Cassette tower shockproof drive structure

Abstract

The utility model provides a kind of anti-vibration driving structure of storage tower, it at least includes a storage tower and an anti-vibration device, the storage tower is by a cage and multiple vertical storage basket groups set around the cage are composed, and multiple flat storage positions are provided on the multiple storage basket groups, and the cage can be driven by a driving device, and the anti-vibration device has a tablet compression module and an anti-vibration touch module that can drive the tablet compression module, wherein the tablet compression module is respectively slid with a guide column between adjacent storage basket groups, and multiple wings are provided on the multiple guide columns, corresponding to the flat storage positions of two side storage basket groups, so that the multiple wings can be moved between a limit position and a release position relative to the upper surface of the multiple semiconductor elements, thereby, when the earthquake intensity exceeds the set value, the semiconductor elements on the storage tower can be quickly limited and protected to avoid the semiconductor elements from being shaken out.

Description

Technical Field

[0001] This utility model relates to a shockproof technology for storage devices, specifically a shockproof drive structure for a wafer storage tower, which can quickly restrict and protect the semiconductor components on the wafer storage tower during an earthquake, and improve the smoothness and stability of the operation to avoid jamming due to the angle of operation, thus ensuring the effectiveness of its shockproof operation. Background Technology

[0002] With the advancement and improvement of network and communication technologies, coupled with the development of smartphones, electric vehicles, IoT (Internet of Things), and AI technologies, people have gained a richer and more convenient life. These technological products are mainly made of semiconductor components manufactured through semiconductor processes. These semiconductor components include, but are not limited to, photomasks and wafers. According to current semiconductor component manufacturing technology, the circuit patterns of semiconductor components are transferred from the photomask to the surface of the wafer through a photolithography process. As the line diameter of the circuit patterns of the aforementioned semiconductor components has evolved from the early micrometer level to the nanometer level, in order to cope with the contamination of semiconductor components by particles in the environment and harmful gases released during the manufacturing process, contamination control measures during storage, transportation, and manufacturing have become more stringent.

[0003] In semiconductor manufacturing plants, maintaining cleanliness during the manufacturing process primarily relies on designing cleanrooms. However, due to the large size of cleanrooms and the mutual interference of airflow between different devices, the cleanliness of the environment can still be easily affected. Therefore, the storage and transportation of semiconductor components outside the manufacturing process require a separate container with an independent clean environment. Taking photomasks as an example, due to the aforementioned miniaturization of semiconductor components, contamination of the photomask can cause distortion or deformation of the circuit patterns on the wafer surface. To maintain the cleanliness of the photomask during storage or transportation outside the manufacturing process, it is typically housed in a SEMI standard photomask transport box (Reticle SMIF). Within the Pod (RSP), to reduce the adhesion of harmful contaminants such as particles, chemicals, or free gas molecules from the environment to the photomask surface, thus reducing defects, the multiple photomask transport boxes containing the photomasks are then stored in a large storage cabinet (Stocker). Currently, the storage cabinet's storage positions are arranged in a matrix on one side of the surface, and a linear robotic arm that can move left, right, up, and down is used to pick up and place photomask transport boxes in different storage positions. This increases the robotic arm's travel distance, thus increasing the time spent picking up and placing photomask transport boxes and reducing its operating efficiency. Furthermore... This approach also significantly increases the storage space of each photomask transport box. At the same time, the operating space and load-bearing capacity of the robotic arm used to transport the photomask transport boxes also need to be increased. In order to maintain the cleanliness of the internal environment of each photomask transport box, an inflation plate connected to an inflation system is usually designed on each storage position of the storage cabinet to fill the photomask transport box with clean gas. This inadvertently complicates the structure of the storage cabinet, increases its manufacturing and maintenance costs, and also increases the volume of the storage cabinet. With the same volume, a smaller volume will directly reduce the storage capacity of the semiconductor components in the storage cabinet.

[0004] Furthermore, as mentioned above, since the circuit pattern line diameter of semiconductor components has developed to the nanometer level, the importance and value of related semiconductor components are constantly increasing. Taking the aforementioned photomask as an example, the value of a single piece may be as high as millions, and when it is damaged, it may affect the efficiency of the manufacturing process. Therefore, the protection level for the multiple semiconductor components is also constantly improving. In recent years, earthquakes have occurred frequently, so there is a need to provide a good shockproof design for the multiple storage devices to protect the multiple semiconductor components in the event of an earthquake. Therefore, how to solve the aforementioned problems is what this utility model aims to explore and solve.

