A phased array antenna heat dissipation device

Abstract

The utility model belongs to antenna technical field especially is a kind of phased array antenna heat abstractor, including the cold plate that is attached and installed on TR component and with multiple refrigerant flow passages in its inside, cold plate input is connected with refrigerant supply component through input pipe, and cold plate output forms closed loop circuit with refrigerant supply component through output pipe, it further includes controller and the first temperature measuring portion installed on TR component, output pipe is equipped with heat abstractor and second temperature measuring portion, and controller is based on TR component surface temperature and refrigerant temperature after heat dissipation, adjusts the operating state of refrigerant supply component, the utility model can carry out heat dissipation before refrigerant backflow to refrigerant supply component, reduce the operating power of refrigerant supply component, improve the heat dissipation efficiency of TR component;According to the temperature of TR component surface and the temperature of refrigerant after heat dissipation monitored by first temperature measuring portion to dynamically adjust refrigerant supply component operation, balance TR component temperature and refrigerant heat dissipation capacity, solve the energy waste or heat dissipation deficiency problem caused by traditional fixed power heat dissipation.

Description

Technical Field

[0001] This utility model belongs to the field of antenna technology, specifically relating to a heat dissipation device for a phased array antenna. Background Technology

[0002] As a core component of modern radar, communication, and electronic reconnaissance systems, phased array antennas achieve rapid target localization and tracking through electronically controlled beam scanning. Their performance directly determines the system's efficiency and reliability. With the iterative upgrades of phased array antenna technology, the design trend towards high integration and high power density has led to a dramatic increase in the heat generation of the TR (transmit / receive) modules, becoming a key bottleneck restricting the stable operation of the system. For example, in military phased array radars, the heat flux density of a single-channel TR module can reach tens to hundreds of watts per square centimeter. If the heat cannot be dissipated in time, it will lead to semiconductor material performance degradation, signal distortion, and even hardware damage, seriously threatening mission execution capabilities. Currently, heat dissipation solutions for phased array antennas mainly include the following technical approaches:

[0003] Air cooling: Forced convection through a combination of fan and heat sink fins has advantages such as low cost and simple structure, but it has drawbacks such as low heat dissipation efficiency (the thermal conductivity of air is only 0.026 W / (m·K)), high noise, and difficulty in adapting to high heat flux density scenarios.

[0004] Single-phase liquid cooling systems remove heat by directly contacting the heat source with the coolant, and their thermal conductivity (e.g., water's thermal conductivity is approximately 0.6 W / (m·K)) is significantly better than air. However, existing technologies have the following shortcomings:

[0005] 1. High heat dissipation consumption: When the refrigerant enters from the cold plate inlet and flows through each refrigerant channel to dissipate heat from the TR component and then flows out from the cold plate outlet, it flows directly back to the refrigerant cooling equipment through the outlet pipe to cool the refrigerant and reduce its temperature to the target temperature. Because the refrigerant temperature output from the cold plate outlet is relatively high, if it flows directly to the cooling equipment for cooling, it increases the operating power of the cooling equipment.

[0006] 2. Inefficient control strategy: Traditional liquid cooling systems rely on fixed pump speeds, with the energy consumption of the circulating pump and heat exchanger accounting for 20%-30% of the total system power consumption. Moreover, they still run at full speed under low load conditions, making it difficult to adapt to load fluctuations of TR components, resulting in low system efficiency and high energy consumption. Utility Model Content

[0007] To address the above problems, the purpose of this utility model is to provide a phased array antenna heat dissipation device to solve the problems mentioned in the background art.

[0008] This utility model provides a phased array antenna heat dissipation device, including a cold plate that is attached to a TR component and has multiple refrigerant channels inside. The cold plate inlet is connected to a refrigerant supply component through an inlet pipe, and the cold plate outlet forms a closed loop with the refrigerant supply component through an outlet pipe. It also includes a controller and a first temperature measuring unit installed on the TR component. The outlet pipe is provided with a heat dissipation unit for dissipating heat from the refrigerant output from the cold plate outlet and a second temperature measuring unit for monitoring the temperature of the refrigerant after passing through the heat dissipation unit. Both the first and second temperature measuring units are connected to the controller and are used to provide the controller with signals of the surface temperature of the TR component and the temperature of the refrigerant after heat dissipation, respectively. The controller adjusts the operating state of the refrigerant supply component based on the surface temperature of the TR component and the temperature of the refrigerant after heat dissipation.

