Electronic device housing and electronic device

Abstract

This application relates to the field of heat dissipation structures, aiming to solve the problem of poor strength of electronic device housings, and provides an electronic device housing and an electronic device. The electronic device housing includes a side plate and a baffle. The side plate has a through hole that extends through the side plate along its thickness direction. The through hole has a first end and a second end opposite each other along a first direction. The baffle includes a first blocking portion and a second blocking portion. The first blocking portion is spaced apart from the side plate and located inside the side plate, corresponding to the through hole along its thickness direction. The first blocking portion has a third end and a fourth end. A second blocking portion connects between the second end and the fourth end, and the second blocking portion intersects the side plate at an angle. The beneficial effects of this application are that the side plate has good strength, and the baffle located inside the side plate provides shielding, preventing direct observation of electronic components from the outside, thus improving safety performance and meeting safety regulatory requirements.

Description

Technical Field

[0001] This application relates to the field of heat dissipation structures, and more specifically, to an electronic device housing and an electronic device. Background Technology

[0002] To meet safety regulations, some existing electronic device housings require complex baffles to cover openings or require thicker plates to accommodate openings. Utility Model Content

[0003] This application provides an electronic device housing and an electronic device to solve the problem of poor housing strength when holes are directly opened in the side panel.

[0004] An embodiment of this application provides an electronic device housing, which includes a side panel and a baffle. The side panel has a through hole extending through it along its thickness direction. The through hole has a first end and a second end opposite each other in a first direction. The baffle includes a first blocking portion and a second blocking portion. The first blocking portion is spaced apart from the side panel and located inside the side panel, corresponding to the through hole along its thickness direction. The first blocking portion has a third end and a fourth end. A second blocking portion connects the second end and the fourth end, and the second blocking portion intersects the side panel at an angle.

[0005] In the embodiments of this application, cooling gas can enter the through hole from between the first and second ends of the through hole, and enter the inner side of the side plate from between the first and third ends of the through hole through the baffle. The first shielding part is spaced apart from the side plate and connected to the second end through the second shielding part to shield the inner side of the side plate. A thinner side plate can be used to meet the requirements of safety regulations.

[0006] In one possible implementation, the electronic device housing further includes two side stops, which are respectively connected between the two ends of the baffle along the second direction and the two ends of the through hole along the second direction. The second direction is perpendicular to or obliquely intersects the first direction.

[0007] In one possible implementation, the side plate has multiple through holes arranged in an array on the side plate. Each through hole is provided with a baffle.

[0008] In one possible implementation, the third end and the first end are flush along the thickness direction of the side plate.

[0009] In one possible implementation, the electronic device housing includes multiple side panels. The housing also includes a base plate, with the side panels respectively connected to the circumferential sides of the base plate and forming a mounting space with the base plate. A baffle is located on the side panel closest to the mounting space. Through holes in the multiple side panels communicate with the mounting space.

[0010] In one possible implementation, a heat dissipation vent is defined between the first end and the third end, with the vent facing the base plate.

[0011] In one possible implementation, the through hole is an elongated hole extending along a second direction, which is perpendicular to the first direction. The second direction is parallel to the base plate.

[0012] In one possible implementation, the baffle is formed by stamping.

[0013] In one possible implementation, the thickness of the side plate is less than or equal to 0.5 mm.

[0014] Embodiments of this application also provide an electronic device, which includes an electronic device housing, electronic components, and a heat dissipation assembly. The electronic components are disposed inside the electronic device housing. The heat dissipation assembly is disposed inside the electronic device housing and is capable of drawing cooling gas into the electronic device housing through a through-hole to dissipate heat from the electronic components. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0017] Figure 2 This is a schematic diagram of the structure of an electronic device housing according to an embodiment of this application.

[0018] Figure 3 for Figure 2 A cross-sectional view of the electronic device housing along line AA.

[0019] Figure 4 for Figure 3 Enlarged view of point B in the middle.

