A new type of static electricity guiding pin device
By eliminating static electricity on the wafer using a conductive pin device, the problems of static electricity affecting the accuracy of stress measurement and dust adsorption are solved, thereby improving the measurement accuracy and yield of the wafer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- RONGXIN SEMICONDUCTOR (NINGBO) CO LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-06-02
AI Technical Summary
During the production process, wafers generate static electricity due to contact and friction with various materials, which affects the accuracy of stress measurement and causes dust to adhere to the surface, reducing the yield.
Design an electrostatic conductive pin device, comprising a stage, conductive pins, conductive disks, connecting wires, and a grounding wire. The conductive pins and conductive disks guide static electricity to the grounding wire. Combined with a screw and a support plate, the stage is leveled to prevent scratches and slippage.
It improves the accuracy of wafer stress measurement, avoids dust adsorption, and increases wafer yield.
Smart Images
Figure CN224319570U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of static electricity elimination technology, specifically a novel static electricity conductive pin device. Background Technology
[0002] Currently, during the production process, wafers frequently come into contact with and rub against various materials, such as during handling and processing, which causes electron transfer and the accumulation of static electricity on the wafer surface. The electric field generated by static electricity may change the electron distribution of the microstructure on the wafer surface, affecting the accuracy of wafer stress measurement. Furthermore, static electricity can cause dust and impurities to be adsorbed on the wafer surface, resulting in wafer contamination and reducing chip yield. To address these issues, we propose a novel electrostatic conductive pin device. Utility Model Content
[0003] The purpose of this invention is to provide a novel electrostatic discharge pin device that facilitates the elimination of static electricity on wafers, thereby improving the accuracy of wafer stress measurement. It also prevents dust and impurities from adsorbing onto the wafer surface due to static electricity, thus improving wafer yield. This invention solves the problems of static electricity generated by frequent contact and friction between wafers and various materials, which reduces the accuracy of wafer stress measurement, and static electricity causing dust and impurities to adsorb onto the wafer surface, resulting in wafer contamination and reduced chip yield.
[0004] To achieve the above objectives, this utility model provides the following technical solution: A novel electrostatic conductive pin device, comprising a stage and a conductive pin. A groove is provided on the upper surface of the stage, and a conductive disk is fixedly installed inside the groove. A connecting wire is fixedly connected to the lower surface of the conductive disk. A plurality of threaded holes are evenly distributed on the upper surface of the conductive disk, and the bottom end of the conductive pin is located inside the threaded holes. An external thread is provided on the outer surface of the conductive pin near its bottom end. Nuts are provided on the upper surface of the stage near the four corners, and screws are movably inserted into each of the four nuts, penetrating the stage. The bottom ends of the four screws are rotatably connected to a support plate via bearings. A level is fixedly installed on the upper surface of the stage near its four edges.
[0005] Preferably, the conductive pin has a rounded corner A at the edge of its upper surface to prevent the sharp part of the edge of the pin from scratching the wafer when the wafer is placed on top of the pin.
[0006] Preferably, the conductive needle has a contact block at its tip, and the outer diameter of the contact block is larger than the outer diameter of the conductive needle. The conductive needle is T-shaped, and the upper surface of the contact block has a rounded corner B near the edge. This increases the contact area between the conductive needle and the wafer, thereby reducing the contact resistance between them and making it easier for static electricity accumulated on the wafer surface to be quickly discharged through the path formed by the conductive needle.
[0007] Preferably, each of the four screws has a knob fixedly connected to its top end, and the screw is rotated by rotating the knob.
[0008] Preferably, anti-slip pads are fixedly installed on the lower surfaces of the four support plates, which can prevent the support plates from slipping and thus prevent the platform from sliding.
[0009] Preferably, the connecting wire passes through the platform, and a connector is fixedly connected to the end of the connecting wire. The connecting wire is connected to the grounding wire through the connector.
[0010] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0011] 1. This utility model, by setting up a stage, groove, conductive disk, threaded hole, conductive pin, external thread, connecting wire, nut, screw, support plate, and level, achieves the effect of facilitating the elimination of static electricity on the wafer, thereby improving the accuracy of wafer stress measurement. It also prevents dust and debris from adhering to the wafer surface due to static electricity, thus improving wafer yield. After the stage is placed on the platform, the connecting wire and grounding wire are connected. The bottom end of the conductive pin is inserted into the threaded hole and fixed. The number and distribution of the conductive pins can be set according to the size of the wafer, allowing the wafer to be placed on the top of the conductive pins. Static electricity on the wafer is then guided through the conductive pin and conductive disk to the connecting wire, and finally to the grounding wire, thus eliminating static electricity on the wafer. The level of the stage is observed using the level, and the level of the stage is adjusted by turning the screw to raise and lower the support plate, ensuring the stage is level and preventing the wafer placed on the conductive pin from slipping due to tilting.
[0012] 2. By setting a rounded corner A, this utility model can prevent the sharp part of the edge of the ejector pin from scratching the wafer when the wafer is placed on the top of the ejector pin.
[0013] 3. By setting a contact block, this utility model can increase the contact area between the conductive needle and the wafer, thereby reducing the contact resistance between the two and making it easier for the static electricity accumulated on the wafer surface to be quickly discharged through the path formed by the conductive needle.
[0014] 4. By setting an anti-slip pad, this utility model can prevent the support plate from slipping, thus preventing the platform from sliding. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0016] Figure 2 This is a partial three-dimensional structural diagram of the platform of this utility model;
[0017] Figure 3This is a partial three-dimensional structural diagram of the conductive needle of this utility model;
[0018] Figure 4 This is a partial three-dimensional structural diagram of the nut of this utility model;
[0019] Figure 5 This is a schematic diagram of the second three-dimensional structure of the conductive needle of this utility model.
