A low-orbit satellite phased array antenna thermal control device

Abstract

This invention provides a thermal control device for a low-Earth orbit satellite phased array antenna, relating to the field of spacecraft thermal control technology. It primarily employs a heat-collecting cold plate, a heat spreader, an antenna heat dissipation chamber, and a compensating heating circuit to achieve heat dissipation and temperature control. The heat-collecting cold plate is integrated into the phased array antenna's radio frequency channel using an electromechanical-thermal integrated design. One end of the heat spreader is connected to the power module at the bottom of the antenna, while the other end is thermally conductively mounted on the heat-collecting cold plate. The heat-collecting cold plate is connected to the antenna heat dissipation chamber on all four sides, and the heat collected is dissipated into the cold air environment through the heat dissipation surface of the antenna chamber. The compensating heating circuit, located inside the antenna heat dissipation chamber, maintains its temperature through an autonomous closed-loop mode. The beneficial effects of this invention are: the heat-collecting cold plate, the heat spreader, and the antenna heat dissipation chamber construct an efficient heat dissipation channel for the antenna's distributed heat source; the compensating heating circuit achieves the goal of low-temperature storage when the antenna is powered off; and the entire thermal control device ensures precise temperature control of the phased array antenna in the complex thermal environment of orbit.

Description

Technical Field

[0001] This invention relates to a thermal control device adapted to phased array antennas for low-Earth orbit satellites, belonging to the field of spacecraft thermal control technology. Background Technology

[0002] Spaceborne phased array antennas are crucial payload products for low-Earth orbit communication satellites, offering advantages such as beam agility switching and adaptive nulling for interference suppression. A phased array antenna typically comprises a radio frequency (RF) channel, a network module, a beam control module, and a power module. The RF channel contains numerous power devices, resulting in highly concentrated heat. As spaceborne phased arrays evolve towards higher power, higher integration, lighter weight, and stronger environmental adaptability, the high-density integration of antenna components continuously increases internal heat flux. Therefore, employing appropriate spaceborne active phased array thermal control technologies is essential to ensure on-orbit antenna performance.

[0003] Low-Earth orbit (LEO) satellite phased arrays face a complex external space heat flow environment during operation, including solar radiation, Earth's infrared radiation, and albedo. Furthermore, the satellite platform and other extravehicular equipment also have complex infrared radiation coupling relationships with the phased array antenna. The core of phased array thermal control design is to construct a rational and efficient heat dissipation channel to effectively dissipate internal heat sources during antenna operation and minimize the absorption of external space heat flow. When the antenna is powered off, a low-temperature compensation heating circuit is used for insulation, ultimately ensuring that the antenna component temperature meets requirements.

[0004] Patent document CN112670696B discloses a phased array antenna cold plate, which dissipates heat from the antenna by forced convection heat transfer through the liquid working medium inside the cold plate, achieving temperature control of a highly integrated phased array antenna under the constraint of a small space. However, this active cooling system is large in size, complex, and has low reliability of moving parts, making it difficult to meet the requirements of satellite miniaturization, lightweighting, and high reliability.

[0005] Patent document CN114094304A discloses a heat dissipation structure for a phased array antenna. This structure utilizes a component frame to conduct internal heat to an external heat pipe, which then dissipates the heat to a cold space and the satellite's heat dissipation surface via its condensation section. The satellite's heat dissipation surface is then further utilized for heat dissipation. However, in this heat dissipation structure, the heat from the T / R component chip must first pass through the casing, component frame, and external heat pipe before reaching the heat dissipation surface. This increases the heat transfer path length and reduces efficiency. Furthermore, the antenna's heat dissipation heavily relies on the satellite platform's heat dissipation surface, increasing the complexity and coupling of the satellite assembly and limiting the antenna product's adaptability and versatility. Summary of the Invention

[0006] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide a thermal control device for a low-orbit satellite phased array antenna. The antenna internally uses miniaturized heat collection cold plates and heat dissipation plates to collect and transfer heat from the heat-generating module. An antenna heat dissipation chamber independent of the satellite platform is used to dissipate heat from both the transmitting and receiving phased array antennas, ultimately achieving the integration and universality of the thermal control components.