[0020] Figure 5 for Figure 2 A sectional view along line CC.

[0021] Explanation of key component symbols:

[0022] 1000 electronic devices

[0023] Electronic Components 100

[0024] Heat dissipation component 200

[0025] Electronic device housing 300

[0026] Side panel 10

[0027] First end 101

[0028] Second end 102

[0029] baffle 11

[0030] Second shielding part 111

[0031] Third end 1111

[0032] First shielding part 112

[0033] Fourth end 1121

[0034] 12 heat dissipation vents

[0035] Through hole 13

[0036] Side guard 14

[0037] Base plate 15

[0038] Installation space 16

[0039] First direction Z

[0040] Second direction Y

[0041] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0042] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0043] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0045] Some embodiments of this application are described in detail. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0046] Example

[0047] See Figure 1 The embodiments of this application provide an electronic device 1000, which includes an electronic device housing 300, electronic components 100, and a heat dissipation assembly 200.

[0048] Electronic component 100 is housed within the electronic device housing 300. If electronic component 100 is an electronic device such as a PCB board, it will generate heat during operation.

[0049] The heat dissipation component 200 is disposed within the electronic device housing 300 and is capable of drawing cooling gas into the electronic device housing 300 to dissipate heat from the electronic components 100. Optionally, the heat dissipation component 200 may be a fan.

[0050] See Figures 2 to 5 In this embodiment, the electronic device housing 300 includes a side plate 10 and a baffle 11. The side plate 10 has a through hole 13 that extends through the side plate 10 along its thickness direction. The through hole 13 has a first end 101 and a second end 102 opposite each other along a first direction Z. The baffle 11 includes a first blocking portion 112 and a second blocking portion 111. The first blocking portion 112 is spaced apart from the side plate 10 and located inside the side plate 10, corresponding to the through hole 13 along its thickness direction. The first blocking portion 112 has a third end 1111 and a fourth end 1121. The second blocking portion 111 connects the second end 102 and the fourth end 1121, and the second blocking portion 111 intersects the side plate 10 at an angle.

[0051] In this embodiment, a baffle 11 is provided on the inner side of the side plate 10 near the through hole 13. The baffle 11 is obliquely connected to the side plate 10 via a second blocking part 111, and is provided along the thickness direction of the side plate 10 (e.g., Figure 1 The thickness direction of the middle side plate 10 is the second direction Y) corresponding to the first shielding part 112 of the through hole 13, which enhances the strength of the side plate 10 near the through hole 13. The baffle 11 shields the inside of the electronic device housing 300, so the internal structure cannot be directly observed from the outside, which improves the safety performance and meets the requirements of safety regulations.

[0052] In this embodiment, cooling gas enters between the first end 101 and the second end 102 of the through hole 13, and enters the electronic device housing 300 from the heat dissipation port 12 under the guidance of the baffle 11. The through hole 13 transitions smoothly to the inner side of the electronic device housing 300, resulting in minimal obstruction to the flow of cooling gas within it. This is comparable to the heat dissipation efficiency of directly opening a through hole in the side plate 10, thus improving structural strength while maintaining heat dissipation efficiency and shielding the inner side of the electronic device housing 300.

[0053] In this embodiment, the electronic device housing 300 further includes two side stops 14, which are respectively connected between the two ends of the baffle 11 along the second direction Y and the two ends of the through hole 13 along the second direction Y. The second direction Y is perpendicular to or obliquely intersects the first direction Z.

[0054] In this embodiment, two side baffles 14 are respectively connected to the two sides of the baffle 11 along the second direction Y and connected to the side plate 10, supporting the second shielding part 111 and the first shielding part 112, thereby enhancing the strength of the side plate 10 near the through hole 13. At the same time, the two side baffles 14 correspond to the two sides of the through hole 13 along the second direction Y and are connected to the two edges of the heat dissipation vent 12 along the second direction Y, guiding the cooling gas into the electronic device housing 300 along the heat dissipation vent 12.

