribution of magnetic field lines of the magnet 22, increases magnetic attraction, and thus reduces the thickness of the magnet 22. The material of the magnetic conductive element 23 can be a magnetically conductive material such as stainless steel.

[0133] In some embodiments, see Figure 3 The detection element 12 includes at least one of a photoplethysmography (PPG) sensor, an electrocardiogram (ECG) sensor, and a temperature sensor. One or more functional detection elements 12 can be configured as needed. Different detection elements 12 can detect different user parameters.

[0134] Photoplethysmography (PPG) sensors use photoelectric sensors to detect the intensity of reflected light after it has been absorbed by human blood and tissues, and record the changes in blood vessel volume during the cardiac cycle. From the obtained pulse waveform, heart rate and blood oxygen can be calculated.

[0135] An electrocardiogram (ECG) sensor uses electrodes that come into contact with human skin to record the timing and intensity of electrical signals that cause the heart to beat.

[0136] Temperature sensors use temperature-sensitive elements to measure changes in human body temperature. Temperature sensors can be negative temperature coefficient (NTC) thermistors.

[0137] In the case where the detection element 12 includes an optical volumetric sensor, see [reference] Figure 5 , Figure 6 The detection element 12 includes one or more light-emitting diodes (LEDs) 121 and one or more photoelectric diodes (PDs) 122, which are spaced apart. The light-emitting surface of the LED 121 faces away from the substrate 11, and the light-receiving surface of the photoelectric diode 122 faces away from the substrate 11. The first chip 13 includes a heart rate sensing chip.

[0138] Light-emitting diode 121 is a semiconductor light-emitting device that emits light. Photodiode 122 is a semiconductor photodetector that converts light into electrical signals. Light-emitting diode 121 and photodiode 122 are disposed on substrate 11 and electrically connected to substrate 11. A predetermined distance exists between the PPG sensor and the base shell 200 to ensure normal operation of the PPG sensor. During operation, part of the light signal emitted by light-emitting diode 121 is absorbed by human blood and tissues, and part of the light signal is reflected and received by photodiode 122. The heart rate sensing chip can record the changes in blood vessel volume during the cardiac cycle based on the collected light signals, and calculate the heart rate and blood oxygen saturation from the obtained pulse waveform. The combination and layout of light-emitting diode 121 and photodiode 122 can be determined according to the optical path design. The heart rate sensing chip can be an analog front-end (AFE) chip, capable of achieving high-precision vital sign measurement.

[0139] In some embodiments, see Figure 5 , Figure 6 A light-shielding member 123 is provided between the light-emitting diode 121 and the photodiode 122. The light-shielding member 123 prevents the light from the light-emitting diode 121 from directly shining onto the photodiode 122, allowing the photodiode 122 to receive the light signal reflected from the human body, thus improving detection accuracy. The light-shielding member 123 can be made of materials such as foam. The light-shielding member 123 can be rectangular, circular, or other shapes and is arranged around the light-emitting diode 121. The light-shielding member 123 can be fixed to the substrate 11 by means of adhesive bonding or other methods.

[0140] In some embodiments, see Figure 3 , Figure 7The wireless charging module 20 includes a magnetic ring 24, with a coil 21 sleeved on the magnetic ring 24 to enhance magnetic field coupling and improve charging efficiency. The magnetic ring 24 can be made of ferrite or other magnetic materials. The coil 21 and the magnetic ring 24 can be fixed to the inside of the bottom shell 200 by means of bonding or other methods.

[0141] When it is necessary to confirm the circuit board assembly 100 and electronic device 1000 of this embodiment, it can be confirmed by disassembly analysis or computed tomography (CT) that the detection element 12 is disposed on the first surface 11a of the substrate 11, the first chip 13 is disposed on the first surface 11a of the substrate 11 or the main board 30, the third surface 22a of the magnet 22 is fixed to the second surface 11b of the substrate 11, and the main board 30 and the fourth surface 22b of the magnet 22 are arranged facing each other.

