An LED package structure

Abstract

The utility model discloses a kind of LED packaging structures, it is related to LED packaging technology, comprising: heat dissipation substrate;Circuit board, installed on the heat dissipation substrate;Several LED chips, installed on the circuit board;Frame, fixedly connected the heat dissipation substrate, the frame is provided with backshaped glue tank;Transparent cover plate, matching the frame, the transparent cover plate is connected symmetrical positioning U rod, symmetrical the positioning U rod matching the backshaped glue tank, at least one corner of the transparent cover plate is provided with glue injection hole, the glue injection hole penetrates the positioning U rod.The technical problem to be solved by the utility model is to provide a kind of LED packaging structure, realize the positioning of transparent cover plate, prevent transparent cover plate from shifting in packaging process, facilitate to realize LED packaging.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, specifically to an LED packaging structure. Background Technology

[0002] LED packaging is the process of protecting, fixing, and electrically connecting LED chips using specific processes and materials to achieve their light-emitting function and improve reliability and performance. LED packaging structure involves encapsulating LED chips using specific processes and materials to achieve functions such as chip protection, improved light extraction efficiency, and heat dissipation performance.

[0003] Existing technologies, such as the utility model with authorization publication number CN222916536U, effectively improve the sealing performance of the LED packaging structure, making it less likely for the transparent cover to separate from the frame-shaped support, thus improving the structural stability of the LED packaging structure.

[0004] Currently, there is a lack of an LED packaging structure that facilitates the connection between the transparent cover and the frame, limits the position of the transparent cover, and enables the packaging of this type of LED. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an LED packaging structure that enables the positioning of the transparent cover plate, prevents the transparent cover plate from shifting during the packaging process, and facilitates LED packaging.

[0006] This utility model achieves its purpose through the following technical solution:

[0007] An LED packaging structure is characterized by comprising: a heat dissipation substrate for supporting the entire packaging structure; a circuit board mounted on the heat dissipation substrate to provide electrical connections for LED chips and ensure their normal operation; a plurality of LED chips mounted on the circuit board; a frame fixedly connected to the heat dissipation substrate, the frame having a return groove for sealing and fixing the encapsulating adhesive; a transparent cover plate matched with the frame for protecting the LED chips from damage by the external environment while allowing light to pass through; the transparent cover plate is connected to symmetrical positioning U-shaped rods, the symmetrical positioning U-shaped rods matching the return groove, the positioning U-shaped rods cooperating with the return groove to ensure the fixing and sealing of the transparent cover plate and the frame; the transparent cover plate has an injection hole at at least one corner, the injection hole penetrating the positioning U-shaped rod, the injection hole for injecting encapsulating adhesive to achieve the sealing performance of the package.

[0008] As an optimization, the frame is provided with symmetrical T-slots, which are respectively connected to the return adhesive groove, and the symmetrical T-slots are matched with symmetrical T-plates.

[0009] As an optimization, the symmetrical T-plates are each provided with square holes, and the transparent cover is fixedly connected to symmetrical positioning rods, which are matched with the symmetrical square holes. The connection between the transparent cover and the T-plates is achieved through the matching of the square holes and the positioning rods, further enhancing the stability of the transparent cover.

[0010] As an optimization, the symmetrical T-plates are each provided with a set of irregularly shaped holes, and a set of mounting rods are fixedly connected to both sides of the transparent cover. Each mounting rod is fixedly connected to an irregularly shaped block, which matches the irregularly shaped hole. By matching the irregularly shaped block with the irregularly shaped hole, a tighter connection can be achieved, preventing the transparent cover from shifting during the packaging process.

[0011] As an optimization, the irregularly shaped block is thicker in the middle and thinner at both ends, and the irregularly shaped block is made of elastic material, which makes it easy for the irregularly shaped block to be inserted into the irregularly shaped hole.

[0012] As an optimization, one of the irregularly shaped blocks in each group is fixedly connected to a positioning rod, and the frame is provided with symmetrical positioning holes, with the symmetrical positioning rods matching the symmetrical positioning holes. This enhances the positioning accuracy between the transparent cover and the frame.

[0013] Compared with related technologies, the LED packaging structure provided by this utility model has the following beneficial effects:

[0014] (1) The transparent cover plate of this utility model is placed above the LED chip to play an optical protection role. It not only allows light to pass through, but also prevents damage to the LED chip from the external environment (such as dust, moisture, chemicals, etc.), thereby ensuring that the optical performance of the LED chip is not affected.

[0015] (2) This utility model uses a T-plate and a combination of irregular holes and irregular blocks to achieve the positioning of the transparent cover, achieve a tighter connection, and prevent the transparent cover from shifting during the packaging process. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 For the localized explosion of this utility model Figure 1 ;

[0018] Figure 3 For the localized explosion of this utility model Figure 2 ;

[0019] Figure 4 This is a partial top view of the present invention;

[0020] Figure 5 This is a partially cut-away three-dimensional structural diagram of the present invention;

[0021] Figure 6 For the present utility model Figure 5 A magnified view of part A in the image.

[0022] In the picture:

[0023] 1. Transparent cover plate; 11. Injection hole; 12. Positioning U-rod; 13. Positioning rod; 14. Mounting rod; 15. Irregular block; 16. Positioning round rod.

