An insulation block jig for semiconductor package

Abstract

The utility model belongs to but is not limited to the field of semiconductor packaging technology discloses a kind of insulation block jigs for semiconductor packaging, it include: block, locating block, copper pole, block is fixedly connected with locating block by internal hexagon bolt, locating block is assembled in the stroke air cylinder output end of test equipment by screw;Block interior is equipped with mounting hole position, by embedding copper pole and reinforcing fixed, realize the stable clamping of block assembly to DIP straight-in type packaging sample in testing process and insulation interval keep. The utility model can satisfy the insulation test of DIP straight-in type semiconductor packaging form, there is reliable stability and the convenience of operation, improve equipment capacity, increase the accuracy of product parameter, strengthen equipment stability, so as to avoid product damage caused by too close insulation distance, so as to reduce maintenance use cost.

Description

Technical Field

[0001] This utility model belongs to, but is not limited to, the field of semiconductor packaging technology, and particularly relates to an insulating pressing fixture for semiconductor packaging. Background Technology

[0002] In the semiconductor discrete device and IC packaging industry, after chip packaging, curing, and lead cutting, insulation parameter testing of the chip's internal performance is required. This testing necessitates the use of an insulation parameter testing machine. Before testing, the test sample must be fixed in a designated position on the equipment, and a certain level of stability is required to support the entire testing process. Existing insulation clamping fixtures generally correspond to the DBC surface on the back of the product under test. Due to the high-voltage characteristics, the insulation performance of this fixture after factory molding (insufficient insulation distance / deteriorated insulation, etc.) cannot guarantee the functional integrity of the tested product, leading to inaccurate parameter measurements, mismeasurements, and product damage, affecting equipment parameters. Loose connections can also cause product / equipment damage. Therefore, a fixture design that meets the fixing conditions for product parameter testing is particularly important.

[0003] Based on the above analysis, the urgent technical problems that need to be solved in the existing technology are as follows: the existing insulating pressure block fixture generally corresponds to and matches the DBC surface on the back of the product being tested. Due to the high voltage characteristics, after the fixture is manufactured, the insulation performance (insufficient insulation distance / deterioration of insulation, etc.) cannot guarantee the proper function of the product being tested, resulting in the inability to measure accurate parameters during testing, causing mismeasurement and product damage, affecting equipment parameters, and if there is a loose connection, it will cause damage to the product / equipment. Utility Model Content

[0004] In view of the problems existing in the prior art, this utility model provides an insulating pressing fixture for semiconductor packaging.

[0005] This invention is implemented as follows: an insulating pressure block fixture for semiconductor packaging includes a positioning block, a pressure block, and several copper electrodes; the pressure block is located in front of the positioning block, and the pressure block and the positioning block are fixedly connected by a first screw; the rear side of the positioning block is provided with several second screw holes, which are used to screw into the output end of a stroke cylinder; the inner side of the pressure block is provided with multiple through holes along the Z-axis, and a copper electrode is embedded in each through hole and locked by a fastener; a guide is provided between the pressure block and the positioning block, and the guide restricts the pressure block to reciprocate linearly only along the Z-axis relative to the positioning block.

[0006] Furthermore, the pressure block is integrally injection molded from high-temperature resistant insulating polyether ether ketone material, and the front end face of the pressure block is provided with a parallel guide groove corresponding to the DIP package pin row.

[0007] Furthermore, the copper electrode is formed by electrolytic copper rod processing, and the outer circle forms an H7 / h6 fit with the through hole. The bottom end of the copper electrode is provided with an external thread section and is secured by a locking screw. The top surface of the copper electrode is electroplated with a gold layer with a thickness of three micrometers.

[0008] Furthermore, the guide component includes four guide pins with a diameter of two millimeters and four deep groove ball bearings with an outer diameter of six millimeters, an inner diameter of two millimeters, and a thickness of three millimeters; each guide pin is embedded in the positioning block by an interference fit, the outer ring of the bearing is pressed into the bottom recess of the pressure block, and the inner ring of the bearing is fitted onto the outer circumference of the guide pin.

[0009] Furthermore, the first screw is an M1.4 socket head cap screw, and a spring washer and a flat washer are sequentially arranged between the head of the first screw and the pressure block.

[0010] Furthermore, the positioning block is a single milled stainless steel part, and the bottom surface of the positioning block is provided with two M2.5 blind holes for screwing to the end face of the piston rod of the stroke cylinder; the upper surface of the positioning block and the bottom surface of the pressure block are coplanar to form a reference plane.

