An imaging plate detachable small size high speed camera structure

Abstract

The utility model discloses a small size high -speed camera structure of imaging board detachable belongs to high -speed camera structure technical field, the utility model discloses a baffle, front shell and rear shell, and the cooperation board connector is connected between the baffle and the front shell, sets up the mounting hole on the front shell, and the convex block is installed to the lateral wall of front shell, and the thread hole is seted up in the convex block, and the imaging board mounting surface and the board connector are seted up on the front shell, and the hole is seted up on the baffle, and the counterbore is seted up to one end of the hole, and the recess is seted up to the lateral wall of baffle, and the contact plate is seted up to the lateral wall of baffle, and the hole is cooperated with the mounting hole, and the board connector is seted up between the contact plate and the imaging board mounting surface.

Description

Technical Field

[0001] This utility model relates to the field of high-speed camera structure design technology, specifically a small-sized high-speed camera structure with a detachable imaging plate. Background Technology

[0002] Based on project experience, there are generally three connection methods between circuit boards: FPC pluggable connector connection, rigid-wound board connection, and board-to-board connector connection. FPC pluggable connector connection involves designing FPC sockets on the two circuit boards to be connected, and then connecting the two sockets with FPC cables to achieve data transmission. FPC cables are flexible and bendable, giving this connection method advantages such as flexible circuit board placement and reusable / replaceable circuit boards. However, this project requires a maximum frame rate of 1000 frames per second, which FPC cannot meet. Rigid-wound board connection connects the two circuit boards using a rigid-wound board. This connection method saves connector space, maximizes the use of board area, and meets the data transmission requirements of this project. However, the relative positions of the circuit boards are fixed, and the two connected circuit boards cannot be separated, failing to meet the requirement that the imaging board can be removed individually. Board-to-board connector connection designs board-to-board connectors at corresponding positions on the two connected circuit boards. The board-to-board connectors interlock to achieve connection and data transmission. This board-to-board connector connection method meets the data transmission requirements of this project.

[0003] In existing high-speed camera structures, the connectors between two circuit boards are fixed in position during use, and the imaging board must be plugged in and installed in the overall state. This poses a significant challenge to the structural design and heat dissipation design in high-temperature environments. To meet the camera's high frame rate and other functional performance requirements, the imaging board needs to be able to be removed and installed separately, which is inconvenient during use and installation. Utility Model Content

[0004] The purpose of this utility model is to provide a small-sized high-speed camera structure with a detachable imaging board. The front shell structure design ensures the mounting surface of the front end and the surrounding area, while simultaneously mounting the imaging board and the FPGA board. This not only ensures the dustproof requirements of the imaging board and the heat dissipation requirements of the heat-generating devices on the FPGA board, but also ensures that the imaging board is easy to disassemble and install.

[0005] This utility model is achieved through the following technical solution:

[0006] This utility model relates to a small-sized high-speed camera structure with a detachable imaging plate, comprising a baffle, a front shell, and a rear shell. The baffle and the front shell are fitted with a plate-to-plate connector. The front shell has mounting holes and a protrusion mounted on its side wall. The protrusion has a threaded hole inside. The front shell has a clearance hole between the imaging plate mounting surface and the plate-to-plate connector. The baffle has a through hole with a countersunk hole at one end. The baffle has a groove on its side wall and a contact plate on its side wall. The through hole and the mounting hole are fitted together.

[0007] Furthermore, the back of the front cover is provided with a DDR heat-conducting surface, an FPGA board mounting surface, and an FPGA heat-conducting surface, with the FPGA board and interface board installed sequentially on the back of the front cover.

[0008] Furthermore, there are eight protrusions, which mate with the grooves.

[0009] Furthermore, a board-to-board connector is provided between the imaging board mounting surface and the FPGA board mounting surface, and the contact plate avoids the positioning solder points on the back of the board-to-board connector.

[0010] This utility model has the following beneficial effects:

[0011] This utility model uses a board-to-board connector to connect the imaging board and the processing board, which not only meets the project requirements for disassembling the imaging board, but also meets the project's data transmission requirements. The FPGA board's heat dissipation structure design conducts the heat generated by the FPGA and DDR devices to the front shell through heat conduction. The heat is then conducted through the mounting holes on the front shell and in contact with the rear shell, which is designed with a cooling fan. The front shell structure design ensures that the front face and the surrounding area have mounting surfaces, while simultaneously mounting the imaging board and the FPGA board. This ensures both the dustproof requirements of the imaging board and the heat dissipation requirements of the heat-generating devices on the FPGA board, and also ensures that the imaging board can be easily disassembled and installed. The baffle structure design cooperates with the front shell for installation, ensuring the dustproof requirements of the imaging board. The height difference design between the front face and the overall structure avoids overall installation interference.

[0012] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0013] Figure 1 This is a structural diagram of a high-speed camera.

[0014] Figure 2 This is a schematic diagram of the left side structure of the front shell;

[0015] Figure 3 This is a schematic diagram of the right side structure of the front shell;

[0016] Figure 4 This is a schematic diagram of the left side structure of the baffle;

[0017] Figure 5 This is a schematic diagram of the right side structure of the baffle;

[0018] Figure 6 This is a schematic diagram of the top structure of a high-speed camera.