[0005] In view of the above-mentioned shortcomings and drawbacks, the creator believed that it was necessary to make corrections. Therefore, based on years of experience in related technologies and product design and manufacturing, and adhering to the concept of excellent design, the creator researched and improved the above-mentioned shortcomings. After continuous efforts in trial and error, the creator finally successfully developed a shock-proof drive structure for storage towers, thereby overcoming the troubles and inconveniences caused by the poor shock-proof design of existing storage cabinets. Utility Model Content

[0006] Therefore, the main purpose of this utility model is to provide a shock-resistant drive structure for a semiconductor storage tower, which can drive and restrict the semiconductor components on the storage position during an earthquake to prevent them from being dislodged due to vibration, thereby greatly improving the safety of semiconductor components during storage.

[0007] Another objective of this utility model is to provide a shock-resistant drive structure for a storage tower, which can improve the smoothness and stability of the operation, so as to avoid jamming due to the angle of the operation and ensure the effectiveness of its shock-resistant operation.

[0008] Another objective of this invention is to provide a shock-resistant drive structure for a storage tower, which utilizes a modular design of storage location and shock-resistant mechanism, making it easy to install and maintain, and greatly improving its practicality.

[0009] Based on this, the present invention mainly achieves the aforementioned objectives and effects through the following technical means:

[0010] This utility model provides a shock-resistant drive structure for a semiconductor storage tower, used to house a plurality of semiconductor components. The shock-resistant drive structure for the semiconductor storage tower includes at least:

[0011] A semiconductor storage tower consists of a cage and a plurality of semiconductor storage baskets. The plurality of semiconductor storage baskets are vertically locked around the cage and have a plurality of horizontally placed storage positions arranged vertically and at equal intervals for selective horizontal placement of a plurality of semiconductor devices. The cage of the semiconductor storage tower can be rotated by a drive device.

[0012] A shock-absorbing device is installed around the cage, and the shock-absorbing device includes at least:

[0013] A tablet compression module is provided with a guide post between adjacent tablet storage baskets around the cage. The multiple guide posts are slidably disposed between the top and bottom ends of the cage. Furthermore, the multiple guide posts are provided with multiple winglets corresponding to the flat storage positions of the tablet storage baskets on both sides, and one end of the multiple winglets can extend into the upper surface of the multiple semiconductor elements located on the relatively flat storage positions.

[0014] An anti-vibration trigger module is provided with a plurality of equiangular driving elements around the storage tower. The plurality of driving elements are fixed on a fixed base and have actuating rods that can extend and retract relative to the fixed base. The actuating rods of the plurality of driving elements are arranged together to form a pressure ring around the periphery of the cage. The anti-vibration trigger module has a connecting plate spanning the bottom ends of at least two adjacent guide columns. The outer edge of the connecting plate is formed with at least one convex pressure plate that overlaps with the pressure ring. When the actuating rods of the plurality of driving elements drive the pressure ring, the pressure ring can drive the connecting plate through the plurality of elastic pressure members, so that the connecting plate can synchronously drive the relative displacement of the guide columns.

[0015] Preferably, the cage has at least a bottom frame, a top frame, and a plurality of basket plates disposed between the outer contours of the bottom frame and the top frame, and the bottom and top frames have a plurality of guide seats at equal angles and distances, so that the plurality of guide pillars of the pressing module can slide together between the guide seats opposite to the bottom and top frames.

[0016] Preferably, the plurality of tablet storage baskets are composed of a plurality of tablet storage boxes arranged vertically and locked to the plurality of basket plates. The plurality of tablet storage boxes consists of a box back plate and two box side plates respectively disposed on both sides of the box back plate. The plurality of tablet storage boxes are provided with a plurality of equidistant tablet carrier plates in layers between the box back plate and the two side box plates to form a plurality of flat storage positions. The plurality of guide posts are provided with a plurality of wing groups corresponding to the tablet storage boxes of the two sides of the tablet storage baskets. The plurality of wing groups have a sleeve that can be locked to the guide post. The plurality of wing groups are formed on both sides of the periphery of the plurality of sleeves.

