High-efficiency chip liquid cooling heat dissipation device

Abstract

The utility model relates to a kind of high -efficient chip liquid cooling heat sink, including radiator cold plate, shunt plate, radiator cover, radiator cold plate and radiator cover are enclosed and constitute heat dissipation space, shunt plate is in heat dissipation space;Radiator cold plate is equipped with microstructure rib column in one side in heat dissipation space, to strengthen heat exchange;Radiator cover is provided with a pair of working medium flow port;Shunt plate near radiator cold plate one side is equipped with recess, shunt plate and radiator cold plate are in contact, recess and the space formed by the surrounding of radiator cold plate constitute heat exchange cavity;The recess groove bottom is hollow, the other side of shunt plate is equipped with working medium inflow chamber and working medium outflow chamber in hollow groove bottom both ends opposite, the other side of shunt plate is also equipped with multiple partitions connected head and tail on hollow groove bottom, adjacent two partitions or head and tail partition and its similar groove wall constitute flow channel, the flow channel with working medium inflow chamber is connected with working medium inflow chamber with opening to the working medium inflow chamber.The utility model has good heat exchange efficiency, good heat dissipation effect, and stable operation.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, specifically to a high-efficiency chip liquid cooling heat dissipation device. Background Technology

[0002] The rapid iteration of microelectronics technology is driving continuous upgrades in chip performance. With the trends of device miniaturization and high-density integration, thermal management faces severe challenges. As core unit power consumption increases significantly and the heat accumulation effect caused by three-dimensional stacking structures leads to an exponential increase in chip heat flux density, the thermal density of chips exhibits a high-temperature characteristic. Given the sensitivity of semiconductor components to high temperatures, excessive overheating can easily damage components. Therefore, thermal management solutions have become a key factor restricting chip performance and reliability. Effective heat dissipation technology plays a decisive role in maintaining stable chip operation and extending service life.

[0003] Current mainstream chip cooling solutions are mainly classified according to heat conduction mechanisms, covering various technical paths such as forced air cooling, heat pipe conduction, circulating liquid cooling, thermoelectric cooling, and phase change cooling. Especially in the field of liquid cooling technology, phase change liquid cooling systems based on medium phase change have become the preferred solution for dealing with the thermal load of high-power chips due to their compact structural design, high heat flux carrying capacity, and low noise operation characteristics.

[0004] However, engineering practice has revealed inherent defects in traditional liquid cooling systems: limited by unreasonable heat transfer interface design and insufficient working fluid circulation efficiency, they generally suffer from bottlenecks such as limited heat dissipation performance and low heat exchange efficiency, making it difficult to meet the heat dissipation requirements of continuous high-power operation scenarios. Against this backdrop, developing novel cooling devices with enhanced heat transfer characteristics has become a crucial technological direction for breakthroughs in the field of microelectronics heat dissipation.

[0005] Patent CN118507439A discloses a CPU / GPU phase-change liquid cooling radiator, including an upper cover plate, a baffle plate, a lower cover plate, and a base plate. The baffle plate is pressed between the upper and lower cover plates. The upper cover plate has a pair of working fluid flow ports, serving as the working fluid inlet and outlet of the radiator, respectively. The upper cover plate also has a pair of connecting grooves, each communicating with one of the working fluid flow ports. The baffle plate has a pair of through holes corresponding to the positions of the connecting grooves. The lower cover plate has a through opening in the middle, with the baffle plate located at one end of the through opening, and the base plate connected to the other end of the through opening. The inner wall of the base plate has several raised microstructures, and the outer wall of the base plate is shaped to conform to the heat dissipation surface of the CPU / GPU. The above patent suffers from low heat exchange efficiency and poor heat dissipation effect. Utility Model Content

[0006] To address at least one of the heat dissipation problems of existing chip heat sinks, namely low heat exchange efficiency, poor heat dissipation effect, and unstable operation, this invention provides a high-efficiency liquid cooling device for chips. Compared with the prior art, the flow distribution plate design provided by this invention can help the cooling medium to make more uniform and sufficient contact with the microstructured ribs set on the bottom surface of the cold plate. At the same time, it can allow the cooling medium to flow out of the cold plate cavity through a shorter path, which is equivalent to reducing the thermal resistance in the heat exchange process and achieving high-efficiency heat exchange. In addition, capillary structures can be formed by sintering copper powder particles on the bottom surface of the cold plate and the microstructured ribs. The capillary structure can significantly increase the surface area inside the heat sink and enhance the liquid supply through the capillary effect, thereby enhancing convective heat transfer.

[0007] The objective of this utility model can be achieved through the following technical solutions:

[0008] A high-efficiency liquid cooling heat dissipation device for chips includes a heat sink cold plate, a flow distribution plate, and a heat sink cover plate. The heat sink cold plate and the heat sink cover plate together form a heat dissipation space, and the flow distribution plate is located within the heat dissipation space.

[0009] The radiator cold plate has microstructured ribs on one side within the heat dissipation space to enhance heat transfer;

[0010] The radiator cover is provided with a pair of working fluid flow ports, which serve as the working fluid inlet and working fluid outlet of the heat dissipation device, respectively.

[0011] The flow divider plate has a groove on the side near the radiator cold plate, the flow divider plate abuts against the radiator cold plate, and the space formed by the groove and the radiator cold plate constitutes a heat exchange chamber.