[0024] 2. Frame; 21. Backing groove; 22. T-groove; 23. Positioning round hole;

[0025] 3. Heat dissipation substrate;

[0026] 4. Circuit board;

[0027] 5. LED chips;

[0028] 6. T-shaped insert plate; 61. Square hole; 62. Irregular hole. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Example 1: An LED packaging structure includes: a heat dissipation substrate 3 for supporting the entire packaging structure; a circuit board 4 mounted on the heat dissipation substrate 3 to provide electrical connection for LED chips 5, ensuring their normal operation; a plurality of LED chips 5 mounted on the circuit board 4; a frame 2 fixedly connected to the heat dissipation substrate 3, the frame 2 being provided with a return adhesive groove 21 for sealing and fixing the encapsulating adhesive; a transparent cover plate 1 matched with the frame 2 for protecting the LED chips 5, preventing damage to the chips from the external environment, while allowing light to pass through; the transparent cover plate 1 is connected to symmetrical positioning U-shaped rods 12, the symmetrical positioning U-shaped rods 12 matching the return adhesive groove 21, the positioning U-shaped rods 12 cooperating with the return adhesive groove 21 to ensure the fixing and sealing of the transparent cover plate 1 and the frame 2; the transparent cover plate 1 is provided with an injection hole 11 at at least one corner, the injection hole 11 penetrating the positioning U-shaped rod 12, the injection hole 11 for injecting encapsulating adhesive to achieve the sealing of the packaging.

[0031] The working principle of the LED packaging structure provided by this utility model is as follows:

[0032] Place the transparent cover plate 1 on top of the frame 2, insert the positioning U rod 12 into the return adhesive groove 21, with a gap between its lower end and the bottom side of the return adhesive groove 21, and use the equipment to inject adhesive from the injection hole 11 into the return adhesive groove 21 to fix the transparent cover plate 1.

[0033] The frame 2 is provided with symmetrical T-slots 22, which are respectively connected to the return adhesive groove 21, and the symmetrical T-slots 22 are matched with symmetrical T-insertion plates 6.

[0034] Example 2: The symmetrical T-plates 6 are each provided with square holes 61. The transparent cover 1 is fixedly connected to symmetrical positioning rods 13, and the symmetrical positioning rods 13 are matched with the symmetrical square holes 61. The connection between the transparent cover 1 and the T-plates 6 is achieved through the matching of the square holes 61 and the positioning rods 13, further enhancing the stability of the transparent cover 1.

[0035] The working principle of the LED packaging structure provided by this utility model is as follows:

[0036] Insert the T-plate 6 into the T-groove 22, ensuring the T-plate 6 does not contact the inner wall of the return adhesive groove 21. Place the transparent cover plate 1 over the frame 2. Insert the positioning U-rod 12 into the return adhesive groove 21, and insert the positioning rod 13 into the square hole 61. Use the equipment to inject adhesive into the return adhesive groove 21 through the injection hole 11, thus fixing the transparent cover plate 1 and the T-plate 6.

[0037] Example 3: The symmetrical T-plates 6 are each provided with a set of irregular holes 62. A set of mounting rods 14 are fixedly connected to both sides of the transparent cover plate 1. Each mounting rod 14 is fixedly connected to an irregular block 15, and the irregular block 15 matches the irregular hole 62. By matching the irregular block 15 with the irregular hole 62, a tighter connection can be achieved, preventing the transparent cover plate 1 from shifting during the packaging process.

[0038] The irregularly shaped block 15 is thicker in the middle and thinner at both ends. The irregularly shaped block 15 is made of elastic material, which makes it easy for the irregularly shaped block 15 to be inserted into the irregularly shaped hole 62.

[0039] One of the irregularly shaped blocks 15 in each group is fixedly connected to a positioning rod 16. The frame 2 is provided with symmetrical positioning holes 23, and the symmetrical positioning rods 16 match the symmetrical positioning holes 23. This enhances the positioning accuracy between the transparent cover plate 1 and the frame 2.

[0040] The working principle of the LED packaging structure provided by this utility model is as follows:

[0041] Insert the T-plate 6 into the T-groove 22, ensuring the T-plate 6 does not contact the inner wall of the return adhesive groove 21. Place the transparent cover 1 over the frame 2. Insert the positioning U-rod 12 into the return adhesive groove 21. Insert the irregularly shaped block 15 into the irregularly shaped hole 62. Insert the positioning round rod 16 into the positioning round hole 23. Use the equipment to inject adhesive into the return adhesive groove 21 through the injection hole 11, thus fixing the transparent cover 1 and the T-plate 6.

[0042] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An LED packaging structure, characterized in that, include: Heat dissipation substrate (3); Circuit board (4) is mounted on the heat dissipation substrate (3); Several LED chips (5) are mounted on the circuit board (4); The frame (2) is fixedly connected to the heat dissipation substrate (3), and the frame (2) is provided with a return adhesive groove (21). A transparent cover plate (1) is matched with the frame (2). The transparent cover plate (1) is connected to a symmetrical positioning U rod (12). The symmetrical positioning U rod (12) is matched with the return glue groove (21). At least one corner of the transparent cover plate (1) is provided with a glue injection hole (11). The glue injection hole (11) passes through the positioning U rod (12).

2. The LED packaging structure according to claim 1, characterized in that: The frame (2) is provided with symmetrical T-slots (22), which are respectively connected to the return adhesive groove (21), and the symmetrical T-slots (22) are matched with symmetrical T-plates (6).

3. The LED packaging structure according to claim 2, characterized in that: The symmetrical T-plates (6) are respectively provided with square holes (61), and the transparent cover plate (1) is fixedly connected to the symmetrical positioning rods (13), and the symmetrical positioning rods (13) match the symmetrical square holes (61).

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