Semiconductor device workpiece stage and wafer inspection apparatus

CN224319836UActive Publication Date: 2026-06-02DONGFANG JINGYUAN ELECTRON LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGFANG JINGYUAN ELECTRON LTD
Filing Date
2025-04-17
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing semiconductor equipment has a limited range of movement for the workpiece stage, and laser rulers cannot perform closed-loop control over a wider range.

Method used

By employing a combination of multiple laser rulers and reflectors, and through the collaborative work of overlapping detection areas and a host computer, closed-loop control of the stage can be achieved over a wider range.

Benefits of technology

The increased movement range of the stage improves the working range and accuracy of position data for wafer inspection equipment.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224319836U_ABST
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Abstract

This invention provides a semiconductor equipment workpiece stage and a wafer inspection device. The semiconductor equipment workpiece stage includes a first reflector and a plurality of first laser rulers. The first reflector is disposed on the stage of the semiconductor equipment workpiece stage to move with the stage along a first direction. The plurality of first laser rulers are disposed on a support base of the semiconductor equipment workpiece stage. The plurality of first laser rulers are arranged sequentially at intervals along the first direction, and the distance between any two adjacent first laser rulers is less than the width of the first reflector along the first direction. The first laser rulers are configured to emit laser light along a second direction and receive laser light reflected by the first reflector. The semiconductor equipment workpiece stage can use laser rulers for closed-loop control over a wider range, thus expanding the movement range of existing staged stages and consequently expanding the working range of wafer inspection equipment such as scanning electron microscopes and optical cameras.
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