[0012] The bottom of the groove is hollow. On the other side of the flow divider plate, there are working fluid inflow chambers and working fluid outflow chambers at opposite ends of the hollow groove bottom. On the other side of the flow divider plate, there are also multiple partitions connected end to end on the hollow groove bottom. Two adjacent partitions or the first and last partitions and the groove wall near them form a flow channel. The flow channel that opens into the working fluid inflow chamber is called the working fluid inflow channel and is connected to the working fluid inflow chamber. The flow channel that opens into the working fluid outflow chamber is called the working fluid outflow channel and is connected to the working fluid outflow chamber.

[0013] The working fluid flows into the working fluid inlet cavity from the working fluid inlet, then flows into the heat exchange cavity through the opening into the working fluid inlet cavity, then flows into the opening into the working fluid outlet cavity from the heat exchange cavity, then gathers into the working fluid outlet cavity, and then flows out from the working fluid outlet cavity, forming a heat exchange loop.

[0014] Furthermore, the radiator cold plate has a bottom capillary structure on one side of the heat dissipation space, i.e., the bottom surface of the cold plate, referred to as the first capillary structure; the first capillary structure has one or more layers.

[0015] When the thickness of the bottom capillary structure is such that the surface of the radiator cold plate is a smooth metal surface.

[0016] Furthermore, the microstructure rib is a solid rib covered with a capillary structure, referred to as the second capillary structure. When the thickness of the second capillary structure is 0%, the microstructure rib is a completely solid rib; when the thickness of the second capillary structure is 100%, the microstructure rib is composed of a completely porous capillary structure.

[0017] Furthermore, the first capillary structure or the second capillary structure is a porous capillary structure;

[0018] The porous capillary structure is constructed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering. The porosity of the porous capillary structure is 10% to 99%, and the thickness at different locations or regions is adjusted according to design requirements.

[0019] Furthermore, the shape of the microstructure ribs is selected from one or more of the following: rectangular cross-section prism, rectangular cross-section pyramid, rectangular cross-section frustum, trapezoidal prism, trapezoidal pyramid, trapezoidal frustum, parallelogram prism, parallelogram pyramid, parallelogram frustum, triangular prism, triangular pyramid, triangular frustum, circular prism, circular pyramid, circular frustum, elliptical prism, elliptical pyramid, elliptical frustum, hemispherical, or umbrella-shaped.

[0020] The arrangement of the microstructure ribs can be selected as either straight or staggered, depending on the applicable situation.

[0021] Furthermore, when the shape of the microstructure rib is umbrella-shaped, the umbrella-shaped structure is divided into two parts: a head and a root. The head and the root may be the same or different, and both are selected from one or more of the following: rectangular cross-section prism, rectangular cross-section pyramid, rectangular cross-section frustum, trapezoidal prism, trapezoidal pyramid, trapezoidal frustum, parallelogram prism, parallelogram pyramid, parallelogram frustum, triangular prism, triangular pyramid, triangular frustum, circular prism, circular pyramid, circular frustum, elliptical prism, elliptical pyramid, and elliptical frustum.

[0022] When the shape of the microstructure rib is umbrella-shaped, the circumcenters of the horizontal projection contours of the root and head of the umbrella structure can be coincident or misaligned according to design requirements; the circumradius of the horizontal projection contour of the root is denoted as R1, the circumradius of the horizontal projection contour of the head is denoted as R2, when the root and head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2, the ratio of the circumradius of the root to the circumradius of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0023] Furthermore, the partition is divided into a multi-segment structure, a sine structure, a cosine structure, a tangent structure, or a cotangent structure.

[0024] Furthermore, when the partition is composed of multiple segments, the partition is divided into three segments: a first partition segment, a second partition segment, and a third partition segment. The first partition segment is denoted as L1, the second partition segment as L2, and the third partition segment as L3. At least one of L1, L2, and L3 is not zero. The included angles formed by any two segments are denoted as α and β, respectively. The distance from the center line of the flow channel to the first partition segment L1 is denoted as W1, the distance from the center line of the flow channel to the third partition segment L3 is denoted as W2, and the wall thickness of the partition is denoted as D.

[0025] Furthermore, when the dimensions of W1 and W2 remain the same, the angles of α and β are both 180 degrees, and the dimension range of L2 is 0 mm, the flow channel shape is rectangular. The rectangular flow channel shape allows the cooling medium to contact the microstructure ribs on the bottom surface of the cold plate more evenly during cooling, resulting in a more uniform temperature distribution of the cold plate.

[0026] Furthermore, when the dimensions of W1 and W2 are different, and the value of W1 is 0 and the value of W2 is greater than 0, when the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is triangular. The triangular flow channel can make the flow rate of the cooling medium into the heat exchange chamber more uniform.

[0027] Furthermore, when the dimensions of W1 and W2 are different and neither is 0, and the value of W1 is less than the value of W2, and the dimensions of L1 are 0mm, the dimensions of L3 are 0mm, and the dimensions of L2 are not 0mm, the shape of the flow channel is trapezoidal. The trapezoidal flow channel can not only make the flow of the cooling medium into the heat exchange chamber more uniform, but also be more suitable for low flow rate conditions.

[0028] Furthermore, when W1 and W2 have different dimensions, and neither of them is 0, and the value of W1 is less than the value of W2, and the dimensions of L1, L2, and L3 are not 0 mm, the shape of the flow channel is convex. The convex flow channel can ensure the uniformity of temperature distribution on the bottom surface of the cold plate, and at the same time, it can adjust the uniformity of the flow rate of the cooling medium.

