Ceramic heating plate for semiconductor equipment using intaglio processing

Abstract

The utility model discloses a kind of ceramic heating disc for semiconductor equipment using negative engraving processing, including outer shell, split type heating disc, heating wire, first screw sleeve and second screw sleeve, outer shell and split type heating disc are detachably connected by first screw sleeve and second screw sleeve, heating wire is installed in outer shell, split type heating disc includes: outer ring, inner ring, disc and thermocouple, inner ring is detachably installed in the inside of outer ring, disc is detachably installed in the inside of inner ring, thermocouple is detachably installed on outer ring, the bottom of inner ring is fixed with two first clamping strips, two first clamping grooves for clamping first clamping strip are provided in outer ring, the bottom of disc is fixed with two second clamping strips, two second clamping grooves for clamping second clamping strip are provided in inner ring.The utility model divides the disc surface of heating disc into multiple areas, each area can be replaced individually, so as to save resources.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a ceramic heating plate for use in semiconductor equipment with intaglio processing. Background Technology

[0002] In semiconductor etching processes, ceramic heating plates are used to heat semiconductor materials. Existing ceramic heating plates have a single, solid surface, and ceramic is relatively brittle. External impacts and friction during use can cause partial damage to the heating plate surface, requiring replacement of the entire plate, which is wasteful of resources. Therefore, there is an urgent need to develop a ceramic heating plate for semiconductor equipment used in etching processes that divides the heating plate surface into multiple areas, each of which can be replaced individually, thus saving resources and overcoming the shortcomings of current applications to meet current needs. Utility Model Content

[0003] The purpose of this invention is to provide a ceramic heating plate for use in semiconductor devices with intaglio processing, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A ceramic heating plate for use in semiconductor equipment with intaglio processing includes a housing, a split heating plate, a heating wire, a first threaded sleeve, and a second threaded sleeve. The housing and the split heating plate are detachably connected by the first and second threaded sleeves. The heating wire is installed inside the housing. The split heating plate includes an outer ring, an inner ring, a disc, and a thermocouple. The inner ring is detachably installed inside the outer ring, the disc is detachably installed inside the inner ring, and the thermocouple is detachably installed on the outer ring. Two first retaining strips are fixed to the bottom of the inner ring, and two first retaining grooves are provided inside the outer ring for retaining the first retaining strips. Two second retaining strips are fixed to the bottom of the disc, and two second retaining grooves are provided inside the inner ring for retaining the second retaining strips.

[0006] Preferably, the outer shell, outer ring, inner ring, and disk are all made of ceramic material.

[0007] Preferably, the first threaded sleeve is fixed to the inner side of the outer casing, and the inner side of the first threaded sleeve is provided with threads; the second threaded sleeve is fixed to the outer side of the split heating plate, and the outer side of the second threaded sleeve is provided with threads; the first threaded sleeve and the second threaded sleeve are detachably connected by threads.

[0008] Preferably, both the first and second threaded sleeves are made of stainless steel.

[0009] The beneficial effects of this invention are as follows: This ceramic heating plate, used in semiconductor equipment with intaglio processing, allows for the placement of semiconductor wafers onto a separate heating plate during use. The plate is heated by heating wires, and when the separate heating plate is partially damaged, it can be unscrewed from the outer casing. Then, the disc is pushed upwards to separate it from the inner ring, and the inner ring is pushed upwards to separate it from the outer ring. This separates the outer ring, inner ring, and disc. Depending on the location of the damage, one or more of the outer ring, inner ring, and disc can be replaced. In summary, this invention divides the heating plate surface into multiple areas, each of which can be replaced individually, thus saving resources. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0011] Figure 2 This is a schematic diagram of the disassembled state of this utility model.

[0012] Figure 3 This is a partial structural diagram of the present invention. Figure 1 .

[0013] Figure 4 This is a partial structural diagram of the present invention. Figure 2 .

[0014] Figure 5 This is a schematic diagram showing the disassembled state of the split heating plate in this utility model.

[0015] Figure 6 This is a partial structural diagram of the present invention. Figure 3 .

[0016] Figure 7 This is a partial structural diagram of the present invention. Figure 4 .

[0017] Legend:

[0018] 1. Outer shell; 2. Split heating plate; 201. Outer ring; 2011. First slot; 202. Inner ring; 2021. First retaining strip; 2022. Second slot; 203. Disc; 2031. Second retaining strip; 204. Thermocouple; 3. Heating wire; 4. First threaded sleeve; 5. Second threaded sleeve. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0020] Specific implementation examples are given below.

