Chip encapsulation adhesive storage device

Abstract

The utility model relates to electronic packaging material storage technical field discloses a kind of glue storage devices for chip packaging, including base, jar body assembly, discharge component and heating assembly.Base supporting overall structure, jar body assembly is stored glue by forming closed space through shell and top cover, discharge component is sealed and controls glue discharge through glue outlet by sealing assembly, and heating assembly cyclically heats and maintains glue temperature.The device has good sealing performance, stable glue temperature, is clean and convenient, can accurately control glue discharge amount, temperature distribution is uniform in jar body, glue local solidification or flowability reduction problem is solved, cleaning can be completed without disassembling discharge component, and maintenance efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging material storage technology, specifically to a chip packaging adhesive storage device. Background Technology

[0002] Adhesives used in chip packaging require high-precision bonding, necessitating stringent requirements for the sealing, temperature stability, and cleanliness of the storage environment. However, existing adhesive storage devices have numerous technical limitations, making them unsuitable for industrial production needs.

[0003] A search revealed existing technology (application number: CN202322647138.8), which describes "an adhesive storage device." This invention uses a cylinder to drive the can lid into the can body, discharging the adhesive from the can body through the discharge pipe, thus reducing adhesive residue on the inner wall of the can body.

[0004] However, while existing technologies use cylinders to drive the can lid into the can and discharge the glue from the can through the discharge pipe, reducing glue residue on the inner wall of the can, they still have some shortcomings: some devices have rudimentary outlet sealing methods, resulting in high glue leakage when the machine is stopped, causing material waste and environmental pollution; existing heating systems mostly use electric heating wires for direct heating, leading to uneven temperature distribution inside the can and causing localized curing or decreased fluidity of the glue; heating components lack circulating insulation design, resulting in high temperature fluctuations in the glue inside the can when the ambient temperature fluctuates, failing to meet the requirements of high-precision encapsulation for glue viscosity stability; glue easily remains on the inner wall and funnel, and traditional cleaning methods require manual disassembly and cleaning, which is time-consuming and results in high residue on the inner wall, which can easily lead to mixing and contamination of new and old glue over time. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip packaging adhesive storage device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a chip packaging adhesive storage device, comprising: a base, disposed on the ground; a tank assembly, welded to the base; a discharge assembly, welded to the lower side of the tank assembly; and a heating assembly, one end of which is opened inside the tank assembly and the discharge assembly; the discharge assembly includes: a sealing assembly, one end of which is welded inside the discharge assembly for sealing the storage tank.

[0007] As a further description of the above technical solution:

[0008] The discharge assembly further includes: a funnel, welded to the lower side of the tank assembly; a cleaning port, welded to the lower side of the funnel; and a glue outlet, one end of which is opened on the cleaning port for controlling the glue discharge amount.

[0009] As a further description of the above technical solution:

[0010] The sealing assembly includes: a connecting rod, one end of which is welded to the cleaning port; an upper clamping block, one end of which is threaded to the other end of the connecting rod; a lower clamping block, threaded to the other end of the upper clamping block; and a sealing ring, which is slidably connected between the upper clamping block and the lower clamping block.

[0011] As a further description of the above technical solution:

[0012] The tank assembly includes: an outer shell welded to a base; a top cover disposed on the outer shell; and a threaded bolt threadedly connected to the outer shell and the top cover.

[0013] As a further description of the above technical solution:

[0014] The heating assembly includes: a water pump, installed on the ground; a water storage tank, fixedly connected to one end of the water pump; a water inlet, located on the water storage tank; a water inlet pipe, one end of which is welded to the output end of the water pump; an insulated water pipe, located inside the tank assembly and the discharge assembly, with one end fixedly connected to the other end of the water inlet; and a water outlet pipe, one end of which is welded to the other end of the water inlet pipe, and the other end of which is located on the water storage tank.

[0015] As a further description of the above technical solution:

[0016] The sealing ring is slidably connected to the inner wall of the cleaning port, and the device is sealed by the compression of the upper clamping block and the lower clamping block.

[0017] As a further description of the above technical solution:

[0018] The water storage tank is equipped with a heating element inside, which is used to heat the water and maintain a specified temperature.

