An adapter plate electroplating substrate

Abstract

This utility model belongs to the technical field of circuit board electroplating, and particularly relates to an electroplating substrate for an adapter board. The substrate body is provided with multiple first dividing lines and multiple second dividing lines, which are perpendicularly arranged and divide the substrate body into multiple product units. An adapter board body is also provided, containing at least one through-slot and multiple protrusions. The surface of the adapter board body is coated with a metal layer to enclose the adapter board body. Multiple isolation zones are provided on the inner sidewall of the through-slot, spaced at a first distance and with a length equal to a second distance. No metal layer is coated within the isolation zones, leaving the adapter board body exposed. By providing multiple isolation zones within the through-slot, moisture can be conducted from the isolation zones to the outside, and the mechanical stress of the metal layer can be released through the isolation zones.

Description

Technical Field

[0001] This utility model belongs to the technical field of circuit board electroplating, and in particular relates to an electroplating substrate for an adapter board. Background Technology

[0002] An interposer, also known as a high-density interconnect (HDI) transition board, is typically located between a chip and a package substrate to achieve high-reliability, high-bandwidth, and low-latency electrical connections. Interposers are commonly used in high-performance computing, advanced packaging, and miniaturized electronic systems such as 5G technology.

[0003] As technology continues to develop, the requirements for adapter boards are becoming increasingly stringent. Typically, adapter boards have a hollow design in the middle, especially when used in 5G scenarios. The hollow design can reduce the absorption of signals by the substrate material and suppress common-mode noise to a certain extent.

[0004] After the adapter board is hollowed out in the middle, it is usually necessary to electroplate a metal layer onto the entire board. This includes electroplating the inner sidewalls of the hollowed-out portion with metal, i.e., wrapping the sidewalls with metal. This method can optimize the electrical performance of the circuit board. In subsequent production after metal layering, the adapter board needs to undergo more than four reflow soldering cycles on the substrate. During the soldering process, metal layer bulging is very likely to occur at the board edges. This is because during multiple reflow soldering cycles, the entire exterior of the adapter board is covered with metal, causing moisture to accumulate inside the PCB, and the metal layer will generate unreleased mechanical stress, resulting in bulging. This problem can lead to poor contact between the produced adapter board and subsequent use, and in more serious cases, it can cause damage to the adapter board due to mechanical stress. Utility Model Content

[0005] To address the aforementioned problems, this invention proposes an electroplating substrate for an adapter plate. By placing the adapter plate on the substrate and dividing it into multiple product units, production efficiency is improved while avoiding substrate distortion caused by stress during production due to irregularly placed multiple adapter plates. Furthermore, by setting multiple isolation zones on the sidewalls of the through-slots in the adapter plate body, the adapter plate is exposed outside the metal layer through these distance zones. This releases mechanical stress and moisture in the metal layer through the isolation zones, preventing bubbles caused by moisture and cracking of the metal layer due to mechanical stress.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] In a first aspect, an electroplated substrate for an adapter plate includes:

[0008] The substrate body is provided with multiple first dividing lines and multiple second dividing lines. The first dividing lines and the second dividing lines are arranged perpendicularly and the substrate body is divided into multiple product units by the first dividing lines and the second dividing lines.

[0009] The adapter plate body has at least one through groove and multiple protrusions inside, and the surface of the adapter plate body is coated with a metal layer to wrap the adapter plate body through the metal layer.

[0010] The inner sidewall of the through groove is provided with multiple isolation zones, which are set at a first distance and the length of the isolation zone is a second distance. There is no metal coating in the isolation zone so that the adapter plate body is exposed.

[0011] By setting a substrate body with multiple first dividing lines and multiple second dividing lines, the substrate body is divided into multiple product units by the first dividing lines and the second dividing lines. A transition plate body is also provided, with at least one through-slot and multiple protrusions within the transition plate body. The surface of the transition plate body is coated with a metal layer to enclose the transition plate body. Multiple isolation zones are provided on the inner sidewall of the through-slot, with the isolation zones spaced at a first distance and a second distance in length. No metal layer is coated within the isolation zones, leaving the transition plate body exposed. By setting multiple isolation zones inside the through-slot, moisture can be conducted from the isolation zones to the outside, and the mechanical stress of the metal layer can be released through the isolation zones.