[0142] See Figures 5 to 7 This application provides a circuit board assembly 100, including a detection module 10, a wireless charging module 20, and a motherboard 30. The detection module 10 includes a substrate 11 and a detection element 12. The substrate 11 has a first surface 11a and a second surface 11b facing each other. The detection element 12 is disposed on the first surface 11a. The wireless charging module 20 includes a coil 21 and a magnet 22, the coil 21 being disposed around the outer periphery of the substrate 11. The magnet 22 is sheet-shaped, and the magnet 22 has a thickness direction (...) along its thickness direction. Figure 3 The magnet 22 has a third surface 22a and a fourth surface 22b that are opposite to each other in the vertical direction. The third surface 22a of the magnet 22 is fixed to the second surface 11b of the substrate 11, and the magnet 22 is located inside the coil 21. An electromagnetic shielding member 31 is provided between the main board 30 and the magnet 22. The electromagnetic shielding member 31 is fixed to the fourth surface 22b of the magnet 22. The main board 30 and the substrate 11 are electrically connected.

[0143] The circuit board assembly 100 provided in this application embodiment has a detection element 12 in the detection module 10 disposed on the first surface 11a of the substrate 11. The coil 21 of the wireless charging module 20 is disposed around the outer periphery of the substrate 11 and is wound around the magnet 22. The magnet 22 is used for magnetic attraction with the wireless charger, and the wireless coil 21 is used for electromagnetic coupling with the wireless charger to achieve charging. The detection module 10 is mounted on the electromagnetic shield 31 of the motherboard 30 via the magnet 22, eliminating the safety gap between the detection module 10 and the motherboard 30, which can reduce the thickness of the circuit board assembly 100 and the electronic device 1000. Moreover, the motherboard 30, the magnet 22 and the detection module 10 are an integral structure, and the motherboard 30 and the detection module 10 can be electrically connected through a flexible circuit board 50. The flexible circuit board 50 is short in length, small in area, and low in cost. The motherboard 30 and the substrate 11 are electrically connected to realize signal transmission between the motherboard 30 and the substrate 11.

[0144] In some embodiments, the detection module 10 further includes a first chip 13, which is disposed on the first surface 11a or the motherboard 30. The first chip 13, disposed on the first surface 11a or the motherboard 30, reserves a large area on the second surface 11b of the substrate 11. The third surface 22a of the magnet 22 is fixed to the second surface 11b of the substrate 11. The magnet 22 can be configured with a large area to reduce its thickness while still meeting magnetic attraction requirements, thereby reducing the thickness of the circuit board assembly 100 and the electronic device 1000.

[0145] It is understood that the circuit board assembly 100 of the previous embodiment can be applied to the circuit board assembly 100 of this embodiment, and will not be described again here.

[0146] When it is necessary to confirm the circuit board assembly 100 and electronic device 1000 of this embodiment, it can be confirmed by disassembly analysis or computed tomography that the detection element 12 is disposed on the first surface 11a of the substrate 11, the third surface 22a of the magnet 22 is fixed to the second surface 11b of the substrate 11, an electromagnetic shielding component 31 is disposed between the main board 30 and the magnet 22, and the electromagnetic shielding component 31 is fixed to the fourth surface 22b of the magnet 22.

[0147] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board assembly, characterized in that, include: The detection module (10), the wireless charging module (20), and the motherboard (30) are included. The detection module (10) includes a substrate (11), a detection element (12), and a first chip (13); the substrate (11) has a first surface (11a) and a second surface (11b) facing each other; the detection element (12) is disposed on the first surface (11a), and the first chip (13) is disposed on the first surface (11a) or the motherboard (30); The wireless charging module (20) includes a coil (21) and a magnet (22). The coil (21) is arranged around the outer periphery of the substrate (11). The magnet (22) is sheet-shaped and has a third surface (22a) and a fourth surface (22b) facing away from each other along the thickness direction of the magnet (22). The third surface (22a) of the magnet (22) is fixed to the second surface (11b) of the substrate (11). The magnet (22) is located inside the coil (21). The fourth surface (22b) of the motherboard (30) and the magnet (22) are arranged facing each other, and the motherboard (30) and the substrate (11) are electrically connected.

2. The circuit board assembly according to claim 1, characterized in that, An electromagnetic shielding component (31) is provided between the motherboard (30) and the magnet (22), and the electromagnetic shielding component (31) is fixed to the fourth surface (22b) of the magnet (22).

