PCB board and inverter
By using an integrated PCB design, the problems of large structure, high stray inductance, and high thermal resistance of traditional inverters have been solved, resulting in reduced size, lower stray inductance, and lower thermal resistance, thereby improving power density.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENGWEICE ELECTRONICS (JIANGSU) CO LTD
- Filing Date
- 2025-04-11
- Publication Date
- 2026-06-05
AI Technical Summary
In traditional inverter structures, the use of connectors and other methods for conduction results in a larger overall structure, higher stray inductance, higher switching losses, and higher thermal resistance, which limits the output power density.
The integrated PCB design integrates the control board, driver board and power module into one unit. Laser holes and drill holes are used instead of connectors for conduction, and embedded structures are used to reduce wiring loops, thereby reducing stray inductance and thermal resistance.
It achieves a 30%~40% reduction in size and weight, a more than 50% reduction in stray inductance, a reduction in switching losses, a reduction in thermal resistance, and an improvement in overall power density.
Smart Images
Figure CN224329625U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of printed circuit board technology, and relates to a PCB board and an inverter. Background Technology
[0002] In recent years, with the rapid development of new energy vehicles, inverters, as a core component of electric vehicle power systems, have received increasing attention. Inverters convert the DC power stored in batteries into AC power required to drive the motor, and their performance directly affects the energy efficiency and operational reliability of the entire vehicle. Traditional inverter structures consist of multiple components, including control boards, drive boards, power modules, and heat sinks, forming a complete power conversion system. These individual components are often connected via connectors, resulting in a large overall structure, tangled external wiring loops, high stray inductance, high switching losses, and high thermal resistance, all of which limit power density output. Traditional PCB fabrication methods can no longer meet these requirements, therefore, a new PCB board and inverter are urgently needed to solve these technical problems.
[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this application and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a PCB board and inverter that can solve the technical problem that the existing inverter structure is too large, has high stray inductance, high switching loss, and high thermal resistance due to the conduction through connectors and other means, thus limiting the power density output.
[0005] To solve the above-mentioned technical problems, this utility model is implemented using the following technical solution:
[0006] This utility model provides a PCB board, comprising:
[0007] A first substrate with a scooping groove, a power device embedded in the scooping groove, at least one first power layer, at least one second driving layer, a second substrate, and a third prepreg for connecting the second driving layer and the second substrate.
[0008] The first power layer includes a first prepreg and a first copper foil connected to the first prepreg. The first prepreg and the first copper foil are connected alternately in sequence. The first prepreg is used to press the power device or the first copper foil together.
[0009] The second driving layer includes a second prepreg and a second copper foil connected to the second prepreg. The second prepreg and the second copper foil are connected alternately in sequence. The second prepreg is used to press the first copper foil or the second copper foil together.
[0010] The first copper foil is etched with power board wiring lines, the second copper foil is etched with driver board wiring lines, and the second substrate is etched with control board wiring lines.
[0011] Furthermore, a first laser hole penetrating the first copper foil and the first prepreg is formed on the first power layer, and a second laser hole penetrating the second copper foil and the second prepreg is formed on the second driving layer. A conductive layer is formed in both the first laser hole and the second laser hole by filling technology.
[0012] Furthermore, a via extending from the surface of the second substrate to the second copper foil is formed on the second substrate, and a conductive layer is formed in the via by a filling technique.
[0013] Furthermore, the filling technology includes electroplated copper filling, copper paste filling, and resin filling.
[0014] Furthermore, the size of the scouring groove is larger than the size of the power device, and the single-sided distance between the scouring groove and the power device is greater than or equal to 100 μm and less than or equal to 200 μm.
[0015] Furthermore, the height difference between the power device and the first substrate is within 50 μm.
[0016] Furthermore, both the first substrate and the second substrate are obtained by laminating at least one core plate.
[0017] Secondly, this application provides an inverter, including the PCB board described in any of the above claims.
[0018] Compared with the prior art, the beneficial effects achieved by this utility model are as follows:
[0019] This application integrates the control board, drive board, power module, and conduction connectors in the inverter into a single PCB, reducing the size and weight by approximately 30% to 40% compared to traditional inverter structures. By using built-in laser holes and drilled holes instead of traditional connectors for conduction, wiring loops can be reduced, stray inductance can be reduced by more than 50%, and switching losses can be reduced. The use of embedded structures reduces the total heat path, thereby reducing thermal resistance and improving overall power density. Attached Figure Description
[0020] Figure 1 This application provides a schematic diagram of a PCB board structure.