[0021] See Figures 1 to 7 In this embodiment of the present invention, a ceramic heating plate for semiconductor equipment using intaglio processing includes a housing 1, a split heating plate 2, a heating wire 3, a first threaded sleeve 4, and a second threaded sleeve 5. The housing 1 and the split heating plate 2 are detachably connected by the first threaded sleeve 4 and the second threaded sleeve 5. The heating wire 3 is installed inside the housing 1. The split heating plate 2 includes an outer ring 201, an inner ring 202, a disc 203, and a thermocouple 204. The inner ring 202 is detachably installed inside the outer ring 201, and the disc 203 is detachably installed inside the inner ring 202. The thermocouple 204... 04 is detachably installed on the outer ring 201. The thermocouple 204 is used to detect the temperature on the split heating plate 2. The bottom of the inner ring 202 is fixed with two first retaining strips 2021. The outer ring 201 is provided with two first retaining grooves 2011 for retaining the first retaining strips 2021. The bottom of the disc 203 is fixed with two second retaining strips 2031. The inner ring 202 is provided with two second retaining grooves 2022 for retaining the second retaining strips 2031. The outer shell 1, outer ring 201, inner ring 202 and disc 203 are all made of ceramic material, which gives them good high temperature resistance.

[0022] The first threaded sleeve 4 is fixed to the inner side of the outer shell 1, and the inner side of the first threaded sleeve 4 is provided with threads. The second threaded sleeve 5 is fixed to the outer side of the split heating plate 2, and the outer side of the second threaded sleeve 5 is provided with threads. The first threaded sleeve 4 and the second threaded sleeve 5 are detachably connected by threads. The first threaded sleeve 4 and the second threaded sleeve 5 are both made of stainless steel. Since the outer shell 1, the outer ring 201, the inner ring 202, and the disc 203 are all made of ceramic material, it is not easy to process threads on ceramic. The first threaded sleeve 4 and the second threaded sleeve 5 are used for intermediate connection.

[0023] Working principle: This ceramic heating plate, used in semiconductor equipment, employs an intaglio process. During use, the semiconductor wafer is placed on the separate heating plate 2, and the heating wire 3 heats the separate heating plate 2. When the separate heating plate 2 is partially damaged, it can be unscrewed from the outer casing 1. Then, the disc 203 is pushed upwards to separate it from the inner ring 202, and the inner ring 202 is pushed upwards to separate it from the outer ring 201. This separates the outer ring 201, inner ring 202, and disc 203. Then, depending on the location of the damage, one or more of the outer ring 201, inner ring 202, and disc 203 can be replaced.

[0024] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A ceramic heating plate for use in semiconductor devices with intaglio processing, characterized in that, The device includes an outer shell (1), a split heating plate (2), a heating wire (3), a first threaded sleeve (4), and a second threaded sleeve (5). The outer shell (1) and the split heating plate (2) are detachably connected by the first threaded sleeve (4) and the second threaded sleeve (5). The heating wire (3) is installed inside the outer shell (1). The split heating plate (2) includes an outer ring (201), an inner ring (202), a disc (203), and a thermocouple (204). The inner ring (202) is detachably installed inside the outer ring (201). The disc (203) is detachably installed inside the outer ring (201). 03) The thermocouple (204) is detachably installed on the inner side of the inner ring (202) and detachably installed on the outer ring (201). The bottom of the inner ring (202) has two first locking strips (2021) fixed. The outer ring (201) has two first slots (2011) for locking the first locking strips (2021). The bottom of the disc (203) has two second locking strips (2031) fixed. The inner ring (202) has two second slots (2022) for locking the second locking strips (2031).

2. The ceramic heating plate for semiconductor devices using intaglio etching according to claim 1, characterized in that, The outer shell (1), outer ring (201), inner ring (202), and disk (203) are all made of ceramic material.

3. The ceramic heating plate for semiconductor devices using intaglio etching according to claim 1, characterized in that, The first threaded sleeve (4) is fixed to the inner side of the outer shell (1), and the inner side of the first threaded sleeve (4) is provided with threads. The second threaded sleeve (5) is fixed to the outer side of the split heating plate (2), and the outer side of the second threaded sleeve (5) is provided with threads. The first threaded sleeve (4) and the second threaded sleeve (5) are detachably connected by threads.

4. The ceramic heating plate for semiconductor devices using intaglio etching according to claim 3, characterized in that, Both the first threaded sleeve (4) and the second threaded sleeve (5) are made of stainless steel.

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