[0019] This utility model has the following beneficial effects:

[0020] The sealing assembly employs a combination structure of upper clamping block, lower clamping block, and sealing ring, achieving multiple seals through threaded extrusion. This reduces leakage rate, minimizes the intrusion of moisture and impurities from the air, and reduces residual glue leakage at the discharge port during shutdown, thus minimizing material waste. The heating assembly uses a spiral insulated water pipe for circulating heating, ensuring uniform temperature distribution within the tank and resolving issues such as localized glue curing or decreased fluidity. This meets the viscosity stability requirements of high-precision encapsulation. Cleaning can be completed without disassembling the discharge assembly, improving maintenance efficiency. Attached Figure Description

[0021] Figure 1 This is a front view of a chip packaging adhesive storage device proposed in this utility model;

[0022] Figure 2This is a cross-sectional view of an adhesive storage device for chip packaging proposed in this utility model;

[0023] Figure 3 This is a schematic diagram of the sealing assembly of a chip packaging adhesive storage device proposed in this utility model;

[0024] Legend:

[0025] 1. Base; 2. Tank assembly; 21. Outer shell; 22. Top cover; 23. Threaded bolt; 3. Discharge assembly; 31. Funnel; 32. Cleaning port; 33. Glue outlet; 34. Sealing assembly; 341. Connecting rod; 342. Upper clamping block; 343. Lower clamping block; 344. Sealing ring; 4. Heating assembly; 41. Water pump; 42. Water storage tank; 43. Water inlet; 44. Water inlet pipe; 45. Insulated water pipe; 46. Water outlet pipe. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] Example 1:

[0030] like Figures 1 to 3 As shown, this embodiment provides a chip packaging adhesive storage device, including: a base 1, which is set on the ground; a tank assembly 2, which is welded to the base 1; a discharge assembly 3, which is welded to the lower side of the tank assembly 2; and a heating assembly 4, one end of which is opened inside the tank assembly 2 and the discharge assembly 3. The discharge assembly 3 includes: a sealing assembly 34, one end of which is welded inside the discharge assembly 3 for sealing the storage tank.

[0031] In this embodiment, the sealing component and the heating component constitute an adhesive storage device for chip packaging according to this application.

[0032] It should also be noted that the base 1 supports the overall structure, the tank assembly 2 stores the adhesive, the discharge assembly 3 controls the output of the adhesive, the heating assembly 4 maintains the temperature of the adhesive, and the sealing assembly 34 seals the storage tank.

[0033] Specifically, the discharge assembly 3 also includes: a funnel 31, welded to the lower side of the tank assembly 2; a cleaning port 32, welded to the lower side of the funnel 31; and a glue outlet 33, one end of which is opened on the cleaning port 32 to control the glue discharge amount.

[0034] In this embodiment, the glue is collected by the funnel 31 and discharged from the glue outlet 33 through the cleaning port 32. The cleaning port 32 can be opened to clean up any residue.

[0035] Specifically, the sealing assembly 34 includes: a connecting rod 341, one end of which is welded to the cleaning port 32; an upper clamping block 342, one end of which is threaded to the other end of the connecting rod 341; a lower clamping block 343, which is threaded to the other end of the upper clamping block 342; and a sealing ring 344, which is slidably connected between the upper clamping block 342 and the lower clamping block 343.

[0036] In this embodiment, the rotating lower clamping block 343 compresses the sealing ring 344, causing it to fit tightly against the inner wall of the cleaning port 32 to achieve a seal.

[0037] Specifically, the tank assembly 2 includes: a shell 21, welded to the base 1; a top cover 22, disposed on the shell 21; and a threaded bolt 23, threadedly connected to the shell 21 and the top cover 22.

[0038] In this embodiment, the threaded bolt 23 fixes the top cover 22 to the outer shell 21, forming a closed storage space.

[0039] Specifically, the heating component 4 includes: a water pump 41, which is installed on the ground; a water storage tank 42, which is fixedly connected to one end of the water pump 41; a water inlet 43, which is opened on the water storage tank 42; a water inlet pipe 44, one end of which is welded to the output end of the water pump 41; an insulated water pipe 45, which is opened inside the tank assembly 2 and the discharge assembly 3, and one end of which is fixedly connected to the other end of the water inlet 43; and a water outlet pipe 46, one end of which is welded to the other end of the water inlet pipe 44, and the other end of which is opened on the water storage tank 42.

[0040] With this setup, the water pump 41 pumps the hot water in the water storage tank 42 into the insulated water pipe 45, circulating and heating the tank and the discharge assembly. The hot water then flows back through the outlet pipe 46.

[0041] Specifically, the sealing ring 344 is slidably connected to the inner wall of the cleaning port 32, and the device is sealed by the compression of the upper clamping block 342 and the lower clamping block 343.

[0042] The upper clamping block 342 and the lower clamping block 343 rotate relative to each other, compressing the sealing ring 344 to deform and fill the gap, thereby sealing the cleaning port 32.