[0021] Figure 2 This is a schematic diagram of a traditional inverter.
[0022] Figure 3 A schematic diagram of an inverter provided in this application;
[0023] Figure 4 A partial process diagram A for PCB board manufacturing provided in this application;
[0024] Figure 5 This is a partial process diagram (B) for the manufacturing of a PCB board provided in this application.
[0025] Explanation of reference numerals in the attached figures:
[0026] 1. Trapping tank; 2. Power device; 3. First power layer; 301. First prepreg; 302. First copper foil; 303. First laser hole; 4. Second driving layer; 401. Second prepreg; 402. Second copper foil; 5. Third prepreg; 6. Second substrate; 7. Through hole; A-1. First controller; A-2. Control board; A-3. First conductive board; A-4. First driving device; A-5. Driving board; A-6. Second conductive board; A-7. Traditional power device; A-8. Traditional power module; A-9. First heat sink; A-10. Connector; A-11. Insulating thermally conductive adhesive; B-1. Second controller; B-2. Second driving device; B-3. Connecting layer; B-4. Second heat sink. Detailed Implementation
[0027] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.
[0028] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0030] The connection between prepreg and copper foil in PCB board is mainly achieved through lamination process. The core of this process is to utilize the resin melting characteristics of prepreg under high temperature and high pressure to form a physical and chemical bond.
[0031] The prepreg is made of fiberglass cloth impregnated with epoxy resin and is in the B-Stage (semi-cured state). During the lamination process, the resin is heated and melts, filling the gaps between the copper foil and the core board. After curing, it forms an insulating layer and achieves adhesion. Example 1:
[0032] like Figure 1 As shown, this embodiment provides a PCB board, including:
[0033] A first substrate with a scouring groove 1, a power device 2 embedded in the scouring groove 1, at least one first power layer 3, at least one second driving layer 4, a second substrate 6, and a third prepreg 5 for connecting the second driving layer 4 and the second substrate 6.
[0034] The first power layer 3 includes a first prepreg 301 and a first copper foil 302 connected to the first prepreg 301. The first prepreg 301 and the first copper foil 302 are connected alternately in sequence. The first prepreg 301 is used to press the power device 2 or the first copper foil 302.
[0035] The second driving layer 4 includes a second prepreg 401 and a second copper foil 402 connected to the second prepreg 401. The second prepreg 401 and the second copper foil 402 are connected alternately in sequence. The second prepreg 401 is used to press the first copper foil 302 or the second copper foil 402.
[0036] The first copper foil 302 is etched with power board wiring lines, the second copper foil 402 is etched with driver board wiring lines, and the second substrate 6 is etched with control board wiring lines.
[0037] The first power layer 3 has a first laser hole 303 that penetrates the first copper foil 302 and the first prepreg 301, and the second driving layer 4 has a second laser hole that penetrates the second copper foil 402 and the second prepreg 401. The first laser hole 303 and the second laser hole are both filled with conductive layers.
[0038] The second substrate 6 has a through hole 7 extending from the surface of the second substrate 6 to the second copper foil 402. A conductive layer is formed in the through hole 7 by filling technology. The through hole 7 is obtained by controlled depth drilling.
[0039] The filling techniques include electroplated copper filling, copper paste filling, and resin filling, all of which are existing technologies and will not be described in detail here.
[0040] The size of the scouring groove 1 is larger than the size of the power device 2. The single-sided distance between the scouring groove 1 and the power device 2 is greater than or equal to 100 μm and less than or equal to 200 μm. The height difference between the power device 2 and the first substrate is within 50 μm.
[0041] Both the first substrate and the second substrate 6 are obtained by laminating at least one core plate.
[0042] like Figure 4 and Figure 5 As shown, the PCB manufacturing process provided in this embodiment includes:
[0043] A groove 1 is machined in the embedded area of the power device 2;
[0044] A power device 2 is embedded in the groove 1, and the power device 2 is pressed together on the upper and lower surfaces by a first prepreg 301 and a first copper foil 302.