[0019] In the diagram: 1. Baffle; 101. Through hole; 102. Countersunk hole; 103. Groove; 104. Contact plate; 2. Front shell; 201. Mounting hole; 202. Protrusion; 203. Threaded hole; 204. Imaging board mounting surface; 205. Board connector clearance hole; 206. DDR heat-conducting surface; 207. FPGA board mounting surface; 208. FPGA heat-conducting surface; 3. Rear shell; 4. Board connector. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-6 This utility model provides a technical solution: a small-sized high-speed camera structure with a detachable imaging plate, including a baffle 1, a front shell 2 and a rear shell 3. The baffle 1 serves to protect the imaging plate and prevent dust. The front shell 2 is a mounting and fixing component for the circuit board. The circuit board is installed and fixed on the front shell 2 in sequence. The baffle 1 and the front shell 2 are connected by a board-to-board connector 4.

[0022] The front shell 2 is provided with mounting holes 201, and the side wall of the front shell 2 is provided with mounting protrusions 202. The protrusions 202 have threaded holes 203 inside. The front shell 2 is provided with imaging board mounting surface 204 and board connector clearance holes 205. The baffle 1 is provided with through holes 101, and one end of the through holes 101 is provided with countersunk holes 102. The side wall of the baffle 1 is provided with grooves 103 and contact plates 104. The through holes 101 and mounting holes 201 are matched. The board connector 4 is provided between the imaging board mounting surface 204 and the FPGA board mounting surface 207.

[0023] The back of the front shell 2 is provided with a DDR heat-conducting surface 206, an FPGA board mounting surface 207, and an FPGA heat-conducting surface 208. The FPGA board and the interface board are installed on the back of the front shell 2 in sequence. The main heat-generating components on the FPGA board conduct heat to the front shell 2. The front shell 2 is installed in contact with the rear shell 3. The rear shell 3 is designed with a cooling fan to dissipate heat. The front shell 2 is designed with mounting holes 201 to conduct heat out through contact with the overall structure.

[0024] There are eight protrusions 202, which mate with the grooves 103.

[0025] When disassembling a small-sized high-speed camera structure using an imaging plate, the imaging plate is installed on the front of the front housing 2. The front housing 2 has a hole cut to accommodate the corresponding position of the board connector 4. The mounting holes 201 on the front housing 2 are used to install and fix the imaging plate. When installing the imaging plate, first place it in the corresponding position on the front housing 2, then place the baffle 1 above the imaging plate. Install the mounting screws through the baffle 1 and the imaging plate in sequence to fix them to the front housing 2. The baffle 1 has a groove 103 at the corresponding position to accommodate the protrusion 202 of the front housing 2. The baffle 1 has a contact plate 104 that contacts the surface of the imaging plate to prevent dust. After installation, the surface of the baffle 1 is lower than the front end of the front housing 2 to avoid interference with the overall mounting structure. To prevent interference, the mounting surface 204 of the imaging board overlaps with a hardware exclusion zone on the back of the imaging board. After tightening the screws, this area makes tight contact and serves as a dustproof function. The board connector 4 fits relatively tightly. To meet the requirements for insertion and removal of the imaging board, both a dustproof area overlapping with the imaging board and a suspended area of ​​the imaging board are designed to allow the installation tool to remove or remove the board connector 4 by prying the edge of the imaging board. When removing the imaging board, use a flathead screwdriver to first pry the suspended areas on both sides of the board connector 4. After the board connector 4 creates a gap, pry the other two sides of the imaging board. By prying the suspended areas at the four corners of the imaging board in this way, the imaging board can be removed.

[0026] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A small-sized high-speed camera structure with a detachable imaging plate, comprising a baffle (1), a front shell (2), and a rear shell (3), characterized in that: The baffle (1) and the front shell (2) are fitted with a plate connector (4). The front shell (2) is provided with a mounting hole (201). The side wall of the front shell (2) is fitted with a protrusion (202). The protrusion (202) has a threaded hole (203) inside. The front shell (2) is provided with an imaging plate mounting surface (204) and a plate connector clearance hole (205). The baffle (1) is provided with a through hole (101). One end of the through hole (101) is provided with a countersunk hole (102). The side wall of the baffle (1) is provided with a groove (103). The side wall of the baffle (1) is provided with a contact plate (104). The through hole (101) is fitted with the mounting hole (201).

2. The small-sized high-speed camera structure with a detachable imaging plate according to claim 1, characterized in that, The back of the front shell (2) is provided with a DDR heat-conducting surface (206), an FPGA board mounting surface (207) and an FPGA heat-conducting surface (208), and the FPGA board and the interface board are installed on the back of the front shell (2) in sequence.

3. The small-sized high-speed camera structure with a detachable imaging plate according to claim 1, characterized in that, The number of protrusions (202) is eight, and the protrusions (202) cooperate with the grooves (103).

4. The small-sized high-speed camera structure with a detachable imaging plate according to claim 2, characterized in that, A board connector (4) is provided between the imaging board mounting surface (204) and the FPGA board mounting surface (207).

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