[0043] Specifically, the water storage tank 42 is equipped with a heating element inside, which is used to heat the water and maintain a specified temperature.

[0044] In this embodiment, the heating element is powered on to heat the water, and the temperature controller automatically starts and stops heating according to the detected water temperature to maintain a stable water temperature.

[0045] In actual use, the operating principle is as follows: the operator first pours water into the water inlet 43, and the water temperature is heated and maintained at the specified temperature by the heating component inside the water storage tank 42. The water pump 41 is turned on to pump the heated water from the inlet pipe 44 into the insulated water pipe 45 and then back into the water storage tank 42 from the outlet pipe 46. Warm water is introduced into the equipment to keep the glue in a liquid state. The screw bolt 23 is turned to lock the outer shell 21 and the top cover 22. During normal use, the lower clamping block 343 is turned to tighten it with the upper clamping block 342, and the sealing ring 344 is squeezed to seal the equipment. If glue is needed, the glue outlet 33 is opened to receive glue. If the inside of the equipment needs to be cleaned, the lower clamping block 343 is turned to loosen it from the upper clamping block 342. After the sealing ring 344 retracts, the lower clamping block 343, the sealing ring 344, and the upper clamping block 342 are removed in sequence. The funnel 31 is opened to spray water from above to clean the inside of the equipment, and the wastewater flows out from the cleaning port 32.

[0046] Understandable, Figure 1 This illustration only schematically shows some components of a chip packaging adhesive storage device; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, a chip packaging adhesive storage device may also include, compared to... Figure 1 More or fewer parts.

[0047] In some embodiments, the adhesive storage device for chip packaging can be a room temperature storage type, a constant temperature storage type, a high pressure storage type, etc., wherein the room temperature storage type can be, but is not limited to, epoxy adhesive storage type, silicone adhesive storage type, acrylic adhesive storage type, etc. Figure 1 In this embodiment, the working temperature type of the adhesive storage device for chip packaging is room temperature storage type. Of course, other types of adhesive storage devices for chip packaging can also adopt similar structures, which will not be described in detail below.

[0048] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0049] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip packaging adhesive storage device, characterized in that: include: The base (1) is set on the ground; Tank assembly (2) is welded to base (1); The discharge assembly (3) is welded to the lower side of the tank assembly (2); The heating component (4) is located at one end inside the tank assembly (2) and the discharge assembly (3); The discharge assembly (3) includes: The sealing component (34) is welded at one end to the inside of the discharge component (3) for sealing the storage tank.

2. The adhesive storage device for chip packaging according to claim 1, characterized in that: The discharge assembly (3) also includes: The funnel (31) is welded to the lower side of the tank assembly (2); Cleaning port (32) is welded to the lower side of funnel (31); The glue outlet (33) is located on the cleaning port (32) at one end and is used to control the amount of glue dispensed.

3. The adhesive storage device for chip packaging according to claim 2, characterized in that: The sealing assembly (34) includes: The connecting rod (341) is welded at one end to the cleaning port (32); The upper clamping block (342) is threaded to the other end of the connecting rod (341) at one end; The lower clamping block (343) is threadedly connected to the other end of the upper clamping block (342); The sealing ring (344) is slidably connected between the upper clamping block (342) and the lower clamping block (343).

4. The adhesive storage device for chip packaging according to claim 3, characterized in that: The tank assembly (2) includes: The outer shell (21) is welded to the base (1); Top cover (22), mounted on outer casing (21); A threaded bolt (23) is threadedly connected to the outer casing (21) and the top cover (22).

5. The adhesive storage device for chip packaging according to claim 4, characterized in that: The heating component (4) includes: Water pump (41), installed on the ground; A water storage tank (42) is fixedly connected to one end of a water pump (41); The water inlet (43) is located on the water storage tank (42); The water inlet pipe (44) is welded at one end to the output end of the water pump (41); The insulated water pipe (45) is located inside the tank assembly (2) and the discharge assembly (3), and one end is fixedly connected to the other end of the water inlet (43); The outlet pipe (46) is welded at one end to the other end of the inlet pipe (44), and the other end is opened on the water storage tank (42).

6. The adhesive storage device for chip packaging according to claim 5, characterized in that: The sealing ring (344) is slidably connected to the inner wall of the cleaning port (32), and the equipment is sealed by the compression of the upper clamping block (342) and the lower clamping block (343).

7. The adhesive storage device for chip packaging according to claim 6, characterized in that: The water storage tank (42) is equipped with a heating element inside, which is used to heat the water and maintain a specified temperature.

Images