[0007] The technical solution adopted in this invention is:

[0008] A thermal control device for a low-orbit satellite phased array antenna includes: a transmitting phased array antenna, a receiving phased array antenna, and an antenna heat dissipation chamber, used for temperature control of the transmitting and receiving phased array antennas;

[0009] The transmitting phased array antenna is connected to the antenna heat dissipation chamber through the first internal heat collection plate, and the receiving phased array antenna is installed on the inner surface of the antenna heat dissipation chamber through the second heat collection plate; the antenna heat dissipation chamber simultaneously dissipates the heat generated inside the two phased array antennas to the outside space.

[0010] Furthermore, the transmitting phased array antenna is a stacked low-profile tile structure, including: a transmitting radio frequency channel, a first heat collection cold plate, a transmitting network module, a transmitting beam control module, a transmitting power supply module, and a first heat dissipation plate;

[0011] The transmitting radio frequency channel is installed at the protrusion position in the center area of ​​the first heat collector cold plate. The heat of the chip inside is transferred vertically to the first heat collector cold plate along the thickness direction of the transmitting radio frequency channel. The transmitting network module and the transmitting wave control module are arranged below the first heat collector cold plate in sequence, and the internal heat is conducted to the first heat collector cold plate through the metal shell.

[0012] The transmitting power module is located below the transmitting wave control module. First heat spreaders are installed on both sides of the outer shell of the transmitting power module and are connected to the lower surface of the first heat collector plate.

[0013] Furthermore, the receiving phased array antenna includes: a receiving radio frequency channel, a second heat collection cooling plate, a receiving network module, a receiving beam control module, a receiving power supply module, and a second heat dissipation plate;

[0014] The receiving RF channel and receiving network module are respectively installed above and below the second heat-collecting cold plate for heat dissipation. The receiving beam control module is located below the receiving network module, and the receiving power supply module is located below the receiving beam control module. One end of the second heat-collecting plate is connected to the side of the receiving power supply module, and the other end is connected to the lower surface of the second heat-collecting cold plate.

[0015] Furthermore, the connection surfaces between the first heat-collecting cold plate and the transmitting radio frequency channel, between the first heat-collecting cold plate and the transmitting network module, between the second heat-collecting cold plate and the receiving radio frequency channel, and between the second heat-collecting cold plate and the receiving network module are all coated with thermally conductive filler.

[0016] Furthermore, the first heat spreader has a steam chamber structure inside, and the evaporation section connected to the power supply module absorbs heat and transports the heat to the condensation area near the first heat collector cold plate through the internal working fluid, forming a heat conduction bridge; the second heat spreader has the same structure as the first heat spreader; all connecting surfaces of the first and second heat spreaders are coated with thermally conductive filler.

[0017] Furthermore, the first and second heat-collecting cold plates have the same structure, both including multiple array heat pipes. The central areas of both the first and second heat-collecting cold plates are machined with several rectangular or circular through holes for electrical and mechanical vertical interconnection of the antenna components. Both the first and second heat-collecting cold plates collect heat and diffuse it to the surrounding area through the internal array heat pipes to achieve heat exchange with the antenna heat dissipation chamber.

[0018] Furthermore, the antenna heat dissipation chamber is a cuboid structure composed of a first heat dissipation plate, a second heat dissipation plate, a third heat dissipation plate, a first structural plate, and a second structural plate.

[0019] Two openings are provided on the first heat sink to expose the electromagnetic wave radiating ends of the transmitting phased array antenna and the receiving phased array antenna, so as to realize antenna communication;

[0020] Heat pipes are embedded inside the first, second, and third heat dissipation plates to rapidly diffuse the heat collected and transferred by the first and second heat collection plates to all areas of the heat dissipation surface, thereby improving the radiation efficiency of the heat dissipation surface to the cold air.

[0021] The first heat pipes, which are embedded inside the first heat sink, turn out from both sides and are externally connected to the inner surfaces of the second and third heat sinks. The projections of the first heat pipe, the second heat pipe, and the third heat pipe on the heat sink are all orthogonal, forming a heat pipe coupling network.

[0022] The first heat sink, the second heat sink, and the third heat sink form a three-dimensional combined heat dissipation surface through a heat pipe coupling network;

[0023] The fourth heat pipe is installed on the inner surface of the first heat sink and is orthogonal to the first heat pipe, which flattens the temperature difference between the first heat pipes and improves the temperature uniformity of the heat sink.