[0009] Preferably, the heat dissipation section includes a non-linear heat dissipation pipe disposed near the cold plate outlet and heat dissipation fins uniformly distributed along the axial direction of the non-linear heat dissipation pipe.

[0010] Preferably, the non-linear heat dissipation pipe includes, but is not limited to, spiral coil structure, serpentine zigzag structure, and three-dimensional labyrinth structure.

[0011] Preferably, the refrigerant supply assembly includes a refrigerant tank for storing refrigerant, a circulation pump connected to the input pipe, and a heat exchanger for cooling the refrigerant flowing out from the heat dissipation section.

[0012] Preferably, a heat-conducting plate is provided between the TR component and the cold plate, and the size of the heat-conducting plate is adapted to the size of the antenna array.

[0013] Preferably, the first temperature measuring unit includes multiple temperature sensors, which are evenly distributed on the surface of the TR component to monitor the temperature distribution in different areas.

[0014] The beneficial effects of this invention are: by setting a heat dissipation part on the output tube, heat dissipation can be carried out before the refrigerant flows back to the refrigerant supply component, thereby reducing the operating power of the refrigerant supply component and improving the heat dissipation efficiency of the TR component and the antenna array; at the same time, the operation of the refrigerant supply component is dynamically adjusted according to the temperature of the TR component surface monitored by the first temperature measuring part and the temperature of the refrigerant after heat dissipation, thereby balancing the TR component temperature and the refrigerant heat dissipation capacity in real time and solving the problem of energy waste or insufficient heat dissipation caused by traditional fixed power heat dissipation. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a top view of the structure of this utility model;

[0017] Figure 3 This is a bottom-view cross-sectional structural diagram of the present invention;

[0018] Figure 4 This is a side view sectional structural diagram of the present invention.

[0019] In the diagram: 1. TR component; 2. Refrigerant flow channel; 3. Cold plate; 4. Inlet; 5. Inlet pipe; 6. Outlet; 7. Outlet pipe; 8. Controller; 9. First temperature measuring unit; 10. Heat dissipation unit; 11. Second temperature measuring unit; 12. Non-linear heat dissipation pipe; 13. Heat sink; 14. Refrigerant tank; 15. Circulating pump; 16. Heat exchanger; 17. Heat conduction plate; 18. Antenna array; 19. Phase shifter; 20. Feed network. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of this utility model in any way.

[0021] The phased array antenna mainly includes components such as antenna array 18, TR module 1, phase shifter 19, feed network 20, and control circuit. It also includes components such as power supply, signal conditioner, and beam controller. The antenna array 18 is the main body for electromagnetic wave radiation and reception of the phased array antenna, achieving flexible beam control through spatial layout and phase modulation. The TR module 1 is the radio frequency signal processing center of the phased array antenna, responsible for the conversion and amplification of signal transmission and reception. The existing phased array antenna heat dissipation device of this invention mainly includes a cold plate 3 that is attached to the TR module 1 and has multiple refrigerant channels 2 inside. The cold plate 3's input port 4 is connected to... The refrigerant supply assembly is connected, and the output port 6 of the cold plate 3 forms a closed loop with the refrigerant supply assembly through the output pipe 7. The TR assembly 1 is in close contact with the heat absorption surface of the cold plate 3, and heat is conducted from the TR assembly 1 to the body of the cold plate 3. The coolant circulates in the coolant channel of the cold plate 3, absorbing heat from the body of the cold plate 3 and raising its own temperature. The heated coolant is pumped to external heat dissipation devices such as radiators and heat exchangers, and the heat is dissipated to the surrounding environment by means of air cooling or water cooling. The cooled coolant then flows back to the cold plate 3 to continue absorbing heat, forming a closed loop system. The above is an introduction to the existing phased array antenna heat dissipation device.

[0022] As can be seen from the above, the existing phased array antenna heat dissipation device has the following defects when in use: when the refrigerant enters from the inlet 4 of the cold plate 3 and flows to each refrigerant channel 2 to dissipate heat from the TR component 1 and then flows out from the outlet 6 of the cold plate 3, it flows directly back to the refrigerant cooling equipment through the outlet pipe 7 to cool the refrigerant to reduce its temperature to the target temperature. Since the refrigerant temperature output from the outlet 6 of the cold plate 3 is relatively high, if it flows directly to the cooling equipment for cooling, it increases the operating power of the cooling equipment. At the same time, the traditional liquid cooling system relies on a fixed pump speed. The energy consumption of the circulating pump 15 and the heat exchanger 16 accounts for 20%-30% of the total power consumption of the system, and it still runs at full speed under low load conditions, making it difficult to adapt to the load fluctuation of the TR component 1. The system has low efficiency and high energy consumption. Based on the above problems, the present invention adopts the following improvement method to solve them.