[0017] Preferably, the ends of the blades in the plurality of blade groups are provided with limiting bumps corresponding to the plurality of semiconductor elements to reduce the area in contact with the plurality of semiconductor elements.

[0018] Preferably, the at least one limiting protrusion can be selected from materials such as PEEK or PEI.

[0019] Preferably, the shockproof trigger module has 6 sets of driving elements and a plurality of linkage plates of equal length. Each linkage plate can be locked with three guide posts at equal angles to drive the plurality of guide posts respectively, thereby reducing the occurrence of jamming.

[0020] Preferably, an elastic pressure member is provided between the convex pressure plate of the linkage plate and the pressure ring at the relative position, so that the pressure ring can press the linkage plate through the plurality of elastic pressure members.

[0021] Preferably, the linkage plate is provided with an upper buffer and a lower buffer on the guide post respectively above and below, so as to reduce the impact force of the blades of the plurality of blade groups on the plurality of semiconductor elements.

[0022] Therefore, through the aforementioned technical means, the anti-vibration drive structure of the storage tower of this utility model can utilize the anti-vibration trigger module to drive the guide column of the pressing module to move the multiple blades downward to restrict the multiple semiconductor elements from detaching from the horizontal storage position. Furthermore, the anti-vibration trigger module can drive the guide column of the pressing module to move the multiple blades upward to release the multiple semiconductor elements, allowing them to be moved out of the horizontal storage position. This prevents the multiple semiconductor elements from detaching from the storage tower during an earthquake, while also improving the smoothness and stability of the operation to avoid jamming due to the angle of operation, ensuring the effectiveness of its anti-vibration operation. This effectively improves the safety of the multiple semiconductor elements during storage. Additionally, the modular design of the components in this utility model makes it easy to install and maintain, greatly enhancing its practicality and increasing its added value and economic benefits.

[0023] To enable a further understanding of the structure, features and other objectives of this utility model, preferred embodiments of this utility model are described below in detail with reference to the accompanying drawings, so that those skilled in the art can implement them. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the anti-vibration drive structure of the storage tower of this utility model applied to a storage compartment.

[0025] Figure 2 This is a three-dimensional appearance schematic diagram of the anti-vibration drive structure of the storage tower of this utility model, to illustrate its appearance and relative relationships.

[0026] Figure 3 This is a schematic diagram of most of the anti-vibration drive structure of the storage tower of this utility model.

[0027] Figure 4 This is a partial external view of the storage basket assembly and the tablet pressing module in the anti-vibration drive structure of the tablet storage tower of this utility model.

[0028] Figure 5 This is a partially exploded schematic diagram of the storage basket group and the tablet pressing module in the anti-vibration drive structure of the tablet storage tower of this utility model.

[0029] Figure 6 This is a schematic diagram of the anti-vibration device in the anti-vibration drive structure of the storage tower of this utility model.

[0030] Figure 7 This is a partially enlarged schematic diagram of the anti-vibration device in the anti-vibration drive structure of the storage tower of this utility model.

[0031] Figure 8 This is a side view of the anti-vibration trigger module in the anti-vibration drive structure of the storage tower of this utility model.

[0032] Figure 9This is a schematic diagram of the anti-vibration device in the anti-vibration drive structure of the storage tower of this utility model before its operation, to illustrate the pre-operation state of its anti-vibration trigger module and its relative relationships.

[0033] Figure 10 This is a schematic diagram of the shock-absorbing device after its operation in the anti-vibration drive structure of the tablet storage tower of this utility model, to illustrate the post-operation state of its tablet pressing module and its relative relationships.