[0024] Furthermore, thermally conductive fillers are coated between the contact surfaces of the first and second heat-collecting cold plates and the first heat dissipation plate to reduce contact thermal resistance; the first, second, and third heat dissipation plates are all made of 0.5mm thick aluminum skin aluminum honeycomb composite material, and the embedded heat pipes are 12mm high aluminum ammonia axial channel heat pipes.

[0025] Furthermore, the outer surfaces of the first heat sink, the second heat sink, and the third heat sink are coated with thermal control white paint; the outer surfaces of the first structural plate and the second structural plate are covered with a multi-layer heat insulation assembly with multiple units; the outer surface of the multi-layer heat insulation assembly uses a conductive aluminum-siloxane composite film.

[0026] The inner surfaces of the first heat sink, the second heat sink, the third heat sink, the first structural plate, and the second structural plate are all coated with thermal control black paint.

[0027] The outer surface of the portion below the heat-collecting cold plate in the transmitting phased array antenna and the receiving phased array antenna is coated with high thermal control black paint.

[0028] Furthermore, the thermal control device of the present invention also includes a compensation heating circuit, which is a closed-loop circuit consisting of a heater and a temperature sensor attached to the inner surface of the antenna heat dissipation chamber, and performs heat preservation through an autonomous closed-loop mode.

[0029] The beneficial effects of this invention compared to the prior art are:

[0030] (1) The miniaturized heat collection cold plate provided by the present invention solves the problem of direct heat dissipation in the narrow space between the phased array antenna RF channel and the network module, greatly shortens the heat transfer path, reduces thermal resistance, and improves heat dissipation efficiency. The heat pipe array inside the heat collection cold plate greatly improves the temperature consistency between different RF channels, ensuring the electromagnetic radiation performance of the antenna on track.

[0031] (2) This invention integrates the heat dissipation requirements of the transmitting and receiving phased arrays by designing an integrated antenna heat dissipation chamber, which can make full use of the heat capacity of different antennas to reduce the temperature rise of high-power antennas under short-term operating conditions. In addition, the antenna heat dissipation chamber is heat-insulated from the satellite platform and independently completes the heat dissipation of the transmitting and receiving phased array antennas. It can be decoupled in terms of satellite assembly and testing, realizing the requirements of integrated and universal thermal control components.

[0032] (3) In this invention, the heat dissipation plate of the antenna heat dissipation chamber adopts a three-dimensional combined heat dissipation surface composed of semi-embedded heat pipes and external attachment, which minimizes the impact of seasonal changes in external heat flow in different directions. The compensation heating circuit in the antenna heat dissipation chamber simultaneously meets the storage temperature requirements when the transmitting phased array and the receiving phased array are not working.

[0033] (4) The heat collection cold plate of the present invention adopts an electromechanical-thermal integrated design and is integrated below the antenna radio frequency channel; one end of the heat dissipation plate is connected to the power module at the bottom of the antenna, and the other end is heat-conductingly installed on the heat collection cold plate; the heat collection cold plate is connected to the antenna heat dissipation chamber around its perimeter, and the heat collected therefrom is dissipated to the cold air environment through the heat dissipation surface of the antenna chamber; the compensation heating circuit arranged inside the antenna heat dissipation chamber is used for heat preservation in low temperature environment through autonomous closed-loop mode.

[0034] (5) The heat collection cold plate of the present invention includes multiple array heat pipes to ensure that the temperature level and consistency of the radio frequency channel meet the requirements.

[0035] (6) The heat spreader of the present invention has an L-shaped three-dimensional structure, with one end connected to the antenna power module and the other end connected to the heat collection cold plate, which serves as a heat conduction bridge.

[0036] (7) The outer surface of the portion below the heat-collecting cold plate in the phased array antenna of the present invention is coated with a high-emissivity thermal control black paint. The outer surface of all heat dissipation plates in the antenna heat dissipation compartment is coated with a thermal control white paint. The outer surface of all structural compartment plates in the antenna heat dissipation compartment is covered with a multi-layer heat insulation assembly of 10 units. The inner surface of the antenna heat dissipation compartment is coated with a high-emissivity thermal control black paint to enhance radiative heat transfer and achieve temperature uniformity. Attached Figure Description

[0037] Figure 1 This is an overall diagram of a low-orbit satellite phased array antenna thermal control device according to the present invention;

[0038] Figure 2 This is a schematic diagram of the exploded structure of a phased array antenna for low-orbit satellite launch according to the present invention.