[0029] Furthermore, when the flow channel structure of the flow divider 3 is a sine or cosine structure, the dimension from the flow channel centerline to the wall centerline is denoted as W3, the wall thickness is D2, the amplitude of the wall centerline of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, and the total length of the flow channel is L. At this time, the flow channel shape is wavy. When heat exchange is carried out, the wavy flow channel can enhance the turbulence effect and improve the local heat exchange capacity.

[0030] Furthermore, when the flow channel structure of the flow divider 3 is a tangential or co-tangential structure, the dimension from the flow channel centerline to the wall centerline is W4, the wall thickness is D3, the amplitude of the wall centerline of the tangential or co-tangential structure is B, and the total length of the flow channel is L. At this time, the shape of the flow channel is streamlined. The streamlined flow channel is evolved from the convex shape, which not only makes the temperature distribution on the bottom surface of the cold plate more uniform and adjusts the flow uniformity of the cooling working fluid flowing into the heat exchange cavity, but also enhances the smoothness of the flow transition.

[0031] Furthermore, the radiator cold plate is welded to the flow divider plate, and the flow divider plate is welded to or integrally formed with the radiator cover plate, preferably by welding. That is, when the radiator cold plate is connected to the flow divider plate by welding, and the flow divider plate is connected to the radiator cover plate by welding or integral forming, no sealing gaskets or washers are needed between the cold plate and the flow divider plate, between the flow divider plate and the radiator cover plate, or between the radiator cover plate and the cold plate. No threaded holes or snap-fit ​​connections are also needed in corresponding positions.

[0032] Furthermore, when the radiator cold plate, the flow divider plate, and the radiator cover plate are connected by means of threaded connection, snap-fit ​​or riveting, a first sealing gasket is installed between the radiator cold plate and the flow divider plate.

[0033] A second sealing gasket is installed between the partition of the diversion plate and the microstructure rib to adjust the assembly gap;

[0034] A first sealing gasket is installed between the flow divider plate and the radiator cover plate;

[0035] A second sealing gasket is installed between the radiator cold plate and the radiator cover plate to improve the overall sealing performance of the structure.

[0036] Furthermore, the heat sink cover is provided with a connecting structure, which includes a connecting screw and a connecting nut. The connecting screw passes through the mounting surface of the chip and the connecting structure. By tightening the connecting nut, the bottom surface of the entire heat sink is tightly attached to the heat-generating surface of the chip.

[0037] The device also includes a pair of radiator connectors, which are respectively located on a pair of working fluid flow ports. The radiator connectors can be connected to the radiator cover plate by means of threaded connection or welding.

[0038] Compared with the prior art, the present invention has the following advantages:

[0039] (1) This utility model provides a high-efficiency chip liquid cooling heat dissipation device. The heat sink cold plate of the heat dissipation device is provided with microstructure ribs on one side of the heat dissipation space, which greatly increases the contact area with the working fluid and significantly improves the heat exchange efficiency. At the same time, the groove on the side of the flow plate near the heat sink cold plate forms a heat exchange cavity with the cold plate, and multiple partitions connected end to end are provided on the other side to form a complex flow channel, so that the working fluid flows evenly in the heat exchange cavity, avoids the generation of local hot spots, achieves uniform chip surface temperature, and extends the chip service life.

[0040] (2) This utility model provides a high-efficiency chip liquid cooling heat dissipation device. The surface of the microstructure ribs of the device is covered with a porous capillary structure, which can further promote the distribution of working fluid and enhance heat conduction through capillary action.

[0041] (3) This utility model provides a high-efficiency chip liquid cooling heat dissipation device. The bottom capillary structure and rib capillary structure of the device can be prepared by metal powder sintering, metal wire sintering and other processes. The porosity and thickness can be adjusted according to the heat dissipation requirements (such as increasing the porosity in high heat density areas) to balance heat dissipation efficiency and manufacturing cost.

[0042] (4) This utility model provides a high-efficiency chip liquid cooling heat dissipation device. When the screw connection is made, a sealing gasket is set between the heat sink cold plate and the flow divider plate. A sealing gasket is installed between the top of the microstructure rib of the heat sink cold plate and the lower surface of the flow channel of the flow divider plate. A sealing gasket is set between the heat sink cold plate and the heat sink cover plate. A sealing gasket is set between the flow divider plate and the heat sink cover plate. A cover plate working fluid inlet and a cover plate working fluid outlet are set on the cover plate. The device realizes the quick positioning and installation of the connector-cover plate, cover plate-flow divider plate, cover plate-cold plate and flow divider plate-cold plate respectively, and provides a guarantee for forming a reliable sealing structure. This is very important for heat dissipation systems that need to prevent the cooling medium from leaking or the air from entering. At the same time, the screw connection can also be easily and quickly disassembled and replaced.

[0043] (5) This utility model provides a high-efficiency chip liquid cooling heat dissipation device. The flow distribution plate design of this device can help the cooling medium to contact the microstructure ribs set on the bottom surface of the cold plate more evenly and fully. At the same time, it can allow the cooling medium to flow out of the cold plate cavity through a shorter path, which is equivalent to reducing the thermal resistance in the heat exchange process and achieving high-efficiency heat exchange.