[0012] In some implementations, the first distance is 1.8 to 2.2 mm.

[0013] By setting a first distance, the metal layer is prevented from cracking due to excessive mechanical stress during reflow soldering.

[0014] In some implementations, the second distance is 0.6 to 1 mm.

[0015] By setting a second distance, the mechanical stress of the metal layer and the moisture generated by the adapter plate can be released, while also avoiding the impact of excessive distance on the conductivity of the adapter plate.

[0016] In some embodiments, the thickness of the adapter plate body is greater than 2.5 mm.

[0017] In some embodiments, the metal layer is copper.

[0018] In some embodiments, at least one connection portion is provided between the product unit and the adapter board body.

[0019] The product is connected to the product unit via a connector, which is then further connected to the substrate body to enable quick disassembly after production. This also prevents excessive stress from the substrate body during production from being transferred to the adapter board.

[0020] In some embodiments, the substrate body is provided with a plurality of fixing holes.

[0021] The substrate body is positioned during production using fixing holes to avoid product problems caused by misalignment during the process.

[0022] In some embodiments, the through groove includes a first through groove and a second through groove, and a dividing portion is provided between the first through groove and the second through groove.

[0023] By setting two through slots, the electrical performance of the adapter plate can be further improved through the partition, while also further releasing the mechanical stress of the metal layer.

[0024] In some embodiments, metal layers with a third distance are provided on both sides of the protrusion, and the metal layers are adjacent to the isolation area.

[0025] A third metal layer is provided on both sides of the protrusion to prevent the metal layer of the protrusion from falling off during reflow soldering. At the same time, an isolation zone is provided outside the third distance to prevent moisture accumulation on the protrusion.

[0026] In some embodiments, the third distance is greater than 2 mm.

[0027] The beneficial effects of this utility model on the production substrate of an adapter plate are:

[0028] By setting a substrate body with multiple first dividing lines and multiple second dividing lines, the first and second dividing lines are arranged perpendicularly and divide the substrate body into multiple product units. An adapter plate body is also provided, with at least one through-slot and multiple protrusions within it. The surface of the adapter plate body is coated with a metal layer to enclose it. Multiple isolation zones are provided on the inner sidewall of the through-slot, spaced at a first distance and with a length equal to a second distance. No metal layer is coated within these isolation zones, leaving the adapter plate body exposed. By setting multiple isolation zones inside the through-slot, the adapter plate body is exposed outside the metal layer, allowing moisture to be conducted to the outside during production and relieving mechanical stress on the metal layer through the isolation zones. Attached Figure Description

[0029] Figure 1 This is a top view of a substrate for producing an adapter board according to the present invention;

[0030] Figure 2This is a top view of the adapter plate body of the adapter plate production substrate of this utility model.

[0031] Figure 3 for Figure 2 Enlarged view of part a;

[0032] Figure 4 This is a schematic diagram showing the distribution of the metal layer and isolation area of ​​a substrate for producing an adapter board according to this utility model.

[0033] Figure label:

[0034] 1. Substrate body; 11. First dividing line; 12. Second dividing line; 13. Product unit; 14. Fixing hole;

[0035] 2. Adapter plate body; 21. Through groove; 211. First through groove; 212. Second through groove; 213. Dividing part; 22. Protrusion; X3. Third distance; 23. Metal layer; X1. First distance; 24. Isolation area; X2. Second distance; 25. Connecting part. Detailed implementation method:

[0036] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of this utility model can be combined with each other. The detailed description in the specific embodiments should be understood as an explanation of the spirit of this utility model and should not be regarded as an improper limitation of this utility model.