[0023] like Figure 1-4 As shown, a phased array antenna heat dissipation device, based on existing technology, adds a controller 8 and a first temperature measuring unit 9 installed on the TR component 1 for monitoring the heat of the TR component 1. The first temperature measuring unit 9 includes multiple temperature sensors evenly distributed on the TR component 1 to monitor the temperature of different areas. The maximum value measured by the multiple temperature sensors is used as the final temperature value of the TR component 1. The use of multiple temperature sensors also avoids the inability to promptly obtain the temperature of the TR component 1 if one temperature sensor fails. The output tube 7 is divided into two parts: a heat dissipation unit 10 and a second temperature measuring unit 11. The heat dissipation unit 10 is used to dissipate heat from the refrigerant output from the cold plate 3's output port 6. Figure 1As shown, the heat dissipation unit 10 includes a non-linear heat dissipation pipe 12 disposed on one side of the cold plate 3 output port 6 and heat dissipation fins 13 uniformly distributed along the axial direction of the non-linear heat dissipation pipe. The non-linear heat dissipation pipe 12 is connected to the phased array antenna body through a support frame. The shape of the non-linear heat dissipation pipe 12 can be one of a spiral coil structure, a serpentine folding structure, and a three-dimensional labyrinth structure. It can extend the flow path of the refrigerant in a limited space and enhance the heat dissipation efficiency. Among them, the spiral coil (4mm pitch, 15mm diameter) increases the heat exchange area by 2.8 times compared with the straight pipe, and the heat dissipation is increased to 450W at the same flow rate (the straight pipe is only 160W), and the refrigerant disturbance is enhanced; the serpentine folding structure has a bending radius of 10mm, which generates secondary flow of the refrigerant, increases the turbulence by 40%, and increases the convective heat transfer coefficient from 500W / m²·K to 700W / m²·K; the three-dimensional labyrinth structure (6mm interlayer spacing) While increasing the heat exchange path, the weight of the pipe is reduced by 60% compared to copper radiators (aluminum + thin-wall design). Simultaneously, with the action of the heat sink 13, the heat of the refrigerant is dissipated more quickly, enhancing the speed of refrigerant heat exchange. The heat sink can be designed in a wave shape to expand the heat dissipation area. The second temperature measuring unit 11 is used to monitor the temperature of the cooled refrigerant. The temperature sensors in both the first temperature measuring unit 9 and the second temperature measuring unit 11 can be infrared temperature sensors or fiber optic temperature sensors. The first temperature measuring unit 9 and the second temperature measuring unit 11 are connected to the controller 8. The controller 8 controls the operating status of the refrigerant supply assembly based on the temperatures measured by the first temperature measuring unit 9 and the second temperature measuring unit 11. The refrigerant supply assembly consists of a refrigerant tank 14 for storing refrigerant, a circulation pump 15 connected to the input pipe for driving refrigerant circulation, and a heat exchanger 16 (e.g., a heat exchanger for cooling the refrigerant flowing out of the heat sink 10) for cooling the refrigerant. Figure 1As shown, the heat exchanger 16 can be used for chilled water cooling. Low-temperature chilled water is produced by a refrigeration unit (such as a water chiller). The chilled water circulates between the refrigerant and the refrigeration unit. The refrigeration unit uses the compression, condensation, expansion, and evaporation processes of the refrigerant to remove heat from the chilled water, thus lowering the chilled water temperature. The refrigerant exchanges heat with the chilled water in the heat exchanger 16, thereby achieving the cooling of the refrigerant. The refrigerant can be an ethylene glycol aqueous solution (which is more efficient than air cooling). Specifically, for example, under a certain operating state, the safe temperature range of TR component 1 is set to a first preset threshold - a second preset threshold (first preset threshold < second preset threshold), and the ideal temperature of the refrigerant after heat dissipation is set to a third preset threshold. When the surface temperature of TR component 1 is higher than the first preset threshold and the temperature of the refrigerant after heat dissipation is lower than the first preset threshold, the refrigerant temperature is lower than the second preset threshold. When the temperature reaches the third preset threshold, it indicates that the refrigerant dissipates heat quickly through the heat dissipation section 10 (possibly due to the low ambient temperature). Maintaining or slightly reducing the operating power of the heat exchanger 16 while increasing the speed of the circulation pump 15 can accelerate the refrigerant flow and better dissipate heat from the TR component 1. When the refrigerant temperature after heat dissipation is higher than the third preset threshold, it indicates that the ambient temperature is high or the operating power of the TR component 1 is high. It is necessary to increase the cooling power of the heat exchanger 16 to reduce the refrigerant temperature to the third preset threshold, thereby effectively dissipating heat from the TR component 1. When the surface temperature of the TR component 1 is lower than the third preset threshold, it indicates that the operating power of the TR component 1 is low and less heat is generated. In this case, reducing the speed of the circulation pump 15 and reducing the cooling power of the heat exchanger 16 can save energy consumption.