[0044] (6) This utility model provides a high-efficiency chip liquid cooling heat dissipation device. The bottom surface of the cold plate and the microstructure ribs of the device can be sintered with copper powder particles to form a capillary structure. The capillary structure can significantly increase the surface area inside the heat sink and enhance the supply of liquid through the capillary effect, thereby strengthening the convective heat transfer. Attached Figure Description

[0045] Figure 1 This is a unfolded view of the overall structure of the radiator of this utility model;

[0046] Figure 2 This is an assembly drawing of the screw-connected radiator of this utility model.

[0047] Figure 3 This is a cross-sectional view of the overall structure of the radiator of this utility model;

[0048] Figure 4 This is a schematic diagram of the structure of the heat sink cold plate of this utility model;

[0049] Figure 5 This is a schematic diagram of the upper surface structure of the diversion plate of this utility model;

[0050] Figure 6 This is a schematic diagram of the structure of the lower surface of the flow divider of this utility model;

[0051] Figure 7 This is a side cross-sectional view of the diverter plate of this utility model;

[0052] Figure 8 This is a schematic diagram of the upper surface of the radiator cover of this utility model;

[0053] Figure 9 This is a schematic diagram of the lower surface of the radiator cover of this utility model;

[0054] Figure 10 This is a schematic diagram of the structure of the radiator connector of this utility model;

[0055] Figure 11 This is a schematic diagram of the structure of the first sealing gasket of the radiator according to this utility model;

[0056] Figure 12 This is a schematic diagram of the structure of the second sealing gasket of the radiator according to this utility model;

[0057] Figure 13 This is a schematic diagram of the connection structure of this utility model.

[0058] Figure 14 A schematic diagram of the flow channel design of the flow divider of this utility model;

[0059] Figure 15 This is a structural schematic diagram illustrating the shape characteristics of the microstructure ribs of this utility model;

[0060] Figure 16 This is a schematic diagram of the structure of the heat sink cold plate of the straight-row rectangular rib column of this utility model;

[0061] Figure 17 This is a schematic diagram of the structure of the heat sink cold plate of the straight-line triangular ribbed column of this utility model;

[0062] Figure 18 This is a schematic diagram showing the dimensions of the umbrella-shaped micro-ribbed column structure on the bottom surface of the cold plate of this utility model.

[0063] Figure 19 This is a schematic diagram of the capillary structure of the cold plate of this utility model.

[0064] The numbers in the diagram are as follows:

[0065] 1-Cool plate of radiator; 11-First countersunk hole of cold plate; 12-Second countersunk hole of cold plate; 13-Bottom surface of cold plate; 14-Microstructure ribs; 15-Heat exchange cavity; 131-Capillary structure of bottom surface; 141-Capillary structure of ribs;

[0066] 3-Diverter plate; 31-First mating surface on the diverter plate; 32-Upper surface groove of the diverter plate; 33-Counterhead of the diverter plate; 34-Working fluid inlet cavity; 35-Working fluid inlet channel; 36-Working fluid outlet channel; 37-Working fluid outlet cavity; 38-Blind hole of the diverter plate; 39-Lower first mating surface of the diverter plate; 310-Lower surface groove of the diverter plate; 311-Lower second mating surface of the diverter plate; 312-Lower wall of the diverter plate channel;

[0067] 5-Radiator cover plate; 51-Through hole in cover plate; 52-Second mating surface on cover plate; 53-First mating surface on cover plate; 54-Working fluid inlet of cover plate; 55-Working fluid outlet of cover plate; 56-Second mating surface under cover plate; 57-First mating surface under cover plate; 58-Lower groove under cover plate; 59-Blind hole in cover plate;

[0068] 6-Radiator connector; 61-Connector hole; 62-Connector bottom surface; 63-Connector structure.

[0069] 7-Second sealing gasket;

[0070] 8-Second sealing gasket;

[0071] 9-Connecting structure; 91-Connecting screw; 92-Connecting nut. Detailed Implementation

[0072] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0073] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0074] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0075] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0076] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "linked" in this utility model have the meaning of establishing conductivity. The specific meaning needs to be understood in conjunction with the context.

[0077] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0078] To address at least one of the heat dissipation problems of existing chip heat sinks, namely low heat exchange efficiency, poor heat dissipation effect, and unstable operation, this utility model provides a high-efficiency chip liquid cooling heat dissipation device, the specific structure of which is shown below. Figure 1-3 It includes a radiator cold plate 1, a flow divider 3, and a radiator cover plate 5. The radiator cold plate 1 and the radiator cover plate 5 together form a heat dissipation space, and the flow divider 3 is located within the heat dissipation space.

[0079] The radiator cold plate 1 is provided with microstructure ribs 14 on one side within the heat dissipation space to enhance heat exchange;

[0080] The radiator cover plate 5 is provided with a pair of working fluid flow ports, which serve as the working fluid inlet 54 and working fluid outlet 55 of the heat dissipation device, respectively.

[0081] The flow divider 3 has a groove on one side near the radiator cold plate 1. The flow divider 3 abuts against the radiator cold plate 1. The space formed by the groove and the radiator cold plate 1 constitutes a heat exchange chamber 15.

[0082] The bottom of the groove is hollow. On the other side of the flow divider 3, a working fluid inflow cavity 34 and a working fluid outflow cavity 37 are provided opposite to each other at both ends of the hollow groove bottom. On the other side of the flow divider 3, multiple partitions connected end to end are also provided on the hollow groove bottom. Two adjacent partitions or the first and last partitions and the groove wall close to them form a flow channel. The flow channel opening to the working fluid inflow cavity 34 is called the working fluid inflow channel 35 and is connected to the working fluid inflow cavity 34. The flow channel opening to the working fluid outflow cavity 37 is called the working fluid outflow channel 36 and is connected to the working fluid outflow cavity 37.