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the specific technical solutions of this utility model will be further described in detail below with reference to the accompanying drawings of the embodiments of this utility model. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0038] In the embodiments of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0039] Furthermore, in this embodiment of the invention, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0040] In the embodiments of this utility model, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0041] In embodiments of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0042] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant information in a specific manner.

[0043] Example 1:

[0044] like Figure 1 As shown, this embodiment proposes an electroplating substrate for an adapter plate, comprising:

[0045] The substrate body 1 has multiple first dividing lines 11 and multiple second dividing lines 12, which are perpendicularly arranged and divide the substrate body 1 into multiple product units 13. The adapter plate body 2 has at least one through groove 21 and multiple protrusions 22. The surface of the adapter plate body 2 is coated with a metal layer 23 to wrap the adapter plate body 2. Multiple isolation areas 24 are provided on the inner sidewall of the through groove 21. The multiple isolation areas 24 are set at a first distance X1 and the length of the isolation area 24 is a second distance X2. The isolation areas 24 are not coated with the metal layer 23 so that the adapter plate body 2 is exposed.

[0046] Specifically, the electroplated substrate of the adapter board is divided into multiple product units 13 by multiple vertical first dividing lines 11 and second dividing lines 12. The product units 13 are typically rectangular. In some more specific embodiments, the substrate body 1 is divided into 16 product units 13 of equal area by three first dividing lines 11 and three second dividing lines 12, which are used to fix the adapter board. The regular matrix arrangement of the product units 13 ensures relatively balanced stress on the substrate during production, reducing the likelihood of partial breakage of the adapter board in some product units 13. The adapter board is fixed inside the product unit 13. It can be fixed by snap-fit ​​or by easily separable connecting parts 25, allowing for disassembly after production. The adapter board body 2 has at least one through slot 21, or features such as windows, grooves, or cavities, to improve signal integrity and reliability, enhance heat dissipation, and increase integration compatibility. The system includes multiple protrusions 22, which can be used for decoration or to be configured according to the circuit board's wiring when connecting the adapter board. A metal layer 23 is coated on the surface of the adapter board body 2. This metal layer 23 optimizes electrical performance and increases structural reliability to address signal integrity issues. However, during subsequent high-temperature reflow soldering cycles (four or more), the fully coated metal layer 23 will experience thermal expansion and contraction, potentially causing it to fracture or tear due to mechanical stress. Simultaneously, the mechanical stress of the adapter board can also cause the fully coated metal layer 23 to fracture and tear. Furthermore, the fully coated metal layer 23 prevents the release of moisture generated during reflow soldering. To address the aforementioned issues, multiple isolation zones 24 are provided on the inner sidewall of the channel 21. These isolation zones 24 are formed by removing the metal layer 23 after electroplating using an automated milling machine. A first distance X1 is maintained between the isolation zones 24, and the length of each isolation zone 24 is a second distance X2. The coordination of the first distance X1 and the second distance X2 allows the isolation zones 24 and the metal layer 23 on the sidewall of the channel 21 to alternate, preventing situations where the metal layer 23 is too large or the isolation zone 24 is too small, resulting in incomplete moisture release and insufficient release of mechanical stress from the metal layer 23. Simultaneously, it also avoids the problem of performance not meeting specifications due to an excessively large isolation zone 24 or an excessively small metal layer 23.

[0047] By setting a substrate body 1, the substrate body 1 is provided with multiple first dividing lines 11 and multiple second dividing lines 12. The first dividing lines 11 and the second dividing lines 12 are arranged perpendicularly and divide the substrate body 1 into multiple product units 13 through the first dividing lines 11 and the second dividing lines 12. A transition plate body 2 is also provided. The transition plate body 2 is provided with at least one through groove 21 and multiple protrusions 22. The surface of the transition plate body 2 is coated with a metal layer 23 to wrap the transition plate body 2. Multiple isolation areas 24 are provided on the inner sidewall of the through groove 21. The multiple isolation areas 24 are set at a first distance X1 and the length of the isolation area 24 is a second distance X2. The isolation areas 24 are not coated with the metal layer 23 so that the transition plate body 2 is exposed. By setting multiple isolation zones 24 inside the through groove 21, the adapter plate body 2 is exposed outside the metal layer 23, so that moisture can be conducted from the isolation zone 24 to the outside during the production of the adapter plate body 2, and the mechanical stress of the metal layer 23 can be released through the isolation zone 24.