[0055] In this embodiment, the side plate 10 has multiple through holes 13, which are arranged in an array on the side plate 10. Each through hole 13 is provided with a baffle 11.

[0056] In this embodiment, the array of multiple through holes 13 guides the cooling gas into the electronic device housing 300, increasing the entry speed of the cooling gas and thus improving the heat dissipation efficiency.

[0057] In this embodiment, each through hole 13 is provided with a baffle 11 and a side stop 14, which improves the strength of the side plate 10. If through holes 13 distributed in an array are directly opened in the side plate 10, the strength of the side plate 10 material will decrease due to too many holes, the safety performance will decrease, and the requirements of safety regulations will not be met.

[0058] In this embodiment, the side block 14, the second shield 111 and the first shield 112 are connected by a smooth curved surface transition.

[0059] In this embodiment, the second shielding part 111 and the first shielding part 112 are connected by a smooth curved surface transition, so that the through hole 13 transitions smoothly and reduces the loss when the cooling gas enters. If the second shielding part 111 and the first shielding part 112 extend in a straight line and are connected, the cooling gas will encounter greater resistance at the corner of the through hole 13 when it enters, resulting in lower heat dissipation efficiency.

[0060] In this embodiment, the electronic device housing 300 includes a plurality of side plates 10. The electronic device housing 300 also includes a base plate 15, and the plurality of side plates 10 are respectively connected to the circumferential sides of the base plate 15, forming a mounting space 16 together with the base plate 15. A baffle 11 is located on the side plate 10 near the mounting space 16. Through holes 13 of the plurality of side plates 10 are respectively connected to the mounting space 16.

[0061] In this embodiment, the installation space 16 is located inside the electronic device housing 300.

[0062] In this embodiment, multiple side plates 10 are arranged circumferentially, and each of the multiple side plates 10 is provided with an array of through holes 13, which together guide the cooling gas into the installation space 16 circumferentially. The electronic components 100 can be cooled by cooling gas entering from multiple directions at the same time, making the cooling more uniform.

[0063] In this embodiment, the through hole 13 is an elongated hole extending along the second direction Y, which is perpendicular to the first direction Z. The second direction Y is parallel to the base plate 15.

[0064] In this embodiment, the length of the through hole 13 along the second direction Y is relatively long, which increases the air intake area of ​​the through hole 13. At the same time, the path that the cooling gas needs to flow into remains unchanged, only the amount of cooling gas entering through the through hole 13 is increased, thereby improving the heat dissipation efficiency.

[0065] In this embodiment, a heat dissipation port 12 is defined between the first end 101 and the third end 1111, and the heat dissipation port 12 faces the base plate 15.

[0066] In this embodiment, the first end 101 and the third end 1111 are spaced apart relative to each other along the thickness direction of the side plate 10, and form a heat dissipation port 12 facing the bottom plate 15 along the first direction Z. Cooling gas can enter the interior of the electronic device housing 300 through the heat dissipation port 12. The cooling gas is guided to be blown from the heat dissipation port 12 to the bottom plate 15, and then moves along the bottom plate 15 to the heat dissipation assembly 200. It passes through the electronic component 100 and dissipates heat from the electronic component 100, thus avoiding the cooling gas from being blown directly onto the electronic component 100 and improving the safety performance of heat dissipation.

[0067] In this embodiment, the first end 101 and the third end 1111 correspond to each other, so that the heat dissipation vent 12 is not directly facing the electronic component 100 inside the electronic device housing 300, thus shielding the inside of the electronic device housing 300, improving safety performance, and meeting the requirements of safety regulations.

[0068] In this embodiment, the baffle 11 is formed by stamping.