[0083] The working fluid flows into the working fluid inlet cavity 34 from the working fluid inlet, then flows into the heat exchange cavity 15 through the opening in the working fluid inlet cavity 34, then flows into the opening in the working fluid outlet cavity 37 from the heat exchange cavity 15, then gathers in the working fluid outlet cavity 37, and finally flows out from the working fluid outlet, forming a heat exchange loop. The opening in the working fluid inlet cavity 34 is designated as the working fluid inlet channel 35, and the opening in the working fluid outlet cavity 37 is designated as the working fluid outlet channel 36.

[0084] In one embodiment of this utility model, when the radiator cold plate 1, the diversion plate 3, and the radiator cover plate 5 are connected by means of threaded connection, snap fastening, or riveting,

[0085] A first sealing gasket 2 is installed between the radiator cold plate 1 and the flow divider 3;

[0086] A second sealing gasket 7 is installed between the partition of the diversion plate 3 and the microstructure rib 14 to adjust the assembly gap;

[0087] A first sealing gasket 4 is installed between the flow divider 3 and the radiator cover 5.

[0088] A second sealing gasket 8 is installed between the radiator cold plate 1 and the radiator cover plate 5 to improve the sealing performance of the entire structure.

[0089] In one embodiment of this utility model, the device further includes a pair of radiator connectors 6, which are respectively disposed on a pair of working fluid flow ports. The radiator connectors 6 can be connected to the radiator cover plate 5 by means of threaded connection or welding.

[0090] Specifically, the first contact surface 39 and the second contact surface 311 of the flow divider 3 are connected to the radiator cold plate 1 by threads. The flow divider 3 is provided with a groove 310 on the lower surface of the flow divider to place the first sealing gasket 2, which ensures the reliability and sealing of the threaded connection and forms the heat exchange cavity 15. At the same time, a second sealing gasket 7 is provided between the lower wall surface 312 of the flow channel of the flow divider 3 and the top of the microstructure rib 14 of the cold plate 1 to adjust the assembly gap and seal, and to ensure the stability and reliability of the structure.

[0091] The top surface of the flow divider plate 3 is provided with a working fluid inlet cavity 34 and a working fluid outlet cavity 37. The flow divider plate 3 is connected to the radiator cover plate 5 by a threaded connection. At the same time, the flow divider plate 3 is provided with a groove 32 on the upper surface of the flow divider plate for placing the first sealing gasket 4, which is used to ensure the sealing reliability of the structure when the threaded connection is made. The flow divider plate 3 is provided with a working fluid inlet channel 35 and a working fluid outlet channel 36. The working fluid inlet channel 35 and the working fluid outlet channel 36 are directly connected to the working fluid inlet cavity 34 and the working fluid outlet cavity 37 of the flow divider plate 3, respectively, so that the working fluid can flow into the heat exchange cavity 15.

[0092] The radiator cover plate 5 is connected to the radiator cold plate 1 by a threaded connection. A groove 58 is provided on the cover plate 5 to accommodate the second sealing gasket 8, ensuring a reliable seal between the cover plate 5 and the radiator cold plate 1. The radiator cover plate 5 has a connecting structure 9, which includes a connecting screw 91 and a connecting nut 92. The connecting screw 91 passes through the connecting structure 9 and the mounting surface of the chip. Tightening the connecting nut 92 ensures that the bottom surface of the entire radiator is tightly fitted to the heat-generating surface of the chip. The cavity formed by the second contact surface 56 under the radiator cover plate 5 and the inner wall of the cover plate is used to house the diverter plate 3 and the radiator cold plate 1, and to connect the radiator connector 4. The first contact surface 53 on the radiator cover plate 5 has a working fluid inlet 54 and a working fluid outlet 55 for connecting the radiator connector 6.

[0093] The radiator connector 6 is installed in the working fluid inlet 54 and working fluid outlet 55 of the radiator cover plate 5, and is connected to the radiator cover plate 5 by means of threaded connection. The radiator connector 6 is used for the inflow and outflow of the cooling working fluid.

[0094] Please see Figure 4 As shown, in one embodiment of the present invention, the bottom surface 13 of the radiator cold plate 1 has microstructure ribs 14 perpendicular to the bottom surface, and the bottom surface 13 of the cold plate is provided with a first countersunk hole 11 and a second countersunk hole 12, which are respectively connected to the radiator cover plate 5 and the diverter plate 3.

[0095] Please see Figure 5-7 As shown, in one embodiment of this utility model, the flow divider 3 is provided with an upper surface groove 32 for placing a first sealing gasket 4; a lower surface groove 310 for placing a first sealing gasket 2; a lower wall surface 312 for the flow channel of the flow divider to cooperate with the top surface of the microstructure rib 14 of the cold plate 1 to place a second sealing gasket 7; a countersunk hole 33 for cooperating with the blind hole 59 of the radiator cover plate 5 for screw connection; and a blind hole 38 for cooperating with the first countersunk hole 11 of the cold plate of the radiator cold plate 1 for screw connection.