[0020] Reference numerals: 1. Stage; 2. Conductive needle; 3. Level; 4. Nut; 5. Groove; 6. Conductive disk; 7. Threaded hole; 8. Connecting wire; 9. Connector; 10. External thread; 11. Fillet A; 12. Knob; 13. Screw; 14. Bearing; 15. Support plate; 16. Anti-slip pad; 17. Contact block; 18. Fillet B. Detailed Implementation
[0021] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. Example 1
[0022] like Figures 1-4 As shown, this utility model proposes a novel electrostatic conductive pin device, including a stage 1 and a conductive pin 2. A groove 5 is provided on the upper surface of the stage 1, and a conductive disk 6 is fixedly installed inside the groove 5. Both the conductive pin 2 and the conductive disk 6 are made of highly conductive copper. A connecting wire 8 is fixedly connected to the lower surface of the conductive disk 6. The connecting wire 8 is a multi-strand copper core wire that passes through the stage 1. A connector 9 is fixedly connected to the end of the connecting wire 8, and the connecting wire 8 is connected to a grounding wire through the connector 9. Several threaded holes 7 are evenly arranged on the upper surface of the conductive disk 6, and the bottom end of the conductive pin 2 is located inside the threaded holes 7. A rounded corner A11 is provided at the edge of the upper surface of the conductive pin 2. When a wafer is placed on the top of the conductive pin 2, the rounded corner A11... 11 can prevent sharp parts at the surface edge from scratching the wafer. The conductive needle 2 has an external thread 10 near the bottom of its outer surface. Nuts 4 are provided at the four corners of the upper surface of the stage 1. Each of the four nuts 4 has a screw 13 inserted into it, and the screw 13 passes through the stage 1. A knob 12 is fixedly connected to the top of each of the four screws 13. The screw 13 is rotated by the knob 12. The bottom of each of the four screws 13 is rotatably connected to a support plate 15 through a bearing 14. Anti-slip pads 16 are fixedly installed on the lower surface of each of the four support plates 15, which can play an anti-slip role to prevent the stage 1 from sliding. A level 3 is fixedly installed at the four edges of the upper surface of the stage 1.
[0023] In use, after the stage 1 is placed on the table, the connecting wire 8 and the grounding wire are connected. The bottom end of the conductive pin 2 is inserted into the threaded hole 7 and fixed. At the same time, the number and distribution position of the conductive pins 2 can be set according to the size of the wafer, so that the wafer can be placed on the top of the conductive pin 2. The static electricity on the wafer is guided to the connecting wire 8 through the conductive pin 2 and the conductive disk 6, and finally guided to the grounding wire, thereby eliminating the static electricity on the wafer. The level of the stage 1 is observed by the level instrument 3, and the level of the stage 1 is adjusted by turning the screw 13 to drive the support plate 15 to rise and fall, so that the stage 1 is in a horizontal state, so as to prevent the wafer placed on the conductive pin 2 from slipping due to tilting. Example 2
[0024] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, this utility model proposes a novel electrostatic conductive pin device. Compared with Embodiment 1, this embodiment further includes a contact block 17 at the top of the conductive pin 2. The contact block 17 and the conductive pin 2 are integrally formed, and the outer diameter of the contact block 17 is larger than the outer diameter of the conductive pin 2. The conductive pin 2 is T-shaped, and a rounded corner B18 is provided on the upper surface of the contact block 17 near the edge. When the wafer is placed on the top of the contact block 17, the rounded corner B18 can prevent the sharp part of its surface edge from scratching the wafer.
[0025] In this embodiment, the contact block 17 can increase the contact area between the conductive pin 2 and the wafer, thereby reducing the contact resistance between the two and making it easier for the static electricity accumulated on the wafer surface to be quickly discharged through the path formed by the conductive pin 2.
[0026] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.
Claims
1. A novel electrostatic conductive pin device, comprising a stage (1) and a conductive pin (2), characterized in that: The upper surface of the platform (1) is provided with a groove (5), and a conductive disk (6) is fixedly installed inside the groove (5). A connecting wire (8) is fixedly connected to the lower surface of the conductive disk (6). A number of threaded holes (7) are evenly provided on the upper surface of the conductive disk (6), and the bottom end of the conductive needle (2) is located inside the threaded hole (7). An external thread (10) is provided on the outer surface of the conductive needle (2) near the bottom end. Nuts (4) are provided on the upper surface of the platform (1) near the four corners. A screw (13) is movably inserted into the four nuts (4), and the screw (13) passes through the platform (1). The bottom ends of the four screws (13) are rotatably connected to a support plate (15) through a bearing (14). A level (3) is fixedly installed on the upper surface of the platform (1) near the four edges.
2. The novel electrostatic conductive pin device according to claim 1, characterized in that: The conductive needle (2) has a rounded corner A (11) at the edge of its upper surface.
3. The novel electrostatic conductive pin device according to claim 1, characterized in that: The conductive needle (2) has a contact block (17) at its top end, and the outer diameter of the contact block (17) is larger than the outer diameter of the conductive needle (2). The conductive needle (2) is T-shaped, and the upper surface of the contact block (17) is provided with a rounded corner B (18) near the edge.
4. The novel electrostatic conductive pin device according to claim 1, characterized in that: A knob (12) is fixedly connected to the top of each of the four screws (13).
5. A novel electrostatic conductive pin device according to claim 1, characterized in that: Anti-slip pads (16) are fixedly installed on the lower surface of the four support plates (15).
6. A novel electrostatic conductive pin device according to claim 1, characterized in that: The connecting line (8) passes through the stage (1), and a connector (9) is fixedly connected to the end of the connecting line (8).