[0034] Explanation of reference numerals in the attached drawings: 100-Storage tower; 10-Cage body; 11-Bottom frame; 110-Mounting part; 12-Top frame; 120-Mounting part; 121-Support rib; 122-Shaft seat; 123-Step shaft hole; 15-Basket plate; 16-Middle section ring frame; 161-Locking part; 162-Locking part; 163-Middle guide seat; 18-First airflow hole slot; 20-Passive assembly; 22-Gear sleeve; 30-Storage basket assembly; 31-Storage box; 32-Box back plate; 320-Second airflow hole slot; 33-Box side plate; 330-Through hole; 35-Storage carrier plate; 351-Back carrier plate; 352-Side carrier plate; 353-Overhead bridge section; 36-Limiting component; 361- Supporting protrusion; 362-Side baffle; 365-Block; 50-Anti-vibration device; 51-Pressure plate module; 52-Guide seat; 53-Guide seat; 54-Guide post; 55-Wing assembly; 56-Sleeve; 57-Wing; 58-Restricting protrusion; 60-Anti-vibration trigger module; 61-Drive element; 62-Actuating rod; 63-Fixed seat; 64-Pressure ring; 65-Connecting plate; 650-Protruding pressure plate; 66-Elastic pressure element; 671-Upper buffer; 672-Lower buffer; 500-Drive device; 510-Motor element; 800-Storage compartment; 801-Storage space; 802-Upper mounting base; 803-Lower mounting base; 900-Semiconductor element. Detailed Implementation

[0035] This utility model provides a shock-resistant drive structure for a film storage tower. In the accompanying drawings, all references to front and back, left and right, top and bottom, upper and lower parts, and horizontal and vertical in the specific embodiments and components of this utility model's shock-resistant drive structure are for descriptive convenience only and are not intended to limit this utility model or restrict its components to any position or spatial orientation. The dimensions specified in the drawings and specification should be varied according to the design and requirements of the specific embodiments of this utility model without departing from the scope of the claims, and therefore are not limited to this structure for patent purposes.

[0036] Please refer to Figure 1 , Figure 2As shown, this utility model provides a shockproof drive structure for a semiconductor storage tower, which is composed of a semiconductor storage tower 100. It can be applied to a storage chamber 800 to store a plurality of semiconductor components 900, wherein the semiconductor components 900 can be photomask dies. The storage chamber 800 has a storage space 801 inside, and the storage chamber 800 has an upper mounting seat 802 and a lower mounting seat 803 at the top and bottom of the storage space 801, respectively. The semiconductor storage tower 100 is pivotally mounted between the upper mounting seat 802 and the lower mounting seat 803, so that the semiconductor storage tower 100 can be rotated by a drive device 500. The semiconductor storage tower 100 is composed of a cage 10, a plurality of longitudinally arranged semiconductor storage baskets 30, and a shockproof device 50.

[0037] like Figure 3 , Figure 4 and Figure 5 As shown, the cage 10 is composed of at least a bottom frame 11, a top frame 12, and a plurality of basket plates 15 disposed between the outer contours of the bottom frame 11 and the top frame 12. The bottom frame 11 is pivotally mounted on the lower mounting base 803 and has a plurality of equidistant mounting portions 110 for mounting the aforementioned basket plates 15. The top frame 12 has a bearing seat 122 supported by a plurality of radial ribs 121 and the bearing seat 122 has a stepped shaft hole 123 for pivoting the upper mounting base 802. The top frame 12 has a plurality of mounting portions 120 corresponding to the mounting portions 110 of the bottom frame 11, for the plurality of basket plates 15 to be longitudinally locked between the corresponding mounting portions 110 and 120 of the bottom and top frames 11 and 12. Furthermore, according to some embodiments, the plurality of basket panels 15 can be a segmented structure, wherein the cage body 10 has at least one middle section ring frame 16 between the bottom frame 11 and the top frame 12, and the upper and lower edges of the plurality of middle section ring frames 16 respectively have a plurality of locking portions 161 and 162 corresponding to the mounting portions 110 and 120 of the bottom and top frames 11 and 12, respectively, so that the aforementioned segmented basket panels 15 can be respectively locked between the mounting portion 110 of the bottom frame 11 and the lower locking portion 161 of the middle section ring frame 16, and between the upper locking portion 162 of the middle section ring frame 16 and the mounting portion 120 of the top frame 12 (e.g.) Figure 3 As shown, this improves the structural strength of the cage 10 and the plurality of basket plates 15. The plurality of basket plates 15 have a plurality of first airflow slots 18. The bottom frame 11 is pivotally mounted on the lower mounting base 803. A gear sleeve 22 is locked around the bottom frame 11 of the cage 10. When the aforementioned drive device 500 engages and drives the gear sleeve 22 of the bottom frame 11 of the cage 10, it can simultaneously drive the cage 10 to rotate in place relative to the upper and lower mounting bases 802 and 803 of the storage compartment 800.