[0096] Please see Figure 8-10 As shown, in one embodiment of this utility model, the radiator cover plate 5 is provided with a cover plate groove 58 for placing the second sealing gasket 8; the working fluid inlet hole 54 and the working fluid outlet hole 55 of the cover plate are both connected to the radiator connector 6 by threaded connection; the cover plate through hole 51 is connected to the second countersunk hole 12 of the cold plate of the radiator cold plate 1 by thread; the radiator connector 6 is provided with a connector channel 61, a connector bottom surface 62 and a connector structure 63; the radiator connector 6 is installed back-to-back in the working fluid inlet 54 of the cover plate, the connector bottom surface 62 is connected to the first contact surface 53 on the cover plate by screws, and the connector channel 61 communicates with the working fluid inlet cavity 35 of the diverter plate.

[0097] Please see Figure 11-12 As shown, in one embodiment of this utility model, the first sealing gasket 4 is used for sealing the connection between the radiator cover plate 5 and the flow divider plate 3; the second sealing gasket 7 is placed between the lower wall surface 312 of the flow divider plate 3 and the top surface of the microstructure rib 14 of the cold plate 1, both of which are used to ensure the reliability of the seal.

[0098] Please see Figure 13 As shown, in one embodiment of this utility model, the connecting structure 9 includes a connecting screw 91 and a connecting nut 92. The connecting screw 91 passes through the connecting structure 9 and the chip mounting surface of the heat sink cover 5, and the connection and fixation are achieved by screwing the connecting nut 92 and the connecting screw 91 together.

[0099] Please see Figure 14 As shown, in one embodiment of this utility model, the partition is divided into a multi-segment structure, a sine structure, a cosine structure, a tangent structure, or a cotangent structure.

[0100] In one embodiment of this utility model, when the partition is composed of multiple segments, the partition is divided into three segments: a first partition segment, a second partition segment, and a third partition segment. The first partition segment is denoted as L1, the second partition segment as L2, and the third partition segment as L3. At least one of L1, L2, and L3 is not zero. The included angles formed by any two segments are denoted as α and β, respectively. The distance from the center line of the flow channel to the first partition segment L1 is denoted as W1, the distance from the center line of the flow channel to the third partition segment L3 is denoted as W2, and the wall thickness of the partition is denoted as D.

[0101] In one embodiment of this utility model, when the dimensions of W1 and W2 are always the same, the angles of α and β are both 180 degrees, and the dimension range of L2 is 0 mm, the flow channel shape is rectangular. The rectangular flow channel shape allows the cooling medium to contact the microstructure ribs on the bottom surface of the cold plate more evenly during cooling, resulting in a more uniform temperature distribution of the cold plate.

[0102] In one embodiment of this utility model, when the dimensions of W1 and W2 are different, and the value of W1 is 0 and the value of W2 is greater than 0, when the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is triangular. The triangular flow channel can make the flow rate of the cooling working fluid into the heat exchange chamber more uniform.

[0103] In one embodiment of this utility model, when the dimensions of W1 and W2 are different and neither is 0, and the value of W1 is less than the value of W2, and at the same time the dimensions of L1 are 0mm, the dimensions of L3 are 0mm, and the dimensions of L2 are not 0mm, the shape of the flow channel is trapezoidal. The trapezoidal flow channel can not only make the flow rate of the cooling working fluid into the heat exchange chamber more uniform, but also be more suitable for low flow rate conditions.

[0104] In one embodiment of this utility model, when the dimensions of W1 and W2 are different, and neither of them is 0, and the value of W1 is less than the value of W2, and the dimensions of L1, L2, and L3 are not 0 mm, the shape of the flow channel is convex. The convex flow channel can ensure the uniformity of temperature distribution on the bottom surface of the cold plate, and at the same time, it can adjust the uniformity of the flow rate of the cooling medium.

[0105] In one embodiment of this utility model, when the flow channel structure of the flow divider 3 is a sine or cosine structure, the dimension from the flow channel centerline to the wall centerline is denoted as W3, the wall thickness is D2, the amplitude of the wall centerline of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, and the total length of the flow channel is L. At this time, the flow channel shape is wavy. When the wavy flow channel is used for heat exchange, it can enhance the turbulence effect and improve the local heat exchange capacity.

[0106] In one embodiment of this utility model, when the flow channel structure of the flow divider plate 3 is a tangential or co-tangential structure, the dimension from the center line of the flow channel to the center line of the wall is W4, the thickness of the wall is D3, the amplitude of the center line of the wall of the tangential or co-tangential structure is B, and the total length of the flow channel is L. At this time, the shape of the flow channel is streamlined. The streamlined flow channel is evolved from the convex shape, which can not only make the temperature distribution on the bottom surface of the cold plate more uniform and adjust the flow uniformity of the cooling working fluid flowing into the heat exchange cavity, but also enhance the smoothness of the flow transition.

[0107] In one embodiment of this utility model, the radiator cold plate 1 is welded to the diversion plate 3, and the diversion plate 3 is connected to the radiator cover plate 5 by welding or integral molding, preferably by welding. That is, when the radiator cold plate 1 is connected to the diversion plate 3 by welding, and the diversion plate 3 is connected to the radiator cover plate 5 by welding or integral molding, no sealing gaskets or gaskets are needed between the radiator cold plate 1 and the diversion plate 3, between the diversion plate 3 and the radiator cover plate 5, or between the radiator cover plate 5 and the radiator cold plate 1, nor are threaded holes or snap-fit ​​connection devices needed in corresponding positions.