[0039] Figure 3 This is a schematic diagram of a heat collection cold plate structure for a low-orbit satellite launch phased array antenna according to the present invention;

[0040] Figure 4 This is a schematic diagram of the exploded structure of a low-orbit satellite receiving phased array antenna according to the present invention.

[0041] Figure 5 This is a schematic diagram of a heat collection cold plate structure for a low-orbit satellite receiving phased array antenna according to the present invention;

[0042] Figure 6 This is an exploded view of the heat dissipation chamber of a low-orbit satellite phased array antenna according to the present invention.

[0043] In the picture:

[0044] 100 - Transmitting phased array antenna;

[0045] 101-Transmit RF channel; 102-First heat sink; 103-Transmit network module; 104-Transmit beam control module; 105-Transmit power supply module; 106-First heat sink;

[0046] 200 - Receiver phased array antenna;

[0047] 201 - Receiver RF channel; 202 - Second heat sink cooling plate; 203 - Receiver network module; 204 - Receiver beam control module; 205 - Receiver power supply module; 206 - Second heat sink;

[0048] 300-antenna heat dissipation compartment;

[0049] 301 - First heat sink; 302 - Second heat sink; 303 - Third heat sink; 304 - First structural plate; 305 - Second structural plate; 3011 - First heat pipe; 3021 - Second heat pipe; 3031 - Third heat pipe; 3012 - Fourth heat pipe;

[0050] 400-Compensation heating circuit. Detailed Implementation

[0051] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0052] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for ease of description, not to indicate or imply that the entities referred to must have a specific orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first" and "second" are merely used to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between these entities.

[0053] The following examples will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and modifications without departing from the concept of the present invention. These all fall within the scope of protection of the present invention.

[0054] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0055] like Figure 1 As shown, this example provides a thermal control device for a low-orbit satellite phased array antenna, used for temperature control of the transmitting phased array antenna 100 and the receiving phased array antenna 200. The transmitting phased array antenna 100 is connected to the antenna heat dissipation chamber 300 through an internal first heat-collecting cold plate 102, and the receiving phased array antenna 200 is mounted on the inner surface of the antenna heat dissipation chamber through a second heat-collecting cold plate 202; the antenna heat dissipation chamber 300 simultaneously dissipates the heat generated inside the two phased array antennas to the external space.

[0056] like Figure 2 As shown, the transmit phased array antenna 100 has a stacked low-profile tile structure, including: a transmit radio frequency channel 101, a first heat collection cold plate 102, a transmit network module 103, a transmit beam control module 104, a transmit power supply module 105, and a first heat dissipation plate 106.

[0057] The transmit RF channel 101 is mounted on a protrusion in the central region of the first heat-collecting plate 102. Heat from the chip inside is transferred vertically along the thickness of the channel to the first heat-collecting plate, resulting in a very short heat dissipation path. The transmit network module 103 is located on the lower surface of the first heat-collecting plate 102 and can conduct internal heat to the first heat-collecting plate through its metal casing. Thermally conductive fillers are used at the connection surfaces between the first heat-collecting plate and the antenna module.

[0058] The transmitting power module 105 generates a significant amount of heat. Three-dimensional "L"-shaped first heat spreaders 106 are installed on both sides of the outer casing, with one end of each heat spreader 106 connected to the lower surface of the first heat collector 102. The first heat spreader 106 is 5mm thick and has an internal vapor chamber structure. The evaporation section, connected to the transmitting power module, absorbs heat and transfers it to the condensation zone near the first heat collector through the internal working fluid, forming an efficient heat conduction bridge. All connection surfaces of the first heat spreader use thermally conductive fillers.

[0059] like Figure 3 As shown, the first heat-collecting cold plate 102 is 5mm thick and is composed of four porous heat pipe parts welded together by friction stir welding. The number and spacing of the array heat pipes are determined in conjunction with the internal electromechanical interfaces and heat dissipation of the antenna. Several rectangular or circular through holes are machined in the central area of ​​the first heat-collecting cold plate for the electrical and mechanical vertical interconnection of the antenna components. The first heat-collecting cold plate collects heat from the antenna module and diffuses it to the surrounding area through the internal array heat pipes to achieve heat exchange with the antenna heat dissipation chamber.

