Packaging structure

By introducing an interface material between the sidewalls and bottom filler of the semiconductor die and setting a buffer material between the die and the molding compound, the cracking and delamination problems caused by the difference in thermal expansion coefficients in the packaging structure are solved, thereby improving the stability and reliability of the packaging structure.

CN224319882UActive Publication Date: 2026-06-02TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Filing Date
2025-05-08
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

As the integration density of semiconductor components increases, existing packaging technologies struggle to effectively manage material interface cracking or delamination caused by differences in thermal expansion coefficients, affecting the reliability and stability of the packaging structure.

Method used

By introducing an interface material between the sidewalls and bottom filler of the semiconductor die and placing a buffer material between the die and the molding compound, stress caused by the difference in thermal expansion coefficients is alleviated, thereby improving the stability of the packaging structure.

Benefits of technology

It effectively reduces the risk of cracking or delamination caused by differences in thermal expansion coefficients in the packaging structure, improves the reliability and adhesion of the packaging structure, and enhances the packaging quality.

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Abstract

The embodiments disclosed herein provide a packaging structure. The packaging structure includes a semiconductor die. An underfill material is located below the semiconductor die and extends upward to the sidewalls of the semiconductor die. A molding compound surrounds the semiconductor die and the underfill material. An interface material is located between the molding compound and the underfill material.
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