[0069] In this embodiment, the side panel 10 is obtained by stamping a single piece of base material. The base material is a sheet material without holes. After stamping, through holes 13 are obtained distributed in the base material. The stamped portion bends and extends inward towards the base material, forming a second blocking portion 111, a first blocking portion 112, and two side blocking portions 14. The manufacturing process of the side panel 10 from the base material is simple, and only one piece of base material is needed to complete the manufacturing process. No other materials are required, resulting in lower costs.

[0070] In this embodiment, the thickness of the side plate 10 is less than or equal to 0.5 mm.

[0071] In this embodiment, the side plate 10 is relatively thin. Directly opening a through hole in a plate with a thickness of less than 0.66 mm would result in poor safety performance and would not comply with safety regulations. This embodiment uses stamping to form a second shielding part 111, a first shielding part 112, and a side shielding part 14 at the through hole 13, which enhances the strength at the through hole 13, improves safety performance, and has a baffle 11 to shield the inside of the electronic device housing 300, thus complying with safety regulations.

[0072] In summary, in the embodiments of this application, a thinner side plate 10 is used to punch holes, and the punched portion is bent inward to form a second shielding part 111, a first shielding part 112, and two side baffles 14, forming a through hole 13 with a smooth curve transition. The first end 101 and the third end 1111 are spaced apart along the thickness direction of the side plate 10 to form heat dissipation vents 12. A heat dissipation component 200 is provided inside the electronic device housing 300 to guide cooling gas through the through hole 13 and then through the heat dissipation vents 12 into the electronic device housing 300 to dissipate heat from the electronic components 100 inside the electronic device housing 300. The side plate 10 has good strength, and the baffle 11 located on the inner side shields the electronic components 100, making it impossible to directly observe them from the outside. The safety performance is good and meets the safety regulatory requirements.

[0073] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. An electronic device housing, characterized in that, include: A side plate, wherein a through hole is formed in the side plate, the through hole extending through the side plate along its thickness direction; the through hole has a first end and a second end opposite to each other along a first direction; and, A baffle, comprising a first blocking portion and a second blocking portion; the first blocking portion and the side plate are spaced apart from each other and located inside the side plate, and corresponding to the through hole along the thickness direction; the first blocking portion has a third end and a fourth end; the second blocking portion is connected between the second end and the fourth end, and the second blocking portion and the side plate intersect at an angle.

2. The electronic device housing according to claim 1, characterized in that: The electronic device housing also includes two side baffles, which are respectively connected between the two ends of the baffle along the second direction and the two ends of the through hole along the second direction; Wherein, the second direction is perpendicular to or intersects the first direction at an angle.

3. The electronic device housing according to claim 1, characterized in that: The side plate has a plurality of through holes, which are arranged in an array on the side plate; a baffle is provided at each of the through holes.

4. The electronic device housing according to claim 1, characterized in that: The third end and the first end are flush along the thickness direction of the side plate.

5. The electronic device housing according to claim 1, characterized in that: The electronic device housing includes multiple side panels; The electronic device housing also includes a base plate, and a plurality of side plates are respectively connected to the circumferential sides of the base plate, forming an installation space with the base plate; the baffle is located on the side plate near the installation space; The through holes of the multiple side plates are respectively connected to the mounting space.

6. The electronic device housing according to claim 5, characterized in that: A heat dissipation vent is defined between the first end and the third end, and the heat dissipation vent faces the base plate.

7. The electronic device housing according to claim 5, characterized in that: The through hole is an elongated hole extending along a second direction, which is perpendicular to the first direction and parallel to the base plate.

8. The electronic device housing according to claim 1, characterized in that: The baffle is formed by stamping.

9. The electronic device housing according to claim 1, characterized in that: The thickness of the side plate is less than or equal to 0.5 mm.

10. An electronic device, characterized in that, include: The electronic device housing according to any one of claims 1-9; Electronic components are disposed on the inside of the housing of the electronic device; A heat dissipation component is disposed on the inner side of the electronic device housing and is capable of drawing cooling gas into the electronic device housing through the through hole to dissipate heat from the electronic components.

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