[0038] For example Figure 2 , Figure 4 and Figure 5As shown, the outer surfaces of the plurality of basket plates 15 can be respectively locked with the aforementioned tablet storage basket groups 30, and each tablet storage basket group 30 has a plurality of horizontally arranged storage positions at equal intervals. Each tablet storage basket group 30 is composed of a plurality of tablet storage boxes 31 arranged vertically and locked onto the opposite basket plate 15. The plurality of tablet storage boxes 31 consists of a box back plate 32 and two box side plates 33 respectively disposed on both sides of the box back plate 32. The plurality of box back plates 32 have a plurality of second airflow slots 320, and the box side plates 33 on both sides... Each plate 33 has a plurality of through holes 330, allowing the aforementioned shock-absorbing device 50 to extend into the interior from the outside of both sides of the plurality of storage boxes 31. A plurality of equidistant storage plates 35 are fixedly arranged in layers between the back plate 32 and the side plates 33 of the storage boxes 31, forming a plurality of flat storage positions. Each storage plate 35 has a back support plate 351 and two side support plates 352 on each side. The middle section of each side support plate 352 is bent into an overpass section 353 to raise the storage plate. The carrier plate 35 has strength on both sides, and each of the side carrier plates 352 on both sides of the chip carrier plate 35 has a limiting member 36 at both ends of the bridge section 353. The plurality of limiting members 36 have at least one support protrusion 361 that can support the bottom surface of the aforementioned semiconductor element 900, and the outer edge of the plurality of limiting members 36 has at least one side baffle 362 for the side edge of the aforementioned semiconductor element 900 to abut against, so as to limit the left and right position of the plurality of semiconductor elements 900. In addition, the ends of the plurality of limiting members 36 each have a The stop block 365, which is provided for the front and rear end edges of the aforementioned semiconductor element 900 to abut against, restricts the front and rear position of the plurality of semiconductor elements 900, so that the plurality of semiconductor elements 900 can be supported by the support protrusions 361 of the plurality of limiting members 36, so that the plurality of semiconductor elements 900 can be stably placed on any of the chip carriers 35 of the plurality of chip cassettes 31, and the limiting members 36 can be selected from materials such as PEEK or PEI to reduce wear and have a conductive effect;

[0039] Furthermore, the shock-absorbing device 50 is located between the lower mounting base 803 of the cabin 800 and the cage 10, such as Figure 2 and Figure 6 As shown, the shockproof device 50 includes a pressing module 51 that can selectively restrict the semiconductor elements 900 on the chip storage basket assembly 30, and a shockproof actuation module 60 that can drive the pressing module 51. The pressing module 51 has opposing guide seats 52 and 53 between adjacent mounting portions 110 and 120 of the bottom and top frames 11 and 12 of the cage 10, respectively. A guide post 54 is slidably disposed between the bottom and top frames 11 and 12, respectively, for the aforementioned shockproof actuation module 60 to drive the multiple guide posts 54 to move up and down partially. Furthermore, according to some embodiments, when the cage 10 has a middle ring frame 16, the middle ring frame 16 is provided with a multiple middle guide seats 163 corresponding to the multiple guide seats 52 and 53 (e.g., ...). Figure 3 [Disclosed], for the plurality of guide posts 54 to slide through. Furthermore, the plurality of guide posts 54 are provided with at least one wing assembly 55 corresponding to the two side chip storage basket groups 30. This utility model primarily uses the wing assembly 55 corresponding to the two side chip storage basket groups 30 and the chip storage cassette 31 as its main embodiment. The plurality of wing assemblies 55 have a sleeve 56 that can be locked onto the guide post 54. The sleeve 56 has a plurality of winglets 57 extending into the chip storage cassette 31 on both sides of its periphery. The ends of the winglets 57 are positioned above the edges of the semiconductor elements 900 on the plurality of chip carrier plates 35. Furthermore, each winglet 57 has a corresponding limiting protrusion 58 at its end, corresponding to the plurality of semiconductor elements 900. This allows the winglets 57 of the plurality of wing assemblies 55 to be in a released position relative to the upper surface of the semiconductor element 900 when driven by the guide post 54. Figure 9 [As shown] and a limiting position [such as] Figure 10 [As shown], the semiconductor element 900 can be restricted from moving between the wafer carrier 35, wherein the restricted position can prevent the semiconductor element 900 from being removed from the wafer carrier 35. Figure 10 As shown in the figure, the release position allows the semiconductor element 900 to be removed from the wafer carrier 35 (as shown in the figure). Figure 9 As shown, the winglet assembly 55 or the limiting protrusion 58 can be selected from materials such as PEEK or PEI;