[0024] Furthermore, such as Figure 4 As shown, to better dissipate heat from the TR component 1, a composite heat-conducting plate 17 is installed between the TR component 1 and the cold plate 3. The size of the heat-conducting plate 17 is adapted to the size of the antenna array 18. The structure of the composite heat-conducting plate 17 is as follows: Substrate layer: copper alloy (thermal conductivity ≥350W / m·K), thickness 1-2mm; Intermediate phase change layer: paraffin-based composite phase change material (PCM, phase change temperature 40-50℃, latent heat ≥180J / g), thickness 0.5-1mm; Surface microstructure layer: arrayed micro pyramids formed by laser etching (base side length 0.1-0.3mm, height 0.05-0.15mm), contact thermal resistance ≤5×10⁻ 6 m²·K / W, the heat-conducting plate 17 (copper alloy substrate, 1.5mm thick) reduces the surface temperature difference of TR module 1 from 15℃ to 3℃, extends the fatigue life of solder joints caused by thermal stress by 3 times, and can reduce the risk of local hot spots in TR module 1 through large-area heat equalization.

[0025] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0026] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above examples are only for the purpose of helping to understand the method and core ideas of this utility model. The above description is only a preferred embodiment of this utility model. It should be noted that due to the limitations of textual expression, there are objectively infinite specific structures. For those skilled in the art, several improvements, modifications, or changes can be made without departing from the principles of this utility model, and the above technical features can also be combined in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the protection scope of this utility model.

Claims

1. A phased array antenna heat dissipation device, comprising a cold plate (3) fitted onto a TR assembly (1) and having multiple refrigerant channels (2) inside, wherein the inlet (4) of the cold plate (3) is connected to a refrigerant supply assembly via an inlet pipe, and the outlet (6) of the cold plate (3) forms a closed loop with the refrigerant supply assembly via an outlet pipe (7), characterized in that: It also includes a controller (8) and a first temperature measuring unit (9) installed on the TR component (1). The output pipe (7) is provided with a heat dissipation unit (10) for dissipating heat from the refrigerant output from the cold plate (3) outlet (6) and a second temperature measuring unit (11) for monitoring the temperature of the refrigerant passing through the heat dissipation unit (10). The first temperature measuring unit (9) and the second temperature measuring unit (11) are both connected to the controller (8) and are respectively used to provide the controller (8) with signals of the surface temperature of the TR component (1) and the temperature of the refrigerant after heat dissipation. The controller (8) adjusts the operating state of the refrigerant supply component based on the surface temperature of the TR component (1) and the temperature of the refrigerant after heat dissipation.

2. The phased array antenna heat dissipation device according to claim 1, characterized in that: The heat dissipation section (10) includes a non-linear heat dissipation pipe (12) arranged near the outlet (6) of the cold plate (3) and heat dissipation fins (13) evenly distributed along the axial direction of the non-linear heat dissipation pipe (12).

3. The phased array antenna heat dissipation device according to claim 2, characterized in that: The non-linear heat dissipation pipe (12) includes, but is not limited to, spiral coil structure, serpentine folding structure, and three-dimensional labyrinth structure.

4. The phased array antenna heat dissipation device according to claim 1, characterized in that: The refrigerant supply assembly includes a refrigerant tank (14) for storing refrigerant, a circulation pump (15) connected to the input pipe, and a heat exchanger (16) for cooling the refrigerant flowing out from the heat dissipation section (10).

5. The phased array antenna heat dissipation device according to claim 1, characterized in that: A heat-conducting plate (17) is provided between the TR component (1) and the cold plate (3), and the size of the heat-conducting plate (17) is adapted to the size of the antenna array (18).

6. The phased array antenna heat dissipation device according to claim 1, characterized in that: The first temperature measuring unit (9) includes multiple temperature sensors, which are evenly distributed on the surface of the TR component (1) to monitor the temperature distribution in different areas.

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