A bus connection structure and a gateless assembly
By covering the solder strip and busbar with a skin film and using a low-temperature process to form an alloyed connection, the problem of easy poor soldering between the solder strip and busbar in the busbarless module is solved, thereby improving the reliability and service life of the module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG MINGYANG SMART ENERGY CO LTD
- Filing Date
- 2025-05-08
- Publication Date
- 2026-06-02
AI Technical Summary
In gridless modules, the connection between the solder strip and the busbar is prone to poor soldering, which affects the reliability and service life of the module.
A skin membrane is placed between the solder strip and the busbar, and a low-temperature or ultra-low-temperature process is used to make the skin membrane material tightly bonded to the busbar and the solder strip, and an alloyed bond is formed by melting at high temperature.
It effectively prevents cold solder joints, improves component reliability and lifespan, and has a simple structure and is easy to operate.
Smart Images

Figure CN224319797U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of photovoltaic modules, and in particular to a busbar connection structure and a gridless module. Background Technology
[0002] With their unique structural design, busbarless modules have shown significant advantages in reducing module costs, improving photoelectric conversion efficiency, and enhancing resistance to microcracks, and are gradually becoming a research hotspot and development trend in the photovoltaic field.
[0003] The busbar connection process for gridless modules is one of the key technologies in photovoltaic module manufacturing. The interfacial bonding strength between the solder ribbon and the busbar is crucial to the long-term reliability of the module. Improper connection may lead to phenomena such as incomplete soldering between the solder ribbon or busbar, affecting the performance and lifespan of the module.
[0004] The traditional method of busbar connection involves melting the surface coating of the solder strip and the busbar at high temperature to fuse the alloy between the two. After cooling, the alloying is achieved. However, the surface coating of the solder strip of the busbar-less module uses a low-temperature or ultra-low-temperature process, while the surface coating of the conventional busbar uses a high-temperature process. The two are not compatible, and if they are directly welded, "false soldering" will occur, which seriously affects the reliability of the module. Utility Model Content
[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a busbar connection structure that can effectively solve the problem of "incomplete welding" between the solder strip and the busbar during busbar connection.
[0006] Another objective of this invention is to provide a gridless assembly.
[0007] The objective of this utility model can be achieved by adopting the following technical solutions:
[0008] A busbar connection structure includes battery cells, solder ribbons, busbars, and a skin membrane. Several battery cells are connected in series via solder ribbons to form a battery string. One end of the solder ribbon extends outward beyond the edge of the battery cell and is used to connect the busbar. The bottom surface of the end of the solder ribbon that extends beyond the edge of the battery cell is connected to the bottom surface of ...
[0009] Furthermore, one end of the welding strip extends 6-8 mm beyond the edge of the battery cell.
[0010] Furthermore, the skin membrane is made of EVA, POE, EPE or PVB material.
[0011] Furthermore, the width of the skin membrane is greater than or equal to the width of the busbar, and its length is sufficient to cover all the solder strips.
[0012] Furthermore, the surface of the busbar is coated with a tin-lead alloy.
[0013] Furthermore, the solder strip has a copper wire inside and is wrapped with a tin-bismuth-lead coating or a tin-bismuth-silver alloy coating on the outside.
[0014] Furthermore, the solder ribbon and the battery cell are connected by conductive adhesive, UV adhesive, or IFC coating.
[0015] Another objective of this utility model can be achieved by adopting the following technical solution:
[0016] A gateless assembly includes the bus connection structure described above.
[0017] Compared with the prior art, this utility model has the following advantages and beneficial effects:
[0018] This invention, by covering the busbar and solder strip with a skin film, ensures a tight connection between the solder strip and the busbar during the lamination alloying process, preventing "false soldering" and ensuring the reliability of the component. It has a simple structure, is easy to operate, and is highly practical, making it suitable for widespread application. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the bus connection structure of this utility model. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the protection scope of this utility model.