[0011] In the semiconductor packaging process, traditional insulating clamping fixtures often face the following technical problems:

[0012] 1. Insufficient guiding accuracy: Traditional fixtures lack an effective guiding mechanism between the pressing block and the positioning block, which may cause the pressing block to deviate during movement, affecting the pressing accuracy.

[0013] 2. Copper electrode not securely fixed: The way the copper electrode is fixed in the pressure block is not secure enough, and it is easy to loosen after repeated use, affecting electrical performance.

[0014] 3. Poor structural stability: The connection between the pressure block and the positioning block is simple and lacks sufficient structural support, which makes it easy to loosen or deform during high-frequency operation.

[0015] To address the aforementioned problems, this invention proposes an improved insulating clamping fixture for semiconductor packaging.

[0016] This fixture improves guiding accuracy and ensures accurate positioning during the pressing process by setting a guide between the pressing block and the positioning block, which restricts the pressing block to only make linear reciprocating movements along the Z-axis.

[0017] In addition, the inner side of the pressure block is provided with multiple through holes along the Z-axis direction. Each through hole is fitted with a copper electrode and secured by fasteners, which enhances the stability of the copper electrode and prevents it from loosening during use.

[0018] The rear side of the positioning block is provided with several second screw holes for screwing into the output end of the stroke cylinder, providing a solid structural support and improving the overall structural stability.

[0019] Through the above improvements, the fixture has achieved significant technological advancements in guiding accuracy, copper electrode fixation, and structural stability, making it suitable for high-precision, high-reliability semiconductor packaging applications.

[0020] This invention can meet the insulation testing requirements of DIP through-hole semiconductor packages, offering reliable stability and ease of operation. It improves equipment capacity, increases the accuracy of product parameters, enhances equipment stability, and eliminates maintenance costs. Attached Figure Description

[0021] Figure 1 This is a perspective view of the overall assembly of the insulating pressure block fixture provided in this embodiment of the utility model;

[0022] Figure 2 This is a partially enlarged view of the connection structure between the positioning block and the pressure block provided in this embodiment of the utility model;

[0023] Figure 3 This is a schematic diagram of the bolt-spring positioning structure of the pressure block assembly provided in this embodiment of the utility model;

[0024] Figure 4 This is an exploded view of the briquetting assembly provided in this embodiment of the utility model;

[0025] In the diagram: 1. Positioning block; 2. Pressing block; 3. Copper electrode. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.

[0027] like Figures 1-4 As shown, positioning block 1 is positioned face-to-face with the piston rod end face of the test platform's stroke cylinder by two M2.5 socket head cap screws. Its bottom countersunk structure fits into the piston rod cone positioning post, achieving zero clearance constraint in the XY-θ direction. Four ∅2mm through holes are arranged on the upper plane of positioning block 1. ∅2mm-M1.4 threaded shafts are pressed into the through holes as guide pins. A ∅6mm×t3mm miniature deep groove ball bearing is then fitted on the outside of the guide pin. The outer ring of the bearing is pressed into the countersunk platform at the bottom of the pressure block 2, and the inner ring is interference-fitted with the guide pin. This establishes a linear sliding channel for pressure block 2 in the Z-axis direction and suppresses lateral runout.

[0028] The main body of the pressure block 2 is injection molded using PEEK-GF30, with symmetrically milled guide grooves at the four corners corresponding to the DIP package pin array. Four through holes are pre-drilled in the center of the pressure block 2, coaxial with the guide pins of the positioning block 1. During assembly, an M1.4 hex socket head cap screw is passed through the pressure block 2, bearing, and spring washer, and then screwed into the threaded hole at the top of the guide pin. The locking angle is controlled between 120° and 150°, generating a 60N preload force on the spring washer. This preload ensures that the pressure block 2 fits snugly against the positioning block 1 while allowing the bearing to roll to compensate for a flatness difference of ±0.05mm, maintaining the parallelism between the surface of the pressure block 2 and the sample surface.