[0060] like Figure 4 and Figure 5 As shown, the receiving phased array antenna 200 draws on the structure and thermal control design of the transmitting phased array antenna 100, including: a receiving radio frequency channel 201, a second heat collection cooling plate 202, a receiving network module 203, a receiving beam control module 204, a receiving power supply module 205, and a second heat dissipation plate 206.

[0061] Specifically, the receiving RF channel 201 and the receiving network module 203 are directly mounted on the second heat-collecting cold plate for heat dissipation. One end of the second heat-collecting plate 206 is connected to the side of the receiving power module 205, and the other end is connected to the lower surface of the second heat-collecting cold plate 202. The second heat-collecting plate also adopts a vapor chamber structure, which reduces the thermal conductivity and contact thermal resistance of the receiving power module, and improves the heat dissipation efficiency. All connection surfaces between the second heat-collecting cold plate and the antenna module use thermally conductive filler.

[0062] Specifically, the second heat-collecting cooling plate 202 is 5mm thick and is formed by welding two porous heat pipe components together using friction stir welding. The central area of ​​the second heat-collecting cooling plate contains multiple electrical and mechanical interfaces. The second heat-collecting cooling plate collects heat from the antenna module and transfers it to the surrounding area for heat exchange with the antenna heat dissipation chamber.

[0063] like Figure 5 As shown, the antenna heat dissipation chamber 300 is composed of a first heat dissipation plate 301, a second heat dissipation plate 302 and a third heat dissipation plate 303, a first structural plate 304 and a second structural plate 305 forming a cuboid structure. Its size is determined by the phased array antenna field of view layout analysis and the required heat dissipation area.

[0064] Specifically, the antenna heat dissipation compartment has two openings on the first heat dissipation plate 301 to expose the electromagnetic wave radiation arrays of the transmitting phased array antenna and the receiving phased array antenna, thus meeting the requirements of antenna communication.

[0065] The antenna heat dissipation chamber 300 also includes a first heat pipe 3011, a second heat pipe 3021, a third heat pipe 3031 embedded inside the heat dissipation plate, and a fourth heat pipe 3012 attached to the inner surface of the heat dissipation plate. The projections of the first heat pipe 3011, the second heat pipe 3021, and the third heat pipe 3031 on the heat dissipation plate are respectively arranged to cross each other.

[0066] Specifically, the first heat-collecting plate 102 and the second heat-collecting plate 202 are coated with thermally conductive fillers between their contact surfaces with the first heat-dissipating plate 301 to reduce contact thermal resistance. Heat pipes are pre-embedded inside the first heat-dissipating plate 301, the second heat-dissipating plate 302, and the third heat-dissipating plate 303 to rapidly diffuse the heat collected and transferred by the first and second heat-collecting plates to all areas of the heat dissipation surface, improving the radiation efficiency of the heat dissipation surface towards the cold air. In this embodiment, the heat dissipation plate uses a 0.5mm thick aluminum-skinned aluminum honeycomb composite material. The heat pipes are 12mm high aluminum-ammonia axial channel heat pipes.

[0067] like Figure 6 As shown, specifically, the first heat pipe 3011, pre-embedded inside the first heat sink 301, extends from both sides and is externally connected to the inner surfaces of the second heat sink 302 and the third heat sink 303. The projections of the first heat pipe 3011, the second heat pipe 3021, and the third heat pipe 3031 onto the heat sink are orthogonal, forming a heat pipe coupling network. The first heat sink 301, the second heat sink 302, and the third heat sink 303 form a three-dimensional combined heat dissipation surface through the heat pipe coupling network, reducing the impact of seasonal variations in external heat flow in different directions and improving heat dissipation efficiency. The fourth heat pipe 3012 is installed on the inner surface of the first heat sink 301 by screws or clamps and is orthogonal to the first heat pipe 3011, leveling the temperature difference between the first heat pipes 3011 and improving the temperature uniformity of the heat sink.