[0021] Example 1:
[0022] like Figure 1 As shown, this embodiment provides a busbar connection structure, including a battery cell 1, a solder ribbon 2, a busbar 3, and a skin membrane 4. Several battery cells 1 are connected in series to form a battery string via the solder ribbon 2. One end of the solder ribbon 2 extends outward and beyond the edge of the battery cell 1 by 6-8 mm, and is used to connect the busbar 3. The bottom surface of the end of the solder ribbon 2 that extends beyond the edge of the battery cell 1 is connected to the busbar 3. The top surface of the end of the solder ribbon 2 that extends beyond the edge of the battery cell 1 is provided with the skin membrane 4. The skin membrane 4 and the busbar 3 together wrap the solder ribbon 2, thereby making the busbar and the solder ribbon tightly connected.
[0023] The skin membrane 4 is made of EVA, POE, EPE or PVB material with low fluidity under high temperature conditions, which effectively ensures the alloying of the solder strip 2 and the busbar 3.
[0024] The width of the skin membrane 4 is greater than or equal to the width of the busbar 3, and its length is sufficient to cover all the solder strips 2.
[0025] The surface of the busbar 3 is coated with a tin-lead alloy. The solder strip 2 has a copper wire inside and is wrapped with a tin-bismuth-lead coating or a tin-bismuth-silver alloy coating on the outside. The above coating can melt at 140°C and form an alloy with the busbar 3.
[0026] The solder strip 2 and the battery cell 1 are connected by conductive adhesive, UV adhesive or IFC coating.
[0027] The operation of the bus connection structure in this embodiment is as follows:
[0028] 1. Connect several battery cells in series using solder ribbons to form a battery string;
[0029] 2. Connect the assembled battery strings in series using busbars to form a battery pack;
[0030] 3. Cover the solder strip and busbar with a skin film, heat it to make the solder strip adhere tightly to the busbar, and ensure that the solder strip does not move;
[0031] 4. During the lamination process, the coating on the surface of the solder strip melts, causing it to alloy with the busbar.
[0032] This invention ensures a tight connection between the busbar and the solder strip during the lamination alloying process by covering the busbar and solder strip with a skin film, preventing "false soldering" and ensuring the reliability of the component.
[0033] Example 2:
[0034] A gateless assembly includes the bus connection structure described in Embodiment 1.
[0035] The above description is only a preferred embodiment of this utility model patent, but the protection scope of this utility model patent is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the scope disclosed in this utility model patent, based on the technical solution and utility model patent concept of this utility model patent, shall fall within the protection scope of this utility model patent.
Claims
1. A bus connection structure, characterized in that: It includes battery cells, solder ribbons, busbars, and a skin membrane. Several battery cells are connected in series by solder ribbons to form a battery string. One end of the solder ribbon extends outward and beyond the edge of the battery cell to connect to the busbar. The bottom surface of the end of the solder ribbon that extends beyond the edge of the battery cell is connected to the bottom surface of the busbar. The top surface of the end of the solder ribbon that extends beyond the edge of the battery cell is provided with a skin membrane for wrapping the solder ribbon together with the busbar, so that the busbar and the solder ribbon are tightly connected.
2. The bus connection structure according to claim 1, characterized in that: One end of the welding strip extends 6-8 mm beyond the edge of the battery cell.
3. The bus connection structure according to claim 1, characterized in that: The skin membrane is made of EVA, POE, EPE or PVB material.
4. The bus connection structure according to claim 1, characterized in that: The width of the skin membrane is greater than or equal to the width of the busbar, and its length is sufficient to cover all the solder strips.
5. The bus connection structure according to claim 1, characterized in that: The surface of the busbar is coated with a tin-lead alloy.
6. The bus connection structure according to claim 1, characterized in that: The solder strip has a copper wire inside and is wrapped with a tin-bismuth-lead coating or a tin-bismuth-silver alloy coating on the outside.
7. The bus connection structure according to claim 1, characterized in that: The solder strip and the battery cell are connected by conductive adhesive, UV adhesive or IFC coating.
8. A gridless assembly, characterized in that: Includes the bus connection structure as described in any one of claims 1 to 7.