[0029] Copper electrode 3 is a precision-machined C1100 electrolytic copper part. Its outer diameter is H7 / h6 grade interference-fitted with the mounting hole in the center of pressure block 2. It has an M1.4 internal thread at the bottom and is axially locked by a thrust screw. The top contact surface is gold-plated to 3µm to reduce contact resistance. When the stroke cylinder moves downwards, pressure block 2 first positions the outer edge of the DIP body. Then, copper electrode 3, guided by the rolling bearing, cuts in vertically at a uniform speed. The force on the pin is evenly transmitted outwards from the pin root. Simultaneously, the PEEK insulator ensures that the distance between copper electrode 3 and the gold fingers is ≥3mm, meeting the requirements of IEC60664-1 equivalent dust pollution level distance.

[0030] Upon completion of the test, the cylinder retracts, the spring washer releases its stored energy, and the pressure block 2 and copper electrode 3 are lifted synchronously. The bearing ensures no rotational friction during the return stroke, preventing pin scraping. After the pressure block 2 detaches from the sample, it maintains a 60N preload on the positioning block 1 to ensure consistent starting position for the next cycle. The entire mechanism has a cycle life of 1×10⁻⁶ cycles. 6 In the accelerated test, the positioning deviation was stabilized at ±0.02mm, ensuring batch-to-batch consistency and traceability of insulation breakdown test data.

[0031] The insulating pressure block fixture for semiconductor packaging provided in this embodiment of the utility model is used in conjunction with gold fingers and test sockets. It includes: a pressure block 2 is disposed on the front side of the positioning block 1 and fixed relative to it with screws; a copper electrode 3 is disposed inside the pressure block 2 and fixed relative to it; the pressure block 2 is disposed on the equipment stroke cylinder and clamped and fixed thereto. This utility model can meet the insulation testing of DIP through-hole semiconductor packaging.

[0032] This utility model comprises three parts: a pressure block 2, a positioning block 1, and a copper electrode 3. The pressure block 2 is fixedly connected to the positioning block 1 by multiple sets of internal hexagonal bolts, and the positioning block 1 is assembled to the output end of the stroke cylinder of the testing equipment by screws. The pressure block 2 has mounting holes inside, and by embedding the copper electrode 3 and reinforcing it, the pressure block 2 assembly can stably clamp and maintain the insulation distance of the DIP through-hole packaged sample during the testing process.

[0033] The pressure block 2 is made of high-temperature resistant insulating material, and its surface has guide grooves that match the gold fingers or test pieces. The pressure block 2 has a mounting hole in the middle, into which the copper electrode 3 is tightly inserted. An external bearing assembly (6mm outer diameter, 2mm inner diameter, 3mm thickness) is used for positioning and support. With the help of M1.4 socket head cap screws and spring washers, the clamping force is ensured to be uniform, and positional displacement or loosening is avoided during the test.

[0034] The main body of the positioning block 1 is made of metal or high-strength alloy. The bottom is fixed to the end of the equipment cylinder with M2.5 bolts, and the top is fitted with the pressure block 2 to form an integral unit. The positioning block 1 has pre-drilled threaded holes and through holes to facilitate the assembly and maintenance of the copper pole 3 and pressure block 2 components, while ensuring the installation accuracy and ease of changeover of the entire fixture system.

[0035] Copper electrode 3, used as a signal lead or test contact, is made of highly conductive pure copper or electroplated gold copper. It is bolted into the pressure block 2, ensuring a fixed position. Its surface treatment is excellent to reduce contact resistance. The position of copper electrode 3 strictly corresponds to the gold fingers and test pieces, ensuring stable electrical connection during insulation testing and reducing the risk of leakage and poor connection.

[0036] This fixture uses a stroke cylinder to drive the pressure block 2 to move up and down, achieving automatic clamping and release of semiconductor packages. When the equipment performs an insulation test, the cylinder pushes the pressure block 2 downward, and the copper electrode 3 contacts the sample while maintaining a standard insulation distance; after the test is completed, the cylinder resets, the pressure block 2 rises, and one test cycle is completed.

[0037] The modular design and precise coordination of the clamping block 2, copper electrode 3, and positioning block 1 ensures the uniformity and stability of the clamping force during testing, improving the consistency and repeatability of the equipment's insulation testing. This effectively prevents product damage and test misjudgments caused by uneven manual clamping or insufficient insulation distance, reducing maintenance costs and improving the overall production line yield.

[0038] Example 1: Insulating clamping fixture for single-row DIP-8 packaged devices

[0039] In this embodiment, the positioning block 1 is precision machined from 6061 aluminum alloy, with dimensions of 30×20×15 mm. Its bottom is securely connected to the cylinder output end of the testing equipment via two M2.5 bolts. The pressure block 2 is located at the front end of the positioning block 1 and is fixed to it with two M1.4 hexagonal bolts. Its surface material is PPS engineering plastic, possessing excellent insulation and high-temperature resistance. The copper electrode 3 is made of gold-plated copper rod, tightly embedded in the mounting hole inside the pressure block 2, serving as an electrical signal test contact. It works in conjunction with a spring washer to achieve a constant clamping force.