[0108] Please see Figure 15-18 As shown, in one embodiment of this utility model, the shape of the microstructure rib 14 is selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical, or umbrella-shaped.

[0109] The arrangement of the microstructure ribs 14 can be selected as either straight or staggered, depending on the applicable situation.

[0110] In one embodiment of this utility model, when the microstructure rib 14 has an umbrella-shaped shape, the umbrella-shaped structure is divided into two parts: a head and a root. The head and the root may be the same or different, and are selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, and elliptical frustum.

[0111] When the shape of the microstructure rib 14 is umbrella-shaped, the circumcenters of the horizontal projection contours of the root and head of the umbrella-shaped structure can be coincident or misaligned according to design requirements; the circumradius of the horizontal projection contour of the root is denoted as R1, the circumradius of the horizontal projection contour of the head is denoted as R2, when the root and head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2, the ratio of the circumradius of the root to the circumradius of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0112] Please see Figure 19 As shown, in one embodiment of the present invention, the radiator cold plate 1 is located on one side of the heat dissipation space, that is, the bottom surface 13 of the cold plate is covered with a capillary structure, referred to as the first capillary structure 131; the first capillary structure 131 has one or more layers.

[0113] When the thickness of the first capillary structure 131 is 0, the surface of the heat sink cold plate 1 is a smooth metal surface.

[0114] In one embodiment of this utility model, the microstructure rib 14 is a solid rib covered with capillary structure, referred to as the second capillary structure 141. When the thickness ratio of the second capillary structure 141 is 0%, the microstructure rib 14 is a completely solid rib; when the thickness ratio of the second capillary structure 141 is 100%, the microstructure rib 14 is composed of a completely porous capillary structure.

[0115] In one embodiment of this utility model, the first capillary structure 131 or the second capillary structure 141 is a porous capillary structure.

[0116] The porous capillary structure is constructed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering. The porosity of the porous capillary structure is 10% to 99%, and the thickness at different locations or regions is adjusted according to design requirements.

[0117] In one embodiment of this utility model, the materials of the radiator cold plate 1, the diverter plate 3, the radiator cover plate 5, and the radiator connector 6 are selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic, or glass.

[0118] In one embodiment of this utility model, the first sealing gasket 2 and the second sealing gasket 8 are made of rubber, silicone, fluororubber or plastic, and the first sealing gasket 4 and the second sealing gasket 7 are made of stainless steel, copper, iron, rubber, silicone, fluororubber or plastic.

[0119] In one embodiment of this utility model, the cooling medium of the cooling device is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquid.

[0120] In one embodiment of this invention, a thermally conductive medium is filled between the heat sink 1 and the chip surface. This invention does not limit the type of thermally conductive medium; for example, the thermally conductive medium is thermal grease or liquid metal. When the thermally conductive medium is liquid metal, a protective design is provided around the chip to prevent liquid metal leakage from damaging the motherboard.

[0121] In one embodiment of this utility model, the basic application principle of the high-efficiency chip liquid cooling heat dissipation device of this utility model is as follows: the heat sink is tightened to the chip mounting surface by connecting screws 91 through the connecting structure 9 on the heat sink cover plate 5 to achieve connection and fixation with the chip surface, so that the heat sink is pressed onto the chip surface. The low-temperature cooling medium enters the heat sink through the joint hole 61 of the heat sink connector 6, which is screwed to the working medium outlet 55 of the heat sink cover plate 5, and flows into the working medium inflow cavity 34 of the diversion plate 3. Then, through the working medium inflow channel 35 designed by the diversion plate 3, it makes full contact with the structural ribs 14 provided on the bottom surface 13 of the cold plate to form a heat exchange cavity 15, thereby achieving efficient heat exchange. After the heat exchange is completed, it flows out through the working medium outflow channel 36 designed on the diversion plate 3 and converges into the working medium outflow cavity 37. Finally, it is discharged to the external pipeline through another heat sink connector.

[0122] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A high-efficiency liquid cooling heat dissipation device for chips, characterized in that, It includes a radiator cold plate (1), a flow divider (3), and a radiator cover plate (5). The radiator cold plate (1) and the radiator cover plate (5) together form a heat dissipation space, and the flow divider (3) is located within the heat dissipation space. The radiator cold plate (1) has microstructure ribs (14) on one side within the heat dissipation space to enhance heat exchange; The radiator cover (5) is provided with a pair of working fluid flow ports, which serve as the working fluid inlet (54) and working fluid outlet (55) of the heat dissipation device, respectively. The flow divider (3) has a groove on the side near the radiator cold plate (1), the flow divider (3) abuts against the radiator cold plate (1), and the space formed by the groove and the radiator cold plate (1) constitutes a heat exchange chamber (15). The bottom of the groove is hollow. On the other side of the flow divider (3), there are working fluid inflow chamber (34) and working fluid outflow chamber (37) at opposite ends of the hollow bottom. On the other side of the flow divider (3), there are also multiple partitions connected end to end on the hollow bottom. Two adjacent partitions or the first and last partitions and the groove wall close to them form a flow channel. The flow channel opening to the working fluid inflow chamber (34) is called the working fluid inflow channel (35) and is connected to the working fluid inflow chamber (34). The flow channel opening to the working fluid outflow chamber (37) is called the working fluid outflow channel (36) and is connected to the working fluid outflow chamber (37). The working fluid flows into the working fluid inlet (54) into the working fluid inlet cavity (34), then flows into the heat exchange cavity (15) through the opening into the working fluid inlet cavity (34), then flows into the opening into the working fluid outlet cavity (37) from the heat exchange cavity (15), then gathers into the working fluid outlet cavity (37), and then flows out from the working fluid outlet cavity, forming a heat exchange loop.

2. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that, The side of the radiator cold plate (1) located within the heat dissipation space, i.e., the bottom surface (13) of the cold plate is covered with a first capillary structure (131); the first capillary structure (131) has one or more layers; When the thickness of the first capillary structure (131) is 0, the surface of the bottom surface (13) of the radiator cold plate (1) is a smooth metal surface.

3. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that, The microstructure rib (14) is a solid rib covered with a second capillary structure (141). When the thickness of the second capillary structure (141) is 0%, the microstructure rib (14) is a completely solid rib. When the thickness of the second capillary structure (141) is 100%, the microstructure rib (14) is composed of a completely porous capillary structure.

4. A high-efficiency chip liquid cooling heat dissipation device according to claim 2 or 3, characterized in that, The first capillary structure (131) or the second capillary structure (141) is a porous capillary structure; The porous capillary structure is formed by sintering metal powder, sintering metal wire, or sintering a mixture of metal powder and metal wire, and the porosity of the porous capillary structure is 10% to 99%.

5. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that, The shape of the microstructure rib (14) is selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical or umbrella-shaped. The microstructure ribs (14) are arranged in a straight line or staggered pattern.

6. The high-efficiency chip liquid cooling heat dissipation device according to claim 5, characterized in that, When the shape of the microstructure rib (14) is umbrella-shaped, the umbrella structure is divided into two parts: a head and a root. The head and the root may be the same or different, and both are selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, and elliptical frustum. When the shape of the microstructure rib (14) is umbrella-shaped, the circumcenter of the horizontal projection profile of the root of the umbrella structure coincides with or is misaligned with the circumcenter of the horizontal projection profile of the head; the circumcenter radius of the horizontal projection profile of the root is denoted as R1, the circumcenter radius of the horizontal projection profile of the head is denoted as R2, when the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2, and the ratio of the circumcenter radius of the root to the circumcenter radius of the head is 0.1 to 10.

7. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that, The partition is divided into multi-segment structure, sine structure, cosine structure, tangent structure or cotangent structure; When the partition is composed of multiple segments, the partition is divided into three segments: the first partition segment, the second partition segment, and the third partition segment. The first partition segment is denoted as L1, the second partition segment as L2, and the third partition segment as L3. At least one of L1, L2, and L3 is not zero. The included angles formed by any two segments are denoted as α and β, respectively. The distance from the center line of the flow channel to the first partition segment (L1) is denoted as W1, the distance from the center line of the flow channel to the third partition segment (L3) is denoted as W2, and the wall thickness of the partition is denoted as D. When the dimensions of W1 and W2 remain the same, the angles of α and β are both 180 degrees, and the dimension of L2 is 0 mm, the flow channel shape is rectangular. When the dimensions of W1 and W2 are different, and the value of W1 is 0 and the value of W2 is greater than 0, when the angles of α and β are both 180 degrees, and the dimension range of L2 is 0 mm, the flow channel shape is triangular. When the dimensions of W1 and W2 are different and neither is 0, and the value of W1 is less than the value of W2, and the dimensions of L1 and L3 are both 0 mm, and the dimension of L2 is not 0 mm, the shape of the flow channel is trapezoidal. When W1 and W2 have different dimensions, neither of them is 0, and the value of W1 is less than the value of W2, and the dimensions of L1, L2, and L3 are not 0 mm, the shape of the flow channel is convex. When the flow channel structure of the flow divider (3) is a sine or cosine structure, the dimension from the flow channel centerline to the wall centerline is denoted as W3, the wall thickness is denoted as D2, the amplitude of the wall centerline of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, the total length of the flow channel is L, and the flow channel shape is wavy. When the flow channel structure of the flow divider (3) is a tangential or co-tangential structure, the dimension from the flow channel centerline to the wall centerline is W4, the wall thickness is D3, the amplitude of the wall centerline of the tangential or co-tangential structure is B, the total length of the flow channel is L, and the shape of the flow channel is streamlined.

8. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that, The radiator cold plate (1) is welded to the flow divider plate (3), and the flow divider plate (3) is connected to the radiator cover plate (5) by welding or integral molding, preferably by welding.

9. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that, When the radiator cold plate (1), the diversion plate (3) and the radiator cover plate (5) are connected by means of threaded connection, snap fastening or riveting, a first sealing gasket (2) is installed between the radiator cold plate (1) and the diversion plate (3). A second sealing gasket (7) is installed between the partition of the diversion plate (3) and the microstructure rib (14) to adjust the assembly gap; A first sealing gasket (4) is installed between the flow divider (3) and the radiator cover (5); A second sealing gasket (8) is installed between the radiator cold plate (1) and the radiator cover plate (5) to ensure the sealing of the connection.

10. The high-efficiency chip liquid cooling heat dissipation device according to claim 1, characterized in that, The heat sink cover (5) is provided with a connecting structure (9), which includes a connecting screw (91) and a connecting nut (92). The connecting screw (91) passes through the connecting structure (9) and the mounting surface of the chip. By tightening the connecting nut (92), the bottom surface of the entire heat sink is in close contact with the heat-generating surface of the chip. The device also includes a pair of radiator connectors (6), which are respectively located on a pair of working fluid flow ports.

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