3. The circuit board assembly according to claim 2, characterized in that, The electromagnetic shield (31) and the fourth surface (22b) of the magnet (22) are bonded together with an adhesive or fastener.

4. The circuit board assembly according to claim 2, characterized in that, The electromagnetic shield (31) and the fourth surface (22b) of the magnet (22) are riveted together.

5. The circuit board assembly according to claim 1, characterized in that, An electromagnetic shielding element (31) is provided between the motherboard (30) and the magnet (22), and the electromagnetic shielding element (31) and the fourth surface (22b) of the magnet (22) are spaced apart.

6. The circuit board assembly according to claim 1, characterized in that, The third surface (22a) of the magnet (22) and the second surface (11b) of the substrate (11) are bonded together with an adhesive (40) or fasteners.

7. The circuit board assembly according to claim 1, characterized in that, The third surface (22a) of the magnet (22) and the second surface (11b) of the substrate (11) are riveted together.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The ratio of the area of ​​the third surface (22a) of the magnet (22) to the area of ​​the second surface (11b) of the substrate (11) is greater than or equal to 0.3; And / or, the area of ​​the third surface (22a) of the magnet (22) is greater than or equal to 50 square millimeters.

9. The circuit board assembly according to any one of claims 1 to 7, characterized in that, A first electronic device is disposed on the second surface (11b) of the substrate (11), the height of the first electronic device being less than or equal to the thickness of the magnet.

10. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The substrate (11) is a rigid circuit board, and the substrate (11) and the main board (30) are electrically connected by a flexible circuit board (50).

11. The circuit board assembly according to claim 10, characterized in that, The flexible circuit board (50) and the substrate (11) are welded together. Alternatively, the flexible circuit board (50) and the substrate (11) are connected and conductive through a connector.

12. The circuit board assembly according to claim 10, characterized in that, The flexible circuit board (50) and the main board (30) are soldered together. Alternatively, the flexible circuit board (50) and the main board (30) are connected and conductive through a connector (53).

13. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The substrate (11) includes a flexible portion (112) and a reinforcing sheet (113), the reinforcing sheet (113) being stacked on the flexible portion (112); the flexible portion (112) and the main board (30) are electrically connected; the first surface (11a) is located on the side of the flexible portion (112) opposite to the reinforcing sheet (113), and the second surface (11b) is located on the side of the reinforcing sheet (113) opposite to the flexible portion (112).

14. The circuit board assembly according to claim 13, characterized in that, The flexible part (112) and the main board (30) are welded together. Alternatively, the flexible part (112) and the main board (30) are connected and conductive through a connector (53).

15. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The substrate (11) is a rigid-flex plate, which includes a rigid part and a flexible part. The rigid part and the flexible part are electrically connected, and the flexible part is electrically connected to the main board (30). Alternatively, the substrate (11) and the motherboard (30) are electrically connected via a connector.

16. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The first surface (11a) of the substrate (11) is provided with a magnetic conductive element (23), and the magnetic conductive element (23) and the detection element (12) are arranged at intervals.

17. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The detection element (12) includes at least one of an optical volumetric sensor, an electrocardiogram sensor, and a temperature sensor.

18. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The detection element (12) includes one or more light-emitting diodes (121) and one or more photodiodes (122), the light-emitting diodes (121) and the photodiodes (122) are arranged at intervals, the light-emitting surface of the light-emitting diode (121) is arranged away from the substrate (11), and the light-receiving surface of the photodiode (122) is arranged away from the substrate (11); the first chip (13) includes a heart rate sensing chip.

19. An electronic device, characterized in that, The device includes a bottom shell (200), a middle frame (300), and a circuit board assembly (100) as described in any one of claims 1 to 16; the bottom shell (200) is mounted on the middle frame (300), the detection module (10) and the wireless charging module (20) are disposed inside the bottom shell (200), and the main board (30) is disposed on the middle frame (300); the first surface (11a) of the substrate (11) is disposed facing the inner side surface (200a) of the bottom shell (200), and the detection element (12) is located between the bottom shell (200) and the substrate (11).

20. The electronic device according to claim 19, characterized in that, The electronic device (1000) includes a watch or a wristband.

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