[0040] And such Figure 2 , Figure 6 As shown, the shock-absorbing actuation module 60 can synchronously drive the plurality of guide posts 54 of the tablet pressing module 51 to drive the vane groups 55 of the tablet pressing module 51 on each guide post 54 to move downward, so that the plurality of vane groups 55 can restrict the semiconductor elements 900 in the relative tablet storage cassette 31 of the plurality of tablet storage basket groups 30, and so that the vanes 57 of the plurality of vane groups 55 can restrict the semiconductor elements 900 on the relative tablet storage carrier plate 35. According to some embodiments, such as... Figures 6-10As shown, the shock-absorbing trigger module 60 has a plurality of equal-angled drive elements 61 on the bottom surface of the cabin 800 or the lower mounting base 803 relative to the periphery of the cage 10. This utility model uses six sets of drive elements 61 as the main embodiment. The plurality of drive elements 61 are fixed on a fixed base 63, and each plurality of drive elements 61 has an actuating rod 62 that can extend and retract relative to the fixed base 63. Furthermore, the actuating rods 62 of the plurality of drive elements 61 together form a pressure ring 64 surrounding the periphery of the cage 10. The shock-absorbing trigger module 60 also has a connecting rod spanning the bottom ends of at least two adjacent guide posts 54. The movable plate 65, in this utility model, is mainly implemented by locking one movable plate 65 for every three guide posts 54, so that it has six sets of movable plates 65 to drive the plurality of guide posts 54 respectively, so as to reduce the occurrence of jamming. Each movable plate 65 has at least one convex pressure plate 650 formed on its outer edge, which overlaps with the pressure ring 64. An elastic pressure member 66 is provided between the plurality of convex pressure plates 650 and the pressure ring 64 at their relative positions. This allows the pressure ring 64 to press the movable plate 65 downwards through the plurality of elastic pressure members 66 when the actuating rod 62 of the plurality of driving elements 61 retracts to drive the pressure ring 64. Figure 9 , Figure 10 As shown in the figure, the linkage plate 65 can synchronously drive the corresponding guide post 54 to move downward, thereby driving the blade assembly 55 of the aforementioned pressing module 51 to move downward through the moving guide post 54 (as shown in the figure). Figure 10 As shown, the blades 57 of the plurality of blade groups 55 can restrict the opposing semiconductor elements 900. In addition, the linkage plate 65 is provided with an upper buffer 671 and a lower buffer 672 between each of the guide posts 54 and the upper bottom frame 11 guide seat 52 and the lower gear sleeve 22, respectively, to reduce the impact force of the blades 57 of the plurality of blade groups 55 on the plurality of semiconductor elements 900.

[0041] This allows for the formation of a shock-resistant drive structure for a storage tower that can increase storage capacity and provide shock resistance.

[0042] Through the aforementioned structural design, such as Figure 1 , Figure 2 and Figure 3As shown, in operation, when a robotic arm (not shown) is needed to place or grasp a semiconductor element 900 on the wafer storage tower 100, the motor element 510 of the drive device 500 is activated. Since the drive device 500 can mesh with the gear sleeve 22 of the passive assembly 20 at the bottom of the cage 10 of the wafer storage tower 100, the cage 10 of the wafer storage tower 100 can be driven by the motor element 510 of the drive device 500, thereby enabling the wafer storage tower 100 to... The cage 10 can rotate coaxially between the upper and lower mounting seats 802 and 803 of the compartment 800, so that the designated storage basket group 30 on the cage 10 where the aforementioned semiconductor element 900 is placed can be rotated to the position corresponding to the robotic arm, so that the robotic arm can move up and down to the height of the storage carrier plate 35 of the storage box 31 containing the aforementioned semiconductor element 900 in the storage basket group 30, so as to place or grasp the semiconductor element 900 relative to the storage carrier plate 35 using the robotic arm.