[0040] Example 2: Insulation test fixture for dual-row DIP-16 packaged devices

[0041] The pressure block 2 used in this embodiment is relatively large, measuring 60×15×10 mm. It has two rows of guide grooves in the middle, which align with the gold fingers on both sides of the DIP-16 device. Pressure block 2 is injection molded from high-temperature resistant PEEK material and has two sets of mounting holes in the middle, each set containing a pair of copper electrodes 3 for symmetrical contact testing points. The copper electrodes 3 are secured by end locking screws to maintain stable contact. Positioning block 1 is also made of high-strength aluminum alloy and has two threaded holes on top for easy replacement of pressure blocks of different models.

[0042] Example 3: Vertical support type pressure block structure with bearing assembly

[0043] In this embodiment, a miniature needle roller bearing sleeve is added inside the mounting hole of the pressure block 2 to cooperate with the copper electrode 3 for axial positioning, ensuring that the pressure block 2 is not misaligned or worn due to repeated movement during the test. The pressure block 2 is mounted on the positioning block 1 by M1.4 bolts, and the initial clamping force is provided by the built-in spring mechanism, completing the pre-compression before the cylinder actuates. When the cylinder presses down, the copper electrode 3 contacts the DIP device pin, and the bearing provides stable support force to ensure that the insulation distance and contact resistance are not affected.

[0044] Example 4: Multi-size adaptable replaceable briquetting system

[0045] To accommodate testing requirements for different package sizes, this embodiment features a modular structure. The positioning block 1 is equipped with guide rails and slots, allowing for quick insertion and removal of the pressure block 2 module. A standardized copper electrode 3 unit is embedded in the center of the pressure block; each copper electrode unit is replaceable, facilitating maintenance and switching between different testing standards. All modules use standard interface connections and automatically align after installation, significantly improving production line efficiency and adaptability.

[0046] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0047] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the technical scope disclosed in this utility model, and within the spirit and principles of this utility model, should be included within the protection scope of this utility model.

Claims

1. An insulating clamping fixture for semiconductor packaging, characterized in that, It includes a positioning block, a pressure block, and several copper electrodes; the pressure block is located in front of the positioning block, and the pressure block and the positioning block are fixedly connected by a first screw; the rear side of the positioning block is provided with several second screw holes, which are used to screw into the output end of the stroke cylinder; the inner side of the pressure block is provided with multiple through holes along the Z-axis, and a copper electrode is embedded in each through hole and locked by fasteners; a guide is provided between the pressure block and the positioning block, and the guide restricts the pressure block to reciprocate linearly only along the Z-axis relative to the positioning block.

2. The fixture according to claim 1, characterized in that, The pressure block is integrally injection molded from high-temperature resistant insulating polyether ether ketone material, and the front end face of the pressure block is provided with a parallel guide groove corresponding to the DIP package pin row.

3. The fixture according to claim 1, characterized in that, The copper electrode is formed by electrolytic copper rod, and the outer circle and the through hole form an H7 / h6 fit. The bottom end of the copper electrode is provided with an external thread section and is secured by a locking screw. The top surface of the copper electrode is plated with a gold layer with a thickness of three micrometers.

4. The fixture according to claim 1, characterized in that, The guide component includes four guide pins with a diameter of two millimeters and four deep groove ball bearings with an outer diameter of six millimeters, an inner diameter of two millimeters, and a thickness of three millimeters. Each guide pin is embedded in the positioning block by an interference fit. The outer ring of the bearing is pressed into the bottom recess of the pressure block, and the inner ring of the bearing is fitted onto the outer circumference of the guide pin.

5. The fixture according to claim 1, characterized in that, The first screw is an M1.4 socket head cap screw, and a spring washer and a flat washer are sequentially arranged between the head of the first screw and the pressure block.

6. The fixture according to claim 1, characterized in that, The positioning block is a single milled stainless steel part. The bottom surface of the positioning block has two M2.5 blind holes for screwing to the end face of the piston rod of the stroke cylinder. The upper surface of the positioning block and the bottom surface of the pressure block are coplanar to form a reference plane.

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