[0048] Example 2:

[0049] like Figures 2-4 As shown, compared to Example 1, this example further optimizes and explains the structure proposed in Example 1:

[0050] In some embodiments, the first distance X1 is 1.8~2.2mm. By setting it to 1.8~2.2mm, a distance less than 1.8mm would result in an excessively small isolation zone 24, failing to adequately release the mechanical stress on the metal layer 23 and causing incomplete moisture release, leading to bulging. A distance greater than 2.2mm would result in an excessively large isolation layer, potentially causing the metal layer 23 on the sidewall of the through-slot 21 to fracture or detach during subsequent reflow soldering. Setting the first distance X1 prevents the metal layer 23 from cracking due to excessive mechanical stress during reflow soldering.

[0051] In some embodiments, the second distance X2 is 0.6~1mm. An isolation area 24 larger than 1mm will result in an excessively large isolation area 24, causing the metal layer 23 to be too small, which may lead to breakage and detachment of the metal layer 23. An isolation area 24 smaller than 0.6mm will result in an excessively large metal layer 23, which will not achieve the desired release of mechanical stress on the metal layer 23 and may also lead to incomplete moisture release, resulting in bulging. By setting the second distance X2, the mechanical stress of the metal layer 23 and the moisture generated by the adapter plate can be released, while also avoiding the impact of an excessively large distance on the conductivity of the adapter plate.

[0052] Furthermore, in some preferred embodiments, by coordinating the first distance X1 and the second distance X2, when the first distance X1 is 2 mm and the second distance X2 is 0.8 mm, the metal layer 23 and the isolation area 24 on the sidewall of the through groove 21 are optimally matched.

[0053] In some embodiments, the thickness of the adapter board body 2 is greater than 2.5 mm. Specifically, the adapter board is usually a double-layer board with circuits on both surfaces that connect to subsequent chips and packaging substrates. Therefore, isolation areas 24 can only be opened on the sidewalls of the through slot 21 to release mechanical stress on the metal layer 23 and release moisture inside the metal layer 23.

[0054] In some embodiments, the metal layer 23 is copper. By cladding the metal layer with copper, the performance of the adapter board can be optimized, while also providing a low-impedance current path, shielding signal interference, and improving signal integrity. At the same time, copper cladding can increase heat dissipation capacity and prevent excessive mechanical stress caused by poor thermal conductivity of the metal layer 23.

[0055] In some embodiments, at least one connecting portion 25 is provided between the product unit 13 and the adapter plate body 2. Specifically, at least one connecting portion 25 is provided, which can be a connecting terminal. The connecting terminal can be cylindrical, and its two ends are respectively connected to the substrate body 1 and the adapter plate body 2. The size of the connecting portion 25 between the substrate body 1 and the adapter plate body 2 should be as small as possible to avoid excessive stress transmission during production. At the same time, the small size of the connecting portion 25 allows the adapter plate body 2 to be quickly detached from the substrate body 1 after production. The product is connected to the product unit 13 and further connected to the substrate body 1 through the connecting portion 25 to achieve rapid disassembly after production and to avoid excessive stress transmission from the substrate body 1 to the adapter plate during production.

[0056] In some embodiments, the substrate body 1 is provided with a plurality of fixing holes 14. Specifically, the fixing holes 14 can be provided on the periphery of the upper surface of the substrate body 1 to achieve fixing and positioning of the substrate during production. Furthermore, they can also prevent the substrate body 1 from being misaligned due to the force of the router cutting out the isolation area 24. By positioning the substrate body 1 during production through the fixing holes 14, product problems caused by misalignment during the process can be avoided.