[0045] A first laser groove is laser-machined in the area of the power device 2 that needs to be electrically conductive, and a conductive layer is formed in the first laser groove by filling.
[0046] The first PCB board was fabricated by etching the first copper foil 302 according to the design, and it has the function of a power board.
[0047] A second prepreg 401 and a second copper foil 402 are added to the first PCB board and then laminated together.
[0048] The second copper foil 402 is laser-processed to create a second laser groove. A conductive layer is formed in the second laser groove by filling. The second copper foil 402 is etched according to the design to complete the second PCB board, which has the functions of a power board and a driver board.
[0049] The second substrate 6 is etched according to the design, and the third PCB board is completed, which has the function of a control board.
[0050] A third prepreg 5 is added between the second PCB board and the third PCB board, and they are aligned and pressed together to form an integral PCB board with the functions of a power board, a driver board and a control board.
[0051] Through-hole 7 is formed by controlled-depth drilling and filling technology to achieve conductivity between the second PCB board and the third PCB board. Example 2:
[0052] This embodiment provides an inverter, including the PCB board described in Embodiment 1, which has corresponding functional modules and beneficial effects, such as... Figure 3 As shown, it also includes: a second controller B-1, a second drive device B-2, a connection layer B-3, and a second heat sink B-4, wherein the second controller B-1 and the second drive device B-2 are integrated on the PCB board, the connection layer B-3 is connected to the PCB board, and the second heat sink B-4 is connected to the connection layer B-3. The structure and connection method of the second controller B-1, the second drive device B-2, the connection layer B-3, and the second heat sink B-4 are all existing technologies and will not be described in detail here.
[0053] In addition, such as Figure 2 As shown, this embodiment provides the structure of a conventional inverter, specifically including: a first control device A-1, a control board A-2, a first conduction board A-3, a first drive device A-4, a drive board A-5, a second conduction board A-6, a conventional power device A-7, a conventional power module A-8, a first heat sink A-9, a connector A-10, and an insulating thermally conductive adhesive A-11. Its structure and connection method are also existing technologies and will not be described in detail here.
[0054] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A PCB board, characterized in that, include: A first substrate with a scooping groove (1), a power device (2) embedded in the scooping groove (1), at least one first power layer (3), at least one second driving layer (4), a second substrate (6), and a third prepreg (5) for connecting the second driving layer (4) and the second substrate (6); The first power layer (3) includes a first prepreg (301) and a first copper foil (302) connected to the first prepreg (301). The first prepreg (301) and the first copper foil (302) are connected alternately in sequence. The first prepreg (301) is used to press the power device (2) or the first copper foil (302). The second driving layer (4) includes a second prepreg (401) and a second copper foil (402) connected to the second prepreg (401). The second prepreg (401) and the second copper foil (402) are connected alternately in sequence. The second prepreg (401) is used to press the first copper foil (302) or the second copper foil (402). The first copper foil (302) is etched with power board wiring lines, the second copper foil (402) is etched with driver board wiring lines, and the second substrate (6) is etched with control board wiring lines.
2. The PCB board according to claim 1, characterized in that, The first power layer (3) has a first laser hole (303) that penetrates the first copper foil (302) and the first prepreg (301), and the second drive layer (4) has a second laser hole that penetrates the second copper foil (402) and the second prepreg (401). The first laser hole (303) and the second laser hole are both filled with conductive layers.
3. The PCB board according to claim 2, characterized in that, The second substrate (6) has a through hole (7) extending from the surface of the second substrate (6) to the second copper foil (402), and a conductive layer is formed in the through hole (7) by filling technology.
4. The PCB board according to claim 3, characterized in that, The filling techniques include electroplated copper filling, copper paste filling, and resin filling.
5. The PCB board according to claim 1, characterized in that, The size of the scouring groove (1) is larger than the size of the power device (2), and the single-sided distance between the scouring groove (1) and the power device (2) is greater than or equal to 100 μm and less than or equal to 200 μm.
6. The PCB board according to claim 1, characterized in that, The height difference between the power device (2) and the first substrate is within 50 μm.
7. The PCB board according to claim 1, characterized in that, The first substrate and the second substrate (6) are both obtained by laminating at least one core plate.
8. An inverter, characterized in that, Includes the PCB board as described in any one of claims 1-7.