[0043] Taking the placement of the plurality of semiconductor elements 900 on the storage positions of the plurality of chip carriers 35 in the plurality of chip cassettes 31 as an example, Figure 2 , Figure 4 As shown, when the plurality of semiconductor elements 900 are placed from top to bottom on the wafer carrier plate 35 of the opposite wafer cassette 31, the lower surface of the plurality of semiconductor elements 900 can be supported by the support protrusions 361 of the plurality of limiting members 36, so that the plurality of semiconductor elements 900 can be stably placed in the opposite wafer carrier plate 35.

[0044] Furthermore, during the storage of the plurality of semiconductor devices 900 in the storage tower 100, if the seismic intensity exceeds a set value, then... Figure 2 and Figures 6-10 As shown, the shock-absorbing device 50 can activate the drive element 61 of the pressing module 51, which, through the plurality of actuating rods 62, drives the pressure ring 64 to move downward, so that the pressure ring 64 can simultaneously press against the elastic clamping member 66 on the convex pressure plate 650 of the connecting plate 65. This allows the connecting plate 65 to simultaneously drive the relative plurality of guide posts 54 to slide downward. When the plurality of guide posts 54 move downward, they can simultaneously drive the plurality of blade groups 55 locked on them to move downward (e.g., Figure 9 , Figure 10 As shown in the figure, since the plurality of vane groups 55 have a plurality of equidistant vanes 57 on each side, and the plurality of vanes 57 can be positioned above the semiconductor elements 900 of the wafer carriers 35 opposite to the plurality of wafer cassettes 31 [e.g.] Figure 10 As shown, the blades 57 of the plurality of blade groups 55 can restrict the opposing semiconductor elements 900. Furthermore, since the upper buffer 671 and the lower buffer 672 are respectively provided above and below the linkage plate 65, the impact force of the blades 57 of the plurality of blade groups 55 relative to the plurality of semiconductor elements 900 can be reduced (e.g., Figure 10 As shown, when the earthquake intensity exceeds the set value, the anti-vibration device 50 can activate the pressing module 51 to drive the anti-vibration trigger module 60 to restrict the plurality of semiconductor elements 900, so as to prevent the plurality of semiconductor elements 900 from falling out of the storage tower 100.

[0045] As described above, the anti-vibration drive structure of the storage tower of this utility model utilizes the storage tower 100 to be driven to rotate in place by the drive device 500, so that the storage basket group 30 on the cage 10 of the storage tower 100 can correspond to the robotic arm, allowing the robotic arm to move up and down to grab the semiconductor element 900 on the storage box 31 of the storage basket group 30 relative to the storage carrier plate 35. This not only simplifies the structure but also facilitates the placement and grabbing of the semiconductor element 900, and further significantly increases the storage capacity of the storage tower 100.

[0046] Furthermore, since the storage tower 100 of this utility model is equipped with an anti-vibration device 50, when the earthquake intensity exceeds the set value, the anti-vibration trigger module 60 can retract the pressure ring 64 through the actuation rod 62 of the plurality of driving elements 61, so that the pressure ring 64 can press down the linkage plate 65, so that the linkage plate 65 can synchronously drive the relative guide post 54 to move downward, so that the wing 57 of the wing group 55 on the guide post 54 of the pressing module 51 can relatively restrict the semiconductor element 900 on the plurality of storage carrier plates 35, so as to prevent the plurality of semiconductor element 900 from falling out of the storage tower 100 during an earthquake. At the same time, it can improve the smoothness and stability of the operation, so as to avoid jamming due to the angle of operation, and ensure the effectiveness of its anti-vibration operation, which can effectively improve the safety of the plurality of semiconductor element 900 during the storage process.

[0047] Furthermore, the tablet storage box 31 of the tablet storage basket assembly 30 and the wing assembly 55 of the tablet pressing module 51 of the shockproof device 50 are modularly designed, making them easy to install and maintain, and greatly improving their practicality.

[0048] The above-described embodiments are merely preferred embodiments of this utility model and should not be used to limit the scope of protection of this utility model. Any modifications or embellishments made to the main design concept and spirit of this utility model that are not of substantial significance, but solve the same technical problem as this utility model, should be included within the scope of protection of this utility model.