[0068] Specifically, the inner surface of the first heat dissipation plate 301 of the antenna heat dissipation chamber 300 is also provided with a compensation heating circuit 400. The compensation heating circuit 400 includes a heater and a temperature sensor to form a closed loop, and performs heat preservation through an autonomous closed loop mode.

[0069] Specifically, the outer surfaces of the first heat sink 301, the second heat sink 302, and the third heat sink 303 are coated with thermal control white paint. In this embodiment, the thermal control white paint is of model KS-1 or KS-ZT.

[0070] Specifically, the outer surfaces of the first structural plate 304 and the second structural plate 305 are covered with a multi-layer thermal insulation assembly consisting of 10 units. In this embodiment, the outer surface of the multi-layer thermal insulation assembly uses a conductive aluminum-siloxane composite film, which can minimize the infrared radiation coupling effect of the satellite platform and achieve space atomic oxygen protection in the low-Earth orbit environment.

[0071] Specifically, the inner surfaces of the heat dissipation plate and structural plate of the antenna heat dissipation chamber, as well as the outer surface of the phased array antenna, are coated with a high-emissivity thermal control black paint to enhance radiative heat transfer within the chamber and achieve temperature uniformity. In this embodiment, the thermal control black paint is of model E51-M or HA95.

[0072] In this invention, the heat collection cold plate, the heat dissipation plate and the antenna heat dissipation chamber form an efficient heat dissipation channel for the distributed heat source of the antenna. The compensation heating circuit realizes the low temperature storage target when the antenna is powered off. The whole thermal control device ensures the precise temperature control of the phased array antenna in the complex thermal environment on track.

[0073] In summary, the above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A thermal control device for a low-orbit satellite phased array antenna, characterized in that: include: The transmitting phased array antenna (100), the receiving phased array antenna (200), and the antenna heat dissipation chamber (300) independent of the satellite platform are used to control the temperature of the transmitting phased array antenna and the receiving phased array antenna. The transmitting phased array antenna is a stacked low-profile tile structure, including: a transmitting radio frequency channel (101), a first heat collection cold plate (102), a transmitting network module (103), a transmitting beam control module (104), a transmitting power supply module (105), and a first heat dissipation plate (106); the transmitting radio frequency channel is installed at the protrusion position in the central area of ​​the first heat collection cold plate, and the heat of the chip inside is vertically transferred to the first heat collection cold plate along the thickness direction of the transmitting radio frequency channel; the transmitting network module and the transmitting beam control module are arranged below the first heat collection cold plate in sequence, and the internal heat is conducted to the first heat collection cold plate through the metal shell; the transmitting power supply module is set below the transmitting beam control module, and the first heat dissipation plate with an L-shaped three-dimensional structure is installed on both sides of the shell of the transmitting power supply module, one end of the first heat dissipation plate is connected to the transmitting power supply module, and the other end is connected to the first heat collection cold plate; The transmitting phased array antenna is connected to the antenna heat dissipation chamber through the first internal heat collection plate, and the receiving phased array antenna is mounted on the inner surface of the antenna heat dissipation chamber through the second heat collection plate. The first and second heat collection plates have the same structure, both including multiple array heat pipes. The first and second heat collection plates collect heat and diffuse it to the surrounding area through the internal array heat pipes to achieve heat exchange with the antenna heat dissipation chamber. At the same time, the antenna heat dissipation chamber dissipates the heat generated inside the two phased array antennas to the outside space. A compensation heating circuit is provided between the transmitting phased array antenna and the receiving phased array antenna. The compensation heating circuit maintains the temperature in a low-temperature environment through an autonomous closed-loop mode. The antenna heat dissipation chamber (300) includes a first heat dissipation plate (301), a second heat dissipation plate (302), and a third heat dissipation plate (303), all of which have heat pipes embedded inside. The first heat pipe (3011) embedded inside the first heat dissipation plate turns out from both sides and is externally connected to the inner surfaces of the second and third heat dissipation plates. The projections of the first heat pipe (3011) and the second heat pipe (3021), as well as the first heat pipe (3011) and the third heat pipe (3031) on the heat dissipation plates are all orthogonal, forming a heat pipe coupling network. The first heat dissipation plate, the second heat dissipation plate, and the third heat dissipation plate form a three-dimensional combined heat dissipation surface through the heat pipe coupling network. The fourth heat pipe (3012) is installed on the inner surface of the first heat sink and is orthogonal to the first heat pipe (3011); The outer surfaces of the parts below the heat collection cold plate in the transmitting phased array antenna and the receiving phased array antenna are coated with high emissivity thermal control black paint, and the outer surfaces of all heat dissipation plates in the antenna heat dissipation chamber are coated with thermal control white paint.