[0057] In some embodiments, the through-slot 21 includes a first through-slot 211 and a second through-slot 212, with a dividing portion 213 provided between the first through-slot 211 and the second through-slot 212. Specifically, the first through-slot 211 and the second through-slot 212 are typically separated. By dividing them, the first through-slot 211 and the second through-slot 212 can prevent excessive stress on the metal layer 23 on the sidewall of the through-slot 21 when the through-slot 21 is too large, which would prevent the isolation area 24 from completely releasing stress. By providing two through-slots 21, the electrical performance of the adapter board can be further improved by the dividing portion 213, while also further releasing the mechanical stress of the metal layer 23.

[0058] In some embodiments, a metal layer 23 with a distance of at least a third distance X3 is provided on both sides of the protrusion 22, and the metal layer 23 is adjacent to the isolation area 24. Specifically, the metal layer 23 with a distance of at least a third distance X3 is provided on both sides of the protrusion 22. Providing the metal layer 23 on both sides of the protrusion 22 can increase the adhesion of the metal layer 23 on the protrusion 22, and can prevent the metal layer 23 from falling off and deviating after the isolation area 24 is routerd out and after multiple reflow soldering. By providing the metal layer 23 with a distance of a third distance X3 on both sides of the protrusion 22, the metal layer 23 on the protrusion 22 is prevented from falling off during reflow soldering. At the same time, the isolation area 24 is provided outside the third distance X3 to prevent moisture accumulation on the protrusion 22.

[0059] In some embodiments, the third distance X3 is greater than 2 mm. Specifically, a spacing greater than 2 mm ensures that the metal layer 23 has a certain width on both sides of the protrusion, preventing the metal layer 23 from falling off during reflow soldering if it is too small.

[0060] The serial numbers of the utility model embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are only preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent device or equivalent process transformation made based on the content of this utility model specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this utility model.

Claims

1. An electroplated substrate for an adapter plate, characterized in that, include: The substrate body (1) is provided with a plurality of first dividing lines (11) and a plurality of second dividing lines (12). The first dividing lines (11) and the second dividing lines (12) are arranged perpendicularly, and the substrate body (1) is divided into a plurality of product units (13) by the first dividing lines (11) and the second dividing lines (12). The adapter plate body (2) has at least one through groove (21) and multiple protrusions (22) inside. The surface of the adapter plate body (2) is coated with a metal layer (23) so as to wrap the adapter plate body (2) through the metal layer (23). The inner sidewall of the through groove (21) is provided with multiple isolation zones (24), the multiple isolation zones (24) are set at a first distance (X1), the length of the isolation zone (24) is a second distance (X2), and there is no metal layer (23) coated in the isolation zone (24) so ​​that the adapter plate body (2) is exposed.

2. The electroplated substrate of the adapter plate according to claim 1, characterized in that, The first distance (X1) is 1.8~2.2mm.

3. The electroplated substrate of the adapter plate according to claim 1, characterized in that, The second distance (X2) is 0.6~1mm.

4. The electroplated substrate of the adapter plate according to claim 1, characterized in that, The thickness of the adapter plate body (2) is greater than 2.5 mm.

5. The electroplated substrate of the adapter plate according to claim 1, characterized in that, The metal layer (23) is copper.

6. The electroplated substrate of the adapter plate according to claim 1, characterized in that, At least one connection part (25) is provided between the product unit (13) and the adapter plate body (2).

7. The electroplated substrate of the adapter plate according to claim 1, characterized in that, The substrate body (1) is provided with a plurality of fixing holes (14).

8. The electroplated substrate of the adapter plate according to claim 1, characterized in that, The through groove (21) includes a first through groove (211) and a second through groove (212), and a dividing part (213) is provided between the first through groove (211) and the second through groove (212).

9. The electroplated substrate of the adapter plate according to claim 1, characterized in that, The protrusion (22) has a metal layer (23) with a distance of at least a third distance (X3) on both sides, and the metal layer (23) is adjacent to the isolation area (24).

10. The electroplated substrate of the adapter plate according to claim 9, characterized in that, The third distance (X3) is greater than 2 mm.

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