Claims

1. A shock-resistant drive structure for a semiconductor storage tower, used to house multiple semiconductor components, characterized in that: The vibration-resistant drive structure of the storage tower includes at least the following: A semiconductor storage tower consists of a cage and a plurality of semiconductor storage baskets. The plurality of semiconductor storage baskets are vertically locked around the cage and have a plurality of horizontally placed storage positions arranged vertically and at equal intervals for selectively placing a plurality of semiconductor devices horizontally. The cage of the semiconductor storage tower can be rotated by a drive device. A shock-absorbing device is disposed around the cage, and the shock-absorbing device includes at least: A pressing module is provided with a guide post on at least one side of the plurality of chip storage baskets around the cage. The plurality of guide posts are slidably disposed between the top and bottom ends of the cage. The plurality of guide posts are provided with a plurality of winglets corresponding to the flat storage positions of the chip storage baskets on both sides, and one end of the plurality of winglets can extend into the upper surface of the plurality of semiconductor elements located on the relatively flat storage positions. An anti-vibration trigger module is provided with a plurality of equiangular driving elements around the storage tower. The plurality of driving elements are fixed on a fixed base and have actuating rods that can extend and retract relative to the fixed base. The actuating rods of the plurality of driving elements are arranged together to form a pressure ring around the periphery of the cage. The anti-vibration trigger module has a connecting plate spanning the bottom ends of at least two adjacent guide columns. The outer edge of the connecting plate is formed with at least one convex pressure plate that overlaps with the pressure ring. When the actuating rods of the plurality of driving elements drive the pressure ring, the pressure ring can drive the connecting plate, so that the connecting plate can synchronously drive the relative guide column displacement. The shock-absorbing module can drive the guide post of the pressing module to move the plurality of blades downward to restrict the plurality of semiconductor elements from being ejected from the flat storage position, and the shock-absorbing module can also drive the guide post of the pressing module to move the plurality of blades upward to release the plurality of semiconductor elements from the flat storage position.

2. The anti-vibration drive structure for the storage tower as described in claim 1, characterized in that: The cage has at least a bottom frame, a top frame, and a plurality of basket plates disposed between the outer contours of the bottom frame and the top frame. The bottom frame and the top frame have a plurality of guide seats at equal angles and distances, so that the plurality of guide pillars of the pressing module can slide together between the guide seats opposite to the bottom frame and the top frame.

3. The anti-vibration drive structure for the storage tower as described in claim 2, characterized in that: The multiple tablet storage baskets are composed of multiple tablet storage boxes arranged vertically and locked to the multiple basket plates. Each multiple tablet storage box includes a box back plate and two box side plates respectively disposed on both sides of the box back plate. Multiple equidistant tablet storage plates are fixed in layers between the box back plate and the two side box plates to form multiple flat storage positions. Multiple guide posts are provided with multiple wing groups corresponding to the tablet storage boxes of the two side tablet storage baskets. Each multiple wing group has a sleeve that can be locked to the guide post. The multiple wing groups are formed on both sides of the periphery of the multiple sleeves.

4. The anti-vibration drive structure for the storage tower as described in claim 3, characterized in that: The flaps of the plurality of flaps are provided with at least one limiting protrusion corresponding to the plurality of semiconductor elements to reduce the area of ​​contact with the plurality of semiconductor elements.

5. The anti-vibration drive structure for the storage tower as described in claim 4, characterized in that: The at least one limiting bump is made of PEEK or PEI material.

6. The anti-vibration drive structure for the storage tower as described in claim 1, characterized in that: The shock-absorbing trigger module has 6 sets of driving elements and a plurality of linkage plates of equal length. Each linkage plate is locked with three guide posts at equal angles to drive the plurality of guide posts respectively.

7. The anti-vibration drive structure for the storage tower as described in claim 1, characterized in that: An elastic pressure element is provided between the convex pressure plate of the linkage plate and the pressure ring at the opposite position, so that the pressure ring can press the linkage plate through the plurality of elastic pressure elements.

8. The anti-vibration drive structure for the storage tower as described in claim 1, characterized in that: The linkage plate is provided with an upper buffer and a lower buffer above and below the guide post, respectively, to reduce the impact force of the multiple blades on the multiple semiconductor elements.

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