2. The thermal control device for a low-orbit satellite phased array antenna according to claim 1, characterized in that: The receiving phased array antenna (200) includes: a receiving radio frequency channel (201), a second heat collection cooling plate (202), a receiving network module (203), a receiving beam control module (204), a receiving power supply module (205), and a second heat dissipation plate (206). The receiving radio frequency channel (201) and the receiving network module (203) are respectively installed on the upper and lower sides of the second heat collection cooling plate (202) for heat dissipation. The receiving wave control module (204) is located below the receiving network module (203), and the receiving power supply module (205) is located below the receiving wave control module (204). One end of the second heat dissipation plate (206) is connected to the side of the receiving power supply module (205), and the other end is connected to the lower surface of the second heat collection cooling plate (202).

3. The thermal control device for a low-orbit satellite phased array antenna according to claim 2, characterized in that: The connection surfaces between the first heat-collecting cold plate (102) and the transmitting radio frequency channel (101), between the first heat-collecting cold plate (102) and the transmitting network module (103), between the second heat-collecting cold plate (202) and the receiving radio frequency channel (201), and between the second heat-collecting cold plate (202) and the receiving network module (203) are all coated with thermally conductive filler.

4. The thermal control device for a low-orbit satellite phased array antenna according to claim 2, characterized in that: The first heat spreader (106) has a steam chamber structure inside. The evaporation section connected to the power supply module (105) absorbs heat and transports the heat to the condensation area near the first heat collector cold plate (102) through the internal working fluid, forming a heat conduction bridge. The second heat spreader (206) has the same structure as the first heat spreader (106). All connecting surfaces of the first heat spreader (106) and the second heat spreader (206) are coated with thermally conductive filler.

5. The thermal control device for a low-orbit satellite phased array antenna according to claim 2, characterized in that: Both the first and second heat-cooling plates (102) have several rectangular or circular vias machined in their central areas for electrical and mechanical vertical interconnection of the antenna components.

6. The thermal control device for a low-orbit satellite phased array antenna according to claim 2, characterized in that: The antenna heat dissipation chamber (300) also includes a first structural plate (304) and a second structural plate (305), and the first heat dissipation plate (301), the second heat dissipation plate (302), the third heat dissipation plate (303), the first structural plate (304) and the second structural plate (305) together form a cuboid structure. Two openings are provided on the first heat sink (301) to expose the electromagnetic wave radiation array of the transmitting phased array antenna and the receiving phased array antenna, so as to realize antenna communication.

7. A thermal control device for a low-orbit satellite phased array antenna according to claim 6, characterized in that: The first heat-collecting cold plate (102) and the second heat-collecting cold plate (202) are coated with thermally conductive filler between their contact surfaces with the first heat-dissipating plate (301) to reduce contact thermal resistance; the first heat-dissipating plate (301), the second heat-dissipating plate (302) and the third heat-dissipating plate (303) are all made of 0.5mm thick aluminum skin aluminum honeycomb composite material, and the embedded heat pipe is a 12mm high aluminum ammonia axial channel heat pipe.

8. A thermal control device for a low-orbit satellite phased array antenna according to claim 6, characterized in that: The outer surfaces of the first heat sink (301), the second heat sink (302) and the third heat sink (303) are coated with thermal control white paint; the outer surfaces of the first structural plate (304) and the second structural plate (305) are covered with a multi-layer heat insulation component with multiple units; the outer surface of the multi-layer heat insulation component uses a conductive aluminum siloxane composite film. The inner surfaces of the first heat sink (301), the second heat sink (302), the third heat sink (303), the first structural plate (304), and the second structural plate (305) are all coated with thermal control black paint.

9. A thermal control device for a low-orbit satellite phased array antenna according to any one of claims 1-8, characterized in that: The compensation heating circuit (400) is a closed-loop circuit consisting of a heater and a temperature sensor attached to the inner surface of the antenna heat dissipation chamber (300).

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